JPH03232228A - Liquid processor of semiconductor wafer - Google Patents

Liquid processor of semiconductor wafer

Info

Publication number
JPH03232228A
JPH03232228A JP2882290A JP2882290A JPH03232228A JP H03232228 A JPH03232228 A JP H03232228A JP 2882290 A JP2882290 A JP 2882290A JP 2882290 A JP2882290 A JP 2882290A JP H03232228 A JPH03232228 A JP H03232228A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
liquid
wafers
shown
cleaning up
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2882290A
Other versions
JP2837725B2 (en )
Inventor
Masanori Kobayashi
Kazuji Nakajima
Tadayoshi Yoshikawa
Original Assignee
Fujitsu Ltd
Fujitsu Vlsi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To avoid the occurrence of uneven processings, dust adherence etc., on the mirror surface by a method wherein processing liquid feeding pipes are provided on the lower part near the bottom surface of a liquid processing vessel for detachably retaining multiple semiconductor wafers in the erected state.
CONSTITUTION: A retainer 2 wherein multiple wafers 1 are inserted is set in a washing up vessel 10 striding across the first liquid feeding pipe 11 so that cleaning up liquid 6 may be fed from the first and second liquid feeding pipes 11 and 12 as shown by arrows W1 and W2. The cleaning up liquid 6 is jetted from pores 11a to be lifted between respective wafers 1 as shown by the arrow W2 for cleaning up the surfaces of respective wafer 1. On the other hand, the cleaning up liquid fed from the pipe 12 is mixed with the cleaning up liquid 6 fed from the pipe 11 to be drained from a liquid drainage pipe 13 as shown by the other arrow W5. Respective wafers 1 retained by the retainer 2 are pressed down in the running direction as shown by the other arrow W4 so that the wafers 1 may be cleaned up in the oblique state almost the same direction within the allowable width range of the guide grooves 2e.
COPYRIGHT: (C)1991,JPO&Japio
JP2882290A 1990-02-08 1990-02-08 Liquid treatment apparatus of a semiconductor wafer Expired - Fee Related JP2837725B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2882290A JP2837725B2 (en) 1990-02-08 1990-02-08 Liquid treatment apparatus of a semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2882290A JP2837725B2 (en) 1990-02-08 1990-02-08 Liquid treatment apparatus of a semiconductor wafer

Publications (2)

Publication Number Publication Date
JPH03232228A true true JPH03232228A (en) 1991-10-16
JP2837725B2 JP2837725B2 (en) 1998-12-16

Family

ID=12259092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2882290A Expired - Fee Related JP2837725B2 (en) 1990-02-08 1990-02-08 Liquid treatment apparatus of a semiconductor wafer

Country Status (1)

Country Link
JP (1) JP2837725B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766169A (en) * 1993-08-23 1995-03-10 Nec Kansai Ltd Wet treatment equipment
US5799678A (en) * 1995-12-19 1998-09-01 Lg Semicon Co., Ltd. Apparatus for cleansing semiconductor wafer
US5927302A (en) * 1992-04-07 1999-07-27 Fujitsu Limited Method for rinsing plate-shaped articles and cleaning bath and cleaning equipment used in the same
US6279590B1 (en) * 1997-09-19 2001-08-28 Sharp Kabushiki Kaisha Cleaning method and cleaning apparatus
US7131217B2 (en) 2002-08-01 2006-11-07 Samsung Electronics Co., Ltd. Apparatus and method for drying semiconductor wafers using IPA vapor drying method
JP2014017369A (en) * 2012-07-09 2014-01-30 Sharp Corp Cleaning apparatus and cleaning method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5927302A (en) * 1992-04-07 1999-07-27 Fujitsu Limited Method for rinsing plate-shaped articles and cleaning bath and cleaning equipment used in the same
JPH0766169A (en) * 1993-08-23 1995-03-10 Nec Kansai Ltd Wet treatment equipment
US5799678A (en) * 1995-12-19 1998-09-01 Lg Semicon Co., Ltd. Apparatus for cleansing semiconductor wafer
US6279590B1 (en) * 1997-09-19 2001-08-28 Sharp Kabushiki Kaisha Cleaning method and cleaning apparatus
US7131217B2 (en) 2002-08-01 2006-11-07 Samsung Electronics Co., Ltd. Apparatus and method for drying semiconductor wafers using IPA vapor drying method
JP2014017369A (en) * 2012-07-09 2014-01-30 Sharp Corp Cleaning apparatus and cleaning method

Also Published As

Publication number Publication date Type
JP2837725B2 (en) 1998-12-16 grant

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