JP4852023B2 - Retainer and substrate storage container - Google Patents

Description

  The present invention relates to a retainer and a substrate storage container for holding a substrate made of a semiconductor wafer, a glass wafer, or the like.

  Although not shown, a conventional substrate storage container opens and closes a front open box type container main body for arranging and storing a plurality of semiconductor wafers, which are round precision substrates, and an open front portion of the container main body by manual operation or automatic operation. A detachable lid, and a retainer that is deeply attached to the back surface of the lid and holds the front edge, which is the edge of the semiconductor wafer, via a holding part (Patent Documents 1 and 2). reference).

The lid body and the retainer each have a concave portion on one side and a convex portion on the other side, and the retainer is brought into surface contact with the lid body by the engagement between the concave portion and the convex portion, and is fixed. The retainer includes an elastic piece extending in the horizontal direction in the frame, and a holding portion for holding the front periphery of the semiconductor wafer is integrally formed on the elastic piece.
JP 2002-353301 A JP 2005-320028 A

The conventional substrate storage container is configured as described above, and the retainer comes into surface contact with the back surface of the lid, so that when the lid is washed and dried by a washing device that circulates the washing water, the retainer has washing water. As a result, there is a problem that the semiconductor wafer is deposited or accumulated, and as a result, the drying operation is delayed or the semiconductor wafer is contaminated by the remaining cleaning water.
The present invention has been made in view of the above, and an object thereof is to provide a retainer and a substrate storage container capable of speeding up a drying operation and preventing substrate contamination.

In the present invention, in order to solve the above problems, a frame body mounted on the lid body, a pair of elastic pieces projecting from a pair of opposed pieces of the frame body, and a pair of elastic pieces formed on the pair of elastic pieces A holding portion for holding the edge of the end, and is washed with washing water,
The frame body is formed of a pair of facing pieces facing each other at an interval, and a pair of erected pieces respectively installed between both ends of the pair of facing pieces , and at least the facing pieces of the facing pieces and the erected pieces are opposed to each other. In the longitudinal direction of the back surface facing the lid of the piece, a plurality of concave and convex portions that improve the drainability of the washing water are alternately formed at intervals, and in the center of the back surface of the facing piece, the positioning projection of the lid It is characterized in that a positioning portion that is fitted to improve positioning accuracy is formed as a recess .

Note that at least one of the opposing piece and the installation piece of the frame body can be formed with a spring-like bent portion that deforms the frame body and a positioning portion.
The pair of elastic pieces are supported by a pair of first elastic pieces that protrude from the pair of opposed pieces of the frame and approach each other, and a bent free end portion of the pair of first elastic pieces. Formed from the second elastic piece to hold,
The outer end portion of the second elastic piece can be positioned outside the free end portion of the first elastic piece closer to the opposing piece of the frame body, and the outer end portion and the holding portion can be integrated.

The holding portion includes a protrusion that forms a holding groove having a substantially V-shaped cross section or a substantially Y-shaped cross section by a pair of inclined surfaces, and the pair of inclined surfaces of the protrusions can be formed asymmetrically in the vertical and horizontal directions.
In addition, the holding portion is divided into first and second holding portions, and these are formed with a space between the second elastic pieces, and the second holding portion is arranged outside the second elastic piece with respect to the first holding portion. It is also possible to position it on the end side.

In the present invention, in order to solve the above problems, the opening of the container main body for storing the substrate is opened and closed with a detachable lid that is cleaned with cleaning water,
The retainer according to any one of claims 1 to 5 is attached to an opposing surface of the lid that faces the substrate, and the concave and convex portions of the retainer are directed to the opposing surface of the lid.

  Here, the frame in the claims may be vertically long or horizontally long. A plurality of pairs of the pair of elastic pieces and the first elastic pieces may be used. Further, the substrate includes at least various sizes of semiconductor wafers, glass wafers, liquid crystal substrates, and the like. The second elastic piece forming the elastic piece is not particularly limited. Each of the first holding portions forming the holding portion is not particularly limited to a plurality.

  Further, the substrate storage container is not limited to a front open box type, a top open box type for storing a substrate via a cassette, a bottom open box type, transparent, opaque, translucent or the like. In this case, the retainer is used as a front retainer, a rear retainer or the like according to the type of the substrate storage container.

According to the present invention, the concave and convex portions are formed on the frame to improve the drainability of the washing water, so that the drying operation can be speeded up and the substrate can be prevented from being contaminated. In addition, since a plurality of projections and depressions are formed in the longitudinal direction of the back surface facing at least the lid of the opposing piece, the cleaning water is prevented from adhering and accumulating on the retainer when the lid is washed and dried with cleaning water. be able to. As a result, there is little risk of delaying the drying operation or contamination of the substrate by the remaining cleaning water.
Moreover, when a retainer is shape | molded, it becomes possible to relieve the shaping | molding shrinkage | contraction of a retainer and to suppress a deformation | transformation by several unevenness | corrugations. Therefore, the contact accuracy between the substrate and the holding part can be improved. Furthermore, since the positioning part which fits into the positioning protrusion of a cover body is formed in the center part of the back surface of an opposing piece, a retainer can be attached to a cover body with high positioning accuracy.

  The pair of elastic pieces are supported by a pair of first elastic pieces that protrude from the pair of opposed pieces of the frame and approach each other, and a bent free end portion of the pair of first elastic pieces. A second elastic piece to be held, and the outer end portion of the second elastic piece is positioned outside the free end portion of the first elastic piece and closer to the opposing piece of the frame body. If the substrate is integrated, the substrate holding region can be expanded to stably hold the substrate. Therefore, the rotation of the substrate can be suppressed, and there is little possibility that the holding portion is shaved or the substrate is contaminated or damaged as the substrate rotates.

  Further, if the pair of inclined surfaces of the protrusions of the holding part are not formed vertically and horizontally symmetrical, but if they are formed vertically and horizontally asymmetric, there is an area where the inclined surface forming one holding groove can contact the substrate. Since it is wider than the case where it is formed symmetrically in the vertical and horizontal directions, the substrate can be reliably accommodated in the holding groove even when the positions of the substrate and the holding groove are shifted.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. A substrate storage container in this embodiment is a container body 1 for storing a plurality of round semiconductor wafers W as shown in FIGS. And a lid 10 that opens and closes the opened front portion of the container body 1 and a back retainer that is a facing surface of the lid 10 facing the accommodated semiconductor wafer W as a front retainer and holds the semiconductor wafer W. A retainer 20 is provided, and an elastic piece 29 protruding from the frame body 21 of the retainer 20 is divided into a plurality of first elastic pieces 31 and second elastic pieces 33, and each first elastic piece 31 is provided with a damper function. Like to do.

  The plurality of semiconductor wafers W are, for example, 25 or 26, and are aligned and stored in the container body 1. Each semiconductor wafer W is made of, for example, a thin disc-shaped single crystal silicon having a diameter of 300 mm, the front and back surfaces are respectively formed as mirror surfaces, and a notch n having a substantially semi-elliptical shape that facilitates alignment is cut out at the periphery. The notch n is normally located on the front side of the container body 1 which is open. In the vicinity of the notch n, a barcode that is read by a reading device (not shown) is formed along the periphery. Such a semiconductor wafer W is taken in and out of the container body 1 with the peripheral edges of the both sides being handled by a dedicated robot (not shown).

  The container body 1 and the lid 10 of the substrate storage container are molded using a molding material such as polypropylene, cycloolefin polymer, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyether ether ketone, polyacetal, polyether imide, or the like. The Among these molding materials, selection of polycarbonate having excellent transparency and high rigidity is optimal. An appropriate amount of an antistatic agent, a conductivity imparting agent such as carbon or metal fiber, an ultraviolet absorber, or a reinforcing agent such as glass fiber or carbon fiber is selectively added to these molding materials.

  As shown in FIG. 1, the container body 1 is formed in a front open box type having an open front portion, and stores a plurality of semiconductor wafers W in a state of being vertically aligned at a predetermined interval. The container body 1 has a pair of left and right teeth that horizontally support the semiconductor wafer W facing each other on both sides of the container body 1 and arranged in a vertical direction at a predetermined pitch.

  Although not shown, each tooth is formed integrally with the inner side of the container body 1 and has a substantially rectangular, substantially square, or substantially semicircular arc shaped shelf board along the side edge of the semiconductor wafer W, and the shelf board. And a flat substrate contact portion integrally formed on the front surface of the container main body 1 on the shelf, and a step for regulating the position of the semiconductor wafer W together with the inner wall surface of the container main body 1 is formed. Such multiple pairs of teeth function to support the periphery of both sides of the semiconductor wafer W with high precision and to prevent the semiconductor wafer W from tilting in the vertical direction and making it difficult for a dedicated robot to put in and out. To do.

  Positioning tools (not shown) that are positioned on a processing device (not shown) on which the substrate storage container is mounted are integrally formed on both the front side and the rear center of the bottom surface of the container body 1. Are formed in a substantially M-shaped cross section, a substantially V-shaped cross-section, a substantially Y-shaped cross section, and the like. A flat rectangular robotic flange (not shown) that is gripped by an automatic transport mechanism (overhead hoist transfer) (not shown) is detachably attached to the center of the ceiling of the container body 1. Moreover, between the upper and lower sides of the both side walls of the container main body 1 are manually operated handles 2 that extend obliquely in the vertical direction.

  As shown in FIG. 1 and FIG. 2, the lid 10 is mounted and exposed on a substantially rectangular front case 11 corresponding to the front part of the container body 1 and on the left and right sides of the open surface of the case 11. A pair of surface plates is provided, and a locking mechanism for locking that is operated by an external operation is built in between the housing 11 and the pair of surface plates, and the lid body is opened and closed on the front portion of the container body 1. The device is detachably fitted through the seal gasket 12.

  The casing 11 of the lid 10 is basically formed in a substantially dish-shaped cross section having an endless seal gasket 12 on the outer peripheral surface, and the center of the surface is formed to bulge into a substantially rectangular front surface. As the central portion bulges, both side portions are separated to form a space for incorporating a locking mechanism, and the rear central portion 13 is recessed in a substantially rectangular shape to form a space for mounting the retainer 20 (FIGS. 7 to 7). 10).

  The seal gasket 12 is formed into a frame shape using, for example, an elastic polyester-based thermoplastic elastomer or the like, and is compressed and deformed when the lid body 10 is fitted to exhibit a sealing function. In addition, although not shown, the locking mechanism is a pair of rotating plates that are pivotally supported at the center of the left and right sides of the surface of the housing 11 and are operated to rotate from the outside. A pair of advancing and retreating plates that slide on each other, and a locking claw that is rotatably connected to the front end of each of the advancing and retreating operation plates and engages with a locking hole that is perforated on the inner peripheral edge of the front surface of the container body 1 The surface plate of the lid 10 is covered.

  A pair of left and right positioning projections 14 for positioning the frame 21 of the retainer 20 are disposed on the recessed rear surface central portion 13 of the housing 11, and a plurality of stoppers 15 facing the first elastic piece 31 of the retainer 20. And the stoppers 15 function to restrict excessive deformation and breakage of the first elastic piece 31 (see FIGS. 7, 9, and 10). The stopper 15 is formed in an arbitrary shape such as a columnar shape or a trapezoidal shape. Further, as shown in FIG. 2, a plurality of engagement claws 16 that are detachably engaged with the surface of the frame body 21 are arranged in the vertical direction on both the left and right sides of the rear surface central portion 13 of the housing 11. The claw 16 is bent and formed into a J shape, an L shape, or the like.

  As shown in FIGS. 2 to 5, etc., the retainer 20 has a pair of elastic frames 21 that are attached to the lid body 10 and a pair of elastic members that protrude from the pair of opposed pieces 22 of the frame body 21 and approach each other. A piece 29 and a holding part 30 formed on the pair of elastic pieces 29 and holding the front peripheral edge of the semiconductor wafer W are provided, and the pair of elastic pieces 29 protrude from the pair of opposed pieces 22 of the frame body 21, respectively. A pair of first elastic pieces 31 and a second elastic piece 33 which is supported by the bent free end portions 32 of the pair of first elastic pieces 31 and extends in the peripheral direction of the semiconductor wafer W to hold it. At the same time, the holding unit 30 is divided into first and second holding units 35 and 36, and is wet-cleaned separately from the lid body 10 or separately from the lid body 10, or is subjected to a drying operation. .

  The retainer 20 is a molding material such as synthetic resin such as polypropylene, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyether ether ketone, polyacetal, polyether imide, polyester-based thermoplastic performance elastomer, polyurethane-based thermoplastic performance elastomer, and the like. Is molded using. Among these molding materials, it is optimal to select polybutylene terephthalate, which has less outgassing and damage during molding. An appropriate amount of an antistatic agent, a conductivity imparting agent such as carbon or metal fiber, an ultraviolet absorber, or a reinforcing agent such as glass fiber or carbon fiber is selectively added to these molding materials.

  As shown in FIGS. 2 to 5, 8, and the like, the frame body 21 of the retainer 20 includes a pair of facing pieces 22 that extend in the vertical direction of the lid body 10 in parallel and spaced apart from each other, and the pair of facing pieces. A pair of installation pieces 23 installed horizontally between the upper and lower end portions of each of the two pieces 22 are sandwiched and fitted to the positioning projections 14 of the lid 10 at the center of the rear surface of each facing piece 22 to improve the positioning accuracy. A positioning portion 24 is formed in a recessed manner, and each erected piece 23 is formed with a spring-like bent portion 25 protruding in the direction of the semiconductor wafer W, and a plurality of engaging claws are formed in the recessed rear surface central portion 13 of the lid 10. 16 is detachably mounted via 16.

  At the four corners of the front surface of the frame body 21, front substantially I-shaped ribs 26 extending in the direction of the semiconductor wafer W and capable of being gripped are projected and formed, and the plurality of ribs 26 improve the mounting property or retainer 20. The holding part 30 is effectively prevented from being deformed by the action of the load during the stocking. Further, when the plurality of retainers 20 are stacked, a stacking function is exhibited, and deformation due to contact of the first elastic piece 31 and the second elastic piece 33 is prevented. The height of each rib 26 is preferably such that when the plurality of retainers 20 are stacked, the holding portions 30 of the other retainers 20 adjacent to the retainer 20 are not in contact with each other.

  As shown in FIG. 3, a plurality of escape grooves 27 that improve the detachability of the retainer 20 are arranged at intervals on the surface edge of each facing piece 22, and the housing is formed in a region where the escape grooves 27 are not formed. 11 engaging claws 16 are detachably engaged from the outside. Further, as shown in FIG. 8, a plurality of irregularities 28 are alternately formed at intervals in the back surface longitudinal direction of each facing piece 22 facing the lid body 10, and the plurality of irregularities 28 are formed by cleaning the retainer 20. Improves drainability during drying.

  As shown in FIG. 5 and FIG. 7, each bent portion 25 is formed in a substantially U-shaped curve at the center of the installation piece 23, and is deformed so as to be narrowed by a gripping operation, so that the retainer 20 has a substantially rectangular shape in cross section. The mounting operation of mounting the retainer 20 on the back surface central portion 13 of the lid body 10 via the engaging claws 16 is made smooth.

  As shown in FIGS. 5 to 7 and the like, the pair of first elastic pieces 31 protrude inward from the pair of opposed pieces 22 of the frame body 21 and approach each other at intervals. A plurality are arranged at a predetermined pitch in the vertical direction. Each of the first elastic pieces 31 is arranged in parallel with the erected piece 23 of the frame body 21 by bending into a substantially elongated L shape that can be deformed following the movement of the semiconductor wafer W, as shown in FIGS. The short free end portion 32 is directed in the direction of the semiconductor wafer W, and the back surface of the bent portion faces the stopper 15 of the lid body 10 with an interval.

  As shown in FIGS. 5 to 7 and the like, the second elastic piece 33 is formed in a slightly bent plate piece along the front peripheral edge of the semiconductor wafer W, and the central portion is substantially U-shaped in the direction of the first elastic piece 31. A shallow dent is formed. The second elastic piece 33 is installed between the bent free ends 32 of the pair of first elastic pieces 31 and is disposed in parallel to the installation piece 23 of the frame body 21 and the first elastic piece 31. An outer end 34 is located outside the free end 32 of the elastic piece 31 and closer to the facing piece 22 of the frame body 21, and holds the semiconductor wafer W via the first and second holding portions 35 and 36. To do.

  As shown in the figure, the first and second holding portions 35 and 36 are displaced slightly from the central portion of the second elastic piece 33 in the left and right direction, in other words, the first holding portion forming region 37. A pair of left and right first holding portions 35 are formed integrally with each other, and both outer end portions 34 of the second elastic piece 33, in other words, a second holding portion 36 is integrally formed with the second holding portion forming region 38. The second holding part 36 is located at the outer end 34 of the second elastic piece 33 rather than the first holding part 35.

  As shown in FIGS. 2 and 5 to 7, the first and second holding portions 35, 36 are narrow holding grooves each having a substantially V-shaped or Y-shaped cross section by a pair of opposed inclined surfaces 39. Each of the projections 41 forming the projection 40 is provided, and the front peripheral edge of the semiconductor wafer W is guided in the holding groove 40 of the projection 41 and is positioned and clamped.

  As shown in FIGS. 5 to 7, 9, and the like, the pair of first holding portions 35 are arranged at the center of the semiconductor wafer W with the notch n of the semiconductor wafer W sandwiched before the second holding portion 36. It works to keep the line neighborhood. In the first holding portion 35, a pair of inclined surfaces 39 of a substantially block-shaped protrusion 41 is formed asymmetrically in the vertical and horizontal directions, and the pair of inclined surfaces 39 is more than the pair of inclined surfaces 39 in the second holding portion 36. Is also formed high. That is, the pair of inclined surfaces 39 of the protrusion 41 is formed such that one is high and the other is low from the viewpoint of reliably guiding the semiconductor wafer W to the holding groove 40, and the left and right sides of the center line of the plane of the semiconductor wafer W are sandwiched. Exhibits asymmetry.

  As shown in FIGS. 5 to 7, 9, etc., each second holding part 36 has a protrusion 41 from the viewpoint of stably holding the semiconductor wafer W aligned at a predetermined position by the first holding part 35. In addition, the holding groove 40 is formed to extend in the peripheral direction of the semiconductor wafer W. The height of the second holding portion 36 is adjusted to a height that does not protrude from the back surface of the lid 10.

  In the above configuration, when the retainer 20 is attached to the lid body 10, first, the pair of bent portions 25 of the frame body 21 are each gripped to deform the frame body 21 into a substantially square shape in cross section. The frame body 21 is laminated on the back surface central portion 13 of the lid body 10 so as not to interfere with the engaging claw 16, and then the gripping operation of each bent portion 25 is released to return the frame body 21 to its original state and width. Then, the retainer 20 can be mounted appropriately and firmly by engaging the engaging claw 16 of the lid 10 with the region where the escape groove 27 is not formed.

  According to the above configuration, the pair of bent portions 25 are formed on the retainer 20 to give elasticity in advance, so that there is no need to deform the frame body 21 of the retainer 20 to be large and strong. Therefore, there is very little possibility that the retainer 20 will be deformed by mistakenly applying an excessive force when the retainer 20 is mounted.

  Further, even if the retainer 20 is formed in a large size, it is not necessary to form a large number of engaging claws 16 and escape grooves 27, etc., so that the mounting operation can be made smooth and easy, and the working efficiency is remarkably improved. Can be made. In addition, since a plurality of escape grooves 27 are arranged on the outer peripheral edge of the frame body 21, if the gripping operation is performed using the escape grooves 27, the removal work of the attached retainer 20 is greatly simplified and facilitated. I can expect.

  Next, a case where the lid 10 is fitted to the opened front portion of the container main body 1 in which a plurality of semiconductor wafers W are aligned and stored via the retainer 20 will be described. In this case, the inclined surface 39 of the first holding unit 35 first comes into contact with the front peripheral edge of the semiconductor wafer W, and the retainer 20 is adjusted to adjust the position of the semiconductor wafer W along the inclined surface 39 in this state. It approaches along the center line of the wafer W, and the inclined surface 39 of the second holding part 36 also contacts the semiconductor wafer W. In this state, the semiconductor wafer W is stored in the holding grooves 40 of the first and second holding portions 35 and 36.

  In a state where the lid 10 is completely fitted to the opened front portion of the container body 1, the second elastic piece 33 including the first and second holding portions 35 and 36 is placed on the center line of the semiconductor wafer W. The semiconductor wafer W moves in parallel along the shape of the semiconductor wafer W, and the semiconductor wafer W is held. At this time, the first elastic piece 31 supporting the second elastic piece 33 is deformed in the thickness direction of the lid body 10, and the repulsive force accompanying this deformation is transmitted to the second elastic piece 33, whereby the semiconductor wafer W Is firmly held.

  Next, a description will be given of a case where vibration or impact during transportation of the substrate storage container acts on the semiconductor wafer W to cause a shift in the semiconductor wafer W. In this case, a force is exerted on either side of the semiconductor wafer W (see FIG. 10) (see the arrow 10), but at this time, the pair of first elastic pieces 31 that support the second elastic piece 33 are individually deformed asymmetrically to relieve the stress. The portions 35 and 36 are kept in contact with the semiconductor wafer W.

  As a result, it is possible to effectively suppress and prevent the semiconductor wafer W from coming off or rotating from the holding grooves 40 of the first and second holding portions 35 and 36. Further, since the contact state with the semiconductor wafer W is maintained, the generation of particles due to rubbing with the semiconductor wafer W can be effectively reduced.

  According to the above configuration, since the plurality of projections and depressions 28 are formed in the longitudinal direction of the back surface of the facing piece 22 facing the lid 10, the retainer 20 is washed when the lid 10 is washed and dried with circulating washing water. It is possible to suppress and prevent water from adhering and accumulating. As a result, there is no possibility that the drying operation is delayed or the semiconductor wafer W is contaminated by the remaining cleaning water. In addition, the plurality of projections and depressions 28 can relieve molding shrinkage during molding of the retainer 20 and suppress deformation. Therefore, the contact accuracy between the semiconductor wafer W and the first and second holding portions 35 and 36 can be remarkably improved.

  In addition, the elastic piece 29 of the retainer 20 is divided into a first elastic piece 31 and a second elastic piece 33, and only the first elastic piece 31 is deformed, and the first and second holding portions 35 in the second elastic piece 33. Since the relative position with respect to the 36 semiconductor wafers W is not changed, the holding area of the semiconductor wafers W can be expanded and the semiconductor wafers W can be stably held continuously. Therefore, the rotation of the semiconductor wafer W can be restricted, and the first and second holding portions 35 and 36 are scraped along with the rotation of the semiconductor wafer W to generate particles. There is no risk of damage.

  Further, since it is not necessary to restrict the rotation of the semiconductor wafer W by increasing the holding force of the first and second holding portions 35 and 36, it is large when the lid 10 is fitted to the front portion of the container body 1. There is no resistance. Thereby, the lid body 10 can be smoothly fitted to the container body 1. Furthermore, since the first holding part 35 is paired with the second holding part 36, a gap is formed between the first holding part 35 and the second holding part 36, so that there is no hindrance to the visual confirmation and reading operation of the barcode of the semiconductor wafer W.

Next, FIGS. 11 and 12 show a second embodiment of the present invention. In this case, the elastic piece 29 of the retainer 20 is not divided into the first elastic piece 31 and the second elastic piece 33. Each elastic piece 29 is formed in a substantially L shape, and the holding portion 30 is integrally formed on the linear free end portion.
A plurality of concave portions are arranged and perforated on both sides of the back surface central portion 13 of the lid body 10. In addition, a plurality of engaging claws 16 that interfere with the concave portion of the lid body 10 are juxtaposed and formed on the frame body 21 of the retainer 20. Further, a stopper 15 that prevents excessive deformation and breakage of each elastic piece 29 is selectively formed on the back surface of each elastic piece 29.

The holding unit 30 includes a protrusion 41 that forms a narrow holding groove 40 having a substantially V-shaped or substantially Y-shaped cross section by a pair of opposed inclined surfaces 39, and the holding groove 40 of the protrusion 41 has a semiconductor groove W formed on the holding groove 40. The front periphery is guided and positioned. The pair of inclined surfaces 39 of the holding part 30 are formed asymmetrically in the vertical and horizontal directions. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.
In the present embodiment, it is obvious that the same operational effects as those of the above embodiment can be expected, and that the configuration of the retainer 20 can be expected to be diversified.

  Next, FIGS. 13 to 15 show a third embodiment of the present invention. In this case, a substrate storage container is used for aligning a plurality of semiconductor wafers W in a container body 1A having an open top surface. A top open box type that is arranged and stored via the cassette 3 and is an upper edge that is a peripheral edge of a plurality of semiconductor wafers W arranged in the horizontal direction on the ceiling inner surface of the lid 10A that covers the container body 1A and the upper opening of the cassette 3 A retainer 20 that holds the periphery is detachably mounted.

  As shown in FIGS. 14 and 15, the frame body 21 of the retainer 20 has a pair of parallel pieces 45 that are parallel to the opposing piece 22 and are installed between a pair of opposing installation pieces 23 at intervals. Between each opposing piece 22 and each parallel piece 45, a plurality of elastic pieces 29 arranged in the longitudinal direction of these 22 and 45 are installed, and each elastic piece 29 holds the upper peripheral edge of the semiconductor wafer W. A holding portion 30 is integrally formed.

Between the pair of parallel pieces 45, a rectangular space 46 positioned substantially at the center of the frame body 21 is formed in an elongated shape. Each elastic piece 29 is curved so as to approach the upper peripheral edge of the semiconductor wafer W. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.
In the present embodiment, it is obvious that the same operational effects as those of the above embodiment can be expected, and that the configuration of the retainer 20 can be expected to be diversified.

  In the above embodiment, the semiconductor wafer W having a diameter of 300 mm is shown. However, the present invention is not limited to this. For example, the semiconductor wafer W having a diameter of 200 mm or 450 mm may be used. Further, although the teeth are integrally formed on both inner sides of the container body 1, separate teeth may be attached to both sides of the container body 1 later by using fixed parts, frictional engagement, or the like. Further, a required number of ribs 26 having a substantially L-shaped front surface may be formed on the surface of the frame body 21 so as to protrude. Moreover, you may form the some unevenness | corrugation 28 in the back surface facing the cover body 10 of the installation piece 23. FIG. Further, the bent portion 25 can be formed in a substantially C shape, a substantially V shape, or the like.

  Further, the entire bent piece 23 may be curved in an arc shape to form the spring-like bent portion 25, or the spring-like bent portion 25 may be formed not on the installed piece 23 but on the opposing piece 22. Further, the positioning protrusions 14 and the positioning portions 24 can be arranged symmetrically in the left-right direction or asymmetrically arranged in the left-right direction to improve the directionality when the retainer 20 is mounted.

  It is also possible to arrange the positioning protrusions 14 and the positioning portions 24 symmetrically and to newly form irregularities or the like indicating the vertical directionality on the frame body 21. It is also possible to form the positioning portion 24 in the center of the back surface 13 of the lid body 10 and to form the positioning projection 14 on the opposing piece 22 of the frame body 21. Further, the first elastic piece 31 can be formed in a J shape, an S shape, a Z shape, or the like.

It is a whole perspective explanatory view showing typically an embodiment of a substrate storage container concerning the present invention. It is explanatory drawing which shows typically the back surface of the cover body in embodiment of the substrate storage container which concerns on this invention. It is front explanatory drawing which shows typically embodiment of the retainer which concerns on this invention. It is side explanatory drawing which shows typically embodiment of the retainer which concerns on this invention. It is an end face explanatory view showing typically an embodiment of a retainer concerning the present invention. It is principal part perspective explanatory drawing which shows typically embodiment of the retainer which concerns on this invention. It is explanatory drawing which shows typically the mounting work state in embodiment of the retainer which concerns on this invention. It is a section explanatory view showing typically a positioning state of a lid and a retainer in an embodiment of a substrate storage container concerning the present invention. It is explanatory drawing which shows typically the holding | maintenance state of the semiconductor wafer in embodiment of the retainer which concerns on this invention, and a substrate storage container. It is explanatory drawing which shows typically embodiment of the retainer and board | substrate storage container which concern on this invention. It is explanatory drawing which shows typically the cover body etc. in 2nd Embodiment of the retainer and board | substrate storage container which concern on this invention. It is explanatory drawing which shows typically 2nd Embodiment of the retainer and board | substrate storage container which concern on this invention. It is a whole perspective explanatory view showing a 3rd embodiment of a retainer and a substrate storage container concerning the present invention typically. It is front explanatory drawing which shows typically the retainer in 3rd Embodiment of the retainer and board | substrate storage container which concern on this invention. It is side surface explanatory drawing which shows typically 3rd Embodiment of the retainer and board | substrate storage container which concern on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Container main body 1A Container main body 10 Cover body 10A Cover body 11 Housing | casing 13 Back surface center part 14 Positioning protrusion 15 Stopper 16 Engagement claw 17 Fixing protrusion 20 Retainer 21 Frame body 22 Opposing piece 23 Positioning piece 24 Positioning part 25 Bending part 26 Rib 27 Escape groove 28 Concavity and convexity 29 Elastic piece 30 Holding portion 31 First elastic piece 32 Free end portion 33 Second elastic piece 34 Outer end portion 35 First holding portion 36 Second holding portion 39 Inclined surface 40 Holding groove 41 Projection 45 Parallel piece W Semiconductor wafer (substrate)

Claims (6)

A frame body mounted on the lid body, a pair of elastic pieces projecting from the pair of opposing pieces of the frame body, and a holding part formed on the pair of elastic pieces to hold the peripheral edge of the substrate. A retainer which is washed with washing water,
The frame body is formed of a pair of facing pieces facing each other at an interval, and a pair of erected pieces respectively installed between both ends of the pair of facing pieces , and at least the facing pieces of the facing pieces and the erected pieces are opposed to each other. In the longitudinal direction of the back surface facing the lid of the piece, a plurality of concave and convex portions that improve the drainability of the washing water are alternately formed at intervals, and in the center of the back surface of the facing piece, the positioning projection of the lid A retainer characterized in that a positioning portion for fitting and improving positioning accuracy is formed in a recess .   The retainer according to claim 1, wherein a spring-like bent portion that deforms the frame body is formed on at least one of the opposing piece and the installation piece of the frame body, and a positioning portion is formed. The pair of elastic pieces are supported by the pair of first elastic pieces that protrude from the pair of opposing pieces of the frame and approach each other, and the bent free ends of the pair of first elastic pieces to hold the substrate. Formed from the second elastic piece,
The outer end portion of the second elastic piece is positioned outside the free end portion of the first elastic piece closer to the opposing piece of the frame body, and the outer end portion and the holding portion are integrated. The retainer according to 2.   The holding part includes a protrusion that forms a holding groove having a substantially V-shaped or substantially Y-shaped cross section by a pair of inclined surfaces, and the pair of inclined surfaces of the protrusions are formed asymmetrically in the vertical and horizontal directions. Retainer.   The holding portion is divided into first and second holding portions, and these are formed with a space between the second elastic pieces, and the second holding portion is arranged outside the first elastic piece with respect to the outer end portion of the second elastic piece. The retainer according to claim 4, wherein the retainer is positioned on a side. A substrate storage container that opens and closes an opening of a container body that stores a substrate with a removable lid that is cleaned with cleaning water,
6. A substrate storage container, wherein the retainer according to any one of claims 1 to 5 is attached to a facing surface of the lid facing the substrate, and the concave and convex portions of the retainer are directed to the facing surface of the lid.

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