JP4820256B2

JP4820256B2 - Heating element cooling device

Info

Publication number: JP4820256B2
Application number: JP2006262876A
Authority: JP
Inventors: 浩大塚
Original assignee: Honda Motor Co Ltd
Current assignee: Honda Motor Co Ltd
Priority date: 2006-09-27
Filing date: 2006-09-27
Publication date: 2011-11-24
Anticipated expiration: 2026-09-27
Also published as: JP2008085052A

Description

本発明は、半導体素子からなる発熱体を冷却する、発熱体冷却装置に関する。 The present invention relates to a heating element cooling device for cooling a heating element made of a semiconductor element.

半導体素子は動作時に発熱するので、耐久性を維持するために、発熱による温度上昇を抑制することが求められる。例えば、電動モータの回転を制御するパワードライブコントローラには、絶縁ゲートバイポーラトランジスタ（ＩＧＢＴ）等のパワー半導体素子が用いられている。このようなパワー半導体素子は、特に発熱量が多いので、発熱体冷却装置によって十分に冷却することが好ましい。 Since a semiconductor element generates heat during operation, it is required to suppress a temperature rise due to heat generation in order to maintain durability. For example, a power semiconductor device such as an insulated gate bipolar transistor (IGBT) is used in a power drive controller that controls the rotation of an electric motor. Since such a power semiconductor element has a particularly large calorific value, it is preferable that the power semiconductor element be sufficiently cooled by a heating element cooling device.

発熱体冷却装置としては、強制空冷装置や沸騰冷却装置が知られている。強制空冷装置は、ファンで発生した空気流によって半導体素子を冷却するものである。一方、沸騰冷却装置は、半導体素子が発生した熱で、冷媒液を気化させることによって、半導体素子を冷却するものである。沸騰冷却装置は、ファンが必要ないので、ランニングコストを低減することができる。このため、近年、沸騰冷却装置の開発が進められている（例えば、特許文献１参照。）。
特開２００２−１８４９２４ As a heat generating body cooling device, a forced air cooling device and a boiling cooling device are known. The forced air cooling device cools a semiconductor element by an air flow generated by a fan. On the other hand, the boiling cooling device cools a semiconductor element by evaporating a refrigerant liquid with heat generated by the semiconductor element. Since the boiling cooling device does not require a fan, the running cost can be reduced. For this reason, in recent years, a boiling cooling device has been developed (for example, refer to Patent Document 1).
JP2002-184924

特許文献１に示される発熱体冷却装置は、密閉されたケースの中を、分離壁によって第１室と第２室の２つに分離し、第１室において分離壁にモジュール型パワー半導体素子を取付け、第２室（冷却槽）に冷媒液を収納したというものである。
分離壁は貫通孔を有している。パワー半導体素子は、金属製の取付部を有している。この取付部の取付面は、放熱部を兼ねており、貫通孔を塞ぐように分離壁に取付けられる。このため、取付面は、貫通孔を通して、第２室の中の冷媒液に直接に接する。パワー半導体素子が発した熱は、取付面を介して冷媒液に伝わり、放散される。 The heating element cooling device shown in Patent Document 1 separates a sealed case into two chambers, a first chamber and a second chamber, by a separation wall, and a module type power semiconductor element is placed on the separation wall in the first chamber. It is attached and the refrigerant | coolant liquid was accommodated in the 2nd chamber (cooling tank).
The separation wall has a through hole. The power semiconductor element has a metal mounting portion. The mounting surface of the mounting portion also serves as a heat radiating portion, and is attached to the separation wall so as to close the through hole. For this reason, the attachment surface directly contacts the refrigerant liquid in the second chamber through the through hole. The heat generated by the power semiconductor element is transferred to the refrigerant liquid through the mounting surface and is dissipated.

ところで、特許文献１に示される発熱体冷却装置では、冷媒液が気化することによって発生した蒸気の熱を、大気へ効率良く放散する必要がある。このため、第２室（冷却槽）は、熱伝導性が良好な金属材料で構成されることが好ましい。一方、パワー半導体素子の取付部は、取付面から冷媒液へ熱を効率良く伝えるために、金属材料で構成されている。このため、冷媒液を収納した第２室（分離壁）と、パワー半導体素子の取付面との間を、電気的に絶縁する必要がある。しかしながら、電気的に絶縁する部材を新たに設けるのでは、部品数が多くなるとともに、構成が複雑になるので、得策ではない。 By the way, in the heat generating body cooling device shown by patent document 1, it is necessary to dissipate efficiently the heat | fever of the vapor | steam which generate | occur | produced when the refrigerant liquid vaporizes to air | atmosphere. For this reason, it is preferable that the second chamber (cooling tank) is made of a metal material having good thermal conductivity. On the other hand, the mounting portion of the power semiconductor element is made of a metal material in order to efficiently transfer heat from the mounting surface to the refrigerant liquid. For this reason, it is necessary to electrically insulate between the 2nd chamber (separation wall) which accommodated the refrigerant liquid, and the attachment surface of a power semiconductor element. However, it is not a good idea to newly provide an electrically insulating member because the number of parts increases and the configuration becomes complicated.

本発明は、絶縁性の冷媒液を収納した冷却槽と、発熱体を接合した放熱板との間を、簡単な構成によって、電気的に確実に絶縁できるとともに、発熱体を絶縁性の冷媒液で冷却する冷却性能を高めることができる技術を提供することを課題とする。 The present invention can electrically and reliably insulate between a cooling tank containing an insulating refrigerant liquid and a heat radiating plate joined with a heating element with a simple structure, and the heating element can be insulated from the insulating refrigerant liquid. It is an object of the present invention to provide a technique capable of improving the cooling performance of cooling with a vacuum.

請求項１に係る発明では、半導体素子からなる発熱体が発生した熱で、絶縁性の冷媒液を気化させることによって、発熱体を冷却する発熱体冷却装置であって、発熱体冷却装置は、絶縁性の冷媒液を収納する金属製の冷却槽を備え、この冷却槽は、発熱体を取付ける取付面に、内外貫通した貫通孔を有しており、発熱体は、熱伝導性を有した金属製の放熱板における、一方の面に接合されており、放熱板における他方の面は、貫通孔よりも大きい面であって、貫通孔に被せたときに、この貫通孔を通して、冷却槽内の絶縁性の冷媒液に直接に接する放熱面であり、この放熱面のうち、貫通孔に臨む部分だけが露出され、残りの部分は電気絶縁性を有した被覆部材で被覆されており、放熱面は、貫通孔の位置で取付面に、被覆部材を介して重ねて、取付けられており、取付面は、冷却槽を構成する板部材によって形成されており、さらに、発熱体は、外方へ延びるバスバーを有しており、このバスバーは、バスバー固定部にボルト止めされるものであり、このバスバー固定部を配置するように、冷却槽と共に板部材が延長しており、バスバー固定部は、バスバーから伝わった熱が板部材を介して絶縁性の冷媒液に伝わるように、板部材の延長した部位に設けられることで、発熱体が発生した熱を、放熱板とバスバーの両方から絶縁性の冷媒液に伝えるように構成されていることを特徴とする。 The invention according to claim 1 is a heating element cooling device that cools the heating element by evaporating the insulating refrigerant liquid with the heat generated by the heating element composed of a semiconductor element. A cooling tank made of metal that contains an insulating refrigerant liquid is provided, and this cooling tank has a through-hole penetrating inside and outside on a mounting surface to which the heating element is attached, and the heating element has thermal conductivity. It is joined to one surface of a metal heat sink, and the other surface of the heat sink is larger than the through hole. The heat dissipating surface is in direct contact with the insulative refrigerant liquid. Of this heat dissipating surface, only the part facing the through hole is exposed, and the remaining part is covered with a covering member having electrical insulating properties. The surface overlaps the mounting surface at the position of the through-hole via the covering member Mounted, the mounting surface is formed by a plate member constituting the cooling bath, further, the heating element has a bus bar that extends outwardly, the bus bar bolted to the bus bar fixing portion The plate member is extended together with the cooling tank so as to arrange the bus bar fixing portion, and the heat transmitted from the bus bar is transferred to the insulating refrigerant liquid through the plate member in the bus bar fixing portion. As described above, it is characterized in that the heat generated by the heating element is transmitted from both the heat radiating plate and the bus bar to the insulating refrigerant liquid by being provided in the extended portion of the plate member .

請求項２に係る発明では、前記被覆部材は、前記発熱体の全体をモールドするモールド樹脂からなることを特徴とする。 In the invention which concerns on Claim 2, the said covering member consists of mold resin which molds the whole said heat generating body.

請求項３に係る発明では、前記取付面と前記被覆部材との間で、前記貫通孔の周囲は、シール部材によってシールされていることを特徴とする。 In the invention which concerns on Claim 3, the circumference | surroundings of the said through-hole are sealed with the sealing member between the said attachment surface and the said coating | coated member.

請求項４に係る発明では、前記放熱板は、前記放熱面を上向きにして配置されており、前記冷却槽は、前記放熱板よりも高位に配置されるとともに、外表面に放熱フィンを有していることを特徴とする。 In the invention which concerns on Claim 4, the said heat sink is arrange | positioned with the said heat radiating surface facing upwards, While the said cooling tank is arrange | positioned higher than the said heat radiating plate, it has a heat radiating fin on an outer surface. It is characterized by.

請求項１に係る発明は、発熱体（半導体素子）が接合された放熱板の放熱面のうち、冷却槽の貫通孔に臨む部分だけを露出させ、残りの部分を電気絶縁性を有した被覆部材で被覆したので、冷却槽の取付面に対し、被覆部材を介して放熱面を重ね、冷却槽に取付けることができる。
このため、放熱板の放熱面のうち、冷却槽の貫通孔に臨む部分だけを露出させ、残りの部分を電気絶縁性を有した被覆部材で被覆するという、極めて簡単な構成によって、冷却槽と放熱板との間を、電気的に容易に且つ確実に絶縁することができる。しかも、部品数を抑制することができ、取付け工数が増すこともない。
さらには、発熱体から放熱板へ伝わった熱を、放熱板から絶縁性の冷媒液へ直接に伝えることができるので、熱伝達性能を十分に高めることができる。従って、発熱体を冷却する性能を十分に高めることができる。
このように、請求項１に係る発明では、簡単な構成であるにもかかわらず、冷却槽と放熱板との間を電気的に確実に絶縁することができるとともに、発熱体を冷却する冷却性能を十分に高めることができる。
さらに請求項１に係る発明では、冷却槽を構成する板部材によって前記取付面を形成し、この取付面にバスバー固定部を設け、一方、発熱体から外方にバスバーを延ばし、バスバーをバスバー固定部にボルト止めすることによって、バスバーからバスバー固定部へ伝わった熱を、バスバー固定部から絶縁性の冷媒液へ伝わるように構成したものである。
このため、発熱体が発生した熱は、バスバー、バスバー固定部及び板部材を介して絶縁性の冷媒液に伝わる。従って、発熱体が発生した熱は、放熱板とバスバーの両方から、絶縁性の冷媒液に伝わる。この結果、発熱体から絶縁性の冷媒液に伝わる熱量を増大させることができるので、発熱体を冷却する性能を、より一層十分に高めることができる。
このようなバスバー固定部は、バスバーを外部配線に接続するために中継する、端子台を兼ねることができる。 According to the first aspect of the present invention, only the portion facing the through hole of the cooling tank is exposed and the remaining portion of the heat radiating surface of the heat radiating plate to which the heat generating element (semiconductor element) is bonded is exposed. Since it coat | covered with the member, with respect to the attachment surface of a cooling tank, a heat radiating surface can be piled up via a coating | coated member, and it can attach to a cooling tank.
For this reason, only the portion of the heat radiating surface of the heat radiating plate that faces the through hole of the cooling tub is exposed, and the remaining portion is covered with a covering member having electrical insulating properties, so that the cooling tub and It is possible to easily and reliably insulate the heat sink. In addition, the number of parts can be reduced, and the number of mounting steps is not increased.
Furthermore, since the heat transmitted from the heat generating body to the heat radiating plate can be directly transmitted from the heat radiating plate to the insulating refrigerant liquid, the heat transfer performance can be sufficiently enhanced. Therefore, the performance for cooling the heating element can be sufficiently enhanced.
Thus, in the invention according to claim 1, despite the simple configuration, the cooling tank and the heat radiating plate can be electrically and reliably insulated, and the cooling performance for cooling the heating element can be achieved. Can be increased sufficiently.
Furthermore, in the invention according to claim 1, the mounting surface is formed by a plate member constituting the cooling tank, and a bus bar fixing portion is provided on the mounting surface, while the bus bar is extended outward from the heating element, and the bus bar is fixed to the bus bar. The heat transmitted from the bus bar to the bus bar fixing portion is transferred from the bus bar fixing portion to the insulating refrigerant liquid by bolting to the portion.
For this reason, the heat generated by the heating element is transmitted to the insulating refrigerant liquid through the bus bar, the bus bar fixing portion and the plate member. Therefore, the heat generated by the heating element is transmitted from both the heat radiating plate and the bus bar to the insulating refrigerant liquid. As a result, the amount of heat transferred from the heating element to the insulating refrigerant liquid can be increased, so that the performance of cooling the heating element can be further improved sufficiently.
Such a bus bar fixing | fixed part can serve as a terminal block which relays in order to connect a bus bar to external wiring.

請求項２に係る発明では、発熱体の全体をモールドするモールド樹脂によって、被覆部材を構成したものである。このため、発熱体の全体をモールド樹脂でモールドするときに、同時に、放熱板の放熱面をも、モールド樹脂によってモールドすることができる。
従って、モールド樹脂により、（１）発熱体を封止して防湿性を確保する工程と、（２）放熱板の放熱面のうち、電気絶縁に必要な部分を被覆する工程とを、同時に実施することができる。この結果、発熱体と放熱板とからなる半導体モジュールを、簡単に製造することができ、生産性が高まる。 In the invention which concerns on Claim 2, a coating | coated member is comprised with the mold resin which molds the whole heat generating body. For this reason, when the whole heat generating body is molded with the mold resin, at the same time, the heat radiating surface of the heat radiating plate can be molded with the mold resin.
Therefore, (1) the step of sealing the heating element to ensure moisture resistance with the mold resin and (2) the step of covering the part of the heat dissipation surface of the heat sink necessary for electrical insulation are performed simultaneously. can do. As a result, a semiconductor module composed of a heating element and a heat radiating plate can be easily manufactured, increasing productivity.

請求項３に係る発明では、冷却槽の取付面と被覆部材との間で、貫通孔の周囲を、シール部材によってシールしたものである。このため、貫通孔の周囲をシール部材で確実に且つ容易にシールすることができる。この結果、取付面と被覆部材との間から絶縁性の冷媒液の漏洩を防止することができる。 In the invention which concerns on Claim 3, the circumference | surroundings of a through-hole are sealed with the sealing member between the attachment surface of a cooling tank, and a coating | coated member. For this reason, the periphery of the through hole can be reliably and easily sealed with the seal member. As a result, it is possible to prevent leakage of the insulating refrigerant liquid from between the mounting surface and the covering member.

請求項４に係る発明では、放熱板の放熱面を上向きに配置し、放熱板よりも高位に冷却槽を配置したものである。このため、放熱面に対して、絶縁性の冷媒液を常に十分に接触させることができる。従って、放熱面から絶縁性の冷媒液へ、熱を効率良く伝えることができる。また、冷却槽の外表面に放熱フィンを設けたので、絶縁性の冷媒液が気化することによって発生した蒸気の熱を、放熱フィンを介して大気へ効率良く放散することができる。
このため、発熱体から放熱板へ伝わった熱を、絶縁性の冷媒液を介して大気へ、より一層十分に放散することができる。従って、発熱体を冷却する性能を、より一層十分に高めることができる。 In the invention which concerns on Claim 4, the heat radiating surface of a heat sink is arrange | positioned upwards, and a cooling tank is arrange | positioned higher than a heat sink. For this reason, the insulating refrigerant liquid can always be sufficiently brought into contact with the heat radiating surface. Therefore, heat can be efficiently transferred from the heat radiation surface to the insulating refrigerant liquid. Moreover, since the heat radiating fin is provided on the outer surface of the cooling tank, the heat of the vapor generated by vaporizing the insulating refrigerant liquid can be efficiently dissipated to the atmosphere through the heat radiating fin.
For this reason, the heat transmitted from the heating element to the heat radiating plate can be more sufficiently dissipated to the atmosphere via the insulating refrigerant liquid. Therefore, the performance of cooling the heating element can be further enhanced sufficiently.

本発明を実施するための最良の形態を添付図に基づいて以下に説明する。
図１は、本発明の発熱体冷却装置（第１の実施の形態）の説明図である。
発熱体冷却装置１１は、第１〜第３電気部材１２〜１４を冷却するもので、第１〜第３電気部材１２〜１４と、第１〜第３電気部材１２〜１４の上部に取付けられている冷却槽１６と、第１〜第３電気部材１２〜１４に入れた絶縁性の冷媒液１７と、からなる。 The best mode for carrying out the present invention will be described below with reference to the accompanying drawings.
FIG. 1 is an explanatory diagram of a heating element cooling device (first embodiment) according to the present invention.
The heating element cooling device 11 cools the first to third electric members 12 to 14 and is attached to the upper portions of the first to third electric members 12 to 14 and the first to third electric members 12 to 14. The cooling tank 16 and the insulating refrigerant liquid 17 put in the first to third electric members 12 to 14.

図２は、図１の２−２線断面図であり、第１電気部材１２及び冷却槽１６の断面を示している。
第１電気部材１２は、半導体素子からなる発熱体２１と、発熱体２１の固定端２２が一方の実装面２３に取付けられている放熱板２４と、発熱体２１の導電端２５に接続しているバスバー２６と、これらのバスバー２６、発熱体２１及び放熱板２４を覆っている樹脂製の被覆部材２７と、からなる。Ｃ１は冷却槽１６に設定している第１電気部材１２の中心、Ｃｐ１は第１電気部材１２並びに放熱板２４の中心である。 FIG. 2 is a cross-sectional view taken along line 2-2 of FIG. 1 and shows a cross section of the first electric member 12 and the cooling tank 16.
The first electric member 12 is connected to a heating element 21 made of a semiconductor element, a heat dissipation plate 24 having a fixed end 22 of the heating element 21 attached to one mounting surface 23, and a conductive end 25 of the heating element 21. Bus bars 26 and resin covering members 27 covering the bus bars 26, the heating elements 21, and the heat radiating plates 24. C 1 is the center of the first electric member 12 set in the cooling tank 16, and Cp 1 is the center of the first electric member 12 and the heat sink 24.

放熱板２４は、金属製で、下方（矢印ａ１の方向）へ向けた一方の実装面２３と、上方（矢印ａ２の方向）へ向いている他方の放熱面２８を有し、中央に中心Ｃ１と同心に絶縁のための孔３１が開けられ、孔３１は被覆部材２７の樹脂で包まれている。 The heat radiating plate 24 is made of metal and has one mounting surface 23 directed downward (in the direction of arrow a1) and the other heat radiating surface 28 directed upward (in the direction of arrow a2), and has a center C1 at the center. A hole 31 for insulation is opened concentrically with the resin, and the hole 31 is covered with the resin of the covering member 27.

被覆部材２７は、冷却槽１６を取付けている上部に冷却水溜め凹部３２を形成している。具体的には、上部に冷却槽１６を押圧する上部絶縁面３３が形成され、上部絶縁面３３に連ねて所望の深さの凹部壁３４が形成され、凹部壁３４に一体的に連ねて底部となる放熱板２４の他方の放熱面２８が配置されているとともに、放熱板２４の縁から所定の距離だけ放熱面２８に被さっている。縁に被せることで、放熱板２４をより確実に保持することができる。 The covering member 27 forms a cooling water reservoir recess 32 in the upper part to which the cooling tank 16 is attached. Specifically, an upper insulating surface 33 that presses the cooling tank 16 is formed on the upper portion, a concave wall 34 having a desired depth is formed continuously with the upper insulating surface 33, and a bottom portion is integrally formed with the concave wall 34. The other heat radiating surface 28 of the heat radiating plate 24 is disposed, and covers the heat radiating surface 28 by a predetermined distance from the edge of the heat radiating plate 24. By covering the edge, the heat radiating plate 24 can be held more reliably.

また、被覆部材２７は、冷却水溜め凹部３２の中央に放熱板２４の孔３１を包んだ中央絶縁凸部３５が形成され、中央絶縁凸部３５の当接面３６に内リング溝３７が形成され、上部絶縁面３３に外リング溝３８が形成されている。
さらに、被覆部材２７は、中央絶縁凸部３５にボルト用孔４３が中心Ｃ１と同心に開けられ、ボルト用孔４３に通している中央ボルト４４の軸力を受ける補強板４５がインサートされているものである。４７は内リング溝３７に嵌合しているオーリング、４８は外リング溝３８に嵌合しているシール部材である。 Further, the covering member 27 is formed with a central insulating convex portion 35 that wraps the hole 31 of the heat sink 24 at the center of the cooling water reservoir concave portion 32, and an inner ring groove 37 is formed on the contact surface 36 of the central insulating convex portion 35. The outer ring groove 38 is formed in the upper insulating surface 33.
Further, the covering member 27 has a bolt hole 43 concentric with the center C 1 in the central insulating projection 35, and a reinforcing plate 45 that receives the axial force of the central bolt 44 passing through the bolt hole 43 is inserted. Is. 47 is an O-ring fitted in the inner ring groove 37, and 48 is a seal member fitted in the outer ring groove 38.

被覆部材２７の材質は、絶縁性の冷媒液１７に対して耐久性（耐溶解性や耐透過性）があるものである。
絶縁性の冷媒液１７は、例えば、フッ素系不活性液体である。
冷却水溜め凹部３２には、絶縁性の冷媒液１７を入れているが、入れる量は任意である。第１電気部材１２の上部絶縁面３３以上入れることも可能である。
第２・第３電気部材１３、１４は、第１電気部材１２と同様であり、発熱体冷却装置１１に含まれる。 The material of the covering member 27 has durability (dissolution resistance and permeation resistance) with respect to the insulating refrigerant liquid 17.
The insulating refrigerant liquid 17 is, for example, a fluorine-based inert liquid.
Insulating refrigerant liquid 17 is put in the cooling water reservoir recess 32, but the amount to be put is arbitrary. It is possible to insert more than the upper insulating surface 33 of the first electric member 12.
The second and third electric members 13 and 14 are the same as the first electric member 12 and are included in the heating element cooling device 11.

発熱体冷却装置１１は、具体的には、第１電気部材１２の冷却水溜め凹部３２と、第２電気部材１３の冷却水溜め凹部３２と、第３電気部材１４の冷却水溜め凹部３２と、冷却槽１６と、からなるものである。 Specifically, the heat generator cooling device 11 includes a cooling water reservoir recess 32 of the first electric member 12, a cooling water reservoir recess 32 of the second electric member 13, and a cooling water reservoir recess 32 of the third electric member 14. And the cooling tank 16.

冷却槽１６は、第１〜第３電気部材１２〜１４の被覆部材２７に取付けられているベース部５１と、ベース部５１に連なる枠部５２と、枠部５２に連なる天井部５３と、からなる。具体的には、ベース部５１を形成している板部材５４と、板部材５４を縁に嵌合している枠部５２と、天井部５３の中央に形成され且つ、第１〜第３電気部材１２〜１４の中央絶縁凸部３５がそれぞれ密着しているボス部５５と、天井部５３の外面（外表面）５６に形成している放熱フィン５７と、を備えている。 The cooling tank 16 includes a base portion 51 attached to the covering members 27 of the first to third electric members 12 to 14, a frame portion 52 that continues to the base portion 51, and a ceiling portion 53 that continues to the frame portion 52. Become. Specifically, the plate member 54 forming the base portion 51, the frame portion 52 fitting the plate member 54 to the edge, and the center of the ceiling portion 53, and the first to third electrics. A boss portion 55 with which the central insulating convex portions 35 of the members 12 to 14 are in close contact with each other and a heat radiating fin 57 formed on the outer surface (outer surface) 56 of the ceiling portion 53 are provided.

「絶縁性の冷媒液１７を収納する冷却槽１６」とは、冷却水溜め凹部３２に絶縁性の冷媒液１７を上部絶縁面３３以上入れた場合で、冷却槽１６の液面がベース部５１（板部材５４）に達した状態やベース部５１（板部材５４）以上の状態である。 The “cooling tank 16 that stores the insulating refrigerant liquid 17” refers to the case where the insulating refrigerant liquid 17 is placed in the cooling water reservoir recess 32 over the upper insulating surface 33, and the liquid level of the cooling tank 16 is the base portion 51. It is the state which reached (plate member 54) or the state more than base part 51 (plate member 54).

板部材５４は、冷却槽１６の縁に形成している嵌合段部６１に嵌合し、第１〜第３電気部材１２〜１４が密着しているシート面部（取付面）６２が形成され、シート面部６２に連ねてそれぞれ貫通孔であるところの循環開口６３が開けられ、枠部５２に形成された注入口６４に連通している流路６５を封じる蓋部６６（図１参照）を形成したものである。
なお、板部材５４と嵌合段部６１との接合方法は任意であり、例えば、ろう付けを用いる。 The plate member 54 is fitted into a fitting step portion 61 formed at the edge of the cooling tank 16, and a sheet surface portion (attachment surface) 62 in which the first to third electric members 12 to 14 are in close contact is formed. A lid 66 (see FIG. 1) for sealing the flow path 65 communicating with the injection port 64 formed in the frame 52 is formed by opening the circulation openings 63 that are continuous through holes to the sheet surface portion 62. Formed.
In addition, the joining method of the plate member 54 and the fitting step part 61 is arbitrary, for example, brazing is used.

ボス部５５は、被覆部材２７が有する中央絶縁凸部３５の当接面３６が密着している中央シート面６７が形成され、中央シート面６７に中央ボルト４４に対応するめねじ部６８が所望の深さで形成されている。
中央シート面６７は、ベース部５１（板部材５４）のシート面部６２と同じ高さ（つらいち）である。その結果、被覆部材２７が備える中央絶縁凸部３５の当接面３６及び上部絶縁面３３の形成が簡単になり、樹脂成形金型の製造が容易になる。 The boss portion 55 is formed with a central sheet surface 67 in which the contact surface 36 of the central insulating convex portion 35 of the covering member 27 is in close contact, and a female screw portion 68 corresponding to the central bolt 44 is desired on the central sheet surface 67. It is formed with depth.
The central sheet surface 67 has the same height (i.e., as the sheet surface portion 62) of the base portion 51 (plate member 54). As a result, the formation of the contact surface 36 and the upper insulating surface 33 of the central insulating convex portion 35 included in the covering member 27 is simplified, and the manufacture of the resin molding die is facilitated.

ここで、発熱体冷却装置１１の組立て要領の一例を簡単に説明する。図１及び図２を併用して説明する。
まず、第１電気部材１２の内リング溝３７にオーリング４７を入れ、外リング溝３８にシール部材４８を入れ、第１電気部材１２を冷却槽１６の板部材５４のシート面部６２に矢印ａ３（図１右参照）のように当接させる。続けて、第１電気部材１２のボルト用孔４３に中央ボルト４４を通して、冷却槽１６のボス部５５に形成しためねじ部６８にねじ込んで、中央ボルト４４に所望の軸力を付与する。その際、軸力の管理には、例えば、トルク管理を用いる。 Here, an example of the assembly procedure of the heating element cooling device 11 will be briefly described. This will be described with reference to FIGS.
First, an O-ring 47 is inserted into the inner ring groove 37 of the first electric member 12, a seal member 48 is inserted into the outer ring groove 38, and the first electric member 12 is placed on the sheet surface portion 62 of the plate member 54 of the cooling tank 16 with an arrow a 3. (See FIG. 1 right). Subsequently, the central bolt 44 is passed through the bolt hole 43 of the first electric member 12, and is screwed into the threaded portion 68 to form the boss portion 55 of the cooling tank 16, thereby applying a desired axial force to the central bolt 44. At that time, for example, torque management is used for the management of the axial force.

被覆部材２７は、補強板４５を備えているので、中央ボルト４４の軸力のばらつきを小さくすることができるとともに、中央ボルト４４から被覆部材２７に加わる面圧を小さくすることができ、被覆部材２７の変形を抑制することができる。 Since the covering member 27 includes the reinforcing plate 45, it is possible to reduce variations in the axial force of the central bolt 44, and to reduce the surface pressure applied to the covering member 27 from the central bolt 44. 27 deformation can be suppressed.

引き続き、第１電気部材１２と同様に、第２・第３電気部材１３、１４を冷却槽１６の板部材５４に取付ける。
最後に、絶縁性の冷媒液１７を図１の注入装置７１で注入する。注入の手順は、まず、注入口６４に注入装置７１の接続口７２をねじ込み、注入装置７１の真空ポンプ７３で冷却槽１６並びに第１〜第３冷却水溜め凹部３２内を真空にした後、第１バルブ７４を閉じる。その次に、第２バルブ７５を開き、注入装置７１の水圧ポンプ７６で絶縁性の冷媒液１７を注入して、注入口６４に栓をねじ込んで注入口６４を封じる。これで、発熱体冷却装置１１の組立ては完了する。
なお、真空ポンプ７３や液圧ポンプ７６を用いずに絶縁性の冷媒液１７を注入することも可能である。 Subsequently, similarly to the first electric member 12, the second and third electric members 13 and 14 are attached to the plate member 54 of the cooling tank 16.
Finally, the insulating refrigerant liquid 17 is injected by the injection device 71 of FIG. The injection procedure is as follows. First, the connection port 72 of the injection device 71 is screwed into the injection port 64, and the inside of the cooling tank 16 and the first to third cooling water reservoir recesses 32 is evacuated by the vacuum pump 73 of the injection device 71. The first valve 74 is closed. Next, the second valve 75 is opened, the insulating refrigerant liquid 17 is injected by the hydraulic pump 76 of the injection device 71, and a stopper is screwed into the injection port 64 to seal the injection port 64. This completes the assembly of the heating element cooling device 11.
Note that it is possible to inject the insulating refrigerant liquid 17 without using the vacuum pump 73 or the hydraulic pump 76.

次に、本発明の発熱体冷却装置（第１の実施の形態）の作用を説明する。
図３は、発熱体冷却装置（第１の実施の形態）の冷却の機構を説明する図である。図２を併用して説明する。第１電気部材１２を対象に説明し、第２・第３電気部材１３、１４の説明は省略する。 Next, the operation of the heating element cooling device (first embodiment) of the present invention will be described.
FIG. 3 is a diagram for explaining a cooling mechanism of the heating element cooling device (first embodiment). This will be described with reference to FIG. The first electric member 12 will be described, and the description of the second and third electric members 13 and 14 will be omitted.

第１電気部材１２の半導体素子（発熱体）２１を作動させると、半導体素子（発熱体）２１の熱は放熱板２４に矢印ａ４のように伝わり、放熱板２４は伝わった熱を放熱面（上面）２８から絶縁性の冷媒液１７に伝え、絶縁性の冷媒液１７を昇温して矢印ａ５のように蒸発させる。その結果、放熱板２４は放熱面（上面）２８から熱を放出し、半導体素子（発熱体）２１を冷却することができる。
つまり、発熱体２１を絶縁性の冷媒液１７で冷却する冷却性能を高めることができる。
一方、蒸発した絶縁性の冷媒液１７は、温度の低い冷却槽１６の天井部５３に触れて凝結して液化し、液体は冷却水溜め凹部３２に戻る。 When the semiconductor element (heating element) 21 of the first electric member 12 is operated, the heat of the semiconductor element (heating element) 21 is transmitted to the heat radiating plate 24 as indicated by an arrow a4, and the heat radiating plate 24 transfers the transmitted heat to the heat radiating surface ( (Upper surface) 28 is transmitted to the insulating refrigerant liquid 17, and the insulating refrigerant liquid 17 is heated to evaporate as indicated by an arrow a5. As a result, the heat radiating plate 24 can release heat from the heat radiating surface (upper surface) 28 and cool the semiconductor element (heating element) 21.
That is, the cooling performance for cooling the heating element 21 with the insulating refrigerant liquid 17 can be enhanced.
On the other hand, the evaporated insulating refrigerant liquid 17 condenses and liquefies by touching the ceiling 53 of the cooling tank 16 having a low temperature, and the liquid returns to the cooling water reservoir recess 32.

冷却槽１６の天井部５３は、放熱フィン５７によって放熱面積が大きくなり、絶縁性の冷媒液１７で昇温される天井部５３から絶縁性の冷媒液１７の熱を矢印ａ６のように放出することでき、絶縁性の冷媒液１７で昇温される冷却槽１６の温度上昇を抑制することができ、冷却効果を高めることができる。 The ceiling portion 53 of the cooling tank 16 has a large heat radiation area due to the radiation fins 57, and the heat of the insulating refrigerant liquid 17 is released from the ceiling portion 53 heated by the insulating refrigerant liquid 17 as indicated by an arrow a6. It is possible to suppress an increase in the temperature of the cooling tank 16 that is heated by the insulating refrigerant liquid 17 and enhance the cooling effect.

第２・第３電気部材１３、１４の半導体素子（発熱体）２１を作動させると、前述と同様に、発熱体２１を絶縁性の冷媒液１７で冷却する冷却性能を高めることができる。 When the semiconductor elements (heating elements) 21 of the second and third electric members 13 and 14 are operated, the cooling performance for cooling the heating elements 21 with the insulating refrigerant liquid 17 can be improved as described above.

また、被覆部材２７は、半導体素子（発熱体）２１が実装された放熱板２４を覆い、覆っている上部絶縁面３３、つまり凹部壁３４を、金属製の放熱板２４と金属製の冷却槽１６との間に介在させているので、簡単な構成で金属製の放熱板２４と金属製の冷却槽１６とを絶縁することができる。 The covering member 27 covers the heat radiating plate 24 on which the semiconductor element (heating element) 21 is mounted, and covers the upper insulating surface 33, that is, the concave wall 34, with the metal heat radiating plate 24 and the metal cooling bath. Therefore, the metal heat sink 24 and the metal cooling tank 16 can be insulated from each other with a simple configuration.

このように、発熱体冷却装置１１では、絶縁性の冷媒液１７を収納する金属製の冷却槽１６を備え、この冷却槽１６は、発熱体２１を取付ける取付面（シート面部）６２に、内外貫通した貫通孔（循環開口）６３を有しており、発熱体２１は、熱伝導性を有した金属製の放熱板２４における、一方の面（実装面）２３に接合されており、放熱板２４における他方の面（放熱面）２８は、貫通孔６３よりも大きい面であって、貫通孔６３に被せたときに、この貫通孔６３を通して、冷却槽１６内の絶縁性の冷媒液１７に直接に接する放熱面であり、この放熱面２８のうち、貫通孔（循環開口）６３に臨む部分だけが露出され、残りの部分は電気絶縁性を有した被覆部材２７で被覆されており、放熱面２８は、貫通孔（循環開口）６３の位置で取付面（シート面部）６２に、被覆部材２７を介して重ねて、取付けられているので、絶縁性の冷媒液１７を収納した冷却槽１６と、発熱体２１を接合した放熱板２４との間を、簡単な構成によって、電気的に確実に絶縁できるとともに、発熱体２１を絶縁性の冷媒液１７で冷却する冷却性能を高めることができる。 As described above, the heating element cooling device 11 includes the metal cooling tank 16 that stores the insulating refrigerant liquid 17. The cooling tank 16 is provided on the mounting surface (sheet surface portion) 62 to which the heating element 21 is attached. It has a through hole (circulation opening) 63 that penetrates, and the heating element 21 is joined to one surface (mounting surface) 23 of a metal heat radiating plate 24 having thermal conductivity. The other surface (heat dissipating surface) 28 in FIG. 24 is a surface larger than the through-hole 63, and when covered with the through-hole 63, passes through the through-hole 63 to the insulating refrigerant liquid 17 in the cooling tank 16. The heat-radiating surface is in direct contact. Of the heat-radiating surface 28, only the portion facing the through hole (circulation opening) 63 is exposed, and the remaining portion is covered with a covering member 27 having electrical insulation, The surface 28 is taken at the position of the through hole (circulation opening) 63. Since it is attached to the surface (sheet surface portion) 62 so as to overlap with the covering member 27, the space between the cooling tank 16 containing the insulating refrigerant liquid 17 and the heat radiating plate 24 to which the heating element 21 is joined. With a simple configuration, it is possible to electrically reliably insulate, and to improve the cooling performance for cooling the heating element 21 with the insulating refrigerant liquid 17.

発熱体冷却装置１１では、冷却槽１６の取付面（シート面部）６２と被覆部材２７との間で、貫通孔（循環開口）６３の周囲は、シール部材４８によってシールされているので、冷却槽１６と被覆部材２７との間から絶縁性の冷媒液１７が漏れるのを防止することができる。 In the heating element cooling device 11, the periphery of the through hole (circulation opening) 63 is sealed between the mounting surface (sheet surface portion) 62 of the cooling tank 16 and the covering member 27 by the seal member 48. The insulating refrigerant liquid 17 can be prevented from leaking from between the cover 16 and the covering member 27.

放熱板２４は、放熱面２８を上向きにして配置されており、冷却槽１６は、放熱板２４よりも高位（矢印ａ２の方向）に配置されるとともに、外表面５６に放熱フィン５７を有しているので、放熱板２４から熱を奪って蒸発した絶縁性の冷媒液１７を高位に配置している冷却槽１６で液化することができるとともに、放熱フイン５７によってより効率的に液化することができる。 The heat radiating plate 24 is disposed with the heat radiating surface 28 facing upward, and the cooling tank 16 is disposed higher than the heat radiating plate 24 (in the direction of arrow a2) and has heat radiating fins 57 on the outer surface 56. Therefore, the insulating refrigerant liquid 17 that has evaporated from the heat sink 24 can be liquefied in the cooling tank 16 disposed at a high level, and more efficiently liquefied by the heat radiating fins 57. it can.

次に、本発明の別の実施の形態を説明する。まず、第２の実施の形態を説明し、その次に、第３の実施の形態を説明し、最後に、第４の実施の形態を説明する。 Next, another embodiment of the present invention will be described. First, the second embodiment will be described, then the third embodiment will be described, and finally the fourth embodiment will be described.

図４は、第２の実施の形態を説明する図である。上記図１〜図３に示す実施の形態と同様の構成については、同一符号を付し説明を省略する。
第２の実施の形態の発熱体冷却装置１１Ｂは、第１電気部材１２Ｂのフランジ部８１と、フランジ部８１を取付けるために冷却槽１６Ｂに形成したフランジ取付部８２と、を備えていることを特徴とする。
また、フランジ部８１を２本もしくは４本のフランジ用ボルト８３で締結していることを特徴とする。 FIG. 4 is a diagram for explaining the second embodiment. The same configurations as those in the embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals and description thereof is omitted.
The heating element cooling device 11B of the second embodiment includes a flange portion 81 of the first electric member 12B and a flange attachment portion 82 formed in the cooling tank 16B for attaching the flange portion 81. Features.
Further, the flange portion 81 is fastened with two or four flange bolts 83.

第１電気部材１２Ｂは、発熱体（半導体素子）２１が実装されている放熱板２４Ｂと、被覆部材２７Ｂと、を備えている。
放熱板２４Ｂは、金属製で、一方の実装面２３と他方の放熱面２８を有する板である。 The first electric member 12B includes a heat radiating plate 24B on which a heating element (semiconductor element) 21 is mounted, and a covering member 27B.
The heat radiating plate 24 B is a plate made of metal and having one mounting surface 23 and the other heat radiating surface 28.

被覆部材２７Ｂは、冷却槽１６Ｂを取付けている上部に冷却水溜め凹部３２Ｂを形成している。具体的には、冷却槽１６Ｂを押圧する上部絶縁面３３に連ねて所望の深さの凹部壁３４が形成され、凹部壁３４に一体的に連ねて底部となる放熱板２４Ｂの放熱面２８が配置されているとともに、放熱板２４の縁から所定の距離だけ放熱面２８に被さっている。 The covering member 27B forms a cooling water reservoir recess 32B in the upper part to which the cooling tank 16B is attached. Specifically, a recessed wall 34 having a desired depth is formed continuously with the upper insulating surface 33 that presses the cooling tank 16B, and a heat radiating surface 28 of the heat radiating plate 24B that is integrally connected with the recessed wall 34 and serves as a bottom is formed. It is arranged and covers the heat radiation surface 28 by a predetermined distance from the edge of the heat radiation plate 24.

また、被覆部材２７Ｂは、上部絶縁面３３にリング溝８５が形成され、上部絶縁面３３に連ねて外方（矢印ｂ１の方向）にフランジ部８１が形成され、フランジ部８１にボルト用孔８６が２個もしくは４個開けられているものである。８７はリング溝８５に嵌合しているシール部材である。 The covering member 27 B has a ring groove 85 formed in the upper insulating surface 33, a flange portion 81 is formed outwardly (in the direction of the arrow b 1) continuously to the upper insulating surface 33, and a bolt hole 86 is formed in the flange portion 81. 2 or 4 are opened. A seal member 87 is fitted in the ring groove 85.

冷却水溜め凹部３２Ｂには、絶縁性の冷媒液１７を上部絶縁面３３まで入れているが、上部絶縁面３３以上入れることも可能である。
被覆部材２７Ｂの材質は、絶縁性の冷媒液１７に対して耐久性（耐溶解性や耐透過性）があるものである。 Insulating refrigerant liquid 17 is put in the cooling water reservoir recess 32B up to the upper insulating surface 33, but it is also possible to put more than the upper insulating surface 33 therein.
The material of the covering member 27 B has durability (dissolution resistance and permeation resistance) with respect to the insulating refrigerant liquid 17.

図に示していない第２・第３電気部材１３Ｂ、１４Ｂは、第１電気部材１２Ｂと同様である。 The second and third electric members 13B and 14B not shown in the drawing are the same as the first electric member 12B.

発熱体冷却装置１１Ｂは、具体的には、第１電気部材１２Ｂの冷却水溜め凹部３２Ｂと、第２電気部材１３Ｂの冷却水溜め凹部３２Ｂと、第３電気部材１４Ｂの冷却水溜め凹部３２Ｂと、冷却槽１６Ｂと、からなる。 Specifically, the heating element cooling device 11B includes a cooling water reservoir recess 32B of the first electric member 12B, a cooling water reservoir recess 32B of the second electric member 13B, and a cooling water reservoir recess 32B of the third electric member 14B. The cooling tank 16B.

冷却槽１６Ｂは、第１〜第３電気部材１２Ｂ〜１４Ｂの被覆部材２７Ｂに取付けられているベース部５１及び枠部５２と、枠部５２に連なる天井部５３と、からなる。具体的には、ベース部５１を形成している板部材５４と、板部材５４を縁に嵌合している枠部５２と、天井部５３の外面（外表面）５６に形成している放熱フィン５７と、枠部５２に形成しているフランジ取付部８２と、フランジ取付部８２に形成され、フランジ用ボルト８３がねじ込まれるめねじ部８８と、を備えている。 The cooling tank 16 B includes a base portion 51 and a frame portion 52 that are attached to the covering members 27 B of the first to third electric members 12 B to 14 B, and a ceiling portion 53 that continues to the frame portion 52. Specifically, the plate member 54 forming the base portion 51, the frame portion 52 fitting the plate member 54 to the edge, and the heat dissipation formed on the outer surface (outer surface) 56 of the ceiling portion 53. The fin 57, the flange attaching part 82 formed in the frame part 52, and the female thread part 88 into which the bolt 83 for flanges is screwed are formed.

第２の実施の形態の発熱体冷却装置１１Ｂは、第１の実施の形態の発熱体冷却装置１１と同様の効果を発揮する。すなわち、絶縁性の冷媒液１７を収納した冷却槽１６Ｂと、発熱体２１を接合した放熱板２４Ｂとの間を、簡単な構成によって、電気的に確実に絶縁できるとともに、発熱体２１を絶縁性の冷媒液１７で冷却する冷却性能を高めることができる。 The heating element cooling device 11B of the second embodiment exhibits the same effect as the heating element cooling device 11 of the first embodiment. In other words, the cooling tank 16B containing the insulating refrigerant liquid 17 and the heat radiating plate 24B joined to the heating element 21 can be electrically and reliably insulated with a simple configuration, and the heating element 21 can be insulated. The cooling performance of cooling with the refrigerant liquid 17 can be improved.

また、第２の実施の形態の発熱体冷却装置１１Ｂでは、冷却槽１６Ｂに半導体素子（発熱体）２１を含む第１電気部材１２Ｂを第１電気部材１２Ｂの外方に形成したフランジ部８１で取付けるとともに、フランジ部８１を２〜４本のフランジ用ボルト８３で締結しているので、第１電気部材１２Ｂの中央の変形をなくすることができるとともに、冷却槽１６Ｂに第１電気部材１２Ｂをより確実に固定することができる。 Further, in the heating element cooling device 11B of the second embodiment, the first electric member 12B including the semiconductor element (heating element) 21 in the cooling tank 16B is formed by a flange portion 81 formed outside the first electric member 12B. At the same time, the flange portion 81 is fastened with 2 to 4 flange bolts 83, so that the deformation of the center of the first electric member 12B can be eliminated, and the first electric member 12B is attached to the cooling tank 16B. It can be fixed more reliably.

次に、第３の実施の形態を説明する。
図５は、第３の実施の形態を説明する図である。上記図１〜図３に示す実施の形態と同様の構成については、同一符号を付し説明を省略する。
第３の実施の形態の発熱体冷却装置１１Ｃは、第１電気部材１２Ｃの被覆部材２７Ｃがフランジ部８１側のみであることを特徴とする。フランジ部８１には冷却槽１６Ｃが取付けられている。
図に示していない第２・第３電気部材１３Ｃ、１４Ｃはともに、第１電気部材１２Ｃと同様である。 Next, a third embodiment will be described.
FIG. 5 is a diagram for explaining the third embodiment. The same configurations as those in the embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals and description thereof is omitted.
The heating element cooling device 11C of the third embodiment is characterized in that the covering member 27C of the first electric member 12C is only on the flange portion 81 side. A cooling tank 16 C is attached to the flange portion 81.
Both the second and third electric members 13C and 14C not shown in the drawing are the same as the first electric member 12C.

また、第３の実施の形態の発熱体冷却装置１１Ｃは、第１〜第３電気部材１２Ｃ〜１４Ｃ及び冷却槽１６Ｃが縦長（矢印ｃ１の方向）に配置されるものであることを特徴とする。 In addition, the heating element cooling device 11C of the third embodiment is characterized in that the first to third electric members 12C to 14C and the cooling tank 16C are arranged vertically (in the direction of the arrow c1). .

第１電気部材１２Ｃは、半導体素子からなる発熱体２１と、発熱体２１の固定端２２が一方の実装面２３に取付けられている放熱板２４と、発熱体２１の導電端２５に接続しているバスバー２６と、放熱板２４のみを覆っている樹脂製の被覆部材２７Ｃと、を備えている。 The first electric member 12C is connected to a heating element 21 made of a semiconductor element, a heat radiating plate 24 having a fixed end 22 of the heating element 21 attached to one mounting surface 23, and a conductive end 25 of the heating element 21. Bus bar 26 and a resin covering member 27 C covering only the heat radiating plate 24.

被覆部材２７Ｃは、放熱板２４の周囲を包み、包んだ部位に連ねてフランジ部８１が形成され、包んだ部位に連なり、かつ、冷却槽１６Ｃを取付けるための側部絶縁面９１に冷却水溜め凹部３２Ｃを形成している。具体的には、冷却槽１６Ｃを押圧する側部絶縁面９１に連ねて開口部９２が形成され、開口部９２に連ねて放熱板２４による側部放熱面９３が配置され、放熱板２４の縁から所定の距離だけ側部放熱面９３に被さっている。 The covering member 27C wraps around the heat radiating plate 24, and a flange portion 81 is formed continuously to the wrapped portion. The covering member 27C is connected to the wrapped portion, and has a cooling water reservoir on the side insulating surface 91 for attaching the cooling tank 16C. A recess 32C is formed. Specifically, an opening 92 is formed continuously with the side insulating surface 91 that presses the cooling tank 16 C, and a side heat radiating surface 93 is disposed with the heat radiating plate 24 continuously with the opening 92. The side heat radiating surface 93 is covered by a predetermined distance from the side.

また、被覆部材２７Ｃは、側部絶縁面９１にリング溝８５が形成され、側部絶縁面９１に連ねて外方（矢印ｃ２の方向）にフランジ部８１が形成され、フランジ部８１にボルト用孔８６が２個もしくは４個開けられ、フランジ部８１を２本もしくは４本のフランジ用ボルト８３で締結していることを特徴とする。 The covering member 27 C has a ring groove 85 formed in the side insulating surface 91, a flange portion 81 is formed outwardly (in the direction of the arrow c 2) continuously to the side insulating surface 91, and a bolt portion is formed on the flange portion 81. Two or four holes 86 are formed, and the flange portion 81 is fastened with two or four flange bolts 83.

冷却槽１６Ｃは、第１〜第３電気部材１２Ｃ〜１４Ｃの被覆部材２７Ｃに取付けられている第１縦壁９５及びボトム部９６と、ボトム部９６に連なる第２〜第４縦壁部１０２〜１０４と、これらの第１〜第４縦壁部１０２〜１０４に連なっているトップ部１０５と、からなり、絶縁性の冷媒液１７を収納している。 The cooling tank 16 C includes a first vertical wall 95 and a bottom portion 96 attached to the covering member 27 C of the first to third electric members 12 C to 14 C, and second to fourth vertical wall portions 102 to 102 connected to the bottom portion 96. 104 and a top portion 105 connected to the first to fourth vertical wall portions 102 to 104, and contains an insulating refrigerant liquid 17.

冷却槽１６Ｃは、具体的には、第１縦壁９５が被覆部材２７Ｃの側部絶縁面９１に密着している板部材５４と被覆部材２７Ｃのフランジ部８１に密着している本体部１０６とで形成され、本体部１０６にめねじ部１０７が形成され、ボトム部９６にフランジ取付部８２をフランジ部８１に密着するように形成して、フランジ取付部８２にめねじ部１０７が切られ、トップ部１０５に放熱フィン５７、トップ部１０５近傍の第１縦壁９５に放熱フィン５７、トップ部１０５近傍の第４縦壁１０４に放熱フィン５７が形成されているものである。めねじ部１０７にはフランジ用ボルト８３がねじ込まれる。
なお、冷却槽１６Ｃでは、板部材５４の取付け方法は任意であり、例えば、ろう付けでボトム部９６の縁及び本体部１０６に接合する。 Specifically, the cooling tank 16C includes a plate member 54 in which the first vertical wall 95 is in close contact with the side insulating surface 91 of the covering member 27C and a main body portion 106 in close contact with the flange portion 81 of the covering member 27C. The internal thread portion 107 is formed on the main body portion 106, the flange mounting portion 82 is formed in close contact with the flange portion 81 on the bottom portion 96, and the female thread portion 107 is cut on the flange mounting portion 82. A heat radiating fin 57 is formed on the top portion 105, a heat radiating fin 57 is formed on the first vertical wall 95 near the top portion 105, and a heat radiating fin 57 is formed on the fourth vertical wall 104 near the top portion 105. A flange bolt 83 is screwed into the female thread portion 107.
In addition, in the cooling tank 16C, the attachment method of the board member 54 is arbitrary, for example, it joins to the edge of the bottom part 96 and the main-body part 106 by brazing.

第３の実施の形態の発熱体冷却装置１１Ｃは、第１の実施の形態の発熱体冷却装置１１と同様の効果を発揮する。すなわち、絶縁性の冷媒液１７を収納した冷却槽１６Ｃと、発熱体２１を接合した放熱板２４との間を、簡単な構成によって、電気的に確実に絶縁できるとともに、発熱体２１を絶縁性の冷媒液１７で冷却する冷却性能を高めることができる。 The heating element cooling device 11C of the third embodiment exhibits the same effect as the heating element cooling device 11 of the first embodiment. That is, the cooling tank 16C in which the insulating refrigerant liquid 17 is stored and the heat radiating plate 24 to which the heating element 21 is joined can be electrically and reliably insulated with a simple configuration, and the heating element 21 can be insulated. The cooling performance of cooling with the refrigerant liquid 17 can be improved.

また、第３の実施の形態の発熱体冷却装置１１Ｃでは、冷却槽１６Ｃに半導体素子（発熱体）２１を含む第１電気部材１２Ｃを第１電気部材１２Ｃの外方に形成したフランジ部８１で取付けるとともに、フランジ部８１を２〜４本のボルトで締結しているので、第１電気部材１２Ｃの中央の変形をなくすることができるとともに、第１電気部材１２Ｃをより確実に固定することができる。 Further, in the heating element cooling device 11C of the third embodiment, the first electric member 12C including the semiconductor element (heating element) 21 in the cooling tank 16C is formed by a flange portion 81 formed outside the first electric member 12C. At the same time, the flange portion 81 is fastened with 2 to 4 bolts, so that the deformation of the center of the first electric member 12C can be eliminated and the first electric member 12C can be more securely fixed. it can.

さらに、第３の実施の形態の発熱体冷却装置１１Ｃでは、第１〜第３電気部材１２Ｃ〜１４Ｃ及び冷却槽１６Ｃを縦長（矢印ｃ１の方向）に配置しているので、狭い隙間に配置することができ、省資源スペース化を図ることができる。 Furthermore, in the heating element cooling device 11C of the third embodiment, the first to third electric members 12C to 14C and the cooling tank 16C are arranged vertically (in the direction of the arrow c1), and thus are arranged in a narrow gap. It is possible to save resource space.

次に、第４の実施の形態を説明する。
図６は、第４の実施の形態を説明する図である。上記図１〜図３に示す実施の形態と同様の構成については、同一符号を付し説明を省略する。
第４の実施の形態の発熱体冷却装置１１Ｄは、第１〜第３電気部材１２〜１４の上部に冷却槽１６Ｄを配置し、冷却槽１６Ｄにバスバー固定部であるところの端子台１１１を接続したことを特徴とする。
端子台１１１には第１〜第３電気部材１２〜１４のそれぞれのバスバー２６を接続している。後で具体的に説明する。 Next, a fourth embodiment will be described.
FIG. 6 is a diagram for explaining the fourth embodiment. The same configurations as those in the embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals and description thereof is omitted.
In the heating element cooling device 11D of the fourth embodiment, a cooling tank 16D is arranged on top of the first to third electric members 12-14, and a terminal block 111 that is a bus bar fixing portion is connected to the cooling tank 16D. It is characterized by that.
The bus bar 26 of each of the first to third electric members 12 to 14 is connected to the terminal block 111. This will be described in detail later.

冷却槽１６Ｄは、第１の実施の形態の冷却槽１６に端子台１１１を配置するための取付部１１２を備えている。すなわち、冷却槽１６を所定の距離Ｘ１だけ延長したもので、延長した板部材５４（ベース部５１）に台配置部１１３が形成され、台配置部１１３に対向する天井部５３に延長部１１４及び放熱フィン５７が形成されている。
なお、絶縁性の冷媒液１７の量は、板部材５４（ベース部５１）の上まで入れてもよい。 The cooling tank 16D includes an attachment portion 112 for arranging the terminal block 111 in the cooling tank 16 of the first embodiment. That is, the cooling tank 16 is extended by a predetermined distance X1, and a base arrangement part 113 is formed on the extended plate member 54 (base part 51), and the extension part 114 and the ceiling part 53 facing the base arrangement part 113 are formed. Radiating fins 57 are formed.
Note that the amount of the insulating refrigerant liquid 17 may be put on the plate member 54 (base portion 51).

端子台１１１は、バスバー２６に接続する金属製のナット部１２１と、ナット部１２１にねじ込むボルト１２２と、ナット部１２１を覆う樹脂製の絶縁部材１２３と、ナット部１２１と板部材５４（ベース部５１）の間に介在させた電気絶縁シート１２４と、からなる。電気絶縁シート１２４は、厚さが非常に薄く、例えば、０．２ｍｍである。 The terminal block 111 includes a metal nut portion 121 connected to the bus bar 26, a bolt 122 screwed into the nut portion 121, a resin insulating member 123 covering the nut portion 121, a nut portion 121, and a plate member 54 (base portion). 51) and an electric insulation sheet 124 interposed between the two. The electrical insulating sheet 124 is very thin, for example, 0.2 mm.

また、端子台１１１は、ナット部１２１にバスバー２６を接触させ、バスバー２６に、例えば、電動モータのケーブル端子１２５を重ね、これらのバスバー２６並びにケーブル端子１２５にボルト１２２を通してナット部１２１にねじ込むことで、バスバー２６にケーブルを接続している。
端子台１１１を固定する構成は任意であり、例えば、図に示していないボルトで絶縁部材１２３をベース部５１又は枠部５２に固定する。 In addition, the terminal block 111 has the bus bar 26 in contact with the nut portion 121, and, for example, the electric motor cable terminal 125 is overlaid on the bus bar 26, and the bus bar 26 and the cable terminal 125 are screwed into the nut portion 121 through bolts 122. Thus, a cable is connected to the bus bar 26.
The structure which fixes the terminal block 111 is arbitrary, for example, the insulating member 123 is fixed to the base part 51 or the frame part 52 with the volt | bolt which is not shown in the figure.

第４の実施の形態の発熱体冷却装置１１Ｄは、第１の実施の形態の発熱体冷却装置１１と同様の効果を発揮する。すなわち、絶縁性の冷媒液１７を収納した冷却槽１６Ｄと、発熱体２１を接合した放熱板２４との間を、簡単な構成によって、電気的に確実に絶縁できるとともに、発熱体２１を絶縁性の冷媒液１７で冷却する冷却性能を高めることができる。 The heating element cooling device 11D of the fourth embodiment exhibits the same effects as the heating element cooling device 11 of the first embodiment. That is, the cooling tank 16D containing the insulating refrigerant liquid 17 and the heat radiating plate 24 joined with the heat generating element 21 can be electrically and reliably insulated with a simple configuration, and the heat generating element 21 can be insulated. The cooling performance of cooling with the refrigerant liquid 17 can be improved.

また、第４の実施の形態の発熱体冷却装置１１Ｄでは、第１電気部材１２の半導体素子（発熱体）２１を作動させると、半導体素子（発熱体）２１の熱はバスバー２６を伝わって、ナット部１２１に伝わる。ナット部１２１に伝わった熱は板部材５４（ベース部５１）伝わるので、板部材５４（ベース部５１）から絶縁性の冷媒液１７もしくは絶縁性の冷媒液１７の蒸気によって熱を逃がすことができる。 Further, in the heating element cooling device 11D of the fourth embodiment, when the semiconductor element (heating element) 21 of the first electric member 12 is operated, the heat of the semiconductor element (heating element) 21 is transmitted through the bus bar 26, It is transmitted to the nut part 121. Since the heat transmitted to the nut portion 121 is transmitted to the plate member 54 (base portion 51), the heat can be released from the plate member 54 (base portion 51) by the insulating refrigerant liquid 17 or the vapor of the insulating refrigerant liquid 17. .

端子台１１１では、ナット部１２１と板部材５４（ベース部５１）の間に介在させた電気絶縁シート１２４を極めて薄くしているので、熱の伝達を妨げない。その結果、絶縁性の冷媒液１７を収納した冷却槽１６Ｄと、発熱体２１を接合した放熱板２４との間を、簡単な構成によって、電気的に確実に絶縁できるとともに、発熱体２１を冷却する冷却性能をより高めることができる。 In the terminal block 111, the electrical insulating sheet 124 interposed between the nut portion 121 and the plate member 54 (base portion 51) is extremely thin, so that heat transfer is not hindered. As a result, the cooling tank 16D containing the insulating refrigerant liquid 17 and the heat radiating plate 24 joined to the heat generating element 21 can be electrically and reliably insulated with a simple configuration, and the heat generating element 21 can be cooled. The cooling performance can be further increased.

尚、本発明の発熱体冷却装置は、実施の形態では半導体素子の冷却に用いたが、半導体素子以外の発熱するものにも採用可能である。
また、実施の形態では、第１〜第３電気部材１２〜１４を冷却する構成を示したが、第１〜第３電気部材１２〜１４が一体である構成、又は、更に第１〜第３電気部材１２〜１４が分割されている場合においても本発明の発熱体冷却装置は適用可能である。 Although the heating element cooling device of the present invention is used for cooling the semiconductor element in the embodiment, it can be applied to a device that generates heat other than the semiconductor element.
Moreover, in embodiment, although the structure which cools the 1st-3rd electric members 12-14 was shown, the structure in which the 1st-3rd electric members 12-14 are integrated, or also 1st-3rd. Even when the electrical members 12 to 14 are divided, the heating element cooling device of the present invention is applicable.

本発明の発熱体冷却装置は、半導体素子に好適である。 The heating element cooling device of the present invention is suitable for a semiconductor element.

本発明の発熱体冷却装置（第１の実施の形態）の説明図Explanatory drawing of the heat generating body cooling device (1st Embodiment) of this invention 図１の２−２線断面図2-2 sectional view of FIG. 発熱体冷却装置（第１の実施の形態）の冷却の機構を説明する図The figure explaining the mechanism of cooling of a heat generating body cooling device (1st Embodiment). 第２の実施の形態を説明する図The figure explaining 2nd Embodiment 第３の実施の形態を説明する図The figure explaining 3rd Embodiment 第４の実施の形態を説明する図The figure explaining 4th Embodiment

Explanation of symbols

１１…発熱体冷却装置、１６…冷却槽、１７…絶縁性の冷媒液、２１…発熱体、２３…一方の面（実装面）、２４…放熱板、２６…バスバー、２７…被覆部材、２８…他方の面（放熱面）、４７…オーリング、４８…シール部材、５６…外表面（外面）、６２…取付面（シート面部）、６３…貫通孔（循環開口）、１１１…バスバー固定部（端子台）。 DESCRIPTION OF SYMBOLS 11 ... Heat generating body cooling device, 16 ... Cooling tank, 17 ... Insulating refrigerant liquid, 21 ... Heat generating body, 23 ... One surface (mounting surface), 24 ... Heat sink, 26 ... Bus bar, 27 ... Cover member, 28 ... the other surface (heat radiating surface), 47 ... O-ring, 48 ... sealing member, 56 ... outer surface (outer surface), 62 ... mounting surface (sheet surface portion), 63 ... through hole (circulation opening), 111 ... bus bar fixing portion (Terminal block).

Claims

A heating element cooling device that cools the heating element by evaporating an insulating refrigerant liquid with heat generated by a heating element composed of a semiconductor element,
The heating element cooling device includes a metal cooling tank that stores the insulating refrigerant liquid,
This cooling tank has a through-hole penetrating inside and outside on the mounting surface for mounting the heating element,
The heating element is bonded to one surface of a metal heat radiating plate having thermal conductivity,
The other surface of the heat radiating plate is a surface larger than the through hole, and when covered with the through hole, the heat radiating directly contacts the insulating refrigerant liquid in the cooling tank through the through hole. Surface,
Of this heat radiating surface, only the part facing the through hole is exposed, and the remaining part is covered with a covering member having electrical insulation,
The heat dissipating surface is attached to the mounting surface at the position of the through hole, overlapping the covering member ,
The mounting surface is formed by a plate member constituting the cooling tank,
Furthermore, the heating element has a bus bar extending outward,
This bus bar is bolted to the bus bar fixing part,
The plate member extends with the cooling tank so as to arrange the bus bar fixing portion,
The bus bar fixing portion is provided at an extended portion of the plate member so that heat transmitted from the bus bar is transmitted to the insulating refrigerant liquid through the plate member, so that heat generated by the heating element is generated. The heating element cooling device is configured to transmit the heat from both the heat radiating plate and the bus bar to the insulating refrigerant liquid .

2. The heating element cooling device according to claim 1, wherein the covering member is made of a mold resin that molds the entire heating element.

The heating element cooling device according to claim 1 or 2, wherein a periphery of the through hole is sealed between the mounting surface and the covering member by a sealing member.

The heat dissipation plate is arranged with the heat dissipation surface facing upward,
The said cooling tank is arrange | positioned higher than the said heat sink, and has a heat radiating fin in the outer surface, The Claim 1 characterized by the above-mentioned. Heating element cooling device.