JP4830917B2 - High frequency module device and transmission / reception module device using the same - Google Patents

Description

  The present invention relates to a high-frequency module device used for, for example, a transmission / reception module of a radar device or a communication device, and a transmission / reception module device using the same.

  In a conventional high frequency module device used in a microwave band, a millimeter wave band, etc., for example, a high frequency circuit element mounted on a printed board or the like is electrically shielded by a machined metal case. However, when a metal case is used, the weight of the metal case increases due to an increase in the size of the parts to be stored, the number of parts, etc., and it is necessary to construct a shield wall etc. by machining, resulting in high processing costs. In order to realize weight reduction and cost reduction, it has been proposed that such high-frequency circuit elements are electrically shielded using a resin shield cover formed of a conductive resin.

JP 2000-174204 A (page 1-5, FIG. 1-2, etc.) JP 2006-41037 A (page 1-6, FIG. 1-5)

  However, since the conventional high-frequency module device is configured as described above, the installation space for the power supply circuit is provided outside the shield resin cover formed of such a conductive resin, and the device configuration is enlarged. There was a problem of doing. Further, in order to eliminate such a gap in the contact surface between the shield resin cover and the module case and ensure a high shielding effect, a V-shaped groove portion is provided in the module case, and the shield resin cover is provided in the V-shaped groove portion. The structure is such that the open end is engaged, and there is a problem that the processing cost on the module case side is required.

  On the other hand, in a module device used in a relatively low frequency band, a simple shield structure by sheet metal bending is adopted, but in a high-frequency module used in various radar devices and communication devices, it exceeds 1 GHz. In such a frequency band, it is necessary to have a gain of several tens of dB. When such a simple shield structure by sheet metal bending is adopted for a high frequency module, the isolation between each circuit is insufficient and the performance is ensured. It is extremely difficult.

  The present invention has been made in order to solve the above-described problems, and is capable of reducing the weight and size of the device, and also providing a novel high frequency capable of obtaining a high shielding effect and high reliability. An object is to provide a modular device.

A high-frequency module device according to the present invention includes a metal module case, a high-frequency circuit board that is mounted on the module case and has an opening that exposes the mounting surface of the module case, and a peripheral portion of the high-frequency circuit board. A surrounding leg portion and a wall portion disposed in the opening portion are provided, and the leg portion and the wall portion are brought into contact with the module case in the peripheral portion and the opening portion of the high-frequency circuit board, respectively, on the high-frequency circuit board. A conductive resin shield member disposed on the shield, a shield fixing means configured to be higher than the conductive resin shield member, and fixing the conductive resin shield member to the module case; and fixed to the shield fixing means And a power supply circuit board disposed on the resin shield member and a through hole provided on the conductive resin shield member. A power supply wiring that electrically connects the high-frequency circuit board and the power supply circuit board through a hole; and the power supply circuit board that is provided so as to surround the power supply circuit board and to which the power supply wiring is connected And a module case cover that protects against damage.

  In addition, a transmission / reception module device according to another invention includes the high-frequency module device according to claim 1, wherein a transmission unit and a reception unit are respectively formed in a region of the high-frequency circuit board across the opening.

  According to the present invention, the conductive resin shield member is fixed to the module case by the shield fixing means configured higher than the conductive resin shield member, and the power circuit board is fixed to the shield fixing means. Weight reduction and size reduction can be achieved. Further, since the high-frequency circuit board is covered with the conductive resin shield member having the leg portions and the wall portions that are brought into contact with the module case at the periphery and the opening of the high-frequency circuit board, respectively, a higher shielding effect can be obtained. .

Embodiment. 1
Embodiment 1 of the present invention will be described below with reference to FIGS. 1A and 1B are a cross-sectional configuration diagram and a top view showing a high-frequency module device according to Embodiment 1, and FIG. 1A is a cross-sectional view taken along line AA ′ of the high-frequency module device shown in FIG. ) Is a top view of the high-frequency module device. The first embodiment shows a case where the high-frequency module device according to the present invention is applied to a transmission / reception module device. In FIG. 1, 1 is a metal module case, 2 is a high-frequency circuit board mounted on the module case 1, 3 is high-frequency circuit fixing means for fixing the high-frequency circuit board 2 to the module case 1, and 4 is on the module case 1 A shield member (hereinafter simply referred to as a shield member) formed of a conductive resin that is provided and accommodates the high-frequency circuit board 2, 5 and 6 are shield fixing means for the shield member 4, and 7 is disposed on the shield member 4. 8 is a power supply circuit fixing means for fixing the power supply circuit board 7 to the fixing means 6, and 9 is a cover of the module case 1 provided to cover the shield member 4 and the power supply circuit board 7 (hereinafter referred to as cover). 10 is a cover fixing means for fixing the cover member 9 to the module case 1. Each of the fixing means 3, 5, 8 and 10 is a fixing means such as a screw or a bolt, and is screwed into a corresponding screw hole provided in the module case 1 or the like to fix the high-frequency circuit board 2 or the like. However, the shield fixing means 6 needs to have a function of fixing the shield member 4 to the module case 1 and a function of fixing the power supply circuit board 7 on the shield member 4. A post member having a tap 6b for screwing the circuit fixing means 8 is used. As shown in FIG. 1, the shielding member 4 has a leg portion 12 and the wall 13 respectively, are brought into contact with the leg portion 12 and the wall portion 13 of the shield member 4 on the mounting surface of the module case 1 RF It is provided on the circuit board 2.

Here, the high-frequency circuit board 2 and the shield member 4 will be specifically described. As the shield member 4 according to the present invention, for example, in order to obtain an effect of electromagnetic shielding, using an injection molded product formed by injection molding a resin material such as liquid crystal polymer (LCP) or modified polyphenylene oxide (PPO), The surface of the injection molded product is plated with nickel or the like, or the injection molded product is mixed with a metallic filler containing a magnetic material such as ferrite to have a shielding property. Further, as the high-frequency circuit board 2 , in order to reduce the cost of the apparatus, a material whose surface is solder-coated with a hot gas leveler is used instead of an expensive material such as an Au-plated board.

The shield member 4 made of this liquid crystal polymer (LCP) or the like has a problem such as deformation (creep phenomenon) of the shield member 4 due to temperature stress as an inherent phenomenon, but in order to avoid this problem, a solder coat (by hot gas leveler) There is a problem of reliability in securing the shielding property by directly fixing the shielding member 4 on the high-frequency circuit board 2 using the solder spray coating. Therefore, in the high-frequency module device according to the first embodiment, the periphery of the high-frequency circuit board 2 is surrounded by the legs of the shield member 4, and the notch hole 11 is provided in the high-frequency circuit board 2 as shown in FIG. Thus, the resin shield member 4 and the metal module case 1 are directly fixed, whereby the solder coat material is scraped by the thermal expansion / contraction of the shield member 4 and the fixing means 3, 5 , 6 are used. The configuration is such that a decrease in tightening torque of the member can be avoided.

Further, it is conceivable to provide the power circuit board 7 between the shield member 4 and the module case cover 9 from the viewpoint of heat dissipation, but it is difficult to directly mount the power circuit board 7 or the like on the shield member 4. Therefore, in the high-frequency module device according to the first embodiment, the shield fixing means 6 that has been tapped inside is used as the fixing means for the shield member 4. By fixing the power supply circuit board 7 to the tap 6b applied to the inside of the fixing means 6 using the fixing means 8, a high-frequency module having a two-story structure as shown in FIG. 1 can be easily configured. The entire high-frequency module device can be reduced in size.

In FIG. 1, reference numeral 11 denotes a notch hole provided at the center of the high-frequency circuit board 2, 12 denotes a leg part of the shield member 4 disposed so as to surround the periphery of the high-frequency circuit board 2, and 13 denotes a notch. The wall portions 14 and 15 of the shield member 4 disposed in the hole 11 are separated by the wall portion 13 of the shield member 4, and by mounting a semiconductor, a passive chip component, etc., an amplifier, a phase shifter, a control circuit, etc. First and second element regions of the high-frequency circuit board 2 on which the active circuits are formed, 16 is a through hole for power supply wiring provided in the shield member 4, and 17 is through the through hole 16 and the high-frequency circuit board 2 and the power source. Power supply wiring for electrically connecting the circuit board 7, 18 is a gap provided between the outer end of the high-frequency circuit board 2 and the shield member 4, and 19 is the high-frequency circuit board 2 that forms the notch 11. Of A gap provided between the wall portion 13 of the end portion and the shield member 4.

As shown in FIG. 1A, gaps 18 and 19 are provided between the high-frequency circuit board 2 and the shield member 4, and the shield fixing means 5 prevents the shield member 4 from coming into contact with the high-frequency circuit board 2. , 6 are directly fixed to the module case 1. By directly fixing the shield member 4 to the module case 1 in this way, the thermal expansion of the shield member 4 is suppressed, and a decrease in the tightening torque in each of the fixing means 3, 5, 6 and 8 can be avoided. Even if the high-frequency circuit board 2 and the shield member 4 are deformed by thermal expansion, a gap is provided between the shield member 4 and the high-frequency circuit board 2, so the high-frequency circuit board 2 and the shield member 4 The deformation of each member due to contact with can be avoided. Further, since the provided module case cover 9 on the outside of the power supply circuit board 7, the power supply circuit board 7, moisture from the outside to the power source line 17 or the like, foreign matter does not adhere, water from these externally from foreign matter The inside of the module case cover 9 is protected.

  In FIG. 1, 20 and 21 are input / output lines formed on the high-frequency circuit board 2, 22 and 23 are switch circuits connected to the input / output lines 20 and 21, and 24 a and 24 b are first and second inputs. Phase shift circuits formed in the element regions 14 and 15, 25 a and 25 b are amplifier circuits, and 26 a and 26 b are signal lines for transmitting high-frequency signals input via the switch circuits 22 and 23, respectively. In the first embodiment, a phase shift circuit 24a provided in the first element region 14, an amplifier circuit 25a, a signal line 26a, a transmission system circuit, a phase shift circuit 24b provided in the second element region 15, and an amplifier circuit. It is assumed that a receiving system circuit is configured by 25b and the signal line 26b.

  Note that the inside of the shield member 4 is narrower than the waveguide cut-off dimension, and the high-frequency circuit board 2 is also a portion separated into a width less than the waveguide cut-off dimension. High-frequency circuits such as switch circuits 22 and 23, phase shift circuits 24a and 24b, and amplifier circuits 25a and 25b are mounted on the element regions 14 and 15, respectively. In such a structure, the transmission system circuit and the reception system circuit are arranged on the high-frequency circuit board 2 facing each other with the notch hole 11 interposed therebetween, so that the isolation between transmission and reception can be improved. .

  Next, the operation of the high-frequency module device shown in FIG. 1 will be briefly described. For example, the transmission signal supplied to the input / output line 20 at the time of transmission is output to the transmission system circuit formed in the first element region 14 via the switch circuit 22, amplified by the amplifier circuit 25 a, and then phase-shifted The phase amount is controlled by the circuit 24 a and is output to an element antenna (not shown) connected to the module device via the switch circuit 23 and the input / output line 21. The reception signal supplied from the element antenna at the time of reception is output to the reception system circuit formed in the second high frequency element region 15 via the input / output line 21 and the switch circuit 23, and the phase amount is changed by the phase shift circuit 24b. After being controlled, the signal is amplified by the amplifier circuit 25 b and output to a signal processing unit (not shown) connected to the module device via the switch circuit 22 and the input / output line 20.

Finally, assembly of the high-frequency module device according to Embodiment 1 will be described. FIG. 2 is an exploded configuration diagram showing an assembly state of the high-frequency module device shown in FIG. 1, and the assembly of the high-frequency module device shown in FIG. 1 will be briefly described with reference to FIG. In the drawings, the same reference numerals denote the same parts, and detailed descriptions thereof are omitted. As shown in FIG. 2, the shield member 4 is fixed to the module case 1 using shield fixing means 6. Specifically, the shield member 4 is fixed to the module case 1 by screwing the screw portions 6 a of the shield fixing means 6 into corresponding screw holes provided in the module case 1. The shield fixing means 6 has a tap portion 6b for arranging the power circuit board 7 on the shield member 4, and after the shield member 4 is fixed to the module case 1, the power circuit board 7 is provided. In this state, the power supply circuit board 7 is fixed to the shield fixing means 6 by screwing the power supply circuit fixing means 8 into the tap portion 6 b of the shield fixing means 6.

  In addition, in order to connect the high frequency circuit board 2 and the power supply circuit board 7 by the electrical wiring 17, it was set as the structure which provided the through-hole 16 which lets the electrical wiring 17 pass to the shield member 4, However, In the high frequency module apparatus by Embodiment 1, it is like this. Since the through-hole 16 can be formed simultaneously with the formation of the entire shield member 4 by injection molding, there is an advantage that the processing cost of drilling can be greatly reduced compared to the case of using a metal shield member. .

  As described above, according to the high frequency module device according to the first embodiment, by using the conductive resin shield member 4, the high frequency module device can be reduced in weight and size, and the conductive resin shield member 4. Are provided with leg portions 12 and wall portions 13, and these leg portions 12 and wall portions 13 cover the high-frequency circuit board 2 so as to contact the peripheral portion of the high-frequency circuit board 2 and the module case 1 in the opening 11, respectively. Thus, a high shielding effect can be obtained, and consequently high reliability can be realized.

  Further, since the transmission system circuit and the reception system circuit are respectively formed in the first and second element regions sandwiching the opening 11 provided in the high frequency circuit board 2, the isolation characteristics of the portion surrounded by the shield member 4 are formed. Can be further improved, and a transmission / reception module device with good isolation between transmission and reception can be obtained.

Embodiment 2. FIG.
Next, Embodiment 2 of the present invention will be described with reference to FIG. 3A and 3B are a top view and a schematic side view showing the high-frequency module device according to Embodiment 2, wherein FIG. 3A is a top view and FIG. 3B is a schematic side view thereof. In FIG. 3, 4b is a resin shield member, and 27 is an uneven block portion (hereinafter referred to as a cut-off) provided in the shield member 4b to prevent deterioration of the shield performance due to the low dimensional accuracy of the shield member 4b. (Referred to as a block), and is periodically provided on the surface in contact with the module case 1 as shown in FIG. In the drawings, the same reference numerals indicate the same or corresponding parts, and detailed description thereof will be omitted. The cut-off block 27 is provided so that the contact point with the module case 1 is less than or equal to the length of a quarter wavelength of the operating frequency. With such a configuration, the dimensional accuracy of the shield member 4b is improved. It is possible to prevent the shield performance from being deteriorated due to lowness, and to improve the shielding effect. In the case of a metallic shield member, the processing of such a cut-off block 27 is extremely expensive, but in the case of a resin shield member, it can be performed simultaneously with the formation of the entire shield member 4b by injection molding. Therefore, the processing cost can be greatly reduced as in the case of processing the through hole 16 for power supply wiring.

Thus, according to the high frequency module device according to the second embodiment, since the conductive resin shield is used, the weight of the device can be reduced, and compared with the case where a metal shield block is used. A high-performance high-frequency module device can be realized without deteriorating the shielding performance. Moreover, since the cut-off block 27 can be performed simultaneously with the formation of the entire shield member 4b by injection molding, it is suitable for mass production and the cost of the apparatus can be reduced.

It is sectional drawing and the top view which show the high frequency module apparatus by Embodiment 1. It is a disassembled block diagram which shows the assembly condition of the high frequency module apparatus shown in FIG. It is the top view and outline | summary side view which show the structure of the high frequency module apparatus by Embodiment 2. FIG.

Explanation of symbols

1 module case, 2 high-frequency circuit board, 3, 5, 8, 10 fixing means (screw),
4 conductive resin shield member, 6 fixing means (post member), 7 power circuit board,
9 Module case cover, 11 opening, 12 legs, 13 wall,
14 1st area | region, 15 2nd area | region, 16 Through-hole for power supply wiring, 17 Power supply wiring,
18, 19 Clearance.

Claims (5)

A metal module case, a high-frequency circuit board that is mounted on the module case and has an opening that exposes the mounting surface of the module case, and a leg that surrounds the periphery of the high-frequency circuit board and the opening are disposed in the opening. A conductive resin shield disposed on the high-frequency circuit board with the leg portions and the wall portions in contact with the module case at the periphery and the opening of the high-frequency circuit board, respectively. A member, a shield fixing means configured to be higher than the conductive resin shield member, and fixing the conductive resin shield member to the module case; and fixed on the shield fixing means and disposed on the resin shield member. And the high-frequency circuit board and the power supply through a through-hole provided in the conductive resin shield member. A power line for electrically connecting the circuit board is provided so as to surround the power supply circuit board, high frequency and a module case cover for protecting the power supply circuit board on which the power line is connected from the outside Modular device. The high-frequency module device according to claim 1, wherein the conductive resin shield member is formed by mixing a metallic filler into a resin member. The high frequency module device according to claim 1 or 2, wherein a gap is provided between the high frequency circuit board and a leg portion and a wall portion of the conductive resin shield member. 2. The high-frequency module according to claim 1, wherein a concavo-convex block member that abuts the module case at a period of ¼ wavelength or less of a high-frequency signal transmitted through the high-frequency circuit is provided on a leg of the conductive resin shield member. apparatus. A transmission / reception module device comprising the high-frequency module device according to claim 1, wherein a transmission unit and a reception unit are formed in a region of the high-frequency circuit board sandwiching the opening.

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