JP2002184924A - Electronic unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a evaporative cooling type power amplifier where the plastic resin of a module power semiconductor element is not brought into contact with refrigerant liquid. SOLUTION: A hole is made in the part of a wall 9b to which the module power semiconductor element 1b is fitted. The fitting face of the module power semiconductor element 1b is brought into contact with refrigerant liquid 4. The fitting face of the module power semiconductor element 1 operates as a heat dissipating part and the material is constituted of metal. Thus, it is no problem even if the fitting face is brought into contact with refrigerant liquid 4. An O ring 10 is inserted between the outer peripheral part of the fitting face of the module semiconductor element 1b and the wall 9b so that refrigerant liquid 4 does not invade an electric component storage 7 along the fitting face of the module power semiconductor element 1b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic apparatus for cooling a heat-generating component by using a refrigerant liquid. Here, for convenience of explanation, a boil-cooled power amplifier using a power semiconductor element of a package which needs to be miniaturized because it is mounted on a vehicle and which may be corroded or eroded when immersed in a refrigerant liquid will be described. .

[0002]

2. Description of the Related Art FIG. 7 is a view for explaining a conventional boiling cooling type power amplifier. In the figure, 1a is a stack in which a plurality of flat power semiconductor elements are combined, 2 is a case, 3 is a cover, 4 is an insulating refrigerant liquid such as fluorocarbon, 5 is a drive circuit, and 6 is a snubber circuit.

Here, a conventional technique will be described. When the power semiconductor element of the stack 1a generates heat, the refrigerant liquid 4 in contact with the power semiconductor element boils to form bubbles. At this time, the power semiconductor element is cooled by removing heat from the power semiconductor element as boiling heat. The above foam is covered by buoyancy 3
Is reached, the heat is transferred to the cover, the liquid turns into a liquid, and the liquid returns to the refrigerant liquid 4, whereby the circulation is performed.

[0004] A plurality of these bubbles are generated from the vicinity of the power semiconductor element, and the power semiconductor element is cooled by repeating the above-mentioned circulation. This is boiling cooling, which has better heat dissipation efficiency than air cooling or water cooling, and is suitable for a power amplifier that needs to be miniaturized such as mounted on a vehicle.

[0005]

In the boiling-cooled power amplifier as described above, it is necessary that the package of the power semiconductor element is not adversely affected by the coolant liquid. Conventional power semiconductor elements are often of a flat type, and since the package is made of ceramic, there is no problem with strong solvent resistance. In recent years, however, the number of modular power semiconductor elements using a plastic resin package has increased. The plastic resin is not strong in solvent resistance, and when immersed in a coolant liquid as in the prior art, the package may be corroded or eroded during long-term use. Therefore, it was not possible to use a module-type power semiconductor device with the conventional technology.

The present invention has been made in order to solve such problems, and proposes a boiling cooling type power amplifier in which a plastic resin portion of a module type power semiconductor element does not contact a refrigerant liquid.

[0007]

According to a first aspect of the present invention, there is provided a boiling-cooling type power amplifier for an electronic device in which a heat-generating component is boil-cooled by using a refrigerant liquid. A storage part is provided, the storage part for the heat-generating component and the storage part for the refrigerant liquid are separated by a wall, and the heat-generating component is attached to the side of the wall where the heat-generating component is stored.

A boil-cooled power amplifier according to a second aspect of the present invention includes a heat-generating component storage portion, and a refrigerant liquid storage portion provided on a side surface of the heat-generating component storage portion and separated by a wall. The heat-generating component is mounted on the side of the wall where the heat-generating component is stored.

A boiling-cooling type power amplifier according to a third aspect of the present invention has a heat-generating component including a heat-generating component storage portion and a refrigerant liquid storage portion provided on an upper surface of the heat-generating component storage portion and separated by a wall. The heat-generating component is mounted on the side of the wall where the heat-generating component is stored.

A boiling-cooling type power amplifier according to a fourth aspect of the present invention is the one in which the thickness of the wall is reduced only at the mounting portion of the heat-generating component.

According to a fifth aspect of the present invention, there is provided a boiling-cooling type power amplifier comprising: a heat-generating component storage portion; and a refrigerant liquid storage portion provided on a side surface of the heat-generating component storage portion and separated by a wall. A hole is formed in the inner peripheral portion of the heat-generating component mounting portion, and a part of the mounting surface of the heat-generating component is brought into contact with the coolant liquid.

According to a sixth aspect of the present invention, there is provided a boiling-cooling type power amplifier comprising: a heat-generating component storage portion; and a refrigerant liquid storage portion provided on a top surface of the heat-generating component storage portion and separated by a wall. A hole is formed in the inner peripheral portion of the heat-generating component mounting portion, and a part of the mounting surface of the heat-generating component is brought into contact with the coolant liquid.

A boiling cooling power amplifier according to a seventh aspect of the present invention uses a power semiconductor element as the heat generating component.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a configuration diagram of a boiling-cooling type power amplifier according to Embodiment 1 of the present invention, in which 1b is a module type power semiconductor element,
Reference numeral 2 denotes a case, 3 denotes a cover, 4 denotes an insulating refrigerant liquid such as fluorocarbon, 5 denotes a drive circuit, 6 denotes a snubber circuit, 7 denotes an electric component storage section, 8 denotes a refrigerant liquid storage section, and 9 denotes a wall of the case 2. Department.

The present invention has an electric component storage portion 7 and a refrigerant liquid storage portion 8 provided on a side surface of the electric component storage portion 7 with a wall therebetween. By separating the accommodating portion 8 by a wall and attaching the modular power semiconductor element 1b to the wall, heat generated from the modular power semiconductor element 1b is transmitted to the refrigerant liquid 4 through the wall 9. Module type semiconductor element 1b
This package does not come into contact with the refrigerant liquid 4, so that there is no problem with a plastic resin.

Embodiment 2 FIG. 2 is a block diagram of a boiling-cooled power amplifier according to a second embodiment of the present invention. In FIG. 2, 1b is a modular power semiconductor device, 2 is a case, 3a is a top cover, 3b is a bottom cover, and 4 is fluorocarbon. 5, a drive circuit, 6 a snubber circuit, 7 an electric component storage section, 8 a refrigerant liquid storage section, 9
Is a part of the case 2 with a wall. This is an improvement of the first embodiment as described below.

In the first embodiment, the boiling bubbles of the refrigerant liquid 4 rise along the wall 9 by buoyancy. Due to the bubbles, the area where the coolant liquid 4 comes into contact with the wall 9 decreases as the position increases above the wall 9, and the heat radiation efficiency decreases. On the other hand, in the second embodiment, the boiling liquid of the refrigerant liquid 4 rises in the direction perpendicular to the wall 9, and the refrigerant liquid 4 contacts the entire surface of the wall 9.
The heat dissipation efficiency does not decrease unlike the case described above.

However, in the second embodiment, the upper cover 3
a, since a bottom cover 3b and two covers are required,
Embodiment 1 is more advantageous in terms of cost.

Embodiment 3 FIG. 3 is a block diagram of a boiling-cooling type power amplifier according to Embodiment 3 of the present invention. In the figure, 1b is a modular power semiconductor element, 2 is a case, 3 covers, 4 is an insulating refrigerant liquid such as fluorocarbon,
5 is a drive circuit, 6 is a snubber circuit, 7 is an electric component storage section, 8 is a refrigerant liquid storage section, and 9a is a wall which is a part of the case 2. This is an improvement of the first embodiment as described below.

In the first embodiment, the thinner the wall 9 is, the better the heat radiation efficiency is.
There is a limit to thinning the whole. On the other hand, in the third embodiment, only the portion of the wall 9a to which the module type power semiconductor element 1b is attached is thinned, and the heat radiation efficiency can be improved without affecting the strength.

Embodiment 4 FIG. FIG. 4 is a block diagram of a boiling-cooled power amplifier according to Embodiment 4 of the present invention. In the figure, 1b is a modular power semiconductor device, 2 is a case, 3a is a top cover, 3b is a bottom cover, and 4 is fluorocarbon. 5, a drive circuit, 6 a snubber circuit, 7 an electric component storage section, 8 a refrigerant liquid storage section, 9
a is a wall and a part of the case 2. This is an improvement of the second embodiment as described below.

In the second embodiment, the radiation efficiency can be improved by reducing the thickness of the wall 9, but the wall 9 is not
There is a limit to thinning the whole. On the other hand, in the fourth embodiment, only the portion of the wall 9a to which the module type power semiconductor element 1b is attached is thinned, so that the radiation efficiency can be improved without affecting the strength.

Embodiment 5 FIG. 5 is a block diagram of a boiling-cooled power amplifier according to Embodiment 5 of the present invention. In FIG. 5, 1b is a modular power semiconductor element, 2 is a case, 3 is a cover, and 4 is an insulating refrigerant liquid such as fluorocarbon. 5 is a drive circuit, 6 is a snubber circuit, 7 is an electric component storage section, 8 is a refrigerant liquid storage section, 9b is a wall, a part of the case 2, and 10 is an O-ring. This, as shown below,
This is a further improvement of the third embodiment.

In the third embodiment, since the wall 9a is provided between the module type power semiconductor element 1b and the refrigerant liquid 4, the wall 9a
There is a thermal resistance of a. On the other hand, in the fifth embodiment, the wall 9 to which the module type power semiconductor
A hole is made in part b, and the module type power semiconductor element 1
The mounting surface of “b” comes into contact with the refrigerant liquid 4.

The mounting surface of the module type power semiconductor element 1b also serves as a heat radiating portion, and since the material is metal, there is no problem even if it comes into contact with the refrigerant liquid 4. However, the module-type semiconductor element 1 is arranged so that the coolant liquid 4 does not enter the electric component housing 7 along the mounting surface of the module-type power semiconductor element 1b.
The O-ring 10 is inserted between the outer peripheral portion of the mounting surface b and the wall 9b.

Embodiment 6 FIG. FIG. 6 is a block diagram of a boiling-cooled power amplifier according to Embodiment 6 of the present invention. In the figure, 1b is a modular power semiconductor device, 2 is a case, 3a is a top cover, 3b is a bottom cover, and 4 is fluorocarbon. 5, a drive circuit, 6 a snubber circuit, 7 an electric component storage section, 8 a refrigerant liquid storage section, 9
b is a wall, a part of the case 2, and 10 is an O-ring. This is a further improvement of Embodiment 4 as described below.

In the fourth embodiment, since there is a wall 9a between the module type power semiconductor element 1b and the refrigerant liquid 4, the wall 9
There is a thermal resistance of a. On the other hand, in the sixth embodiment, the wall 9 to which the module type power semiconductor
A hole is made in a portion b, and the module type power semiconductor element 1
The mounting surface of “b” comes into contact with the refrigerant liquid 4.

The mounting surface of the module type power semiconductor element 1b also functions as a heat radiating portion, and since the material is metal, there is no problem even if it comes into contact with the refrigerant liquid 4. However, the module-type semiconductor element 1 is arranged so that the coolant liquid 4 does not enter the electric component housing 7 along the mounting surface of the module-type power semiconductor element 1b.
The O-ring 10 is inserted between the outer peripheral portion of the mounting surface b and the wall 9b.

[0029]

According to the present invention, even in the case of an electronic device whose package uses a heat-generating part made of plastic resin, the heat dissipation efficiency can be improved by boiling cooling, and a power amplifier mounted on a vehicle is taken as an example. The occupied space can be reduced to contribute to the reduction in size and weight of the vehicle, and the mobility and fuel efficiency of the vehicle can be improved.

[Brief description of the drawings]

FIG. 1 is a diagram showing Embodiment 1 of a boiling cooling type power amplifier according to the present invention.

FIG. 2 is a diagram showing Embodiment 2 of a boiling cooling type power amplifier according to the present invention.

FIG. 3 is a diagram showing Embodiment 3 of a boiling cooling type power amplifier according to the present invention.

FIG. 4 is a diagram showing Embodiment 4 of a boiling-cooled power amplifier according to the present invention.

FIG. 5 is a diagram showing Embodiment 5 of a boiling-cooled power amplifier according to the present invention.

FIG. 6 is a diagram showing Embodiment 6 of a boiling cooling type power amplifier according to the present invention.

FIG. 7 is a diagram showing a conventional boiling-cooled power amplifier.

[Explanation of symbols]

1a Stack of flat power semiconductor elements, 2 module type power semiconductor elements, 3 covers, 3a Top cover,
3b Bottom cover, 4 Insulating refrigerant liquid, 5 Drive circuit, 6 Snubber circuit, 7 Electrical component storage section, 8 Refrigerant liquid storage section, 9 wall, 9a wall, 9b wall, 10 O-ring.

Claims (7)

[Claims] 1. An electronic device for cooling a heat-generating component by boiling using a coolant liquid, comprising: an accommodating portion for the heat-generating component; and a accommodating portion for the coolant liquid. An electronic device, wherein a liquid storage section is separated from a wall by a wall, and a heat generation component is attached to the heat generation component side of the wall. 2. An electronic device in which a heat-generating component is boiled and cooled by using a refrigerant liquid. A heat-generating component is mounted on the wall of the heat-generating component on the side of the heat-generating component. 3. An electronic apparatus for boiling and cooling a heat-generating component by using a refrigerant liquid, wherein the heat-generating component accommodating portion and a refrigerant-liquid accommodating member provided on an upper surface of the heat-generating component accommodating portion and separated by a wall. A heat-generating component is mounted on the wall of the heat-generating component on the side of the heat-generating component. 4. The electronic device according to claim 1, wherein the thickness of the wall is reduced only at a mounting portion of the heat-generating component. 5. An electronic device in which a heat-generating component is boiled and cooled by using a refrigerant liquid. A hole formed in an inner peripheral portion of the heat-generating component mounting portion of the wall, and a part of the mounting surface of the heat-generating component is brought into contact with the refrigerant liquid. 6. An electronic device for cooling a heat-generating component by boiling using a refrigerant liquid, wherein the refrigerant-storage portion is provided on a top surface of the heat-generating component storage portion. A hole formed in an inner peripheral portion of the heat-generating component mounting portion of the wall, and a part of the mounting surface of the heat-generating component is brought into contact with the refrigerant liquid. 7. The electronic device according to claim 1, wherein the heat generating component is a power semiconductor element.