JP4832316B2 - Liquid cooling heat sink - Google Patents

Liquid cooling heat sink Download PDF

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JP4832316B2
JP4832316B2 JP2007003695A JP2007003695A JP4832316B2 JP 4832316 B2 JP4832316 B2 JP 4832316B2 JP 2007003695 A JP2007003695 A JP 2007003695A JP 2007003695 A JP2007003695 A JP 2007003695A JP 4832316 B2 JP4832316 B2 JP 4832316B2
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heat sink
insulating substrate
opening
coolant
burring
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JP2008172017A (en
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謙 柳川
修平 山口
孝史 上野
努 和田
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T.RAD CO., L T D.
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本発明は、電力用サイリスタその他の半導体等の発熱する電子部品を冷却する液冷ヒートシンクに関し、部品点数が少なく冷却効果の高いものに関する。   The present invention relates to a liquid-cooled heat sink that cools electronic components that generate heat, such as power thyristors and other semiconductors, and relates to a component that has a small number of components and a high cooling effect.

半導体素子を実装したパワーモジュールの多くは、セラミック製の絶縁基板状にハンダ固定され、その絶縁基板がヒートシンクの受熱面にハンダ付けまたはろう付けにより接合される。このような半導体等の電子部品を冷却するヒートシンクの性能向上のため、各種ヒートシンクの構造が提案されている。   Many power modules mounted with semiconductor elements are fixed to a ceramic insulating substrate by soldering, and the insulating substrate is joined to a heat receiving surface of a heat sink by soldering or brazing. Various heat sink structures have been proposed to improve the performance of heat sinks for cooling such electronic components as semiconductors.

下記特許文献１に記載のものは、セラミック製絶縁基板をヒートシンクの受熱面にろう材を介して接合することにより、その接合がハンダに比べて熱抵抗が少なく熱効率が向上する旨、記載されている。
さらに、下記特許文献２に記載のものはヒートシンクに開口を設け、その開口を熱伝導性薄板で液密に閉塞すると共に、その薄板上に絶縁基板を接合し、その絶縁基板状に発熱する電子部品を固定するものである。 The thing of the following patent document 1 is described that joining the ceramic insulating substrate to the heat receiving surface of the heat sink via a brazing material reduces the thermal resistance compared to solder and improves the thermal efficiency. Yes.
Further, the one described in the following Patent Document 2 is provided with an opening in a heat sink, the opening is liquid-tightly closed with a heat conductive thin plate, an insulating substrate is joined on the thin plate, and electrons are generated in the shape of the insulating substrate. The parts are fixed.

特開２００１−１６８５６９号公報JP 2001-168869 A 特開平９−１２１５５７号公報JP-A-9-121557

発熱性電子部品が接合されるセラッミク等の絶縁基板は、その線膨張率が金属製ヒートシンクの受熱面に比較して小さい。そのため、両者の接合時および半導体の使用時の温度変化によって、接合面に亀裂が発生する問題があった。
そこで、熱伝導の低いグリス等を介在してボルト締結する等の方法がとられ、この場合には熱伝導性が悪く且つ、構造上コスト高にならざるを得ない欠点があった。 An insulating substrate such as ceramic to which heat-generating electronic components are bonded has a smaller linear expansion coefficient than the heat receiving surface of the metal heat sink. For this reason, there has been a problem that cracks occur on the joint surface due to temperature changes during the joining of the two and the use of the semiconductor.
Therefore, a method such as fastening bolts with low thermal conductivity grease or the like is used. In this case, there is a drawback that the thermal conductivity is poor and the cost is structurally high.

別の方法として、絶縁基板に金属製の応力緩和部材を介して、ヒートシンクの受熱面にそれをろう付けをする方法がある。これは応力緩和部材の平面に複数のスリットを形成し、それにより応力緩和部材を変形し易くしたものである。この場合にも、部品点数が増加し、ヒートシンク全体のコスト上昇につながっていた。
そこで本発明は、部品点数が少なく、構造が簡単で且つ、熱応力を効果的に吸収し得るヒートシンクを提供することを課題とする。 As another method, there is a method in which the insulating substrate is brazed to the heat receiving surface of the heat sink via a metal stress relaxation member. This is to form a plurality of slits in the plane of the stress relaxation member, thereby making it easier to deform the stress relaxation member. Also in this case, the number of parts increased, leading to an increase in the cost of the entire heat sink.
Therefore, an object of the present invention is to provide a heat sink that has a small number of parts, has a simple structure, and can effectively absorb thermal stress.

請求項１に記載の本発明は、内部に冷却液(1) が流通する偏平なヒートシンク本体(2) の平坦な外面に、開口(3) が設けられ、
その開口(3) の孔縁部に外面側に筒状に突出するバーリング(4)が形成され、そのバーリング(4)の先端が絶縁基板(5)で閉塞されるとともに、そのバーリング(4)の先端と絶縁基板(5)との接触部がろう付けにより液密に接合され、
前記冷却液(1) が、前記バーリング(4)の先端縁まで満たされる状態で、ヒートシンク本体(2)内を流通し、
前記絶縁基板(5)上に発熱する電子部品(6)が接合される液冷ヒートシンクである。 The present invention according to claim 1 is provided with an opening (3) on the flat outer surface of a flat heat sink body (2) through which the coolant (1) flows.
A burring (4) protruding in a cylindrical shape on the outer surface side is formed at the hole edge of the opening (3), the tip of the burring (4) is blocked by the insulating substrate (5) , and the burring (4) The contact portion between the tip of the substrate and the insulating substrate (5) is liquid-tightly joined by brazing ,
In a state where the coolant (1) is filled up to the leading edge of the burring (4), it circulates in the heat sink body (2),
The electronic component that generates heat on the insulating substrate (5) (6) is a liquid-cooled heat sink to be bonded.

請求項２に記載の本発明は、内部に冷却液(1) が流通する偏平なヒートシンク本体(2) の平坦な外面に、開口(3) が設けられ、
その開口(3) の外面側の孔縁部に、環状の突条部(7) を残存させてその外周に環状溝(8) が形成されると共に、前記開口(3) に架橋部(9) が一体に横断され、
前記突条部(7) および架橋部(9) の上端縁が絶縁基板(5)で閉塞されて、それらの接触部がろう付けにより液密に接合され、
前記絶縁基板(5)の外周縁が環状溝(8)の内周縁と整合するように形成され、
前記冷却液(1) が、前記突条部(7) および架橋部(9) の上端縁まで満たされる状態で、ヒートシンク本体(2)内を流通し、
その絶縁基板(5)上に発熱する電子部品(6)が接合される液冷ヒートシンクである。 According to the present invention, the opening (3) is provided on the flat outer surface of the flat heat sink body (2) through which the coolant (1) flows.
An annular groove (8) is formed on the outer periphery of the opening (3), leaving an annular ridge (7) at the outer edge of the hole, and a bridging portion (9) is formed in the opening (3). ) Are crossed together,
The upper edge of the protruding portion (7) and the bridging portion (9 ) is closed with an insulating substrate (5), and their contact portions are liquid-tightly joined by brazing ,
The outer peripheral edge of the insulating substrate (5) is formed to align with the inner peripheral edge of the annular groove (8),
The coolant (1) flows through the heat sink body (2) in a state where the coolant (1) is filled up to the upper end edges of the protrusions (7) and the bridging part (9),
This is a liquid-cooled heat sink in which an electronic component (6) that generates heat is bonded onto the insulating substrate (5).

第１の本発明は、ヒートシンク本体２に設けた開口３の孔縁部に筒状に突出するバーリング４が形成され、そのバーリング４が絶縁基板５で閉塞されるとともに、そのバーリング４の先端と絶縁基板５との接触部がろう付けにより液密に接合され、その絶縁基板５が内部の冷却液１によって直接冷却されるので、絶縁基板５上の電子部品６を効率よく冷却することができる。しかも、絶縁基板５は開口３に接合されているため、筒状に突出したバーリング４は熱変形し易く、絶縁基板５とヒートシンク本体２との熱膨張差を効果的に吸収して、絶縁基板５の割れを防止し、信頼性の高いヒートシンクを提供できる。 In the first aspect of the present invention, a burring 4 projecting in a cylindrical shape is formed at the hole edge of the opening 3 provided in the heat sink body 2, and the burring 4 is closed by the insulating substrate 5 , and the tip of the burring 4 contact portion between the insulating substrate 5 is bonded in a fluid-tight manner by brazing, the insulating substrate 5 are directly cooled by internal coolant 1 Runode can electronic components 6 on the insulating substrate 5 to efficiently cool . In addition, since the insulating substrate 5 is joined to the opening 3, the burring 4 protruding in a cylindrical shape is easily thermally deformed, and effectively absorbs the difference in thermal expansion between the insulating substrate 5 and the heat sink body 2. Therefore, it is possible to provide a highly reliable heat sink.

第２の本発明は、ヒートシンク本体２の開口３の孔縁部に環状の突条部７を残存させて、その周りに環状溝８が形成され且つ、開口３に架橋部９が一体的に横断され、その突条部７および架橋部９の上端縁がその環状溝８より小に形成された絶縁基板５により閉塞され、その接触部がろう付けにより液密に被嵌されたものであるから、絶縁基板５とヒートシンク本体２との熱膨張差に基づく応力を環状溝８が効果的に吸収して、絶縁基板５の割れを防止できる。
即ち、環状溝８の存在によって、開口３の孔縁部が容易に変形し易く、それにより熱応力を容易に吸収し得る。しかも、部品点数が少なく構造が簡単な信頼性の高いヒートシンクを提供できる。 In the second aspect of the present invention, the annular protrusion 7 is left at the hole edge of the opening 3 of the heat sink body 2, the annular groove 8 is formed around it, and the bridging portion 9 is integrally formed with the opening 3. Crossed, the upper edge of the protrusion 7 and the bridging portion 9 is closed by an insulating substrate 5 formed smaller than the annular groove 8 , and the contact portion is liquid-tightly fitted by brazing. Therefore, the annular groove 8 can effectively absorb the stress based on the difference in thermal expansion between the insulating substrate 5 and the heat sink body 2, and the insulating substrate 5 can be prevented from cracking.
That is, due to the presence of the annular groove 8, the hole edge of the opening 3 is easily deformed, so that thermal stress can be easily absorbed. In addition, it is possible to provide a highly reliable heat sink with a small number of parts and a simple structure.

次に、図面に基づいて本発明の実施の形態を説明する。
図１は本発明のヒートシンクの縦断面図であり、図２はそのヒートシンク本体２の第１プレート2aと絶縁基板５との分解斜視図である。
このヒートシンクは、内部に冷却液１が充満して流通する偏平なヒートシンク本体２の開口３がセラミック製の絶縁基板５で直接閉塞され、その絶縁基板５上に電子部品６が接合されるものである。ヒートシンク本体２は、第１プレート2aと第２プレート2cとの間にスペーサ2bが介装され、スペーサ2bによって外周を閉塞する。なお、スペーサ2bの一部には図示しない冷却液１の出入口が開口されている。第１プレート2aと第２プレート2cとの間には、インナーフィン10が内装される。そして第１プレート2aにはその平面に開口３が設けられ、開口３の孔縁部が外面側に筒状に形成されたバーリング４を一体的に有する。そしてバーリング４の開口は、絶縁基板５の外周よりもわずかに小に形成され、バーリング４の先端が絶縁基板５で閉塞される。 Next, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a longitudinal sectional view of a heat sink according to the present invention, and FIG. 2 is an exploded perspective view of a first plate 2 a and an insulating substrate 5 of the heat sink body 2.
In this heat sink, an opening 3 of a flat heat sink body 2 in which the coolant 1 is filled and circulated is directly closed by a ceramic insulating substrate 5, and an electronic component 6 is joined to the insulating substrate 5. is there. The heat sink body 2 has a spacer 2b interposed between the first plate 2a and the second plate 2c, and the outer periphery is closed by the spacer 2b. A part of the spacer 2b has an inlet / outlet for the coolant 1 (not shown). Inner fins 10 are provided between the first plate 2a and the second plate 2c. The first plate 2a is provided with an opening 3 on a plane thereof, and integrally has a burring 4 in which a hole edge portion of the opening 3 is formed in a cylindrical shape on the outer surface side. The opening of the burring 4 is formed slightly smaller than the outer periphery of the insulating substrate 5, and the tip of the burring 4 is closed by the insulating substrate 5.

このように構成された各部品は、一体的にその接触部がろう付け固定されて液密に形成される。そして絶縁基板５の上面には、発熱量の大きな電子部品６がハンダ付け等の手段により接合される。また、ヒートシンク本体２内には冷却液１が流通される。そして電子部品６からの発熱は、絶縁基板５を介して直接冷却液１により吸熱される。
このとき絶縁基板５と開口３の接合面においては、両者間に熱膨張率が異なるため熱応力が生じる。その応力は、バーリング形成された開口３のわずかな変形により吸収され、絶縁基板５に割れを生じることがない。また、絶縁基板５とヒートシンク本体２との接触面は少なく且つ、絶縁基板５は冷却液１に接触している。
そして、直接電子部品６の発熱が冷却液１に吸収されるため、ヒートシンク本体２自体は比較的低温に保たれ、その点からもヒートシンク本体２と絶縁基板５との接合部に加わる熱応力を小とし、信頼性の高いヒートシンクとなり得る。 Each component configured in this manner is formed in a liquid-tight manner by integrally brazing and fixing the contact portion. Then, the electronic component 6 having a large calorific value is joined to the upper surface of the insulating substrate 5 by means such as soldering. A coolant 1 is circulated in the heat sink body 2. The heat generated from the electronic component 6 is directly absorbed by the coolant 1 through the insulating substrate 5.
At this time, thermal stress is generated at the joint surface between the insulating substrate 5 and the opening 3 because the coefficient of thermal expansion differs between the two. The stress is absorbed by a slight deformation of the opening 3 formed by burring, and the insulating substrate 5 is not cracked. Further, there are few contact surfaces between the insulating substrate 5 and the heat sink body 2, and the insulating substrate 5 is in contact with the coolant 1.
Since the heat generated by the electronic component 6 is directly absorbed by the coolant 1, the heat sink body 2 itself is kept at a relatively low temperature, and from this point, the thermal stress applied to the joint between the heat sink body 2 and the insulating substrate 5 is also increased. Small and can be a reliable heat sink.

なお、この例では一対の第１プレート2aと第２プレート2cとの間にスペーサ2bおよびインナーフィン10を配置したが、スペーサ2bおよびインナーフィン10に代えて、外周が第１プレート2aと第２プレート2cに整合する枠部を有し、各枠部間に網目状のフィン部を設けた図示しないインナーフィンを複数接合することもできる。その場合には、冷却液１の出入口を第１プレート2aまたは第２プレート2cに設けることができる。
さらには、インナーフィンの枠の一部を開口しそこから冷却液１を流出入してもよい。 In this example, the spacer 2b and the inner fin 10 are disposed between the pair of the first plate 2a and the second plate 2c. However, the outer periphery is replaced with the first plate 2a and the second plate 10 in place of the spacer 2b and the inner fin 10. A plurality of inner fins (not shown) each having a frame portion aligned with the plate 2c and provided with a mesh-like fin portion between the frame portions can be joined. In that case, the inlet / outlet of the coolant 1 can be provided in the first plate 2a or the second plate 2c.
Furthermore, a part of the frame of the inner fin may be opened and the coolant 1 may flow out and in from there.

次に、図３は本発明の他の実施の形態を示し、図４はそのヒートシンク本体２の第１プレート2aの平面斜視図である。
この例が図１のそれと異なる点は、第１プレート2aの形状のみである。この第１プレート2aは開口３を有し、その孔縁部に環状の突条部７を介し、その外側に隣接して環状溝８が形成されている。そして開口３には、複数の架橋部９が突条部７と一体に且つ面一に形成されている。
このような第１プレート2aはプレス成形により形成することができる。或いはアルミニュームダイキャスト、さらにはアルミニューム材の切削によって形成することもできる。 Next, FIG. 3 shows another embodiment of the present invention, and FIG. 4 is a plan perspective view of the first plate 2a of the heat sink body 2. As shown in FIG.
This example is different from that of FIG. 1 only in the shape of the first plate 2a. The first plate 2a has an opening 3, and an annular groove 8 is formed adjacent to the outer side of the hole edge via an annular ridge 7. In the opening 3, a plurality of bridging portions 9 are formed integrally with the protrusion 7 and flush with each other.
Such a first plate 2a can be formed by press molding. Alternatively, it can be formed by aluminum die casting, or by cutting aluminum material.

このようにしてなる第１プレート2aには、その開口３の孔縁部と絶縁基板５とがろう付けにより接合される。このとき絶縁基板５の裏面は突条部７および架橋部９によって接合される。この架橋部９の存在は、接合時に絶縁基板５を平面に維持してろう付けすることが可能とする。そしてヒートシンク本体２内および各架橋部９間には、冷却液１が充満して流通する。また絶縁基板５上には、電子部品６がろう付け、はんだ付け等の手段により接合され、電子部品６からの発熱は絶縁基板５を介し冷却液１に直接吸熱される。
絶縁基板５からの熱の一部は、架橋部９および突条部７に伝熱されるが、それらに加わる熱応力は環状溝８等の存在により効果的に吸収され、絶縁基板５に割れが生じることはない。 The hole edge of the opening 3 and the insulating substrate 5 are joined to the first plate 2a thus formed by brazing. At this time, the back surface of the insulating substrate 5 is joined by the protruding portion 7 and the bridging portion 9. The presence of the bridging portion 9 makes it possible to braze the insulating substrate 5 while maintaining the flat surface during bonding. The coolant 1 is filled and circulated in the heat sink body 2 and between the bridging portions 9. On the insulating substrate 5, the electronic component 6 is joined by means such as brazing or soldering, and the heat generated from the electronic component 6 is directly absorbed by the coolant 1 through the insulating substrate 5.
Part of the heat from the insulating substrate 5 is transferred to the bridging portion 9 and the protrusion 7, but the thermal stress applied to them is effectively absorbed by the presence of the annular groove 8 and the like, and the insulating substrate 5 is cracked. It does not occur.

本発明のヒートシンクの第１の実施の形態を示す縦断面図。The longitudinal cross-sectional view which shows 1st Embodiment of the heat sink of this invention. 同ヒートシンク本体２の第１プレート2aおよび絶縁基板５の分解斜視図。2 is an exploded perspective view of a first plate 2a and an insulating substrate 5 of the heat sink body 2. FIG. 本発明のヒートシンクの第２の実施の形態を示す縦断面図。The longitudinal cross-sectional view which shows 2nd Embodiment of the heat sink of this invention. 同ヒートシンクに用いられるヒートシンク本体２の第１プレート2aの平面斜視図。The top perspective view of the 1st plate 2a of the heat sink main body 2 used for the heat sink.

符号の説明Explanation of symbols

１ 冷却液
２ ヒートシンク本体
2a 第１プレート
2b スペーサ
2c 第２プレート
３ 開口
４ バーリング
５ 絶縁基板 1 Coolant 2 Heat sink body
2a First plate
2b Spacer
2c 2nd plate 3 Opening 4 Burring 5 Insulating substrate

６ 電子部品
７ 突条部
８ 環状溝
９ 架橋部
10 インナーフィン
11 ろう材 6 Electronic components 7 Projection 8 Ring groove 9 Bridge
10 Inner fin
11 Brazing material

Claims (2)

内部に冷却液(1) が流通する偏平なヒートシンク本体(2) の平坦な外面に、開口(3) が設けられ、
その開口(3) の孔縁部に外面側に筒状に突出するバーリング(4)が形成され、そのバーリング(4)の先端が絶縁基板(5)で閉塞されるとともに、そのバーリング(4)の先端と絶縁基板(5)との接触部がろう付けにより液密に接合され、
前記冷却液(1) が、前記バーリング(4)の先端縁まで満たされる状態で、ヒートシンク本体(2)内を流通し、
前記絶縁基板(5)上に発熱する電子部品(6)が接合される液冷ヒートシンク。 An opening (3) is provided on the flat outer surface of the flat heat sink body (2) through which the coolant (1) flows.
A burring (4) protruding in a cylindrical shape on the outer surface side is formed at the hole edge of the opening (3), the tip of the burring (4) is blocked by the insulating substrate (5) , and the burring (4) The contact portion between the tip of the substrate and the insulating substrate (5) is liquid-tightly joined by brazing ,
In a state where the coolant (1) is filled up to the leading edge of the burring (4), it circulates in the heat sink body (2),
The liquid cooling heat sink on which an electronic component that generates heat on the insulating substrate (5) (6) is joined. 内部に冷却液(1) が流通する偏平なヒートシンク本体(2) の平坦な外面に、開口(3) が設けられ、
その開口(3) の外面側の孔縁部に、環状の突条部(7) を残存させてその外周に環状溝(8) が形成されると共に、前記開口(3) に架橋部(9) が一体に横断され、
前記突条部(7) および架橋部(9) の上端縁が絶縁基板(5)で閉塞されて、それらの接触部がろう付けにより液密に接合され、
前記絶縁基板(5)の外周縁が環状溝(8)の内周縁と整合するように形成され、
前記冷却液(1) が、前記突条部(7) および架橋部(9) の上端縁まで満たされる状態で、ヒートシンク本体(2)内を流通し、
その絶縁基板(5)上に発熱する電子部品(6)が接合される液冷ヒートシンク。 An opening (3) is provided on the flat outer surface of the flat heat sink body (2) through which the coolant (1) flows.
An annular groove (8) is formed on the outer periphery of the opening (3), leaving an annular ridge (7) at the outer edge of the hole, and a bridging portion (9) is formed in the opening (3). ) Are crossed together,
The upper edge of the protruding portion (7) and the bridging portion (9 ) is closed with an insulating substrate (5), and their contact portions are liquid-tightly joined by brazing ,
The outer peripheral edge of the insulating substrate (5) is formed to align with the inner peripheral edge of the annular groove (8),
The coolant (1) flows through the heat sink body (2) in a state where the coolant (1) is filled up to the upper end edges of the protrusions (7) and the bridging part (9),
A liquid-cooled heat sink in which an electronic component (6) that generates heat is bonded onto the insulating substrate (5).
JP2007003695A 2007-01-11 2007-01-11 Liquid cooling heat sink Expired - Fee Related JP4832316B2 (en)

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JPH09121557A (en) * 1995-10-23 1997-05-06 Hitachi Ltd Electronic parts cooling structure for rotary equipment and its manufacture
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