JP4827269B2 - パターン検査装置および方法 - Google Patents
パターン検査装置および方法 Download PDFInfo
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- JP4827269B2 JP4827269B2 JP2010188301A JP2010188301A JP4827269B2 JP 4827269 B2 JP4827269 B2 JP 4827269B2 JP 2010188301 A JP2010188301 A JP 2010188301A JP 2010188301 A JP2010188301 A JP 2010188301A JP 4827269 B2 JP4827269 B2 JP 4827269B2
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- 238000007689 inspection Methods 0.000 title claims abstract description 997
- 238000000034 method Methods 0.000 title claims abstract description 771
- 238000004519 manufacturing process Methods 0.000 claims abstract description 40
- 230000007547 defect Effects 0.000 claims description 529
- 238000012937 correction Methods 0.000 claims description 103
- 239000004065 semiconductor Substances 0.000 claims description 102
- 239000013598 vector Substances 0.000 claims description 100
- 238000011156 evaluation Methods 0.000 claims description 79
- 230000005484 gravity Effects 0.000 claims description 16
- 229960001716 benzalkonium Drugs 0.000 claims description 2
- CYDRXTMLKJDRQH-UHFFFAOYSA-N benzododecinium Chemical compound CCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 CYDRXTMLKJDRQH-UHFFFAOYSA-N 0.000 claims description 2
- 238000013461 design Methods 0.000 description 162
- 230000008569 process Effects 0.000 description 114
- 238000010586 diagram Methods 0.000 description 96
- 235000012431 wafers Nutrition 0.000 description 85
- 238000003708 edge detection Methods 0.000 description 70
- 238000004364 calculation method Methods 0.000 description 63
- 239000010410 layer Substances 0.000 description 61
- 229910052799 carbon Inorganic materials 0.000 description 52
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 51
- 238000010894 electron beam technology Methods 0.000 description 44
- 238000009826 distribution Methods 0.000 description 37
- 238000012545 processing Methods 0.000 description 36
- 239000000523 sample Substances 0.000 description 33
- 238000012360 testing method Methods 0.000 description 33
- 238000004544 sputter deposition Methods 0.000 description 20
- 238000001459 lithography Methods 0.000 description 19
- 238000000576 coating method Methods 0.000 description 18
- 238000001514 detection method Methods 0.000 description 18
- 230000008859 change Effects 0.000 description 17
- 201000009310 astigmatism Diseases 0.000 description 16
- 238000005070 sampling Methods 0.000 description 16
- 238000005259 measurement Methods 0.000 description 15
- 238000003860 storage Methods 0.000 description 15
- 238000012546 transfer Methods 0.000 description 15
- 239000002245 particle Substances 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 230000002159 abnormal effect Effects 0.000 description 13
- 230000002829 reductive effect Effects 0.000 description 13
- 238000000926 separation method Methods 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- 210000004027 cell Anatomy 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- 230000003628 erosive effect Effects 0.000 description 10
- 238000000605 extraction Methods 0.000 description 10
- 230000009466 transformation Effects 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 230000036961 partial effect Effects 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 229920005591 polysilicon Polymers 0.000 description 8
- 230000010339 dilation Effects 0.000 description 7
- 239000000284 extract Substances 0.000 description 7
- 238000009499 grossing Methods 0.000 description 7
- 238000004088 simulation Methods 0.000 description 7
- PXFBZOLANLWPMH-UHFFFAOYSA-N 16-Epiaffinine Natural products C1C(C2=CC=CC=C2N2)=C2C(=O)CC2C(=CC)CN(C)C1C2CO PXFBZOLANLWPMH-UHFFFAOYSA-N 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 238000007726 management method Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 230000018109 developmental process Effects 0.000 description 5
- 230000000737 periodic effect Effects 0.000 description 5
- 230000009897 systematic effect Effects 0.000 description 5
- 238000011960 computer-aided design Methods 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000002372 labelling Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 230000007261 regionalization Effects 0.000 description 4
- 238000010187 selection method Methods 0.000 description 4
- 238000012935 Averaging Methods 0.000 description 3
- 230000003044 adaptive effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000007621 cluster analysis Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- 230000002457 bidirectional effect Effects 0.000 description 2
- 238000004422 calculation algorithm Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000004069 differentiation Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 231100000817 safety factor Toxicity 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- 230000036962 time dependent Effects 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 238000013142 basic testing Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000002068 genetic effect Effects 0.000 description 1
- 238000003702 image correction Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000013041 optical simulation Methods 0.000 description 1
- 238000007500 overflow downdraw method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 210000001316 polygonal cell Anatomy 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Image Analysis (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010188301A JP4827269B2 (ja) | 2004-02-23 | 2010-08-25 | パターン検査装置および方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004047098 | 2004-02-23 | ||
| JP2004047098 | 2004-02-23 | ||
| JP2010188301A JP4827269B2 (ja) | 2004-02-23 | 2010-08-25 | パターン検査装置および方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005039871A Division JP4771714B2 (ja) | 2004-02-23 | 2005-02-16 | パターン検査装置および方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010268009A JP2010268009A (ja) | 2010-11-25 |
| JP2010268009A5 JP2010268009A5 (enrdf_load_stackoverflow) | 2011-07-07 |
| JP4827269B2 true JP4827269B2 (ja) | 2011-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010188301A Expired - Fee Related JP4827269B2 (ja) | 2004-02-23 | 2010-08-25 | パターン検査装置および方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4827269B2 (enrdf_load_stackoverflow) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101261016B1 (ko) * | 2011-03-15 | 2013-05-06 | (주) 인텍플러스 | 평판패널 기판의 자동광학검사 방법 및 그 장치 |
| JP5986817B2 (ja) | 2012-06-15 | 2016-09-06 | 株式会社日立ハイテクノロジーズ | オーバーレイ誤差測定装置、及びコンピュータープログラム |
| JP5957357B2 (ja) | 2012-10-15 | 2016-07-27 | 株式会社日立ハイテクノロジーズ | パターン検査・計測装置及びプログラム |
| CN106990119A (zh) * | 2017-04-27 | 2017-07-28 | 中科慧远视觉技术（洛阳）有限公司 | 一种自动检测白玻表面缺陷的视觉检测系统及检测方法 |
| JP6882097B2 (ja) | 2017-06-29 | 2021-06-02 | Ｔａｓｍｉｔ株式会社 | 走査電子顕微鏡の操作パラメータを検証する方法 |
| JP7157580B2 (ja) * | 2018-07-19 | 2022-10-20 | 東京エレクトロン株式会社 | 基板検査方法及び基板検査装置 |
| WO2021140866A1 (ja) * | 2020-01-10 | 2021-07-15 | 株式会社ニューフレアテクノロジー | パターン検査装置及びパターン検査方法 |
| JP7451287B2 (ja) * | 2020-04-30 | 2024-03-18 | 東レエンジニアリング先端半導体Ｍｉテクノロジー株式会社 | パターン欠陥検出方法 |
| KR102844222B1 (ko) * | 2021-12-02 | 2025-08-07 | 세메스 주식회사 | 반도체 소자 검사 장치 및 이를 이용한 반도체 소자 검사 방법 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3316977B2 (ja) * | 1993-10-12 | 2002-08-19 | 日本アビオニクス株式会社 | パタ−ンの検査方法 |
| JPH1114324A (ja) * | 1997-06-27 | 1999-01-22 | Hitachi Ltd | パターン欠陥検査方法及びその装置 |
| JP3524853B2 (ja) * | 1999-08-26 | 2004-05-10 | 株式会社ナノジオメトリ研究所 | パターン検査装置、パターン検査方法および記録媒体 |
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- 2010-08-25 JP JP2010188301A patent/JP4827269B2/ja not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| JP2010268009A (ja) | 2010-11-25 |
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