JP4841898B2 - Cleaning semiconductor chip tray - Google Patents

Description

  The present invention relates to a cleaning semiconductor chip tray for storing a semiconductor chip coated with a resist on the surface and removing the resist by immersion in a solvent.

  In the manufacture of semiconductor devices, the resist applied on the silicon wafer during the manufacturing process is usually removed in the state of the silicon wafer and then divided into individual semiconductor chips. However, a special structure such as a diaphragm structure is used. In the case of a structure in which a plurality of fine structures are formed, in order to protect the fine structures, it is necessary to form chips with a resist provided on the surface, and then to remove the resist using a solvent.

On the other hand, since the semiconductor chip formed into a chip is accommodated in a semiconductor chip tray for temporary storage or transportation, it is preferable if the resist of the semiconductor chip can be removed while being accommodated in the semiconductor chip tray. However, the conventional semiconductor chip tray is made only for the purpose of containing the semiconductor chip and handling it safely without being damaged.
Japanese Patent Laid-Open No. 7-254637

  For this reason, the conventional semiconductor chip tray is not suitable for immersion in a solvent in order to remove the resist provided on the surface of the semiconductor chip in terms of material and structure. There are problems such as incomplete removal and removal of the semiconductor chip from the tray. The present invention has been made to solve these problems, and provides a cleaning semiconductor chip tray that can be immersed in a solvent in a state in which a semiconductor chip is accommodated to remove a resist provided on the surface of the semiconductor chip. Objective.

  In order to achieve the above object, the cleaning semiconductor chip tray 1 according to the present invention is made of a material insoluble in a solvent, for example, thinner, for example, aluminum or stainless steel. Are provided on the opposite side of the front surface side with a horizontal direction restricting portion 2 for restricting the movement of the semiconductor chip 100 in the horizontal direction and a vertical direction restricting portion 3 for restricting the movement of the semiconductor chip 100 in the vertical direction. The upper horizontal grooves 4 that extend in parallel with each other are alternately arranged, and the horizontal restriction portions 2 and the vertical restriction portions 3 extend in parallel with each other and perpendicular to the upper horizontal grooves 4. The upper vertical groove 5 is formed deeper than the upper horizontal groove 4, and an extended portion 6 having an expanded width is provided at a portion corresponding to the horizontal direction restricting portion 2, Half The four corners of the body chip 100 should be supported by the bottom surface of the upper horizontal groove 4, and the bottom surface of each upper vertical groove 5 is provided with vertical groove through-holes 7 in portions corresponding to the respective extension portions 6, respectively. The bottom surface of the upper horizontal groove 4 is provided with a horizontal groove through hole 8 corresponding to the central portion of each regulating portion 2, 3, and a flat portion 14 is provided on the four peripheral edges, while each vertical groove through hole 7 is provided on the back side. Corresponding to the horizontal direction restricting portion 2, a lower lateral groove 10 extending in parallel with the upper lateral groove 4 is provided so as to connect the tapered concave portions 9 in a row, and the lateral groove penetrating A lower vertical groove 13 communicating with the hole 8 and extending so as to be orthogonal to the lower horizontal groove 10 is provided, and a projecting edge portion 11 is provided on the four peripheral edges corresponding to the flat portion 14. The cleaning semiconductor chip tray 1 is used as a lid body that places the protruding edge portion 11 on a flat portion 14 on the surface side of another cleaning semiconductor chip tray 1 and restricts movement of the semiconductor chip 100 in the thickness direction. .

  According to the present invention, the semiconductor chip is accommodated in the portion regulated by the horizontal direction regulating portion and the vertical direction regulating portion of the tray, and the other cleaning semiconductor chip tray according to the present invention is overlaid in the solvent tank. By soaking, the solvent can be introduced into the cleaning semiconductor chip tray from each through hole of the cleaning semiconductor chip tray, and the solvent can be uniformly distributed through the grooves of the cleaning semiconductor chip tray. The resist provided on the surface of the semiconductor chip can be removed reliably and easily.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. The cleaning semiconductor chip tray 1 (hereinafter, simply referred to as the tray 1) is shown in FIG. 1 with the portion omitted, and FIG. 2 shows the back side, and is insoluble in a known solvent such as thinner. Made of various materials such as aluminum and stainless steel. The tray 1 mounts the semiconductor chip 100 (see FIGS. 5 and 7) on the surface side on the surface opposite to the resist 101 application surface.

  As shown in FIG. 1 and FIG. 5 which is a partially enlarged view thereof, on the surface side of the tray 1, a lateral regulating portion 2 that regulates the lateral movement (width direction) of the semiconductor chip 100 and the semiconductor chip 100. The vertical direction restricting portions 3 for restricting the movement in the vertical direction (length direction) are alternately arranged with the upper horizontal grooves 4 extending in parallel with each other. And each horizontal direction control part 2 and each vertical direction control part 3 are arranged in series by sandwiching the upper vertical groove 5 extending parallel to each other and orthogonal to the upper horizontal groove 4.

  Further, the upper vertical groove 5 is formed deeper than the upper horizontal groove 4 (see FIGS. 6 and 7), and an extended portion 6 having an expanded width is provided at a portion corresponding to the lateral restriction portion 2 of the upper vertical groove 5. Thus, the four corner portions of the semiconductor chip 100 are supported by the bottom surface of the upper lateral groove 4 (see FIGS. 5 and 7). On the bottom surface of each upper vertical groove 5, a vertical groove through hole 7 having a diameter larger than the width of the upper vertical groove 5 is provided in a portion corresponding to each expansion portion 6, while the bottom surface of each upper horizontal groove 4 is provided. Corresponding to the central part of each regulating part 2, 3 is provided with a lateral groove through-hole 8 having an approximately equal width and diameter of the upper lateral groove 4. Further, flat portions 14 are formed on the four peripheral edges. The flat portion 14 is located slightly lower than the bottom surface of the upper vertical groove 5.

  As shown in FIG. 2, on the back side of the tray 1, tapered concave portions 9 are provided concentrically corresponding to the respective longitudinal groove through holes 7, and the tapered concave portions 9 are connected in a row in the horizontal direction. A lower lateral groove 10 extending in parallel with the upper lateral groove 4 is provided corresponding to the restriction portion 2 and the upper and lower sides. Both ends of the lower lateral groove 10 communicate with side through-holes 12 formed on a pair of opposing side portions of the projecting edge portion 11 provided at the four peripheral edges (see FIGS. 4 and 6). Further, on the back side of the tray 1, a lower vertical groove 13 extending so as to be orthogonal to the lower horizontal groove 10 is provided. The lower vertical groove 13 extends in parallel with the upper vertical groove 5 so as to communicate with the horizontal groove through hole 8.

  As shown in FIG. 2, the projecting edge portion 11 has a rounded inner surface at the four corners, and a chamfered portion 11 a on the outer surface of the one corner portion. The protruding edge portion 11 is located on a flat portion 14 provided on the four peripheral edges on the surface side of the other tray 1. As shown in FIG. 1, a chamfered portion 14a is formed on the outer surface of one corner of the flat portion 14, and the double-sided chamfered portions 11a and 14a are made to correspond to each other when aligning the trays 1 with each other. To do. Further, the corners of the four vertical direction restricting portions 3 a corresponding to the rounded inner surfaces at the four corners of the projecting edge portion 11 protrude about 0.2 mm from the flat portion 14. This acts to restrict movement of the mounted chip 100 in the thickness direction when one tray 1 is overlaid on another tray 1. This protrusion creates a space between the flat portion 14 of one tray 1 and the protruding edge portion 11 of the other tray 1, and the amount of solvent flowing in and out increases, improving the resist cleaning performance. .

  Then, the usage method of the tray 1 mentioned above is demonstrated. The chip 100 provided with the resist 101 on the surface is placed so as to correspond to the extended portion 6 on the surface side of the tray 1 so that the back side of the four corners is located on the bottom surface of the upper horizontal groove 4. The chip 100 in the mounted state is formed by two horizontal direction restricting portions 2 positioned so as to be sandwiched from the horizontal direction and four vertical direction restricting portions 3 positioned at four corners so as to be sandwiched from the vertical direction. The positioning is such that the movement of the chip 100 in the width direction and the length direction) is restricted, and the upper vertical groove 5 and the vertical groove through hole 7 are positioned on the back surface side.

  In this way, after the chip 100 to be cleaned is placed at a predetermined position, another tray 1 is placed on the placed tray 1 and the chamfered portions 11a and 14a of the projecting edge portion 11 and the flat portion 14 are placed. Are overlaid at corresponding positions (see FIG. 7). In this state, the surface side of each chip 100 faces the vertical groove through hole 7 in a position corresponding to the space formed by the tapered recess 9 without the resist 101 portion coming into contact with other members. Then, when the chip 100 moves in the thickness direction, point movement with the tapered recess 9 is made at at least one of the four apexes, thereby restricting movement in the vertical direction (thickness direction of the chip 100).

  As shown in FIG. 7, the number of trays 1 is determined according to the number of chips 100 to be cleaned, and the number of trays 1 added to this number is used by being superposed. That is, the uppermost tray 1 is used only as a lid, and the chip 100 is not placed thereon. Then, when the tray 1 thus superposed is gripped by a known gripping tool (not shown) and immersed in a known solvent tank (not shown) in the same manner as in the prior art, the solvent is Each vertical groove through-hole 7 and each horizontal groove through-hole 8 opened on both sides and the side through-hole 12 opened on the side face flow into the tray 1 and each groove 4 communicated with each through-hole 7, 8, 12. , 5, 10, 13, and evenly spread to the accommodation space of each chip 100.

  In addition, the grooves 4, 5, 10, 13 and the through holes 7, 8, 12 facilitate circulation of the solvent between the inside and the outside of the tray 1. Not only does the solvent spread uniformly to each chip 100, but also the solvent mixed in the tray 1 (between the stacked tray 1 and the tray 1) flows out of the tray 1 and the solvent from the outside of the tray 1. This structure is easy to flow into the tray 1.

  In this way, the resist 101 can be removed without unevenness by contacting the resist 101 on the surface of each chip 100 accommodated in the tray 1 without any excess solvent.

  In addition, this invention is not limited to embodiment mentioned above, For example, the magnitude | size of the tray 1, ie, the accommodation number of the chip | tip 100 in the tray 1, can be changed, and each control part 2, 3 is changed according to this. The numbers of the grooves 4, 5, 10, 13, the through holes 7, 8, 12 and the tapered recesses 9 are also changed.

FIG. 3 is a schematic plan view showing a cleaning semiconductor chip tray with a part of the surface side omitted. The schematic top view which abbreviate | omits a part of back side similarly. Similarly a schematic front view. AA sectional view taken on the line AA of FIG. The partial enlarged plan view which shows a semiconductor chip accommodation state. FIG. 3 is a sectional view taken along line BB in FIG. 1. FIG. 4 is a schematic partial enlarged cross-sectional view showing a superposed state of cleaning semiconductor chip trays.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cleaning semiconductor chip tray 2 Horizontal direction control part 3 Vertical direction control part 4 Upper horizontal groove 5 Upper vertical groove 6 Expansion part 7 Vertical groove through hole 8 Horizontal groove through hole 9 Tapered recessed part 10 Lower horizontal groove 11 Projection edge part 12 Side part through hole 13 Lower vertical groove 14 Flat part

Claims (1)

A semiconductor chip tray containing a semiconductor chip coated with a resist on the surface and made of a material insoluble in a solvent for immersing in a solvent to remove the resist,
On the surface side where the semiconductor chip is placed on the surface opposite to the resist coating surface, a lateral direction restricting portion for restricting the lateral movement of the semiconductor chip and a longitudinal direction restriction for restricting the vertical movement of the semiconductor chip. Are arranged alternately with the upper horizontal grooves extending in parallel to each other, and the horizontal restriction portions and the vertical restriction portions are parallel to each other and extend vertically to the upper horizontal grooves. The upper vertical groove is formed deeper than the upper horizontal groove, and an extended portion having an expanded width is provided at a portion sandwiched between the horizontal restriction portions, so that the four corner portions of the semiconductor chip are provided. No order to support the bottom surface of the upper transverse grooves, said each provided longitudinal grooves through hole in the portion corresponding position to the center of each extension portion of each upper longitudinal groove, said each upper lateral grooves each restricting portion its transverse grooves through hole in a position corresponding to the central portion Each provided, while a four periphery of cleaning a semiconductor chip tray is provided a flat portion, as on the back side, a tapered recess provided corresponding to the longitudinal grooves through holes connecting these tapered recess in a row , together with the lateral regulation portion of the corresponding positioned below provided beneath lateral grooves extending parallel to the transverse grooves on the provided under longitudinal groove extending the to be orthogonal to the lateral groove through-hole and communicating and the lower lateral grooves, washed cleaning the semiconductor chip trays, characterized in that a projecting edge corresponding position below the flat portion to the four peripheral edges of the semiconductor chip tray.

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