JP2007176037A - Transfer device and transfer method - Google Patents

Transfer device and transfer method Download PDF

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Publication number
JP2007176037A
JP2007176037A JP2005377900A JP2005377900A JP2007176037A JP 2007176037 A JP2007176037 A JP 2007176037A JP 2005377900 A JP2005377900 A JP 2005377900A JP 2005377900 A JP2005377900 A JP 2005377900A JP 2007176037 A JP2007176037 A JP 2007176037A
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Japan
Prior art keywords
transfer
substrate
mold
pattern
substrates
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JP2005377900A
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Japanese (ja)
Inventor
Toshinao Kamano
Mitsunori Kokubo
Haruyuki Matsubayashi
光典 小久保
治幸 松林
利尚 鎌野
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Toshiba Mach Co Ltd
東芝機械株式会社
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Priority to JP2005377900A priority Critical patent/JP2007176037A/en
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Abstract

A transfer device for transferring a fine pattern provided on a mold onto a substrate, which can perform accurate transfer in a shorter time than before.
A first member, a second member that is relatively movable in a direction approaching and moving away from the first member, a first member, a second member, and a second member. A plurality of substrates 7 and a substrate / mold placement unit 6 on which a plurality of molds 9 for transferring a fine pattern to each substrate 7 can be placed on top of each other; The transfer device 1 includes a drive unit that moves the second member 5 relative to the member 3 and presses each substrate W and each die M placed on the substrate / die placement unit 6.
[Selection] Figure 1

Description

  The present invention relates to a transfer apparatus and a transfer method, and more particularly to a transfer device that transfers a fine transfer pattern formed on the surface of a mold onto the surface of a substrate.

  In recent years, a mold (template, stamper) is formed by forming an ultrafine transfer pattern on a quartz substrate or the like by an electron beam drawing method, and the resist film formed on the surface of the transfer substrate as a molded product (substrate) Research and development has been conducted on nanoimprint technology for pressing a mold with a predetermined pressure to transfer a pattern formed on the mold (see Non-Patent Document 1).

  Moreover, as an apparatus for performing the nanoimprint, for example, a transfer apparatus 100 described in Patent Document 1 is known (see FIGS. 7 and 8). This transfer apparatus 100 is provided with an X stage 106 and a Y stage 108 on a lower horizontal portion of an L-shaped frame 102, and a substrate table 104, which is a support for a product (substrate W), is mounted on the X stage 106 and the Y stage 108. A mold support part (mold holding body) 110 is provided on the upper part of the vertical part 102 via a vertical movement mechanism 112. The mold holder 110 holds the mold M on which a fine pattern for transfer is formed.

Then, the substrate table 104 is appropriately positioned in the X-axis direction and the Y-axis direction using the X stage 106 and the Y stage 108 from the state shown in FIG. 7, the mold holder 110 is lowered, and the substrate W is pressed by the mold M. Thus, a fine pattern is transferred to the substrate W.
JP 2004-34300 A Precision Engineering Journal of the International Societies for Precision Engineering and Nanotechnology

  Incidentally, in the conventional transfer apparatus 100, the substrate W is appropriately positioned in the X-axis direction and the Y-axis direction, and transfer is performed to a plurality of locations on one substrate W. Then, after the transfer, the substrate W is removed from the substrate 100, and the substrate W is appropriately separated so that a plurality of products or semi-finished products can be obtained from one substrate W.

  In the transfer apparatus 100, the substrate table 104 is supported by the X stage 106 and the Y stage 108. By moving and positioning the substrate W in the X-axis direction and the Y-axis direction, the substrate table 104 is moved. The positional relationship between the support portion and the portion of the substrate table 104 that receives the pressing force from the mold M changes, the moment generated in the substrate table 104 changes with each pressing operation, and the deformation amount of the substrate table 104 is slightly different, There is a problem that the transfer to the substrate W may not be performed accurately.

  In addition, in the transfer device 100, it is necessary to cure the molding layer (layer in contact with the transfer pattern of the mold) provided on the substrate W for each pressing operation, and before and after each pressing operation, the X stage Since the substrate table 104 needs to be moved and positioned by the 106 and the Y stage 108, there is a problem that it is difficult to perform the transfer to the substrate W quickly.

  The present invention has been made in view of the above problems, and in a transfer apparatus and transfer method for transferring a fine pattern provided on a mold to a substrate, accurate transfer can be performed in a shorter time than before. It is an object of the present invention to provide a transfer device and a transfer method that can be used.

  According to the first aspect of the present invention, the first member, the second member relatively movable in the direction approaching / separating from the first member, the first member, and the second member are provided. A substrate / mould placement unit that is provided between the first member and the first member, and is capable of placing a plurality of substrates and a plurality of dies for transferring a fine pattern on each substrate, And a drive unit that moves the second member relative to the member to press the substrates and the molds installed in the substrate / mold installation unit.

  According to a second aspect of the present invention, in the transfer apparatus according to the first aspect, the guide member that guides the position of the substrate and the position of the mold that are installed in the substrate / mold installation unit to be a correct position. Is a transfer device.

  According to a third aspect of the present invention, there is provided a transfer method in which the transfer pattern is transferred to the substrate by pressing the substrate with a mold in which a fine transfer pattern is formed. This is a transfer method in which a plurality of molds for transferring a fine pattern are stacked and pressed from the stacked direction to transfer to each of the substrates.

  According to a fourth aspect of the present invention, in the transfer method according to the third aspect, the substrate is formed in a flat plate shape, the mold is formed in a flat plate shape, and a fine transfer pattern is formed on one surface. The pressing is a transfer method that is performed in a state in which the molds and the substrates are alternately stacked in the thickness direction.

  According to a fifth aspect of the present invention, in the transfer method according to the third aspect, the substrate is formed in a flat plate shape, the mold is formed in a flat plate shape, and a fine transfer pattern is formed on one surface. The pressing is a transfer method in which the mold, the substrate, and the planar mold are overlapped in this order and a plurality of times in the thickness direction.

  The invention according to claim 6 is the transfer method according to claim 3, wherein the substrate is formed in a flat plate shape, the mold is formed in a flat plate shape, and a fine transfer pattern is formed on one surface. In order to transfer the pressure onto both sides of the substrate, the first mold, the substrate, and the second mold are arranged in this order. The transfer method is performed in a state of being overlaid a plurality of times in the thickness direction.

  A seventh aspect of the present invention is the transfer method according to the third aspect, wherein the substrate and the mold are formed in a flat plate shape, and the pressure is applied to the respective molds and the respective substrates. The mold is formed in a state where the patterns are alternately overlapped with each other, and the mold located between the substrates is a transfer method in which fine transfer patterns are formed on both surfaces.

  The invention according to claim 8 is the transfer method according to claim 3, wherein the substrate is formed in a flat plate shape, the mold is formed in a flat plate shape, and a fine transfer pattern is formed on one surface. In order to transfer the pressure onto both sides of the substrate, the first mold, the substrate, and the second mold are arranged in this order, The transfer method is performed in a state where a planar mold is provided between the molds which are stacked a plurality of times in the thickness direction and where the substrate does not exist.

  According to the present invention, in the transfer apparatus and transfer method for transferring a fine pattern provided on a mold to a substrate, there is an effect that accurate transfer can be performed in a shorter time than before.

[First Embodiment]
FIG. 1 is a diagram showing a state in which a substrate 7 and a mold 9 are installed in a transfer apparatus 1 according to the first embodiment of the present invention.

  In the present specification, for convenience of explanation, one horizontal direction is defined as the X-axis direction, the other horizontal direction and the direction perpendicular to the X-axis direction is defined as the Y-axis direction, The vertical direction is the Z-axis direction.

  FIG. 1A is a diagram depicting the substrate 7 and the mold 9 separated for easy understanding, and FIG. 1B is a diagram depicting a state in which the transfer apparatus 1 is actually used. It is.

  The transfer device 1 is a device for transferring a fine pattern (for example, a concavo-convex pattern) formed on the surface of the mold M onto the surface of the substrate W, like the conventional transfer device 100, and is a lower side corresponding to the substrate table 104. A member (first member) 3 and an upper member (second member) 5 are provided.

  On the upper surface of the lower member 3, a planar portion extending in the X-axis direction and the Y-axis direction (horizontal direction) is formed. An upper member 5 is provided above the lower member 3, and a planar portion extending in the X-axis direction and the Y-axis direction is formed on the lower surface of the upper member 5. The planar portion of the lower member 3 and the planar portion of the upper member 5 face each other and are parallel to each other.

  The upper member 5 is relatively movable in a direction approaching / separating from the lower member 3 (a direction perpendicular to the upper surface of the substrate table 104; the Z-axis direction).

  For example, the lower member 3 is integrally provided on a frame (not shown; may be in a form other than an “L” shape) of the transfer device 1 (at least in the Z-axis direction cannot be moved). However, the upper member 5 is movable in the Z-axis direction with respect to the frame of the transfer apparatus 1 via a linear guide bearing or the like (not shown). However, the upper member 5 may be fixed to the frame of the transfer device 1, and the lower member 3 may be configured to move in the Z-axis direction with respect to the frame. On the other hand, you may be comprised so that both the upper side member 5 and the lower side member 3 may move. That is, it is only necessary that at least one of the upper member 5 and the lower member moves in the Z-axis direction with respect to the frame of the transfer device 1.

  In the transfer device 1 shown in FIG. 1, the lower member 3 is positioned downward and the upper member 5 is positioned upward. However, the moving direction of the upper member 5 and the lower member 3 is horizontal or oblique. Alternatively, the upper member 5 and the lower member 3 may be disposed.

  Further, the transfer device 1 is provided with a driving means (not shown) and a curing means (not shown) for moving the upper member 5 relative to the lower member 3. For example, the driving means moves the upper member 5 in the Z-axis direction using an actuator such as a servomotor. The curing means removes the molding layer provided on the surface of the substrate 7 when the mold 9 is pressed against the substrate 7 by the driving means so as to transfer the transfer pattern of the mold to the substrate. When the layer to be molded is made of a thermosetting resin, the layer to be molded is heated, and when the layer to be molded is made of a UV curable resin, The layer to be molded is irradiated with ultraviolet rays.

  Between the lower member 3 and the upper member 5, a substrate / die installation portion 6 is formed. The substrate / die setting unit 6 includes a plurality of flat-plate substrates (a plurality of substrates in which a molding layer is provided on the surface of a flat-plate base material) 7, and each substrate 7. A plurality of molds 9 for transferring a fine pattern can be placed in an overlapping manner (for example, alternately).

  The substrate 7 and the mold 9 are formed in a rectangular thin plate shape, and one surface of the substrate 7 is a portion to which a fine transfer pattern formed on one surface of the mold 9 is transferred. A molding layer (for example, a molding layer made of a UV curable resin or a thermosetting resin) is provided.

  In the state where the substrate 7 mold 9 is installed on the substrate / mold installation unit 6, as shown in FIG. 1B, the lower surface of the mold 9 located on the bottom (the surface on which the transfer pattern is not formed). The entire surface is in contact with the upper surface of the lower member 3, and the uppermost surface of the mold 9 (the surface on which the transfer pattern is formed) is located on the lower surface of the lower substrate 7 (covered surface). Similarly, the mold 9 and the substrate 7 are alternately stacked in this thickness direction. Further, the uppermost substrate 7 is separated from the upper member 5.

  In this way, the upper member 5 is lowered while the substrate 7 and the mold 9 are installed on the substrate / die installation portion 6, and the upper member 3 is brought into contact with the uppermost substrate 7. While pressing the mold 9 and curing the formation layer of the substrate 7, transfer is performed on one surface of the substrate 7.

  In addition, as shown in FIG. 2, the transfer pattern on the upper surface of the mold 11 may have a shape that is recessed downward at the center.

  Further, as shown in FIG. 3, the transfer may be performed using a rectangular plate-shaped flat mold 13 whose both surfaces in the thickness direction are flat.

  That is, one mold 9, one substrate 7, and one planar mold 13 are transferred onto the substrate / mold setting unit 6 in this order and multiple times in the thickness direction. May be. It should be noted that the lowermost planar mold 13 and the uppermost planar mold 13 in FIG. 3 may be deleted.

  In this way, by using the flat mold 13, even if the surface roughness of the back side of the mold 9 (the surface opposite to the surface on which the transfer pattern is formed) is rough, there is no influence on the transfer. The manufacture of the mold 9 becomes easy.

  Further, as shown in FIG. 4A, the mold 9 may be disposed on both surfaces of the substrate 7 so that the transfer is performed on both surfaces of the substrate 7 simultaneously.

  That is, one mold 9, one substrate (a substrate on which both layers are formed) 7, and one mold 9 are arranged in this order on the substrate / mold setting unit 6, and in this order. The transfer may be performed by overlapping a plurality of times in the vertical direction.

  Further, as shown in FIG. 4B, the molds 15 on which the transfer patterns are formed on both surfaces and the substrate 7 may be alternately arranged so that the transfer is performed on both surfaces of the substrate 7 simultaneously. In FIG. 4B, the uppermost mold 9 and the lowermost mold 9 have a transfer pattern formed only on the surface in contact with the substrate 7.

  Further, as shown in FIG. 5, the mold 9 may be disposed on both surfaces of the substrate 7, and the planar mold 13 may be disposed between the respective molds 9, and the transfer may be simultaneously performed on both surfaces of the substrate 7. Note that the planar mold 13 present at the bottom of FIG. 3 and the planar mold 13 present at the top of FIG. 3 may be deleted.

  Next, the operation of the transfer device 1 will be described.

  First, as shown in FIG. 1B, in a state where the lower member 3 and the upper member 5 are separated from each other, the die 9 and the substrate 7 are placed on the substrate / die placement portion 6 in a stacked manner (lower) The mold 9 and the substrate 7 are stacked on the side member 3). This installation may be performed manually by an operator or automatically using a robot or the like.

  In this state, under the control of a control device (not shown), the upper member 5 is lowered, and the mold layer of the substrate 7 is cured while pressing the mold 9 and the substrate 7. When the curing is finished, the upper member 5 is raised and the transfer to the substrate 7 is finished. Subsequently, the substrate 7 and the like are removed from the transfer device 1 and transferred to the next substrate 7.

  In addition, when performing the transfer, as described with reference to FIGS. 1 to 5, a substrate, a mold, and a flat mold as necessary may be installed on the substrate / mold setting unit 6.

  According to the transfer device 1, as shown in FIG. 1 and the like, a plurality of substrates 7 and a plurality of molds 9 for transferring a fine pattern are placed on each of the substrates 7 so as to perform transfer. The pressing force applied to each substrate 7 becomes uniform, and accurate transfer can be performed.

  In addition, a plurality of substrates 7 and a plurality of molds 9 are stacked outside the transfer device 1, and the stacked products are placed in the transfer device 1 and pressed by the mold 9 to cure the molding layer of the substrate 7. In this case, positioning, pressing, and curing of the substrate 7 can be performed once (one cycle), and transfer can be performed in a shorter time than conventional.

[Second Embodiment]
FIG. 5 is a diagram showing a schematic configuration of a transfer apparatus 1a according to the second embodiment of the present invention.

  The transfer device 1a according to the second embodiment is different from the transfer device 1 according to the first embodiment in that a guide member 17 is provided. Other points are the transfer device according to the first embodiment. It is comprised like 1 and there exists an almost the same effect.

  That is, the transfer device 1 a includes a guide member 17 that guides the substrate 7 a and the mold 9 a installed in the substrate / mold installation unit 6 so that the positions thereof are in the correct positions.

  The substrate 7a is used as, for example, a CD-ROM or a DVD-ROM, and the substrate 7a and the mold 9a are formed in a disc shape having a circular through hole at the center.

  A columnar guide member 17 is erected at the center of the circular upper surface of the lower member 3a with its axis extending in the vertical direction. The outer diameter of the guide member 17 is slightly smaller than the inner diameter of the through holes of the substrate 7a and the mold 9a.

  Then, when the substrate 7a and the mold 9a are installed on the substrate / mold installation unit 6, if the guide member 17 is inserted into the through hole of the substrate 7a or the mold 9a, the substrate 7a and the mold 9a are correctly positioned. It is supposed to be installed in.

  In addition, since the height of the guide member 17 is higher than the height when a plurality of the substrates 7a and the molds 9a are stacked, when the upper substrate 5a is lowered and the stacked substrates 7a and the molds 9a are pressed. The upper end of the guide member 17 interferes with the lower surface of the upper member 5a. In order to avoid this interference, a recess 19 is provided in the center of the circular lower surface of the upper member 5a.

  According to the transfer device 1a, since the guide member 17 is provided, it is easy to install the substrates 7a and the molds 9a at the correct positions of the transfer device 1a, and to perform more accurate transfer easily. Can do.

  By the way, the lower member 3a is divided at a position indicated by a broken line in FIG. 6, and the member 23 and the guide member 17 are integrally formed, and the integrally formed member 23 and the guide member 17 (tool) are formed. The member 21 may be detachable. In addition, when installing the said jig in the member 21, it shall be able to install the said jig in the exact position of the member 21 by positioning means, such as a positioning pin which is not shown in figure.

  If a plurality of jigs are prepared, one jig is placed on the transfer device 1a, and when the substrates 7a and the molds 9a stacked are pressed to perform transfer, another jig not installed on the transfer device 1a is used. Since each board | substrate 7a and each type | mold 9a can be installed in a jig, the operation rate of the transfer apparatus 1a can be improved.

  In the transfer device 1a, the substrate 7a and the mold 9a are guided and positioned at the center of the substrate 7a and the mold 9a. However, the substrate 7a and the mold 9a are guided and positioned around the substrate 7a and the mold 9a. It may be.

It is a figure which shows the state which installed the board | substrate and the type | mold in the transfer apparatus which concerns on the 1st Embodiment of this invention. It is a figure which shows the state which installed the type | mold which has the transfer pattern in which the center part became concave shape in the transfer apparatus. It is a figure which shows the state which installed the board | substrate, the type | mold, and the plane type | mold in the transfer apparatus. It is a figure which shows the state which installed the board | substrate and the type | mold which transfers to both surfaces of this board | substrate in the transfer apparatus. It is a figure which shows the state which installed the board | substrate, a plane type | mold, and the type | mold which transfers to both surfaces of the said board | substrate in the transfer apparatus. It is a figure which shows the state which installed the board | substrate and the type | mold in the transfer apparatus which concerns on the 2nd Embodiment of this invention. It is a figure which shows schematic structure of the conventional transfer apparatus. It is a figure which shows the VIII arrow in FIG.

Explanation of symbols

1, 1a Transfer device 3, 3a Lower member 5, 5a Upper member 7 Substrate 9, 9a, 11, 15 Mold 13 Plane 17 Guide member

Claims (8)

  1. A first member;
    A second member relatively movable in a direction approaching or moving away from the first member;
    A substrate that is provided between the first member and the second member, and on which a plurality of substrates and a plurality of molds for transferring a fine pattern can be placed on each substrate.・ With mold setting part;
    Drive means for moving the second member relative to the first member and pressing the substrates and the molds installed in the substrate / mold installation unit;
    A transfer device comprising:
  2. The transfer device according to claim 1,
    A transfer apparatus comprising a guide member for guiding the position of the substrate installed in the substrate / mold installation unit and the position of the mold to be correct.
  3. In a transfer method of transferring the transfer pattern to the substrate by pressing the substrate with a mold in which a fine transfer pattern is formed,
    A transfer method comprising: superposing a plurality of substrates and a plurality of molds for transferring a fine pattern on each of the substrates;
  4. The transfer method according to claim 3, wherein
    The substrate is formed in a flat plate shape, the mold is formed in a flat plate shape and a fine transfer pattern is formed on one surface,
    The method of transferring, wherein the pressing is performed in a state where the molds and the substrates are alternately stacked in the thickness direction.
  5. The transfer method according to claim 3, wherein
    The substrate is formed in a flat plate shape, the mold is formed in a flat plate shape and a fine transfer pattern is formed on one surface,
    The transfer method according to claim 1, wherein the pressing is performed in a state where the mold, the substrate, and the planar mold are overlapped in this order and a plurality of times in the thickness direction.
  6. The transfer method according to claim 3, wherein
    The substrate is formed in a flat plate shape, the mold is formed in a flat plate shape and a fine transfer pattern is formed on one surface,
    In order to transfer the pressure onto both surfaces of the substrate, one first mold, one substrate and one second mold are arranged in this order and in the thickness direction. A transfer method characterized in that the transfer is performed in a state of being overlaid a plurality of times.
  7. The transfer method according to claim 3, wherein
    The substrate and the mold are formed in a flat plate shape,
    The pressing is performed in a state where the molds and the substrates are alternately stacked in the thickness direction, and the mold located between the substrates is finely transferred to both surfaces. A transfer method, wherein a pattern is formed.
  8. The transfer method according to claim 3, wherein
    The substrate is formed in a flat plate shape, the mold is formed in a flat plate shape and a fine transfer pattern is formed on one surface,
    In order to perform the transfer on both surfaces of the substrate, a plurality of one first mold, one substrate and one second mold are arranged in this order and in the thickness direction. A transfer method characterized in that the transfer is performed in a state where a planar mold is provided between the molds that are stacked and the substrate does not exist.
JP2005377900A 2005-12-28 2005-12-28 Transfer device and transfer method Pending JP2007176037A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009214502A (en) * 2008-03-12 2009-09-24 Ricoh Co Ltd Imprint method and mold
JP2009241582A (en) * 2008-03-12 2009-10-22 Ricoh Co Ltd Imprinting method
JP2011526553A (en) * 2008-07-17 2011-10-13 エージェンシー・フォー・サイエンス・テクノロジー・アンド・リサーチ Method for making an imprint on a polymer structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004358857A (en) * 2003-06-06 2004-12-24 Meiki Co Ltd Apparatus for forming resin formed product having fine uneven surface
JP2005243114A (en) * 2004-02-25 2005-09-08 Sony Disc Technology Inc Transfer apparatus, transfer method, and information recording medium
JP2006048881A (en) * 2004-08-09 2006-02-16 Toshiba Corp Device and method for imprinting

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004358857A (en) * 2003-06-06 2004-12-24 Meiki Co Ltd Apparatus for forming resin formed product having fine uneven surface
JP2005243114A (en) * 2004-02-25 2005-09-08 Sony Disc Technology Inc Transfer apparatus, transfer method, and information recording medium
JP2006048881A (en) * 2004-08-09 2006-02-16 Toshiba Corp Device and method for imprinting

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009214502A (en) * 2008-03-12 2009-09-24 Ricoh Co Ltd Imprint method and mold
JP2009241582A (en) * 2008-03-12 2009-10-22 Ricoh Co Ltd Imprinting method
JP2011526553A (en) * 2008-07-17 2011-10-13 エージェンシー・フォー・サイエンス・テクノロジー・アンド・リサーチ Method for making an imprint on a polymer structure
KR101502933B1 (en) * 2008-07-17 2015-03-16 에이전시 포 사이언스, 테크놀로지 앤드 리서치 A method of making an imprint on a polymer structure

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