JP4855857B2 - Exposure equipment - Google Patents
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- JP4855857B2 JP4855857B2 JP2006196985A JP2006196985A JP4855857B2 JP 4855857 B2 JP4855857 B2 JP 4855857B2 JP 2006196985 A JP2006196985 A JP 2006196985A JP 2006196985 A JP2006196985 A JP 2006196985A JP 4855857 B2 JP4855857 B2 JP 4855857B2
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Description
本発明は、感光剤を塗布した基板と、フォトマスクとなる原版とを密着させて、基板上に原版のパターンを露光する露光装置に関するものである。 The present invention relates to an exposure apparatus that exposes a pattern of an original on a substrate by bringing a substrate coated with a photosensitive agent and an original serving as a photomask into close contact.
感光剤を塗布した基板と、フォトマスクとなる原版とを密着させて、基板上に原版のパターンを露光する露光装置としては、原盤と基板の間に気密空間を形成し、当該気密空間を減圧することにより原盤を基板に密着させる技術が知られている（たとえば、特許文献１）
ここで、露光装置では、露光経路中に塵や埃が存在すると、パターンを正しく基板上に露光できなくなることがあるため、このような露光経路中の塵や埃を適正に除去することが必要となる。
As an exposure device that exposes the pattern of the original on the substrate by bringing the substrate coated with the photosensitizer and the original serving as the photomask into contact, an airtight space is formed between the master and the substrate, and the airtight space is decompressed. By doing so, a technique for bringing the master into close contact with the substrate is known (for example, Patent Document 1).
Here, in the exposure apparatus, if dust or dirt is present in the exposure path, the pattern may not be correctly exposed on the substrate. Therefore, it is necessary to properly remove the dust and dirt in the exposure path. It becomes.
そして、このような塵や埃を除去する技術としては、露光装置において、露光前に、粘着ローラを用いて基板表面と原版表面の除塵を行う技術などが知られている（たとえば、特許文献２）。
前記粘着ローラを用いて基板と原版との除塵を行う技術によれば、浮遊している塵や埃が存在する場合や、浮遊していた塵や埃が、除塵後、露光前に基板や原版に付着してしまった場合には、パターンの露光が適正に行えなくなるなど、必ずしも高い信頼性をもって、塵や埃によるパターンの露光の不具合の発生を排除することができない。 According to the technology for removing dust between the substrate and the original plate using the adhesive roller, if there is floating dust or dust, or if the floating dust or dust is removed and before exposure, the substrate or the original plate is exposed. If it adheres to the pattern, it is not always possible to eliminate the occurrence of a defect in pattern exposure due to dust or dust with high reliability, for example, the pattern cannot be properly exposed.
そこで、本発明は、露光装置において、塵や埃による、パターンの露光の不具合の発生をより高い信頼性をもって排除することを課題とする。 SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to more reliably eliminate the occurrence of a pattern exposure defect due to dust or dust in an exposure apparatus.
前記課題達成のために、本発明は、感光性を有する基板上に原版のパターンを露光する露光装置を、露光光源と、前記露光光源に、前記基板の同じ領域に対する前記露光光源による露光をｎ回（但し、ｎは２以上の整数）繰り返し行わせる制御部とを含めて構成し、前記露光光源による各回の露光の光量は、ｎ-ｍ（但し、ｍは１以上ｎ未満の整数）回の露光の光量の積算が、前記基板の感光に必要な光量を下回らないように設定したものである。 In order to achieve the above object, the present invention provides an exposure apparatus that exposes a pattern of an original on a photosensitive substrate, an exposure light source and the exposure light source, and exposure by the exposure light source to the same region of the substrate. And a control unit that repeatedly performs the operation (where n is an integer of 2 or more), and the amount of light of each exposure by the exposure light source is nm (where m is an integer of 1 to less than n) times. The total amount of exposure light is set so that it does not fall below the amount of light necessary for exposure of the substrate.
このような露光装置によれば、ｎ-ｍ回の露光の積算が、基板の感光に必要な光量を下回らないように設定しているので、ｎ回の露光において、ｍ回以上、塵や埃による露光の障害が生じた箇所以外の箇所では、露光を適正に行うことができる。一方、露光の各回の間に、露光経路中に浮遊等している塵や埃は移動するため、各回の露光において塵や埃による露光の障害が生じる基板上の箇所は異なる箇所となることが期待できる。よって、このような露光装置によれば、塵や埃による、露光の不具合の発生をより高い信頼性をもって排除することができる。 According to such an exposure apparatus, since the total of nm exposures is set so as not to be less than the amount of light necessary for photosensitivity of the substrate, dust or dust is not less than m times in n exposures. The exposure can be appropriately performed at a place other than the place where the exposure trouble is caused by the above. On the other hand, since dust and dirt floating in the exposure path move during each exposure, the locations on the substrate where exposure failures due to dust and dust occur in each exposure may be different. I can expect. Therefore, according to such an exposure apparatus, it is possible to more reliably eliminate the occurrence of exposure defects due to dust.
ここで、このような露光装置は、前記原版を前記基板に対して密着して露光を行うものであってもよく、この場合には、当該露光装置に、前記原版を前記基板に対して密着させる密着手段を備え、制御部において、前記露光光源による前記基板に対するｎ回の露光の各回が、前記原版が前記基板に対して密着した状態で行われると共に、前記ｎ回の露光の各回の間に、一旦、前記原版の前記基板に対する密着が解除されるように前記密着手段と前記露光光源とを制御することが好ましい。 Here, such an exposure apparatus may be an apparatus that performs exposure by bringing the original plate into close contact with the substrate. In this case, the original plate is brought into close contact with the exposure apparatus. In the control unit, each of n times of exposure of the substrate by the exposure light source is performed in a state where the original plate is in close contact with the substrate, and during each of the n times of exposure. In addition, it is preferable to control the contact means and the exposure light source so that the contact of the original plate with the substrate is released.
このようにすることにより、基板や原版に付着した埃や塵や、密着によって基板と原版の間に挟み込まれた埃や塵を、各回の露光の間で、より確実に移動させることができるようになる。
また、以上のような露光装置は、前記原版を前記基板に対して近接させて露光を行うものであってもよく、この場合には、当該露光装置に、前記基板に対して近接した位置と、当該近接した位置に比べ前記基板に対して離間した位置との間で、前記原版を前記基板に対して相対的に移動する移動手段を備え、前記制御部において、前記露光光源による前記基板に対するｎ回の露光の各回が、前記原版が前記基板に対して前記近接した位置にある状態で行われると共に、前記ｎ回の露光の各回の間に、一旦、前記原版が前記基板に対して前記離間した位置に移動するように前記移動手段と前記露光光源とを制御することが好ましい。
By doing so, dust and dust adhering to the substrate and the original plate, and dust and dust sandwiched between the substrate and the original plate due to close contact can be moved more reliably between each exposure. become.
Further, the exposure apparatus as described above may perform exposure by bringing the original plate close to the substrate, and in this case, the exposure apparatus is provided with a position close to the substrate. And a moving means for moving the original plate relative to the substrate between a position farther from the substrate than the adjacent position, and the controller is configured to move the original relative to the substrate by the exposure light source. Each of the n times of exposure is performed in a state where the original is in the position close to the substrate, and the original is once exposed to the substrate during each of the n times of exposure. It is preferable to control the moving means and the exposure light source so as to move to a separated position.
このようにすることにより、基板や原版に付着した埃や塵や、基板と原版の間で浮遊している埃や塵を、各回の露光の間で、より確実に移動させることができるようになる。
また、以上のような露光装置に、前記基板及び原版周辺の空気を攪拌する攪拌手段を備え、前記制御部において、前記ｎ回の露光の各回の間に、前記攪拌手段に前記攪拌を行わせることも、各回の露光の間で、埃や塵を確実に移動させる上で好ましい。
By doing so, dust and dust adhering to the substrate and the original plate and dust and dust floating between the substrate and the original plate can be moved more reliably between each exposure. Become.
Further, the exposure apparatus as described above is provided with a stirring unit that stirs the air around the substrate and the original plate, and the control unit causes the stirring unit to perform the stirring during each of the n times of exposure. This is also preferable for reliably moving dust and dust between each exposure.
以上のように、本発明によれば、露光装置において、塵や埃による、パターンの露光の不具合の発生をより高い信頼性をもって排除することができる。 As described above, according to the present invention, in the exposure apparatus, it is possible to more reliably eliminate the occurrence of pattern exposure defects due to dust or dirt.
以下、本発明の実施形態について説明する。
図１ａに、本実施形態に係る露光システムの構成を示す。
図示するように、露光システムは、搬入室１、露光室２、搬出室３の３つの処理室と、制御部４を備えたシステムである。
そして、搬入室１には、本露光システムで露光する基板５が投入、載置される基板受入台１１と、搬入キャリア１２が備えられている。ここで、搬入キャリア１２は、搬入室１と露光室２との間を移動可能であり、また、基板５を吸着する上下に移動可能な搬入吸着板１２１を備えている。
Hereinafter, embodiments of the present invention will be described.
FIG. 1a shows the configuration of an exposure system according to this embodiment.
As shown in the figure, the exposure system is a system including three processing chambers, a carry-in chamber 1, an exposure chamber 2, and a carry-out chamber 3, and a control unit 4.
The carry-in chamber 1 is provided with a substrate receiving table 11 on which a substrate 5 to be exposed by the present exposure system is loaded and placed, and a carry-in carrier 12. Here, the carry-in carrier 12 includes a carry-in suction plate 121 that can move between the carry-in chamber 1 and the exposure chamber 2 and can move up and down to suck the substrate 5.
次に、露光室２には、露光ステージ２１、露光ステージアクチュエータ２２、原版６を保持する原版ホルダ２３、原版ホルダアクチュエータ２４、露光光源２５、カメラ２６、固定用ポンプ２７、密着用ポンプ２８とを有している。
露光ステージ２１は、露光ステージアクチュエータ２２によって、水平方向の２軸x,y方向の移動と、鉛直なｚ軸を回転軸とする回転が可能に設けられている。また、原版ホルダ２３は、原版ホルダアクチュエータ２４によってｚ軸方向に移動可能に設けられている。
Next, the exposure chamber 2 includes an exposure stage 21, an exposure stage actuator 22, an original holder 23 for holding the original 6, an original holder actuator 24, an exposure light source 25, a camera 26, a fixing pump 27, and a contact pump 28. Have.
The exposure stage 21 is provided by an exposure stage actuator 22 so that it can be moved in two horizontal x and y directions and rotated around a vertical z axis as a rotation axis. The original holder 23 is provided so as to be movable in the z-axis direction by an original holder actuator 24.
また、図２ａに示すように、原版ホルダ２３は、原版６を保持する透明板２３１と、透明板２３１の縁を取り囲むように明板２３１の下面に設けられたパッキング２３２とを有する。また、原版ホルダ２３は、図２ｂに示すように原版ホルダアクチュエータ２４によって、露光ステージ２１の上空の位置と、露光ステージ２１上にパッキング２３２の下端が接する位置との間で移動される。 2A, the original plate holder 23 includes a transparent plate 231 that holds the original plate 6, and a packing 232 that is provided on the lower surface of the light plate 231 so as to surround the edge of the transparent plate 231. 2B, the original holder 23 is moved by the original holder actuator 24 between the position above the exposure stage 21 and the position where the lower end of the packing 232 contacts the exposure stage 21.
また、露光ステージ２１には、露光ステージ２１の上面の、当該上面に載置された基板５によって覆われることになる位置に配置された開口を有する空気路２１１が設けられており、図２ｂに示すように、固定用ポンプ２７で、この空気路２１１を減圧することにより、露光ステージ２１に載置された基板５を露光ステージ２１の上面に吸着するように構成されている。 Further, the exposure stage 21 is provided with an air passage 211 having an opening arranged at a position on the upper surface of the exposure stage 21 to be covered by the substrate 5 placed on the upper surface, as shown in FIG. As shown, the fixing pump 27 reduces the pressure of the air passage 211 so that the substrate 5 placed on the exposure stage 21 is attracted to the upper surface of the exposure stage 21.
また、露光ステージ２１には、露光ステージ２１の上面の、当該上面に載置された基板５と、当該上面に接した原版ホルダ２３のパッキング２３２との間となる位置に配置された開口を有する空気路２１２が設けられており、図２ｂに示すように、密着用ポンプ２８で、この空気路２１２を用いて、露光ステージ２１と、露光ステージ２１の上面に載置された基板５と、露光ステージ２１上にパッキング２３２が接するように降下した原版ホルダ２３とによって形成される気密空間を減圧し、原版ホルダ２３に保持された原版６を基板５に密着するように構成されている。 The exposure stage 21 has an opening disposed at a position on the upper surface of the exposure stage 21 between the substrate 5 placed on the upper surface and the packing 232 of the original plate holder 23 in contact with the upper surface. An air path 212 is provided, and as shown in FIG. 2 b, the contact pump 28 uses the air path 212 to expose the exposure stage 21, the substrate 5 placed on the upper surface of the exposure stage 21, and the exposure. The airtight space formed by the original plate holder 23 lowered so that the packing 232 is in contact with the stage 21 is decompressed, and the original plate 6 held by the original plate holder 23 is in close contact with the substrate 5.
図１ａに戻り、次に、搬出室３には、本露光システムで露光した排出する基板５を載置する搬出台３１と、排出キャリア３２とが備えられている。ここで、搬出キャリアは、搬出室３と露光室２との間を移動可能であり、また、基板５を吸着する上下に移動可能な搬出吸着板１３１を備えている。 Returning to FIG. 1 a, next, the carry-out chamber 3 is provided with a carry-out stand 31 on which the substrate 5 to be discharged exposed by the present exposure system is placed, and a discharge carrier 32. Here, the carry-out carrier includes a carry-out suction plate 131 that can move between the carry-out chamber 3 and the exposure chamber 2 and can move up and down to suck the substrate 5.
そして、制御部４は、以上の各部を制御して、本露光システムに投入された各基板５に対して、逐次的に、搬入処理、露光処理、搬出処理を行う。
以下、この搬入処理、露光制御処理、搬出処理について説明する。
まず、制御部４が行う搬入処理について説明する。
搬入処理において、制御部４は、搬入室１の搬入キャリア１２を制御し、以下の搬入動作を行わせる。すなわち、図３ａに示すように、搬入動作において、搬入キャリア１２は、搬入吸着板１２１を一旦降下させて、本露光システムに投入され基板受入台１１に載置された基板５を搬入吸着板１２１で吸着しａ１、ａ２、ａ３、露光室２に移動して露光ステージ２１の上に搬送しａ４、ａ５、ａ６、その後、搬入室１に移動復帰ａ７する。
And the control part 4 controls the above each part, and sequentially performs a carrying-in process, an exposure process, and a carrying-out process with respect to each board | substrate 5 thrown into this exposure system.
Hereinafter, the carry-in process, the exposure control process, and the carry-out process will be described.
First, the carrying-in process which the control part 4 performs is demonstrated.
In the carry-in process, the control unit 4 controls the carry-in carrier 12 in the carry-in chamber 1 to perform the following carry-in operation. That is, as shown in FIG. 3 a, in the carry-in operation, the carry-in carrier 12 lowers the carry-in suction plate 121 once, and loads the substrate 5 placed in the exposure system and placed on the substrate receiving table 11 into the carry-in suction plate 121. Then, it is adsorbed at a1, a2, a3, moved to the exposure chamber 2 and conveyed onto the exposure stage 21, a4, a5, a6, and then moved back to the carry-in chamber 1 a7.
次に、制御部４が行う露光処理について説明する。
図４に、この露光制御処理の手順を示す。
図示するように、この露光処理では、まず、固定用ポンプ２７を駆動して、搬入処理によって露光ステージ２１上に載置された基板５を露光ステージ２１に固定する（ステップ４０２）。そして、次に、カメラ２６を用いて撮影した基板５の画像に基づいて基板５の位置、姿勢を算定しつつ、露光ステージアクチュエータ２２を駆動して露光ステージ２１を移動、回転することにより、基板５の原版６に対する位置を正規の位置に位置決めする（ステップ４０４）。
Next, the exposure process performed by the control unit 4 will be described.
FIG. 4 shows the procedure of this exposure control process.
As shown in the figure, in this exposure process, first, the fixing pump 27 is driven to fix the substrate 5 placed on the exposure stage 21 by the carry-in process to the exposure stage 21 (step 402). Then, while calculating the position and orientation of the substrate 5 based on the image of the substrate 5 photographed using the camera 26, the exposure stage actuator 22 is driven to move and rotate the exposure stage 21. 5 with respect to the original plate 6 is positioned at a regular position (step 404).
そして、ｎ（但し、ｎは２以上の整数）回（ステップ４０６、４１８、４２２）、ステップ４０８から４１６の処理を繰り返す。ここで、ｎは、露光回数として予め定め数である。
さて、このｎ回繰り返すステップ４０８から４１６の処理の各回では、まず、原版ホルダアクチュエータ２４を制御して、原版ホルダ２３を露光ステージ２１の上に降下し（ステップ４０８）。密着用ポンプ２８を駆動して、原版６を基板５上に密着させる（ステップ４１０）。
Then, the processing of steps 408 to 416 is repeated n (where n is an integer of 2 or more) times (steps 406, 418, and 422). Here, n is a predetermined number as the number of exposures.
In each of the processes from step 408 to step 416 repeated n times, first, the original holder actuator 24 is controlled to lower the original holder 23 onto the exposure stage 21 (step 408). The contact pump 28 is driven to bring the original 6 into close contact with the substrate 5 (step 410).
その上で、露光光源２５を駆動し、DivEの光量で基板５に原版６のパターンを露光する（ステップ４１２）。ここで、露光回数ｎとDivEは、DivE×（ｎ-ｍ）が基板５の感光剤の実用上の適正露光光量範囲の下限値を下回らないように定める。また、過剰な光量による露光が問題となる場合には、DivE×ｎが基板５の感光剤の実用上の適正露光光量範囲の上限値を超えないように露光回数ｎとDivEを定める。ただし、ｍは予め定めた１以上、ｎ未満の整数である。すなわち、基板５の感光剤の実用上の適正露光光量範囲が８０-１２０であるときにｍを１とする場合には、たとえば、ｎを３、DivEを４０とする。また、基板５の感光剤の実用上の適正露光光量範囲が８０-１２０であるときにｍを２とする場合には、たとえば、ｎを６、DivEを２０とするようにする。 After that, the exposure light source 25 is driven to expose the pattern of the original 6 on the substrate 5 with the amount of DivE light (step 412). Here, the number of exposures n and DivE are determined so that DivE × (n−m) does not fall below the lower limit of the practical appropriate exposure light amount range of the photosensitive agent of the substrate 5. If exposure with an excessive amount of light is a problem, the number of exposures n and DivE are determined so that DivE × n does not exceed the upper limit of the practical appropriate exposure light amount range of the photosensitive agent on the substrate 5. However, m is a predetermined integer of 1 or more and less than n. That is, when m is 1 when the practical appropriate exposure light quantity range of the photosensitive agent of the substrate 5 is 80-120, for example, n is 3 and DivE is 40. Further, when m is 2 when the practical appropriate exposure light quantity range of the photosensitive agent on the substrate 5 is 80-120, for example, n is 6 and DivE is 20.
なお、実用上の適正露光光量範囲とは、基板５に要求される機能上、問題のないパターンを基板５上に形成するのに差し障りのない露光光量範囲を言う。
そして、DivEの光量による露光が完了したならば、密着用ポンプ２８による原版６の基板５に対する密着を解除した上で（ステップ４１４）、原版ホルダアクチュエータ２４を制御して、原版ホルダ２３を露光ステージ２１の上空位置に復帰させる（ステップ４１６）。
そして、ｎ回、ステップ４０８から４１６の処理を繰り返したならば、固定用ポンプ２７による減圧を解除して、基板５の露光ステージ２１に対する固定を解除し（ステップ４２０）、露光制御処理を終了する。
以上、制御部４が行う露光制御処理について説明した。
このような露光制御処理によれば、図３ｂに示すように、露光ステージ２１に基板５が固定された状態においてｂ１、原版ホルダ２３を露光ステージ２１の上に降下して原版６を基板５上に密着させｂ２、DivEの光量で基板５に原版６のパターンを露光しｂ３、原版６の基板５に対する密着を解除して原版ホルダ２３を露光ステージ２１の上空位置に復帰させるｂ４動作を、ｎ回繰り返すｂ５、ｂ６、ｂ７...。
The practical appropriate exposure light amount range refers to an exposure light amount range that does not hinder the formation of a pattern having no problem on the substrate 5 due to the functions required of the substrate 5.
When the exposure with the amount of DivE light is completed, after the close contact of the original plate 6 with the substrate 5 by the contact pump 28 is released (step 414), the original holder actuator 24 is controlled so that the original holder 23 is moved to the exposure stage. 21 is returned to the sky position (step 416).
Then, if the processes of steps 408 to 416 are repeated n times, the decompression by the fixing pump 27 is released, the fixation of the substrate 5 to the exposure stage 21 is released (step 420), and the exposure control process ends. .
The exposure control process performed by the control unit 4 has been described above.
According to such an exposure control process, as shown in FIG. 3 b, in the state where the substrate 5 is fixed to the exposure stage 21, b 1, the original holder 23 is lowered onto the exposure stage 21, and the original 6 is placed on the substrate 5. B4, exposing the pattern of the original 6 on the substrate 5 with the amount of b2, DivE, b3, releasing the adhesion of the original 6 to the substrate 5 and returning the original holder 23 to the upper position of the exposure stage 21; Repeat b5, b6, b7 ...
ここで、このようなｎ回の露光において、塵や埃による露光の障害が生じた基板５上の箇所のうち、最も露光の障害を受けた回数が多かった箇所に生じた露光の障害の回数がｐであったならば、ｎ回の露光によって、基板５の全ての箇所について、少なくともｎ-ｐ回の露光が行われることになる。すなわち、基板５の全ての箇所についてｎ-ｐ回からｎ回の塵や埃の影響を受けない適正な露光が行われることになる。 Here, in such n exposures, the number of exposure failures that occurred in the locations on the substrate 5 where the exposure failures due to dust or dust occurred were the most frequently subjected to exposure failures. If p is p, at least n-p exposures are performed on all parts of the substrate 5 by n exposures. That is, appropriate exposure that is not affected by dust or dust from np times to n times is performed on all portions of the substrate 5.
一方、ｎ回の露光において、ある回の露光中に露光経路中に浮遊していたり基板５や原版６に付着していた塵や埃は、次の回の露光の前に、原版ホルダ２３の移動や密着用ポンプ２８の減圧の影響を受け異なる位置に移動していくものと考えられる。したがって、ｎ回における露光において、塵や埃による露光の障害が基板５の同じ箇所に繰り返し生じる可能性は極めて小さくなる。 On the other hand, in n times of exposure, dust or dust that has floated in the exposure path during one exposure or has adhered to the substrate 5 or the original 6 is transferred to the original holder 23 before the next exposure. It is considered that the actuator moves to a different position under the influence of the movement and the pressure reduction of the contact pump 28. Therefore, the possibility of repeated exposure failures due to dust or dust occurring in the same portion of the substrate 5 in the exposure at n times is extremely small.
したがって、上記ｐがおよそ取り得る値は充分に小さな値となり、上述したｍをこのｐがおよそ取り得る値に設定しておくことにより、基板５の全ての箇所についてｎ-ｍ回からｎ回の光量DivEによる露光が行われるようにすることができ、これにより、基板５の全ての箇所について実用上の適正露光光量範囲内の光量による露光が行われることになる。 Therefore, the value that can be taken by the above p is a sufficiently small value, and by setting the above m to a value that can be taken by this p, all the parts of the substrate 5 are changed from nm to n times. The exposure with the light amount DivE can be performed, and thereby, the exposure with the light amount within the practical appropriate exposure light amount range is performed for all the portions of the substrate 5.
よって、このような露光制御処理によれば、基板５の全ての箇所について適正に原版６のパターンを露光することができるようになる。
以下、制御部４が行う搬出処理について説明する。
搬出処理において、制御部４は、搬出室３の搬出キャリアを制御し、以下の搬出動作を行わせる。すなわち、図３ｃに示すように、搬出動作において、搬出室３の搬出キャリアは、露光室２に移動しｃ１、ｃ２、搬出吸着板１３１を一旦降下させて露光ステージ２１上に載置された露光処理後の基板５を搬出吸着板１３１で吸着しｃ３、ｃ４、搬出室３の搬出ステージの上に搬送するｃ５、ｃ６、ｃ７。
Therefore, according to such an exposure control process, the pattern of the original 6 can be appropriately exposed for all the portions of the substrate 5.
Hereinafter, the carry-out process performed by the control unit 4 will be described.
In the carry-out process, the control unit 4 controls the carry-out carrier in the carry-out chamber 3 to perform the following carry-out operation. That is, as shown in FIG. 3 c, in the carry-out operation, the carry-out carrier in the carry-out chamber 3 moves to the exposure chamber 2, and c 1, c 2, and the carry-out suction plate 131 are once lowered and placed on the exposure stage 21. The processed substrate 5 is adsorbed by the carry-out suction plate 131 and transferred to c3, c4 and the carry-out stage of the carry-out chamber 3 c5, c6, c7.
以上、本発明の実施形態について説明した。
ところで、以上の実施形態では、各回の露光の際に、露光経路中で浮遊する塵や埃や、基板５や原版６に付着した塵や埃が、自らの運動によって、又は、原版ホルダ２３の移動や密着用ポンプ２８の減圧によって異なる位置に移動することを利用して、動作の各回における露光において、塵や埃による露光の障害が基板５の同じ箇所に繰り返し生じないようにしたが、これは、各回の露光の間で、より積極的に塵や埃を移動させるようにしてもよい。
The embodiment of the present invention has been described above.
By the way, in the above embodiment, in each exposure, dust and dust floating in the exposure path, and dust and dust adhering to the substrate 5 and the original plate 6 are moved by their own movements or of the original holder 23. By using the movement and movement to different positions by the pressure reduction of the contact pump 28, the exposure failure due to dust and dust is prevented from repeatedly occurring in the same portion of the substrate 5 in each exposure of the operation. The dust may be moved more positively between each exposure.
すなわち、たとえば、図４に示した露光制御処理のステップ４１６において原版ホルダ２３を上昇させた後に、密着用ポンプ２８から空気を噴出させたり、図１ｂに示すように露光室２内に設けたファン２９によって露光室２内の空気を攪拌するなどするようにしてもよい。 That is, for example, after the original plate holder 23 is raised in step 416 of the exposure control process shown in FIG. 4, air is ejected from the contact pump 28, or a fan provided in the exposure chamber 2 as shown in FIG. 1b. The air in the exposure chamber 2 may be stirred by 29.
なお、以上では、露光システムにおいて、原版６を基板５上に密着させて露光を行ったが、本実施形態は、原版６を基板５上に近接させて露光を行う露光システムにも同様に適用することができる。すなわち、この場合には、たとえば、露光ステージ２１に基板５が固定された状態において、原版ホルダ２３を露光ステージ２１の上空位置から降下して原版６を基板５上に近接させ、前述のDivEの光量で基板５に原版６のパターンを露光し、原版ホルダ２３を露光ステージ２１の上空位置に復帰させる動作を、ｎ回繰り返すようにすれば良い。 In the above, in the exposure system, the original 6 is brought into close contact with the substrate 5 and the exposure is performed. However, the present embodiment is similarly applied to an exposure system in which the original 6 is brought close to the substrate 5 to perform exposure. can do. That is, in this case, for example, in a state where the substrate 5 is fixed to the exposure stage 21, the original holder 23 is lowered from the upper position of the exposure stage 21 to bring the original 6 close to the substrate 5, and the above-described DivE The operation of exposing the pattern of the original 6 on the substrate 5 with the amount of light and returning the original holder 23 to the upper position of the exposure stage 21 may be repeated n times.
また、本実施形態に係る露光システムは、プリント配線基板の露光の他、半導体基板の露光など、各種基板の露光に同様に適用することができる。 The exposure system according to the present embodiment can be similarly applied to exposure of various substrates such as exposure of a semiconductor substrate in addition to exposure of a printed wiring board.
１…搬入室、２…露光室、３…搬出室、４…制御部、５…基板、６…原版、１１…基板受入台、１２…搬入キャリア、２１…露光ステージ、２２…露光ステージアクチュエータ、２３…原版ホルダ、２４…原版ホルダアクチュエータ、２５…露光光源、２６…カメラ、２７…固定用ポンプ、２８…密着用ポンプ、２９…ファン、３１…搬出台、３２…排出キャリア、１２１…搬入吸着板、１３１…搬出吸着板、２３１…透明板、２３２…パッキング。 DESCRIPTION OF SYMBOLS 1 ... Loading chamber, 2 ... Exposure chamber, 3 ... Unloading chamber, 4 ... Control part, 5 ... Substrate, 6 ... Original, 11 ... Substrate receiving stand, 12 ... Loading carrier, 21 ... Exposure stage, 22 ... Exposure stage actuator, DESCRIPTION OF SYMBOLS 23 ... Original plate holder, 24 ... Original plate holder actuator, 25 ... Exposure light source, 26 ... Camera, 27 ... Fixing pump, 28 ... Contact pump, 29 ... Fan, 31 ... Unloading stand, 32 ... Discharge carrier, 121 ... Loading adsorption Plate 131, carrying-out adsorption plate, 231 ... transparent plate, 232 ... packing.
Claims (4)
露光光源と、
前記露光光源に、前記基板の同じ領域に対する前記原版上の同じ領域のパターンの、当該露光光源による露光をｎ回（但し、ｎは２以上の整数）繰り返し行わせる制御部と、
前記基板に対して近接した位置と、当該近接した位置に比べ前記基板に対して離間した位置との間で、前記原版を上下動する移動手段とを有し、
前記制御部は、前記露光光源による前記基板に対するｎ回の露光の各回が、前記原版が前記基板に対して前記近接した位置にある状態で行われると共に、前記ｎ回の露光の各回の間に、前記原版が上下動するように前記移動手段と前記露光光源とを制御し、
前記露光光源による各回の露光の光量は、ｎ-ｍ（但し、ｍは１以上ｎ未満の整数）回の露光の光量の積算が、前記基板の感光に必要な光量を下回らないように設定されていることを特徴とする露光装置。 An exposure apparatus that exposes a pattern of an original on a substrate having photosensitivity and stacked in the vertical direction of the substrate ,
An exposure light source;
A controller that causes the exposure light source to repeatedly expose the pattern of the same region on the original plate to the same region of the substrate by the exposure light source n times (where n is an integer of 2 or more) ;
A moving means for moving the original plate up and down between a position close to the substrate and a position spaced from the substrate compared to the close position;
The control unit performs each of n times of exposure on the substrate by the exposure light source in a state where the original plate is in the close position with respect to the substrate, and between each time of the n times of exposure. , Controlling the moving means and the exposure light source so that the original moves up and down,
The amount of light of each exposure by the exposure light source is set so that the total amount of exposure light of nm (where m is an integer between 1 and less than n) times does not fall below the amount of light necessary for photosensitivity of the substrate. An exposure apparatus characterized by comprising:
前記原版を前記基板に対して密着させる密着手段を有し、
前記制御部は、前記露光光源による前記基板に対するｎ回の露光の各回が、前記原版が前記基板に対して前記近接した位置にある状態で行われると共に、前記ｎ回の露光の各回の間に、一旦、前記原版の前記基板に対する密着が解除されるように前記密着手段を制御することを特徴とする露光装置。 The exposure apparatus according to claim 1,
Having an adhesion means for closely adhering the original plate to the substrate;
The control unit performs each of n times of exposure on the substrate by the exposure light source in a state where the original plate is in the close position with respect to the substrate, and between each time of the n times of exposure. , once an exposure apparatus characterized by controlling the contact means as adhesion is released with respect to the substrate of the original plate.
前記基板及び原版周辺の空気を攪拌する攪拌手段を備え、A stirring means for stirring the air around the substrate and the original plate;
前記制御部は、前記ｎ回の露光の各回の間に、前記攪拌手段に前記攪拌を行わせることを特徴とする露光装置。The exposure apparatus, wherein the control unit causes the stirring means to perform the stirring during each of the n times of exposure.
露光光源の露光経路中に配置された前記原版に対して前記基板を位置決めするステップと、Positioning the substrate relative to the original plate disposed in an exposure path of an exposure light source;
前記露光光源に、前記基板の同じ領域に対する前記原版上の同じ領域のパターンの、当該記露光光源による露光をｎ回（但し、ｎは２以上の整数）繰り返し、当該ｎ回の露光の各回が、前記原版が前記基板に対して前記近接した位置にある状態で行われると共に、前記ｎ回の露光の各回の間に、前記原版が上下動するように行わせるステップとを有し、The exposure light source is repeatedly exposed by the exposure light source for the same area pattern on the original plate to the same area of the substrate n times (where n is an integer of 2 or more), and each time of the n exposures And the step of causing the original to move up and down during each of the n exposures, while the original is in the position close to the substrate.
前記露光光源による各回の露光の光量は、少なくとも、ｎ-１回の露光の積算が、前記基板の感光に必要な光量を下回らないように設定することを特徴とする露光方法。The exposure method is characterized in that the light quantity of each exposure by the exposure light source is set so that at least the integration of n-1 exposures does not fall below the light quantity necessary for the exposure of the substrate.
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| JPS6417426A (en) * | 1987-07-10 | 1989-01-20 | Matsushita Graphic Communic | Formation of resist pattern |
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| JPH06342767A (en) * | 1993-06-02 | 1994-12-13 | Hitachi Ltd | Contact exposure method |
| JPH09330866A (en) * | 1996-06-11 | 1997-12-22 | Canon Inc | Method and apparatus for proximity exposure |
| JP2003162065A (en) * | 2001-11-26 | 2003-06-06 | Mitsubishi Electric Corp | Exposure system, mask for exposure, exposure method, display, and electronic parts |
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