JP4832895B2 - Transfer device - Google Patents

Description

  The present invention relates to a transfer apparatus, and more particularly to a transfer device that transfers a fine transfer pattern formed on a surface of a mold to the surface of a substrate.

  In recent years, a mold (template, stamper) is formed by forming an ultrafine transfer pattern on a quartz substrate or the like by an electron beam drawing method, and the resist film formed on the surface of the transfer substrate as a molded product (substrate) Research and development has been conducted on nanoimprint technology for pressing a mold with a predetermined pressure to transfer a pattern formed on the mold (see Non-Patent Document 1).

  Moreover, as an apparatus for executing the nanoimprint, for example, a transfer apparatus 100 described in Patent Document 1 is known (see FIGS. 6 and 7). This transfer apparatus 100 is provided with an X stage 106 and a Y stage 108 on a lower horizontal portion of an L-shaped frame 102, and a substrate table 104, which is a support for a product (substrate W), is mounted on the X stage 106 and the Y stage 108. A mold support part (mold holding body) 110 is provided on the upper part of the vertical part 102 via a vertical movement mechanism 112. The mold holder 110 holds the mold M on which a fine pattern for transfer is formed.

Then, the substrate table 104 is appropriately positioned in the X axis direction and the Y axis direction using the X stage 106 and the Y stage 108 from the state shown in FIG. 6, the mold holder 110 is lowered, and the substrate W is pressed by the mold M. Thus, a fine pattern is transferred to the substrate W.
JP 2004-34300 A Precision Engineering Journal of the International Societies for Precision Engineering and Nanotechnology

  By the way, in the conventional transfer apparatus 100, the substrate W is formed larger than the mold M, the substrate W is appropriately moved and positioned in the X-axis and Y-axis directions, and transfer is performed to a plurality of locations on one substrate W. . Then, the substrate transferred at a plurality of locations is appropriately separated, and a large number of products and semi-finished products are obtained from one large substrate, so that the transfer can be performed efficiently.

  Further, in the conventional transfer apparatus 100, in order to move and position the substrate table 104 in a stable and accurate state, the substrate table 104 is X in this peripheral portion (at both ends in the X-axis and Y-axis directions and in the vicinity thereof). It is supported by the stage 106 and the Y stage 108.

  Therefore, a portion where the substrate W is pressed by the mold M when transferring (the central portion of the substrate table 104) and a portion where the substrate table 104 is supported by the X stage 106 or the Y stage 108 (the peripheral portion of the substrate table 104) ), And when the substrate M is pressed with the mold M, a moment is generated, and the substrate table 104 and the substrate W are bent downward in FIG. 6 and it is difficult to perform accurate transfer. There is.

  In order to solve this problem, it is conceivable to increase the rigidity of the substrate table by increasing the thickness of the substrate table 104. However, increasing the thickness of the substrate table 104 increases the mass of the substrate table 104, thereby increasing the substrate table 104. In addition, the positioning control becomes difficult, and the mass of the transfer device increases and the size of the transfer device increases.

  The present invention has been made in view of the above problems, and in a transfer device that transfers a fine pattern provided on a mold to a substrate, the transfer is performed while suppressing an increase in the mass of the substrate table on which the substrate is placed. It is an object of the present invention to provide a transfer device in which a substrate table is not easily deformed even when a pressing force is applied.

The invention according to claim 1, a mold for transfer which is disposed a substrate table and, movable positioning the substrate table substrate positioning means for holding a substrate as an object to be molded materials, is opposed to the substrate table with it can hold, and relatively movable mold carrier in a direction toward or away from the said substrate table, the driving of the order by relatively moving said mold carrier to said substrate table If a unit, which is the form by the drive means is pressed against the substrate, in order to prevent the substrate table is deformed, possess the external force applying unit capable of applying an external force to the substrate table, wherein The external force applying means includes an external force adding member that contacts the substrate table and applies an external force to the substrate table. When moving the plate table, the external force applying member is separated from the substrate table, and when the mold is pressed against the substrate by the driving means, the external force applying member is brought into contact with the substrate table to apply external force. The transfer device is configured to include detection means for detecting that the external force applying member contacts the substrate table, and the external force applying means is configured such that the substrate table and the mold holder are separated from each other. When the external force application member moves in the direction of the substrate table and the detection means detects that the external force application member contacts the substrate table, the movement of the external force application member is stopped. The mold is pressed against the substrate by the driving means by holding the position of the stopped external force application member. Kino is a transfer device that is configured to prevent deformation of the substrate table.

According to a second aspect of the present invention, there is provided a substrate table that holds a substrate that is a molding material, substrate movement positioning means that can move and position the substrate table, and a transfer mold that is disposed to face the substrate table. A mold holder that can be held and is relatively movable in a direction approaching and moving away from the substrate table; and a driving unit that moves the mold holder relative to the substrate table. An external force applying means capable of applying an external force to the substrate table in order to prevent the substrate table from being deformed when the mold is pressed against the substrate by the driving means. The means comprises an external force application member that contacts the substrate table and applies an external force to the substrate table, and the substrate movement positioning means When moving the plate table, the external force applying member is separated from the substrate table, and when the mold is pressed against the substrate by the driving means, the external force applying member is brought into contact with the substrate table to apply external force. The transfer device is configured to include detection means for detecting that the external force applying member contacts the substrate table, and the external force applying means is configured such that the substrate table and the mold holder are separated from each other. when you are, together with the external force applying member is moved in the direction of the substrate table, the external force applying member by said detecting means to stop the movement of the external force applying member when it is detected that the contact with the substrate table, Regardless of the change in force applied to the substrate table when the mold is pressed against the substrate by the driving means, By holding the stopped external force applying member at a constant position, the substrate table is prevented from being deformed when the mold is pressed against the substrate by the driving means. It is a transfer device.

The invention of claim 3 is provided integrally with the frame, the substrate is the molded material, a substrate table for holding, can hold mold for transfer arranged to face the front Stories substrate table with some, in a direction approaching and separating from with respect to the substrate table, and the mold holder provided movably relative to the frame, drive means Before moving the mold carrier, wherein said frame substrate table The external force applying member is brought into contact with the substrate table when extended, and the external force applying member is separated from the substrate table when contracted when extended. And a piezo device provided on the frame.

According to a fourth aspect of the present invention, in the transfer device according to the third aspect , a detecting unit that detects a position of the external force applying member, and a control that controls a voltage applied to the piezo device based on a detection result of the detecting unit. A transfer device.

According to a fifth aspect of the present invention, in the transfer device according to the third aspect , the intermediate member provided between the piezo device and the external force applying member, and the contact side portion contacting the substrate table are elastic. The external force applying member provided integrally with the intermediate member such that the elastic portion is located between the intermediate member and the contact side portion; The transfer device includes a detection unit that detects a position of the contact side portion with respect to the intermediate member, and a control unit that controls a voltage applied to the piezo device based on a detection result of the detection unit.

The invention of claim 6 is provided integrally with the frame, it is possible to retain the mold for transfer which is disposed a substrate table for holding a substrate as an object to be molded material, so as to face the front Stories substrate table together, in a direction toward or away from the said substrate table, and the mold holder provided movably relative to the frame, drive means Before moving the mold carrier, said frame and said substrate table The external force applying member is moved in the direction of the substrate table when extended, and the external force applying member is moved away from the substrate table when contracted. A piezo device provided on the frame, a detection means for detecting a force applied between the piezo device and the substrate table, and a detection result of the detection means. A transfer device and a control means for controlling a voltage applied to the piezoelectric device.

  According to the present invention, in a transfer device that transfers a fine pattern provided on a mold to a substrate, even if a pressing force is applied during transfer while suppressing an increase in the mass of the substrate table on which the substrate is placed. There is an effect that it is possible to provide a transfer device in which the substrate table is hardly deformed.

[First Embodiment]
FIG. 1 is a diagram showing a schematic configuration of a transfer apparatus 1 according to the first embodiment of the present invention.

  In the present specification, for convenience of explanation, one horizontal direction is defined as the X-axis direction, the other horizontal direction and the direction perpendicular to the X-axis direction is defined as the Y-axis direction, The vertical direction is the Z-axis direction.

  Similar to the conventional transfer device 100, the transfer device 1 is a device that transfers a fine pattern (for example, a concavo-convex pattern) formed on the surface of the mold M to the surface of the substrate W. The transfer table 1 and the mold holder ( Mold holding table) 110.

  The substrate table 104 is supported by an X stage and a Y stage (both not shown in FIG. 1) which are examples of substrate movement positioning means, and can be moved and positioned in the X axis direction and the Y axis direction.

  Further, the substrate table 104 is formed, for example, in a rectangular plate shape having a predetermined thickness, and is arranged so that the thickness direction coincides with the vertical direction (Z-axis direction). A thin flat substrate (for example, a rectangular plate substrate) W is mounted and held.

  On one surface of the substrate W, a molding layer (for example, a molding layer made of a UV curable resin or a thermosetting resin) that is a portion to which the fine transfer pattern of the mold M is transferred is provided. In the state of being held by the substrate table 104, the molding target layer exists on the upper plane of the substrate W, and the lower plane of the substrate W (the surface on which the molding target layer is not provided) is the substrate table 104. It is in contact with the top surface.

  The mold holder 110 is provided above the substrate table 104. In addition, the mold holder 110 can arrange and hold a transfer mold (rectangular flat plate mold) M on the plane of the lower surface. The lower surface of the mold holder 110 is parallel to the upper surface of the substrate table 104. Therefore, the lower surface of the mold M held on the lower surface of the mold holder 110 and the upper surface of the substrate W held on the substrate table 104 are opposed to each other and are parallel to each other. In addition, a fine transfer pattern exists on the lower surface of the mold M held on the lower surface of the mold holder 110.

  Further, the mold holder 110 has a position where the lower surface of the mold M is in contact with the upper surface of the substrate W in order to transfer the transfer pattern of the mold M to the substrate W, and the substrate W is placed on the substrate table 104 or the substrate W Relative to a direction in which the mold M is moved away from the substrate W to be detached from the substrate table 104 (a direction perpendicular to the upper surface of the substrate table 104; a Z-axis direction). It can be moved freely.

  For example, the mold holder 110 is movable in the Z-axis direction with respect to the frame 102 (may be in a form other than “L” shape) of the transfer apparatus 1 via a linear guide bearing or the like (not shown). It has become. However, the mold holder 110 may be fixed to the frame 102 of the transfer apparatus 1, and the substrate table 104 may be configured to move in the Z-axis direction with respect to the frame 102. Both the mold holder 110 and the substrate table 104 may be configured to move with respect to the frame 102. That is, it is only necessary that at least one of the mold holder 110 and the substrate table 104 move in the Z-axis direction with respect to the frame 102 of the transfer apparatus 1.

  In the transfer apparatus 1 shown in FIG. 1, the substrate table 104 is positioned below and the mold holder 110 is positioned above. Conversely, the substrate table 104 is positioned above and the mold holder 110 is positioned below. Alternatively, the moving direction of the mold holder 110 and the substrate table 104 may be a horizontal direction or an oblique direction.

  In addition, the transfer device 1 is provided with a driving unit (not shown) and a curing unit (not shown) for moving the mold holder 110 relative to the substrate table 104. The drive means moves the mold holder 110 in the Z-axis direction, for example, using an actuator such as a servo motor. The curing means is formed on the upper surface of the substrate W when the mold M is pressed against the substrate W by the driving means to transfer the transfer pattern of the mold M to the substrate W. When the layer to be molded is made of a thermosetting resin, the layer to be molded is heated, and when the layer to be molded is made of a UV curable resin. And irradiating the molding layer with ultraviolet rays.

  Further, as described above, the transfer apparatus 1 is provided with substrate movement positioning means that can move and position the substrate table 104 in the X-axis direction and the Y-axis direction. This substrate movement positioning means is configured using, for example, the X stage 106 and the Y stage 108 described above. More specifically, the substrate table 104 is supported by the frame 102 at the periphery of the substrate table 104, for example, via a linear guide bearing.

  When the substrate table 104 and the mold holder 110 are separated from each other (when the substrate W and the mold M are separated from each other), the substrate table 104 is moved in the X-axis direction using an actuator such as a servo motor. It is possible to move and position in the Y-axis direction.

  The area of the mold M is smaller than the area of the substrate W. Therefore, the substrate table 104 can be appropriately moved and positioned in the horizontal direction so that transfer onto the substrate W can be performed after each positioning. It has become. Then, after the plurality of times of transfer, a large number of products and semi-finished products can be obtained from one large substrate W by appropriately separating the transferred substrate W.

  In addition, the transfer device 1 is configured such that when the mold M is pressed against the substrate W by the driving means to transfer the transfer pattern of the mold M to the substrate W, the substrate table 104 is deformed (bends downward). In order to prevent this, external force applying means capable of applying an external force to the substrate table 104 is provided.

  The external force applying means is configured to add a reaction force corresponding to the pressing force in the vicinity of the location of the substrate table 104 to which the mold M is pressed, for example. That is, when viewed from the direction in which the force is applied by the mold M (Z-axis direction), the external force applying means is located on the lower surface of the substrate table 104 and substantially coincides with the place where the mold M is pressed. The reaction force (upward force in FIG. 1) is applied to the location with the same area as the mold M.

  The external force applying means includes an external force applying member that contacts the substrate table 104 and applies an external force to the substrate table 104, and, as described above, the substrate table 104 is moved by the substrate movement positioning means. When moving in the axial direction or the Y-axis direction, the external force applying member is separated from the substrate table 104, and the external force applying member is brought into contact with the substrate table 104 when the mold M is pressed against the substrate W by the driving means. It is configured to apply external force.

  Explaining in more detail by giving an example, the external force adding means is configured using a piezo device 3. The piezo device 3 is configured by laminating a large number of thin plate-like piezo elements 4 in the thickness direction.

  When the substrate W is placed on the substrate table 104, or when the substrate table 104 is moved and positioned in the X-axis direction or the Y-axis direction, no voltage is applied to each piezo element 4 (piezo device 3). As shown, the upper surface of the piezoelectric device 3 and the lower surface of the substrate table 104 are separated by a distance L. Further, when the mold M is pressed against the substrate W by the driving means, an appropriate voltage is applied to each piezo element 4 (piezo device 3) to bring the upper surface of the piezo device 3 into contact with the substrate table 104, so that the substrate table 104 It is designed to prevent deformation. In the transfer device 1 shown in FIG. 1, the uppermost piezo element 4a corresponds to the external force applying member.

When the piezo device 3 has sufficient rigidity, the voltage V ₁ applied to each piezo element 4 when the mold M is not in contact with the substrate W and the piezo device 3 is in contact with the substrate table 104. Need not be raised when the substrate table 104 is pressed with the mold M, and may be maintained as it is.

On the other hand, when the piezoelectric device 3 does not have sufficient rigidity or more accurately prevents the substrate table 104 from being bent, when the substrate table 104 is pressed by the mold M, the voltage V ₁ is appropriately set according to the pressing force. It is sufficient to prevent the substrate table 104 from being bent.

  The external force application member (external force application member made of, for example, stainless steel instead of the piezo element) may be driven using a fluid pressure cylinder such as an air cylinder. At this time, it is desirable to control the force applied to the substrate table 104 by changing the air pressure. The external force addition member may be provided so as to move in the Z-axis direction with respect to the frame 102, and the external force addition member may be driven by an actuator such as a servomotor via a mechanism such as a ball screw.

  The substrate table 104 is supported at the periphery as described above, and a space for installing the piezo device 3 exists below the substrate table 104.

  Next, the operation of the transfer device 1 will be described assuming that the piezoelectric device 3 has sufficient rigidity.

  First, as shown in FIG. 1, the mold holder 110 and the substrate table 104 are separated from each other, the mold M is installed on the mold holder 110, and the substrate W is installed on the substrate table 104. It is assumed that the lower surface of the table 104 and the upper surface of the piezo device 3 are separated from each other.

  In this state, under the control of a control device (not shown), the substrate W is appropriately positioned in the X-axis and Y-axis directions, and then a voltage is applied to each piezo element 4 so that the piezo device 3 is placed on the lower surface of the substrate table 104. This state is maintained by bringing the upper surface into contact (only contact without pressing). In addition, the value of the voltage applied to each piezo element 4 shall be previously input into the said control apparatus.

Subsequently, the mold holder 110 is lowered and the mold layer of the substrate W is cured while pressing the substrate W with the mold M. When the curing is finished, the mold holder 110 is raised, the voltage application to each piezo element 4 is stopped, and the first transfer to the substrate W is finished.

  Subsequently, the substrate W is further appropriately positioned in the X-axis and Y-axis directions, the second and subsequent transfers are performed, and when the transfer is completed, the substrate W is removed from the transfer device 1 and transferred to the next substrate W. Do.

  According to the transfer apparatus 1, since the external force applying means capable of applying an external force to the substrate table 104 when the mold M is pressed against the substrate W is provided, the rigidity (for example, thickness) of the substrate table 104 is increased. Without deformation, the amount of deformation of the substrate table 104 when the substrate W is pressed with the mold M to be transferred can be kept small, and accurate transfer can be performed.

  Further, since it is not necessary to increase the rigidity of the substrate table 104, the mass of the substrate table 104 can be reduced, and the positioning control of the substrate table 104 can be performed quickly and easily, the mass of the transfer device 1 is increased, and the transfer device 1 is increased. Can be avoided.

  Further, according to the transfer apparatus 1, since the reaction force corresponding to the pressing force is applied in the vicinity of the position of the substrate table 104 to which the mold M is pressed, when the substrate W is pressed by the mold M, In addition, a moment can be prevented from being generated in the substrate table 104, and the deformation of the substrate table 104 can be efficiently suppressed.

  Further, according to the transfer apparatus 1, when the substrate table 104 is moved by the substrate movement positioning unit, the external force application member is separated from the substrate table 104, and when the mold M is pressed against the substrate W, the external force application member is moved. Since the external force is applied by contacting the substrate table 104, the substrate table 104 can be moved with a small force, and the external force applying member and the substrate W can be prevented from being worn. The amount of deformation of the substrate table 104 when the substrate W is pressed with the mold M can be reduced.

[Second Embodiment]
FIG. 2 is a diagram showing a schematic configuration of a transfer apparatus 1a according to the second embodiment of the present invention.

  The transfer device 1a according to the second embodiment of the present invention is different from the transfer device 1 according to the first embodiment in that the transfer device 1a includes a detecting unit that detects that the external force applying member 7 is in contact with the substrate table 104. The other differences are substantially the same as those of the transfer apparatus 1 according to the first embodiment, and have substantially the same effects.

  That is, the external force applying means moves the external force adding member 7 in the direction of the substrate table 104 when the substrate table 104 and the mold holder 110 are separated from each other, and the detecting means applies the external force adding member 7 to the substrate table. When the contact with 104 is detected, the movement of the external force addition member 7 is stopped and the position of the stopped external force addition member 7 is held, whereby the mold M is pressed against the substrate W by the driving means. The substrate table 104 is configured to be prevented from being deformed.

  According to the transfer device 1a, when it is detected that the external force applying member 7 is in contact with the substrate table 104, the movement of the external force adding member 7 is stopped and the position of the stopped external force applying member 7 is held. Therefore, the amount of pressing the substrate table 104 by the external force applying member 7 is insufficient, and the substrate table 104 is deformed downward when the external force adding member 7 is pressed by the mold M without contacting the substrate table 104. The substrate table 104 can be avoided from being deformed upward by excessively pushing the substrate table 104 with the external force applying member 7.

  In the transfer device 1a, when the substrate table 104 and the mold holder 110 are separated from each other, the external force applying member 7 is moved in the direction of the substrate table 104, and the external force applying member 7 is moved to the substrate table 104 by the detecting means. The movement of the external force applying member 7 is stopped when it is detected that the contact is made with the substrate, and the change is not related to the change in the magnitude of the force applied to the substrate table 104 when the mold M is pressed against the substrate W by the driving means. The stopped external force applying member 7 is fixed to the frame 102 by the force applied to the substrate table 104 when the mold M is pressed against the substrate W by the driving means. The substrate M when the mold M is pressed against the substrate W by the driving means. To prevent deformation of the Le 104 may constitute the external force applying means.

  More specifically, similarly to the transfer device 1, the transfer device 1a includes a frame 102, a substrate table 104, and a mold holder 110, and also includes a piezo device 3a as the external force applying means. Yes. The piezo device 3a is formed by stacking thin annular (for example, annular) piezo elements and is formed in a cylindrical shape.

  The lower end of the piezo device 3a is integrally provided on the frame 102 via the plate-like member 5, and the plate-like external force applying member 7 is integrally provided on the upper end of the piezo device 3a.

  The detection means is constituted by, for example, a non-contact sensor 9, and the non-contact sensor 9 is provided inside the cylindrical piezo device 3a. And the distance z between the lower surface of the external force addition member 7 and the detection part (upper surface) of the non-contact sensor 9 can be detected, and the non-contact sensor 9 applies an external force to the non-contact sensor 9. By detecting the distance to the member 7, it is possible to detect that the upper surface of the external force applying member 7 is in contact with the lower surface of the substrate table 104.

  Further, under the control of the control device, the voltage applied to the piezo device 3a is controlled based on the detection result of the non-contact sensor 9.

More specifically, as shown in FIG. 2, in a state (initial state) in which the die holder 110 is separated from the substrate table 104, the die M is not in contact with the substrate W, and the piezo apparatus 3a is contracted. The distance between the substrate table 104 and the external force application member 7 is “L”, and the distance z between the external force application member 7 and the non-contact sensor 9 is “z ₀ ”.

When the piezo device 3 a extends from the initial state and the distance z becomes “L + z ₀ ”, the external force addition member 7 comes into contact with the substrate table 104.

The controller gradually increases the voltage applied to the piezo device 3a from the initial state, gradually extends the piezo device 3a to gradually raise the external force applying member 7, and the non-contact sensor 9 applies an external force to the substrate table 104. When the contact of the additional member 7 is detected (when the distance z becomes “L + z ₀ ”), the increase in the voltage applied to the piezo device 3 a is stopped, and the external force adding member 7 comes into contact with the substrate table 104. The voltage V ₁ at the time is maintained (that is, the distance z is maintained at “L + z ₀ ”) .
As described above, when the substrate table 104 is pressed by the mold M while the voltage V ₁ is maintained, the substrate table 104 is deformed and the distance z tends to be smaller than “L + z ₀ ”. At this time, the control device may further increase the voltage applied to the piezo device 3a so that the distance z is maintained at “L + z ₀ ”.

Incidentally, when the piezoelectric device 3a is sufficiently rigid so that when the substrate table 104 is pressed by the mold M, it is not necessary to increase the voltage applied to the piezoelectric device 3a, it may maintain the voltage V _1.

Furthermore, the voltage applied to the piezo device 3a may be controlled in consideration of the elasticity of the member 5 and the external force applying member 7. That is, when the substrate table 104 is pressed by the piezo device 3a, the member 5 and the external force applying member 7 are also slightly contracted, but the voltage applied to the piezo device 3a is increased in consideration of this very small shrinkage. The distance z may be slightly larger than “L + z ₀ ” (larger by the amount by which the member 5 or the external force applying member 7 is contracted).

  According to the transfer device 1a, when it is detected that the external force applying member 7 has contacted the substrate table 104, the movement of the external force adding member 7 is stopped and the substrate table 104 when the mold M presses the substrate W is applied. Even if the magnitude of the applied force changes, the position of the stopped external force application member 7 is held so as to be a constant position, so that the deformation of the substrate table 104 when the substrate W is pressed by the mold M is almost eliminated. And more accurate transfer can be performed.

  In the transfer device 1a, the strain gauge 11 may be provided on the substrate table 104, and the strain gauge 11 may constitute the detection means, or the non-contact sensor 15 provided above the substrate table 104 may detect the detection means. Alternatively, an impedance detection device 13 for detecting the impedance between the substrate table 104 and the external force applying member 7 may be provided, and the impedance detection device 13 may constitute the detection means.

[Third Embodiment]
FIG. 3 is a diagram showing a schematic configuration of a transfer apparatus 1b according to the third embodiment of the present invention.

  The transfer device 1b according to the third embodiment of the present invention differs from the transfer device 1a according to the second embodiment in that an intermediate member 17 is provided between the external force applying member 7b and the piezo device 3a. This point is configured in substantially the same manner as the transfer apparatus 1a according to the second embodiment, and has substantially the same effect.

  That is, the transfer device 1b according to the third embodiment of the present invention includes a plate-like intermediate member 17 between the piezo device 3a and the external force applying member 7b. The intermediate member 17 is provided integrally with the piezo device 3a and the external force applying member 7b.

  The external force addition member 7b includes a contact side portion (a plate-like contact side portion having a predetermined thickness) 23 that contacts or separates from the substrate table 104 due to expansion and contraction of the piezo device 3a, and elasticity. And a cylindrical proximal end portion 21 in contact with the intermediate member 17. The elastic part 19 is formed in the shape of a truncated cone having a predetermined thickness, and the small diameter part is connected to the contact side part 23 and the large diameter part is connected to the base end part part 21.

  Further, a non-contact sensor 25, which is an example of detection means for detecting the position of the contact side portion 23 with respect to the intermediate member 17 (position in the Z-axis direction), is integrated with the intermediate member 17 inside the proximal end side portion 21. Is provided.

  The voltage applied to the piezo device 3a is controlled based on the detection result of the non-contact sensor 25.

  That is, the voltage applied to the piezo device 3 a is gradually increased, the piezo device 3 a is gradually extended, the upper end of the contact side portion 23 comes into contact with the lower surface of the substrate table 104, and the substrate table 104 is pressed by the contact side portion 23. Then, the elastic part 19 is deformed and the contact side part 23 moves slightly downward with respect to the intermediate member 17. By detecting this movement with the non-contact sensor 25, the voltage applied to the piezo device 3a is controlled as in the case of the transfer device 1a.

  Furthermore, the displacement of the intermediate member 17 with respect to the frame 102 may be detected using the non-contact sensor 27 to prevent the substrate table 104 from being deformed more accurately.

[Fourth Embodiment]
FIG. 4 is a diagram showing a schematic configuration of a transfer apparatus 1c according to the fourth embodiment of the present invention.

  The transfer apparatus 1c according to the fourth embodiment of the present invention is different from the transfer apparatus 1 according to the first embodiment in that a detection unit that detects a force applied between the piezo apparatus 3a and the substrate table 104 is provided. The other differences are substantially the same as those of the transfer apparatus 1 according to the first embodiment, and have substantially the same effects.

  That is, in the transfer device 1 c according to the fourth embodiment, a load cell 29 that is an example of the detection unit is integrally provided on the lower surface of the substrate table 104, and the pressing force applied between the external force applying member 7 and the substrate table 104. (Pressing force when pressing the substrate W with the mold M) is detected, and the voltage applied to the piezoelectric device 3a is controlled based on the detection result.

  That is, the voltage applied to the piezo device 3a is gradually increased, the piezo device 3a is gradually extended, the upper end of the external force application member 7 comes into contact with the lower surface of the load cell 29, and the load cell 29 is pressed by the external force application member 7. By detecting this, the voltage applied to the piezo device 3a is controlled as in the case of the transfer device 1a.

  As shown in FIG. 5, a load cell 29 may be provided between the piezo device 3 a and the frame 102.

  By the way, in the first embodiment, an external force is applied to the substrate table 104 by using an actuator such as a piezo device, but instead of the actuator, a highly rigid support member is used. Deformation may be prevented.

  The support member is integrally provided on the frame 102 at the base end, the tip is in contact with the substrate table 104 or the tip is very slightly separated from the substrate table 104, and the side on which the substrate W is placed. Is a space located on the opposite side of the frame 102 and extends between the frame 102 and the substrate table 104 in the Z-axis direction. Moreover, the said supporting member is comprised with steel and stainless steel, for example, and is satisfy | filled with the material of steel or stainless steel.

1 is a diagram illustrating a schematic configuration of a transfer apparatus according to a first embodiment of the present invention. It is a figure which shows schematic structure of the transfer apparatus which concerns on the 2nd Embodiment of this invention. It is a figure which shows schematic structure of the transfer apparatus which concerns on the 3rd Embodiment of this invention. It is a figure which shows schematic structure of the transfer apparatus which concerns on the 4th Embodiment of this invention. It is a figure which shows schematic structure of the modification of the transfer apparatus which concerns on the 4th Embodiment of this invention. It is a figure which shows schematic structure of the conventional transfer apparatus. It is a figure which shows the VII arrow in FIG.

Explanation of symbols

1, 1a, 1b, 1c Transfer device 3, 3a Piezo device 4 Piezo element 7 External force applying member 9, 25, 27 Non-contact sensor 29 Load cell M type W substrate

Claims (6)

A substrate table for holding a substrate which is a molding material ;
Substrate movement positioning means capable of moving and positioning the substrate table;
Together can hold the mold for transfer arranged to face the front Stories substrate table, and relatively movable mold carrier in a direction toward or away from the said substrate table,
And because of the drive means by relatively moving said mold carrier to said substrate table,
If the mold by the drive means is pressed onto the substrate, in order to prevent the substrate table is deformed, possess the external force applying unit capable of applying an external force to said substrate table,
The external force applying means includes an external force adding member that contacts the substrate table and applies an external force to the substrate table. When the substrate table is moved by the substrate moving positioning means, the external force applying member is provided. In the transfer apparatus configured to apply an external force by bringing the external force application member into contact with the substrate table when the mold is pressed against the substrate by the driving means.
Detecting means for detecting that the external force applying member is in contact with the substrate table;
The external force applying means moves the external force applying member toward the substrate table when the substrate table and the mold holder are separated from each other, and the detecting means causes the external force applying member to move to the substrate table. When the contact is detected, the movement of the external force addition member is stopped and the position of the stopped external force addition member is held, so that the substrate is pressed against the substrate by the driving means. Configured to prevent table deformation,
A transfer device characterized by that. A substrate table for holding a substrate which is a molding material;
Substrate movement positioning means capable of moving and positioning the substrate table;
A mold holding body capable of holding a transfer mold arranged to face the substrate table and relatively movable in a direction approaching and separating from the substrate table;
Drive means for moving the mold holder relative to the substrate table;
An external force applying means capable of applying an external force to the substrate table in order to prevent the substrate table from being deformed when the mold is pressed against the substrate by the driving means;
The external force applying means includes an external force adding member that contacts the substrate table and applies an external force to the substrate table. When the substrate table is moved by the substrate moving positioning means, the external force applying member is provided. In the transfer apparatus configured to apply an external force by bringing the external force application member into contact with the substrate table when the mold is pressed against the substrate by the driving means .
Detecting means for detecting that the external force applying member is in contact with the substrate table;
The external force applying means moves the external force applying member toward the substrate table when the substrate table and the mold holder are separated from each other, and the detecting means causes the external force applying member to move to the substrate table. When the contact is detected, the movement of the external force application member is stopped, and the stopped external force is applied regardless of a change in the force applied to the substrate table when the mold is pressed against the substrate by the driving means. By holding the additional member at a fixed position, it is configured to prevent deformation of the substrate table when the mold is pressed against the substrate by the driving means.
A transfer device characterized by that. A substrate table provided integrally with the frame and holding a substrate which is a molding material ; and
A mold holding body that can hold a transfer mold disposed to face the substrate table, and is movable with respect to the frame in a direction approaching and separating from the substrate table;
Drive means for moving the mold holder;
It is provided in a space formed between the frame and the substrate table, and when extended, an external force application member is brought into contact with the substrate table, and when contracted, the external force application member is disposed on the substrate. A piezo device provided on the frame so as to be separated from the table;
A transfer device comprising: The transfer device according to 請 Motomeko 3,
A detecting means for detecting a position of the external force applying member,
Control means for controlling the voltage applied to the piezo device according to the detection result of the detection means;
Transfer apparatus according to claim Rukoto to have a. The transfer device according to claim 3 , wherein
An intermediate member provided between the piezo device and the external force addition member ;
A contact side portion that contacts the substrate table and an elastic portion having elasticity are configured, and the elastic portion is located between the intermediate member and the contact side portion so as to be integrated with the intermediate member. The external force application member provided in an automatic manner,
Detecting means for detecting a position of the contact side portion with respect to the intermediate member ;
Control means for controlling the voltage applied to the piezo device according to the detection result of the detection means;
Transfer apparatus according to claim Rukoto to have a. A substrate table provided integrally with the frame and holding a substrate which is a molding material ;
A mold holding body that can hold a transfer mold disposed to face the substrate table, and is movable with respect to the frame in a direction approaching and separating from the substrate table ;
Drive means for moving the mold holder;
Together provided the space formed between the frame and the substrate table, when extended moves the external force applying member on the substrate table direction, if contracted in the said external force applying member A piezo device provided on the frame so as to move in a direction away from the substrate table ;
Detecting means for detecting a force applied between the piezo device and the substrate table ;
Control means for controlling the voltage applied to the piezo device according to the detection result of the detection means;
Transfer equipment, characterized in Rukoto to have a.

Images