JP4841063B2 - Microchannel structure and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is suitable for, for example, the production of microchips, uses micromachine technology as a precision grooving method for quartz, eliminates the drilling of through holes with conventional machine tools, and is difficult to achieve with machining and its extension technology. A microchannel structure capable of rationally manufacturing a cover plate or a microchannel structure by forming a small through hole or groove rationally and with high precision by realizing processing of a 10 μm size region and its It relates to a manufacturing method.
[0002]
[Prior art]
So-called IC technology used for semiconductor manufacturing has been progressing year by year, and in recent years, a pattern formation technology with an accuracy of 0.1 μm is being established.
Further, the technical field of forming a shape or structure of several tens of μm on a silicon substrate by using a microfabrication technique of IC technology has progressed, and a technical field called a micromachine has been formed.
[0003]
In response to this situation, in recent years, gene analysis has been actively promoted in the bio-related research field, and the decoding of human genes is being completed, and the next research object is said to be protein analysis. Yes.
That is, knowing what three-dimensional structure of the string-like protein in which amino acids are arranged is a useful clue to know how the protein functions. There are hundreds to thousands of proteins contained in the tissue, and the two-dimensional electrophoresis method is effective for efficiently separating the proteins.
[0004]
More specifically, the two-dimensional electrophoresis method is one-dimensionally separating first by PH difference and then by molecular weight difference in the vertical direction. Thousands of proteins are simultaneously separated at a time. It is possible.
Such analysis requires analysis with a very small amount of solution, and the size of the flow path becomes a very small flow path (microchannel). The microchannel is formed by precisely and smoothly grooving on a quartz substrate, and a cover plate is bonded onto the channel to form a microchannel structure.
[0005]
In a conventional microchannel structure, for example, as disclosed in Japanese Patent Application Laid-Open No. 2000-298109, a laser is irradiated on a quartz substrate or ion etching is performed to form a desired microchannel, and the substrate is formed on the substrate. A cover plate having small holes for water injection and drainage having a diameter of 1 mm was thermally bonded, and the small holes were connected to the microchannel.
[0006]
However, this conventional microchannel structure has a small hole having a very large diameter as a device of this type on the cover plate, and the microchannel is formed in a large shape having a width of 200 μm and a depth of 100 μm. Therefore, there is a problem that the consistency of analysis with a small amount of solution cannot be obtained, and this makes it difficult to reduce the size and weight of this type of device, and miniaturization thereof has been desired.
[0007]
In response to such demands, several proposals have been made for a method of processing a groove having a width of about 20 μm and a depth of about 20 μm in a quartz substrate.
For example, BUNSEKI KAGAKU Vol. 47, No. 6, pp. 361-368 proposes a method of wet etching a quartz substrate with hydrofluoric acid using a resist / Au / Cr laminated film as a mask.
[0008]
However, since wet etching is basically isotropic etching, etching proceeds in the lateral direction as much as the depth direction. That is, the lateral dimension of the groove at the end of etching is the mask opening width plus twice the dimension in the depth direction.
For example, if etching is performed to a depth of 20 μm with a mask width of 20 μm, the actual finished opening size is estimated to be 60 μm. Therefore, it is impossible in principle to form a groove having a width of 20 μm and a depth of 20 μm by wet etching.
[0009]
In order to solve such a problem of wet etching, dry etching has also been attempted. However, since there is no appropriate mask material, Japanese Patent Laid-Open No. 6-219781 is made of 300 nm thick Cr / 100 nm thick aluminum. An example in which a groove having a depth of 12 μm is etched with a laminated film is shown.
[0010]
On the other hand, approaches to micromachining from conventional machining methods have also been made, and dicing saws, ultrasonic machining methods, fine drilling methods, sandblasting methods and the like have been tried.
However, in a dicing saw, only a straight digging groove can be formed on the substrate surface, and it is impossible in principle to cut an arbitrary plane pattern.
Further, the ultrasonic machining method requires a special machining tool, and a fine tool of the order of several tens of μm is necessary. Therefore, its production is extremely difficult.
[0011]
Furthermore, the fine drilling method is limited to drilling, and there is a problem that it is difficult to create a fine tool. In addition, the dicing saw inevitably causes blade blurring during cutting, and the narrower the groove, the slower the cutting speed and the lack of mass productivity.
In addition, since the material to be cut is a difficult-to-cut material called quartz, the wear of the tool is severe, so that the diameter of the through hole is limited to about several hundred μm in order to form a through hole in quartz.
[0012]
In addition, it is possible to use a sandblasting method to cover and process other parts than the work piece with a mask, but the selection of a mask material that can withstand sandblasting and the so-called tapered shape in which the hole shape has a smaller outlet than the entrance. It becomes a problem and it is difficult to obtain a straight through hole.
[0013]
Even if a fine groove can be formed on the surface of the quartz substrate, it is necessary to provide an inlet for injecting the solution into the groove and an outlet for the solution in the cover plate. For this purpose, it depends on conventional machining. I must.
However, it is extremely difficult to provide fine inlets and outlets by machining as described above.
Moreover, the through-hole formed in the cover plate must reach | attain and contact the terminal end of the groove | channel which gave the groove process, and the position alignment is also difficult.
[0014]
In other words, there is a limit to engraving a groove whose shape is precisely controlled in a size area of several tens of μm by a conventional machining, and a flat cover plate is formed on the quartz substrate in which the groove is engraved. It is extremely difficult to precisely align the end of the microchannel formed on the substrate with a through hole of several tens of micrometers formed in the plate.
[0015]
[Problems to be solved by the invention]
The present invention solves such problems, for example, is suitable for the production of microchips, uses micromachine technology as a precision grooving method of quartz, eliminates the drilling of through holes with conventional machine tools, and machining and its extension Realizing the processing of a dimensional region of several tens of μm, which was difficult with technology, and forming minute through-holes or grooves rationally and with high precision, it is possible to rationally manufacture a cover plate or microchannel structure. An object of the present invention is to provide a microchannel structure and a manufacturing method thereof.
[0016]
[Means for Solving the Problems]
The invention of claim 1 Has a plurality of linear grooves intersecting each other Substrates with microchannels and minute through holes in the thickness direction A plurality are formed and at least two cover plate pieces are joined. A cover plate, joining the cover plate to the microchannel side, The through hole is disposed on the joint surface of the cover plate piece, Through hole Said Communicating with microchannels Possible In the microchannel structure, each of the microchannels One end of the groove The above The cover plate is disposed at a corresponding position of the joint portion of the cover plate, a plurality of through holes are disposed at corresponding positions at one end of each groove, and the cover plate is connected. All or part of the through-holes are formed on the joint surface of the cover plate piece to realize processing of a dimension area of several tens of μm, which has been difficult by conventional machining and its extension technology, and fine through-holes. Alternatively, the grooves are formed rationally and with high precision, and a microchannel suitable for microanalysis and a cover plate or a microchannel structure are rationally manufactured.
[0017]
The invention of claim 2 Has a plurality of linear grooves intersecting each other Substrates with microchannels and minute through holes in the thickness direction A plurality are formed and at least two cover plate pieces are joined. A cover plate, joining the cover plate to the microchannel side, The through hole is disposed on the joint surface of the cover plate piece, Through hole Said In a manufacturing method of a microchannel structure that communicates with a microchannel, each of the microchannels One end of the groove The above The cover plate is arranged at a corresponding position of the joint portion of the cover plate, and a plurality of through holes are communicated with the corresponding position of one end of each groove, and the cover plate And all or part of the through-holes are formed on the joint surface of the cover plate piece to realize the processing of a dimension area of several tens of μm, which is difficult with conventional machining and its extension technology, The grooves are formed reasonably and precisely, and a microchannel suitable for microanalysis and a cover plate or microchannel structure are rationally manufactured.
[0018]
According to a third aspect of the present invention, at least two molding blocks that can be joined to each other are provided, and a molding groove that constitutes all or part of the through hole is formed on the joining surface of one or both of the molding blocks. After joining the blocks, the joined molded blocks are cut in a direction perpendicular to the through holes to form a plurality of the cover plate pieces having a predetermined thickness, which is difficult with conventional machining and its extension technology. A micro-channel suitable for ultra-trace analysis and a cover plate or micro-channel structure is realized by processing a dimensional region of several tens of μm and forming minute through holes or grooves rationally and with high precision. I try to make it reasonably.
[0019]
According to a fourth aspect of the present invention, the joined molding block is cut to form a through-hole penetrating in the thickness direction of the cover plate, and the drilling of the through-hole by a conventional machine tool is eliminated. Through holes or grooves are formed reasonably and precisely, and a microchannel suitable for microanalysis and a cover plate or microchannel structure are rationally manufactured.
According to the invention of claim 5, the width dimension of the molding block along the molding groove is formed to be a multiple of the thickness of the cover plate, so that the cover plate can be rationally manufactured and mass-produced. To be able to plan.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
The illustrated embodiment in which the present invention is applied to a microchip for microanalysis will be described below. In FIGS. 1 to 7, reference numeral 1 denotes a rectangular plate-like microchannel structure, which is a quartz substrate 2 and quartz. The manufactured cover plate 3 is polymerized and bonded by thermocompression bonding at a temperature of 1000 ° C. or higher.
[0021]
The substrate 2 is formed in a rectangular plate shape having a thickness of about 1 mm, and a substantially Y-shaped microchannel 4 is formed on the upper surface thereof, and the microchannel 4 has linear grooves 5 to 7 intersecting with each other. These grooves 5 to 7 are each formed to have a width and a depth of about 20 μm by an ion etching process described later.
In the figure, 8 is a round groove-shaped liquid reservoir formed in the middle part of the groove 5, and 9 is a round groove-shaped liquid reservoir formed at the intersection of the grooves 5-7.
[0022]
The cover plate 3 is formed in the same shape and substantially the same thickness as the substrate 2 and is composed of a plurality of cover plate pieces 10 to 12 made of quartz, and the plate pieces 10 to 12 are formed. These side end surfaces are formed by thermal bonding.
In the embodiment, a composite of a molding block, which will be described later, is diced to the same thickness to obtain cover plate 3 or cover plate pieces 10-12.
[0023]
A single or a plurality of solution injection holes or discharge holes of the microchannel 4 at positions corresponding to the end portions of the grooves 5 to 7 on the end surfaces of the cover plate teeth 10 to 12, that is, the side end surfaces. Are formed along the thickness direction.
In the embodiment, the through holes 13 to 15 are formed in a square shape having a side of approximately 20 μm, and communicate with the corresponding grooves 5 to 7. That is, the through-hole 13 is located immediately above one end of the groove 5, and the through-holes 14 and 15 are located directly above one end of the grooves 6 and 7, and communicate with them.
[0024]
In this case, the through-holes 13 to 15 are formed in the entire cross-sectional shape on the side end face of one corresponding cover plate piece 10 as shown in FIG. As described above, a partial cross-sectional shape of each of the through holes 13 to 15, for example, a ½ shape, may be formed on both side end surfaces of the cover plate teeth 10, 11, or 11, 12 facing each other.
[0025]
By doing so, in the former case, the formation of the through holes 13 or grooves in one of the molding blocks described later can be omitted, and in the latter case, the through holes 13 to 15 or molding grooves are formed in the side end surfaces of both molding blocks. By forming, the depth of the forming groove can be reduced, the etching process can be performed easily and quickly, and there is an advantage that the cover plate parts that have been grooved can be used.
[0026]
The cover plate teeth 10 to 12 are formed by dicing the forming blocks 16 to 18 as described above, and the forming blocks 16 to 18 are formed as shown in FIG. It is comprised with the square pillar-shaped quartz pillar which has the same planar shape as the upper surface of -12.
The molding blocks 16 to 18 are integrally formed as shown in FIG. 5 by thermally joining their joining end faces during the manufacturing process of the cover plate 3. In the figure, reference numerals 19 and 20 denote bonding lines formed by the thermal bonding.
[0027]
Among these, the molding blocks 16 and 18 are arranged on both sides of the integrally molded molding block body, and the molding groove 21 for forming the through-hole 13 and the through-holes 14 and 15 are formed on their joining end surfaces, that is, side end surfaces. Forming grooves 22 and 23 are formed. These forming grooves 21 to 23 are formed by dry etching described later.
[0028]
The molding block 17 is disposed at the center of the molding block body, and the joining end surfaces thereof are formed smoothly. In this case, when forming a part of the cross-sectional shape of each of the through holes 13 to 15 on the side end surfaces of both the adjacent cover plate pieces 10, 11 or 11, 12, for example, FIG. Thus, a pair of forming grooves 21 and 24 are formed to face each other.
[0029]
The molding block body is cut by a dicing saw (not shown) in a direction orthogonal to the axial direction of the through holes 13 to 15 as shown in FIG. 5 in the latter stage of the manufacturing process of the cover plate 3. Polish the surface.
In the figure, reference numeral 25 denotes a cutting line by a dicing saw, which is cut out slightly thicker than the finished cover plate 3. This situation is as shown in FIG.
[0030]
The molding grooves 21 to 23 of the molding blocks 16 and 18 are formed to be substantially the same, and the molding method of the molding groove 21 of the molding block 16 will be described. The procedure is as shown in FIGS. 7 (a) to (i). It seems.
First, in FIG. 7A, quartz is cut into a predetermined shape to form a molding block 16, the flat surface is washed and baked, and then sputtered onto the back surface of the surface on which a desired molding groove 21 is formed. A metal film 26 of Cr or the like is formed to a thickness of about 1000 to 2000 mm using a method or the like.
[0031]
The metal film 26 eliminates reflection of light from the stage during exposure when adhering the forming block 16 to the aligner stage when forming a photolithography resist pattern in the following (e), and a precise and good resist groove pattern Done to form.
[0032]
Next, in FIG. 7B, a polyimide film 27 is spin-coated on the surface of the molding block 16 where the molding groove 21 is to be formed to a thickness of 10 μm to several tens of μm, and 1 at a temperature of about 350 ° C. in a nitrogen atmosphere. The polyimide film 27 is cured over a period of time to several hours.
[0033]
In FIG. 7C, the SiO 2 film is formed on the polyimide film 27 by sputtering or the like. ₂ A film 28 is formed. In this case, for example, Ar is SiO. ₂ When forming the film 28, the film 28 is deficient in oxygen, so-called silicon-rich SiO 2. ₂ The film 28 is formed.
Therefore, SiO ₂ The composition of the film 28 is changed to pure SiO ₂ Therefore, it is desirable to use reactive sputtering in which a small amount of oxygen gas is mixed in Ar gas introduced into the sputtering chamber.
[0034]
Next, in FIG. ₂ A photoresist (hereinafter referred to as a resist) 29 is spin-coated on the film 28 to a thickness of about 1 μm. In this case, the resist 29 may be either a positive type or a negative type.
When pattern accuracy is required, the edge of the resist pattern can be sharpened by reducing the thickness of the resist 29 to about 5000 mm.
[0035]
In FIG. 7E, a groove pattern is formed on the resist 29 by ultraviolet exposure through a mask (not shown) having a pattern of the molding groove 21. 30 Form.
The exposure is not limited to the aligner, and any means such as a stepper or electron beam exposure may be used.
[0036]
In FIG. 7F, the formed resist pattern 30 Using as a mask, the underlying SiO ₂ The film 28 is etched using a dry etching method such as RIE (reactive ion etching), ion milling, or ion beam etching.
Next, in FIG. 7G, the resist 29 and SiO ₂ Using the film 28 as a mask, the polyimide film 27 is dry-etched in oxygen plasma.
[0037]
When dry etching of the polyimide film 27 is performed using RIE, it is desirable to enhance the anisotropy as much as possible. Therefore, it is desirable that the polyimide film 27 be performed at a low pressure, specifically about 1 mTorr or less.
If ICP (inductive recoupled plasma) etching is used for the dry etching, etching with high anisotropy can be performed at high speed.
[0038]
Next, in FIG. 7H, the SiO shown in FIG. ₂ Using the laminated film 31 of the film 28 and the polyimide film 27 as a mask, the molding block 16 is engraved by dry etching.
Even in this dry etching, since a highly perpendicular etching shape is required, dry etching at a low pressure is effective.
[0039]
As the etching gas, a fluorine-based gas is used, specifically, CF. _Four , C ₂ F ₆ , C _Three F ₈ , CHF _Three Or a hydrogen-based gas (CH _Four , C ₂ H _Four , C ₂ H ₂ However, it may also be used.
Of course, if dry etching with high plasma density such as ICP etching is used, it is needless to say that anisotropic etching with high mask selectivity can be performed at high speed.
[0040]
7I, the polyimide residual film 27 and the metal film 26 on the back surface of the molding block 16 are removed, and a deep molding groove 21 of about 20 μm is formed on the surface of the molding block 16 with good anisotropy.
At this time, the polyimide film 27 is completely removed during the dry etching, and the depth of the molding groove 21 does not change even if the etching is continued as it is.
[0041]
That is, since the surface 16a of the molding block 16 and the bottom 21a of the molding groove 21 are the same quartz, the etching rate is also equal, and even if further dry etching is continued, the molding groove 21 formed in the molding block 16 has a similar effect. The depth does not change.
In other words, the thickness of the polyimide thick film 27 formed on the molding block 16 is determined, and if the etching selectivity between the polyimide thick film 27 and quartz is known, the thickness of the polyimide film 27 can be adjusted. Etching at a desired depth is possible.
[0042]
In this way, the molding groove 21 of the molding block 16 is formed by first forming the polyimide thick film 27 on the molding block 16, and then forming SiO on the polyimide film 27 by film forming means such as sputtering, LPCVD or plasma CVD. ₂ Or Si _Three N _Four After forming a thin film 28, etc., a photoresist 29 is applied, and an exposure phenomenon is performed to form a resist pattern having a desired groove shape. 30 Form.
[0043]
And the resist pattern 30 Then, the underlying thin film 28 is dry etched to form a groove pattern. 30 Is transferred onto the thin film 28, and further, using the thin film pattern as a mask, the underlying polyimide is dry etched to form a groove pattern.
Finally, the polyimide film 27 is used as a mask to dry-etch the molding block 16 to obtain a precise groove pattern. Since photolithography is used, an arbitrary planar shape pattern can be formed. Moreover, SiO ₂ Since the film 28 is formed into a thin film, it is clear SiO ₂ A mask is obtained.
[0044]
Further, in the manufacturing method according to the present invention, the planar shape pattern to be laid out is not limited to the groove pattern along the crystal orientation, such as using anisotropic etching of a silicon single crystal substrate. It is possible to arbitrarily design the planar shape pattern.
[0045]
FIG. 8 shows another embodiment of the present invention, and the same reference numerals are used for components corresponding to the above-described embodiment.
That is, FIG. 8 shows another forming method of the forming grooves 21 to 23 in order.
First, in FIG. 8A, a conductive thin film 32, specifically a metal thin film, a conductive polycrystalline silicon thin film, a conductive amorphous silicon thin film, or the like is coated on the surface of the forming block 16 where the forming groove 21 is formed. To do.
[0046]
Next, in FIG. 8B, a polyimide thick film 27 is spin-coated on the conductive thin film 32 and cured. Thereafter, in FIG. 8C, SiO serving as a mask on the polyimide thick film 27 when dry etching the thick film 27 is performed. ₂ The thin film 28 is coated, and in FIG. ₂ A resist 29 is spin-coated on the thin film 28, and the resist 29 is patterned in FIG.
At this time, the resist pattern 29 is a pattern in which the resist 29 is left in a portion where the molding groove 21 is formed in the molding block 16.
[0047]
Further, in FIG. 8F, the resist layer 29 is used as a mask to form the underlying SiO. ₂ The thin film 28 and the polyimide thick film 27 are dry-etched and etched until the action reaches the conductive thin film 32.
At this time, the resist 29 is also etched away.
Thereafter, in FIG. 8G, Ni plating 33 is formed on the conductive thin film 32. In this case, the plating thickness is equal to or less than the thickness of the polyimide thick film 27.
[0048]
In FIG. 8 (h), SiO ₂ The thin film 28, the polyimide thick film 27, and the conductive thin film 32 serving as the underlying layer are removed by etching to expose the surface 16a of the molding block 16 forming the groove.
Next, in FIG. 8I, the exposed surface 16a is engraved by dry etching using the Ni plating 33, which is a metallic film, and the conductive thin film 32 as a mask, and etched to a desired depth.
Thereafter, the Ni plating 33 and the conductive thin film 32 are removed by wet etching, and the molding groove 21 is formed in the molding block 16.
[0049]
Thus, in the above embodiment, since the metallic film 33 such as Ni is used as a mask, the masking effect is better than that in the case where the organic polyimide thick film 27 is used as a mask, and the thickness can be reduced accordingly.
[0050]
The method of forming the molding grooves 21 to 23 according to the other embodiments described above can also be applied to the formation of the microchannel 4, and the embodiment of FIGS. 7 and 8 depends on the molding grooves 5 to 7, 21 to 21. 23 is adopted based on the shape dimensions, mask means and processing conditions.
[0051]
As described above, according to the present invention, when the cover plate 3 constituting the microchannel structure 1 is manufactured, the forming grooves 21 to 23 are formed at predetermined positions of the forming blocks 16 to 18 by ion etching or the like. After joining -18, this is diced in a predetermined direction with a predetermined thickness to rationally manufacture a plurality of cover plates 3 and promote mass production thereof.
[0052]
Further, since the manufactured cover plate 3 is constituted by joining a plurality of cover plate pieces 10 to 12, this is constituted by a single cover plate material. Compared to the above, it is possible to produce various shapes and dimensions.
[0053]
Moreover, when forming the fine through holes 13 to 15 provided in the cover plate 3, the perforations of the through holes 13 to 15 by the conventional machine tool are abolished, the processing of the forming grooves 21 to 23, and the forming block 16 are performed. This is reasonably and precisely formed by bonding and dicing of ˜18.
[0054]
【The invention's effect】
As described above, the invention of claim 1 provides each microchannel. One end of the groove The above The cover plate is disposed at a corresponding position of the joint portion of the cover plate, a plurality of through holes are disposed at corresponding positions at one end of each groove, and the cover plate is connected. Since all or part of the through-holes are formed on the joint surface of the cover plate piece, it is possible to realize a processing of a dimension area of several tens of μm, which has been difficult by conventional machining and its extension technology, and fine through-holes. Alternatively, the groove can be formed reasonably and precisely, and a microchannel suitable for microanalysis and a cover plate or microchannel structure can be reasonably manufactured.
[0055]
The invention of claim 2 provides each microchannel. One end of the groove The above The cover plate is arranged at a corresponding position of the joint portion of the cover plate, and a plurality of through holes are communicated with the corresponding position of one end of each groove, and the cover plate Since all or part of the through-holes are formed on the joint surface of the cover plate piece, it is possible to realize a processing of a dimension area of several tens of μm, which has been difficult by conventional machining and its extension technology, and fine through-holes. Alternatively, the groove can be formed reasonably and precisely, and a microchannel suitable for microanalysis and a cover plate or microchannel structure can be reasonably manufactured.
[0056]
According to a third aspect of the present invention, at least two molding blocks that can be joined to each other are provided, and a molding groove that constitutes all or part of the through hole is formed on the joining surface of one or both of the molding blocks. After the blocks are joined, the joined molded blocks are cut in the direction perpendicular to the through holes to form a plurality of the cover plate pieces having a predetermined thickness, which is difficult with conventional machining and its extension technology. The micro-channel and cover plate or micro-channel structure suitable for microanalysis can be realized by processing a dimensional region of several tens of μm, which can be formed in a reasonable and highly precise manner. Can be reasonably manufactured.
[0057]
The invention of claim 4 cuts the joined molding block to form a through-hole penetrating in the thickness direction of the cover plate, and eliminates drilling of the through-hole by a conventional machine tool. A minute through hole or groove can be formed reasonably and precisely, and a microchannel suitable for microanalysis and a cover plate or microchannel structure can be reasonably manufactured.
In the invention of claim 5, since the width dimension along the forming groove of the forming block is formed to be a plurality of times the thickness of the cover plate, the cover plate is rationally manufactured and mass-produced. Can be achieved.
[Brief description of the drawings]
FIG. 1 is a perspective view of a microchannel structure showing an embodiment of the present invention.
FIG. 2 is an exploded perspective view showing a microchannel structure to which the present invention is applied.
FIG. 3 is a front view showing a method of forming through holes provided in a cover plate constituting a microchannel structure to which the present invention is applied, and FIG. 3 (a) is one cover plate piece. A full cross section of the through hole is opened at the joint end face of FIG. 2, and FIG. 5B shows a partial cross section of the through hole at the joint end face of both adjacent cover plate teeth.
FIG. 4 is a perspective view showing an intermediate state of a manufacturing process of a cover plate constituting a microchannel structure to which the present invention is applied, and disassembling a state before joining of respective molding blocks.
FIG. 5 is a perspective view showing an intermediate state of a manufacturing process of a cover plate constituting a microchannel structure to which the present invention is applied, and showing a state before dicing after joining of the respective molding blocks.
FIG. 6 is a perspective view showing a final state of a manufacturing process of a cover plate constituting a microchannel structure to which the present invention is applied, and showing a dicing state of joined molding blocks.
FIG. 7 is a cross-sectional view sequentially showing the manufacturing process of the microchannel and cover plate to which the present invention is applied from FIG.
FIG. 8 is a cross-sectional view showing another embodiment of the present invention, and shows the manufacturing process of the microchannel and cover plate in order from FIG.
[Explanation of symbols]
1 Microchannel structure
2 Substrate
3 Cover plate
4 Microchannel
10, 11, 12 Cover plate teeth
13, 14, 15 through-hole
16, 17, 18 Molding block
21,22,23 forming groove

Claims (5)

A substrate in which a microchannel having a plurality of linear grooves intersecting each other, a plurality of minute through holes are formed in the thickness direction , and at least two cover plate pieces are joined. - pre - and a preparative, wherein the cover on the microchannel side - joining the door, said cover - - pre pre - topics - placing the hole in the joint surface of the scan, the hole in the microchannel In the microchannel structure capable of communicating , one end of each groove of the microchannel is arranged at a corresponding position of the joint portion of the cover plate piece, and a plurality of through holes are provided at the corresponding position of one end of each of the grooves. the communicatively the place, and the cover - pre - the joint surface of the bets and the cover plate piece, microchannel structure characterized by forming all or part of the hole. A substrate in which a microchannel having a plurality of linear grooves intersecting each other, a plurality of minute through holes are formed in the thickness direction , and at least two cover plate pieces are joined. - pre - and a preparative, wherein the cover on the microchannel side - joining the door, said cover - - pre pre - topics - placing the hole in the joint surface of the scan, the hole in the microchannel the method of manufacturing a microchannel structure that communicates, at one end of each groove before Symbol microchannel said cover - pre - topics - arranged in a corresponding position of the joint portion of the scan, the plurality of corresponding positions of the one end of each groove A method of manufacturing a microchannel structure, characterized in that a through hole is communicated and all or a part of the through hole is formed on a joint surface between the cover plate and the cover plate piece. At least two molding blocks that can be joined to each other are provided, and molding grooves constituting all or part of the through holes are formed on the joining surface of one or both of the molding blocks, and the molding blocks are joined and joined. 3. The method of manufacturing a microchannel structure according to claim 2, wherein the molding block is cut in a direction perpendicular to the through hole to form a plurality of the cover plate pieces having a predetermined thickness. 4. The method of manufacturing a microchannel structure according to claim 3, wherein the joined forming block is cut to form a through-hole penetrating in the thickness direction of the cover plate. 5. The method of manufacturing a microchannel structure according to claim 4, wherein a width dimension along the forming groove of the forming block is formed to be a multiple of the thickness of the cover plate.

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