JP4816362B2 - Manufacturing method of electronic device - Google Patents

Description

The present invention relates to an electronic component and a substrate having a detecting portion on one side as well as electrically connected through the bumps, in the manufacture how the electronic device comprising protecting the detection unit of the electronic component in the adhesive film, For example, the present invention can be applied to a sensor device that detects a mechanical quantity such as angular velocity or acceleration.

  Conventionally, as this type of electronic device, for example, a sensor device using a sensor chip having a movable part on one surface as an electronic component and a circuit chip as a base material is known. Specifically, an acceleration sensor, an angular velocity sensor, a pressure sensor, etc. using a sensor chip in which a movable portion as a detection portion that is displaced by a mechanical quantity such as acceleration, angular velocity, or pressure is formed on one surface side of a semiconductor substrate. Proposed.

  Here, the applicant previously described in Japanese Patent Application No. 2005-277696, as such a sensor device, the movable part side of a sensor chip as an electronic component is opposed to a circuit chip as a base material. Proposals have been made in which chips are stacked and bumps are interposed between the two spaced apart chips, and the two chips are electrically connected via the bumps.

  And, by configuring such an electrical connection portion using bumps, the range of deformation due to impact or the like becomes narrower than electrical connection using wires that has been conventionally performed, and electrical connection between both chips due to impact or the like. The change of the parasitic capacitance of the part is suppressed as much as possible.

  Furthermore, in the above-mentioned prior application, an adhesive film-like adhesive film having an electrical insulating property is attached to the surface of the sensor chip that faces the circuit chip, and a portion corresponding to the movable part of the adhesive film is moved to the movable part. Means that the hollow portion is formed by separating the gap.

  Such a hollow portion is formed by forming a concave portion in the adhesive film by, for example, pressing and separating from the movable portion, so that the movable portion can be appropriately protected while ensuring the operation of the movable portion. I have to.

  The sensor device in this prior application is manufactured as follows. A sensor chip having a movable part on one side and a circuit chip are prepared. First, bumps are provided on a part of one side of the sensor chip other than the movable part. Next, in the film affixing step, an adhesive film having a hollow part at a part facing the movable part is affixed to one surface of the sensor chip so as to cover the bump and the movable part.

  Thereafter, in the bump bonding step, one surface of the sensor chip is opposed to the circuit chip, the two chips are overlapped, and the bumps contact the circuit chip beyond the adhesive film. Specifically, the bump breaks through the adhesive film softened by heat or the like, thereby bringing the bump and the circuit chip into contact with each other. After that, the sensor device is completed by electrically connecting the two chips with bumps by ultrasonic bonding or thermocompression bonding.

  However, according to the inventor's study, in the above-described prior application, after the adhesive film is attached to the sensor chip, the adhesive film is reduced in viscosity by heating or the like when performing the bump bonding in the bump bonding step. Further, it has been found that there is a problem that the shape of the hollow portion is broken due to vibration caused by ultrasonic bonding.

  If the shape of the hollow portion is broken, the possibility that the adhesive film comes into contact with the movable portion is increased, and as a result, the operation characteristics of the movable portion are adversely affected.

  And the above-mentioned problem is not limited to the sensor device in the previous application, but an electronic component having a detection part on one side is overlaid on the base material via a bump with the one side facing the base material, and both of them are bumped. Even in the case of electronic devices that are electrically connected in a state of being separated by each other, it is considered that the same occurs.

  That is, even in such an electronic device, the adhesive film is attached to one surface of the electronic component, and a hollow portion separated from the detection portion with a gap is formed in a portion corresponding to the detection portion of the adhesive film. In the case of the configuration, there is a possibility that the hollow portion may be deformed due to heat or vibration during bump bonding after the adhesive film is attached to the electronic component.

  As a countermeasure, it is conceivable to use a hard material having a high viscosity as the adhesive film. However, if the material is hard, bump bonding at the time of bonding the electronic component and the substrate is hindered. In other words, if the adhesive film is hard, the adhesive film is not sufficiently broken through by the bumps at the time of bump bonding, and the material constituting the adhesive film remains between the bumps and the base material, resulting in insufficient bump bonding.

  The present invention has been made in view of the above problems, and electrically connects an electronic component having a detection portion on one surface and a substrate through bumps, and the detection portion of the electronic component is a hollow portion of an adhesive film. It is an object of the present invention to provide a method of manufacturing an electronic device that is protected by the above-described method, in which it is possible to achieve both ensuring of bump bondability and securing of the shape of a hollow portion when an electronic component and a substrate are bonded.

To achieve the above object, according to the invention of claim 1, as an adhesive film (400), a first layer (401) and the first layer (401) softer than the second layer (402) Are stacked, and an opening is formed in the first layer (401) at a portion facing the detection unit (10), and the hollow part (410) is formed so that the second layer (402) covers the opening. ) Is used,
The adhesive film (400) is attached to one surface of the electronic component (100) on the first layer (401) side , and the hollow portion (410) is harder than the second layer (402). (401) and the first layer (401) is made to bite the bump (80),
Subsequently, in the step of superimposing the electronic component (100) and the base material (200), the bump (80) penetrates the second layer (402) of the adhesive film (400) and hits the base material (200) side. a feature that you.

According to this, since the adhesive film (400) has a two-layer structure of the first layer (401) and the second layer (402) that is softer than the first layer (401), the electronic component (100) It becomes easy for the bump (80) to exceed the adhesive film (400) during bonding of the substrate (200) to the substrate (200), and the hollow portion (410) is harder than the second layer (402) . Since the shape is supported by the layer (401), the shape of the hollow portion (410) can be appropriately maintained. That is, it is possible to ensure both the bump bonding property and the shape of the hollow portion (410) when the electronic component (100) and the base material (200) are bonded.

In this case, as in the invention described in claim 2, in the method of manufacturing the electronic device described in claim 1, the adhesive film (400) corresponds to the bump (80) in the first layer (401). It is assumed that a through hole (403) having a size that allows the bump (80) to enter the part is provided,
In the step of attaching the adhesive film (400) to one surface of the electronic component (100) , if the bump (80) is bitten into the first layer (401) through the through hole (403), the film is attached. At the time of attaching, the bump (80) can be easily bited into the first layer (401).

Further, in the invention according to claim 3, as an adhesive film (400), a first layer (401) and the first layer (401) softer than the second layer (402) and it is being laminated The hollow portion (410) is configured in such a manner that an opening is formed in the first layer (401) and the opening is covered by the second layer (402) at a portion facing the detection portion (10). Use things
The height of the bump (80) provided on one surface of the electronic component (100), than the total thickness of the first layer (401) and the second layer of the adhesive film (400) (402) Make it bigger
In the step of attaching the adhesive film (400) to one surface of the electronic component (100), the adhesive film (400) is attached to one surface of the electronic component (100) on the first layer (401) side to form a hollow portion. (410) is supported by the first layer (401) harder than the second layer (402), and the bump (80) penetrates the first layer (401) and the second layer (402), The tip of the bump (80) protrudes from the adhesive film (400),
Subsequently, in the step of superimposing the electronic component (100) and the substrate (200), and feature to make it hit the substrate (200) side the leading end of the bump (80).

According to this, since the hollow part (410) is supported by the first layer (401) harder than the second layer (402), the shape of the hollow part (410) can be appropriately maintained. Moreover, when the adhesive film (400) is attached to one surface of the electronic component (100), the tip of the bump (80) is surely secured from the adhesive film (400) even if the first layer (401) is hard. for projecting, at the time of bonding between the electronic component (100) and the substrate (200), the bump (80) can easily shed it to the substrate (200). Therefore, it is possible to ensure both of the bump bonding property and the shape of the hollow portion (410) when the electronic component (100) and the base material (200) are bonded.

Further, in the invention according to claim 4, as an adhesive film (400), a first layer (401) and the first layer (401) softer than the second layer (402) and it is being laminated , in a position facing the detection unit (10) is Ru is configured hollow portion (410) with a first layer of the opening with an opening is formed in the (401) a second layer (402) covers the form Use things
Furthermore, the adhesive film (400) is assumed to forming the bumps (80) through a size capable of through holes (404) in a portion facing the bump (80) of the second layer (402),
The adhesive film (400) is attached to one surface of the electronic component (100) on the first layer (401) side , and the hollow portion (410) is harder than the second layer (402). (401) and the first layer (401) is made to bite the bump (80),
Subsequently, in the step of superimposing the electronic component (100) and the base material (200), the bump (80) passes through the through hole (404) of the second layer (402) in the adhesive film (400) and the base material. (200) to make it strike the side and feature.

According to this, since the hollow part (410) is supported by the first layer (401) harder than the second layer (402), the shape of the hollow part (410) can be appropriately maintained. Moreover, since the bump (80) passes through the through hole (404) of the second layer (402) in the adhesive film (400) and hits the base material (200), the electronic component (100) and the base material (200) At the time of bonding , the bump (80) can easily exceed the adhesive film (400). Therefore, we achieve both shape ensuring bump bonding Ensuring the hollow portion during the bonding of the electronic component (100) and the substrate (200) (410).

According to a fifth aspect of the present invention, in the method of manufacturing an electronic device according to any one of the first to fourth aspects, the adhesive film (400) is formed by pressing the first and second layers. (401, 402) is not more that it is formed so as to form a first layer (401) side from the second layer (402) is convex toward the side dome shape constituting a hollow portion (410) Also good.

According to this, since the distance between the hollow part (410) and the detection part (10) can be increased , the shape of the hollow part (410) can be more appropriately maintained .

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other are given the same reference numerals in the drawings in order to simplify the description.

(First embodiment)
FIG. 1 is a diagram showing an overall schematic cross-sectional configuration of an angular velocity sensor device S1 as an electronic device according to a first embodiment of the present invention. FIG. 2 is a schematic plan view showing a surface configuration of the circuit chip 200 on the bump 80 side in the angular velocity sensor device S1 shown in FIG.

[Configuration]
As shown in FIG. 1, the angular velocity sensor device S1 of the present embodiment is roughly configured to include an angular velocity sensor chip 100 as an electronic component, a circuit chip 200 as a base material, and a package 300 for storing these. Has been.

  Here, the sensor chip 100 is configured as an angular velocity detection element. As in the case of a general semiconductor angular velocity sensor, a movable portion 10 as a detection portion is formed on one surface of the sensor chip 100 by performing known micromachining on a substrate such as a semiconductor substrate.

  A specific configuration of the sensor chip 100 will be briefly described. For example, as a substrate constituting the sensor chip 100, a second silicon layer as a second semiconductor layer is bonded to a first silicon layer as a first semiconductor layer through an oxide film as an insulating layer. An SOI (silicon-on-insulator) substrate can be employed.

  And the movable part 10 as a detection part is formed by performing trench etching, release etching, etc. with respect to the surface layer of this board | substrate, for example, the 2nd silicon layer in a SOI substrate. The movable portion 10 is connected to a substrate constituting the sensor chip 100 by a beam having a spring property or the like.

  In the sensor chip 100, the movable portion 10 is driven to vibrate in one direction. Under the driving vibration, when the angular velocity is applied, the direction of the driving vibration is orthogonal to the direction of Coriolis force. In the direction, the movable unit 10 is detected and vibrated. The angular velocity can be detected by detecting the displacement state of the movable portion 10 due to the detected vibration as a change in capacitance.

  Here, in the sensor chip 100, a pad 70 for applying a voltage to the movable part 10 and various electrodes (not shown) or taking out a signal at an appropriate position on the one surface where the movable part 10 is formed. Is provided.

  In the example shown in FIGS. 1 and 2, the movable portion 10 is formed at the center of one surface of the sensor chip 100, and the pad 70 is provided at the peripheral portion of one surface of the sensor chip 100. Such a pad 70 is made of, for example, aluminum. As shown in FIG. 1, metal pads 80 made of Au (gold) bumps, solder bumps, or the like are connected to the pads 70.

  The bump 80 is formed by a general stud bump forming method, solder bump forming method, screen printing using a conductive paste such as Au, or printing by an ink jet method using a nano paste such as Au. It can be formed by employing various methods.

  Thereby, as shown in FIG. 1, the sensor chip 100 as an electronic component is bumped in a state where one surface thereof, that is, the surface on the movable portion 10 side as a detection portion is opposed to the circuit chip 200 as a base material. 80 is overlaid on the circuit chip 200 via 80. The sensor chip 100 and the circuit chip 200 are electrically connected by bumps 80.

  Here, as shown in FIG. 1, the pads 70 of the sensor chip 100 and the pads 210 of the circuit chip 200 are connected via bumps 80. Further, in the present angular velocity sensor device S1, since the gap between one surface of the sensor chip 100 and the circuit chip 200 (that is, the height between the two chips) is secured by the bumps 80, the movable portion 10 and the circuit chip 200 Are separated.

  In the circuit chip 200, for example, a MOS transistor, a bipolar transistor, or the like is formed on a silicon substrate or the like using a known semiconductor process. Then, the circuit chip 200 sends a voltage or the like for driving the movable part 10 to the sensor chip 100 via the bumps 80, or converts or amplifies an electric signal sent from the sensor chip 100. It has functions such as processing and outputting to the outside.

  As shown in FIG. 1, the circuit chip 200 is electrically and mechanically connected to the package 300 via bumps 80. Here, as shown in FIG. 1, the package 300 of the present embodiment has a wiring 310 made of a conductive material inside or on the surface, and the wiring 310 is electrically connected to the outside.

  The package 300 can be made of ceramic, resin, or the like, but here is configured as a ceramic laminated wiring board in which a plurality of ceramic layers such as alumina are laminated. In such a laminated wiring board, the wiring 310 is formed between layers, and the wirings 310 are electrically connected by a through hole or the like.

  As shown in FIG. 1, the pads 210 of the circuit chip 200 and the wirings 310 located on the surface of the package 300 are electrically connected by the bumps 80 similar to the bumps 80 connecting the chips 100 and 200. Mechanically connected.

  Here, in the example shown in FIG. 1, the wiring 310 is exposed at the step portion provided inside the package 300, and the peripheral portion of the circuit chip 200 that is slightly larger than the sensor chip 100 is located at the step portion. It is a supported form. In this example, the pad 210 of the circuit chip 200 and the wiring 310 of the package 300 are connected via the bump 80 at the stepped portion.

  In this way, the sensor chip 100 and the circuit chip 200 are electrically connected to the outside via the bump 80 and the wiring 310 of the package 300. For example, an output signal from the circuit chip 200 is sent to the outside from the wiring 310 of the package 300 via the bump 80.

  As shown in FIG. 1, a lid 320 is attached and fixed to the opening of the package 300, and the inside of the package 300 is sealed by the lid 320.

  The lid portion 320 is not limited to a material such as ceramic, resin, or metal, and various joining methods such as adhesion and welding can be used for joining the lid portion 320 and the package 300.

  Furthermore, as shown in FIG. 1 and FIG. 2, between the sensor chip 100 and the circuit chip 200, a film-like adhesive film 400 having electrical insulation is attached to one surface of the sensor chip 100. .

  A part of the adhesive film 400 that faces the movable part (detection part) 10, that is, a part that covers the movable part 10 forms a hollow part 410 with a gap from the movable part 10. Here, since the portion of the adhesive film 400 around the hollow portion 410 is attached to one surface of the sensor chip 100, the space in the hollow portion 410 is sealed.

  Here, as shown in FIGS. 1 and 2, a planar rectangular concave portion 410 that is recessed in a direction away from the movable portion 10 is formed in a portion of the adhesive film 400 that faces the movable portion 10. A part of the adhesive film 400 other than the concave part 410 is attached to the sensor chip 100 to seal the concave part 410, and the sealed concave part 410 is configured as a hollow part 410.

  1 and 2, the adhesive film 400 is provided around the bump 80 between the sensor chip 100 and the circuit chip 200, and the bump 80 is sealed by the adhesive film 400. Yes.

  Moreover, in the adhesive film 400, the hollow part 410 is formed in the site | part which opposes the movable part 10, the adhesive film 400 and the movable part 10 are spaced apart, and an appropriate operation | movement of the movable part 10 is carried out. It is secured. In addition, since the inside of the hollow portion 410 is sealed as described above, the movable portion 10 is protected from the outside.

  Here, as such an adhesive film 400, a film made of an electrically insulating resin can be employed. More specifically, as the adhesive film 400, for example, a resin film such as NCF (Non Contact Film) or ACF (anisotropic conductive film) made of polyimide resin, epoxy resin, silicone resin, or the like can be employed. .

  Moreover, as a material of the adhesive film 400, the resin component as described above may contain, for example, fine particles made of silica or alumina having a spherical shape, that is, filler. The adhesive film 400 is formed by laminating a plurality of layers 401 and 402 as will be described later.

[Manufacturing method]
Next, a manufacturing method of the angular velocity sensor device S1 of the first embodiment will be described with reference to FIG. FIG. 3 is a process diagram showing the manufacturing method.

  In the angular velocity sensor device S1 manufactured by this manufacturing method, as shown in FIG. 3, the adhesive film 400 includes a first layer 401 that constitutes a portion attached to the sensor chip 100 and a hollow portion 410. 2 layers 402 are bonded together.

  Specifically, as shown in FIGS. 3C and 3D, the second layer 402 is affixed to the surface of the first layer 401 on the circuit chip 200 side. In a state where both layers 401 and 402 are laminated, an opening is formed in the first layer 401 at a portion facing the movable portion 10, and the opening is covered by the second layer 402. A hollow portion 410 is formed in the form.

  Here, the first and second layers 401 and 402 are made of the material of the adhesive film 400 described above, but the first layer 401 is harder and the second layer 402 is softer. Is. This can be easily done by changing the viscosity of the resin components of the layers 401 and 402 and the amount of filler contained.

  First, in this manufacturing method, the bump forming step shown in FIG. In this step, on one surface of the sensor chip 100 as an electronic component, excluding the movable portion 10 as the detection portion, specifically on a pad 70 (see FIG. 1) provided around the movable portion 10, The bump 80 is formed by the method described above.

  Next, as shown in FIGS. 3B and 3C, a process of attaching the adhesive film 400 to one surface of the sensor chip 100, that is, a film attaching process is performed. In this step, an adhesive film 400 having a hollow portion 410 is attached to a portion facing the movable portion 10 on one surface of the sensor chip 100. Thus, the movable portion 10 is covered by the hollow portion 410 of the adhesive film 400 and the bump 80 is covered by the peripheral portion of the hollow portion 410.

  At this time, in the film sticking step in the present manufacturing method, first, as shown in FIG. 3B, the first layer 401 constituting the adhesive film 400 is movable on one surface of the sensor chip 100 by pressure bonding or the like. Paste around the part 10.

  Here, the opening for forming the hollow portion 410 is provided in the first layer 401. This opening is formed by punching using a jig or the like. Then, the first layer 401 is attached in a state where the position of the opening and the position of the movable part 10 are matched. At this time, the bump 80 is digged into the first layer 401 by applying the first layer 401 under pressure.

  Next, as shown in FIG. 3C, the second layer 402 constituting the adhesive film 400 is mounted on the first layer 401, and the first layer 401 and the second layer 401 are bonded by pressure bonding or the like. A layer 402 is attached. At this time, the opening of the first layer 401 and the bump 80 are covered with the second layer 402.

  By pasting the second layer 402, the pasting of the adhesive film 400 is completed, and the second layer 402 is substantially equal to the thickness of the first layer 401 at a portion of the second layer 402 that faces the movable portion 10. A hollow portion 410 is formed as a concave portion.

  In this way, the film attaching step is completed, and the first and second layers 401 and 402 are laminated, and the opening formed in the first layer 401 is formed in the second portion at a portion facing the movable portion 10. A state in which the adhesive film 400 in which the hollow portion 410 is formed so as to cover the layer 402 is attached to one surface of the sensor chip 100 on the first layer 401 side, and the bumps 80 bite into the first layer 401 It becomes.

  Next, in this manufacturing method, a bump bonding step is performed in which both the chips 100 and 200 shown in FIG. In this step, one surface of the sensor chip 100 is opposed to the circuit chip 200, and in this state, both the chips 100 and 200 are overlapped via the bump 80 and the adhesive film 400, and the both chips 100 and 200 are bonded by the bump 80. Connect electrically.

  FIG. 3D shows a state in which the two chips 100 and 200 are opposed to each other. From this state, the two chips 100 and 200 are moved closer to each other, thereby performing the above-described overlapping and bump connection. The method for forming the bump 80 on the circuit chip 200 side is as described above.

  Here, in the bump bonding step, the two chips 100 and 200 are overlapped and connected by the bump 80 in a state where the adhesive film 400 is heated and softened by a heater or the like.

  As a result, as in the previous application, the bump 80 on the sensor chip 100 side penetrates the second layer 402 of the adhesive film 400 between the two chips 100 and 200 that are overlapped, and the circuit chip 200 side, that is, the circuit. It hits the bump 80 of the chip 200. Thus, the opposing bumps 80 of the two chips 100 and 200 break through the adhesive film 400 and come into contact with each other.

  The bumps 80 that are in contact with each other are connected by thermocompression bonding or ultrasonic bonding. Thus, the bump bonding process is completed, and accordingly, the sensor chip 100 and the circuit chip 200 are electrically connected by the bumps 80. At the same time, the two chips 100 and 200 are mechanically joined via the adhesive film 400 by utilizing the adhesive function of the adhesive film 400 and softening of the adhesive film 400 by heating at the time of bump bonding.

  In this way, after bonding both the chips 100 and 200, the bonded chips 100 and 200 are bonded to the package 300 via the bumps 80 located on the outer periphery of the sensor chip 100 in the circuit chip 200. Thereafter, the lid 320 is attached to the package 300 and the inside of the package 300 is sealed. Thus, the angular velocity sensor device S1 shown in FIG. 1 is completed.

[Effects]
In the above manufacturing method, the adhesive film 400 is formed by sequentially laminating the relatively hard first layer 401 and the relatively soft second layer 402 from the sensor chip 100 side. At the time of bump bonding, since the bump 80 has already digged into the first layer 401, the portion that is mainly broken through is the second layer 402.

  Here, since the second layer 402 is softer than the first layer 401, the adhesive film 400 can be easily pierced by the bump 80 on the sensor chip 100 side, and the bump 80 and the circuit chip 200 are separated. Bonding is sufficiently ensured.

  The hollow portion 410 that covers the movable portion 10 is configured to cover the opening formed in the relatively hard first layer 401 with the relatively soft second layer 402, and the hollow portion 410 410 is supported by a relatively hard first layer 401. Therefore, the shape of the hollow portion 410 is appropriately maintained even when heat or vibration is applied during the bump bonding process when the two chips 100 and 200 are overlapped or the bumps 80 are connected.

  Thus, according to the manufacturing method of the angular velocity sensor device S1 of the present embodiment, it is possible to ensure both the bump bonding property and the shape of the hollow portion 410 during the bump bonding process of both the chips 100 and 200.

  Here, FIG. 4 is a schematic cross-sectional view showing another example of the manufacturing method of the present embodiment. In FIG. 4, in the manufacturing method of the present embodiment, the bump 80 can enter the portion corresponding to the bump 80 in the first layer 401 in addition to the above-described configuration as the adhesive film 400 in the film attaching step. A sensor having a through hole 403 having a large size is attached to one surface of the sensor chip 100.

  The first layer 401 having such a through hole 403 can be easily formed by drilling with a punch or the like. In this case, the first layer 401 having the through hole 403 is attached to one surface of the sensor chip 100. At this time, as shown in FIG. Bump 80 is bitten into 401.

  Thereafter, as in the manufacturing method described above, the second layer 402 is pasted to complete the film pasting step, resulting in the state shown in FIG. From this state, similarly to the manufacturing method shown in FIG. 3, the bump bonding step is performed to join the two chips 100 and 200 and attach them to the package 300, whereby the angular velocity sensor shown in FIG. Device S1 is completed.

  Needless to say, the manufacturing method shown in FIG. 4 also demonstrates the effects of the manufacturing method of the present embodiment described above. In this case, furthermore, a through hole 403 is formed in the first layer 401. Thus, when the adhesive film 400 is attached to one surface of the electronic component 100, the bumps 80 can be easily bited into the first layer 401.

  3 and 4, the first layer 401 and the second layer 402 constituting the adhesive film 400 are separately attached to one surface of the sensor chip 100 sequentially. These layers 401 and 402 may be attached and integrated, and then attached to one surface of the sensor chip 100.

(Second Embodiment)
FIG. 5 is a process diagram showing the main part of the manufacturing method of the angular velocity sensor device according to the second embodiment of the present invention, and shows a state immediately after the adhesive film 400 is attached to one surface of the sensor chip 100 in the manufacturing method. It is a schematic sectional drawing shown.

  In the manufacturing method of the present embodiment, the bump forming step and the film attaching step are changed in the manufacturing method shown in the first embodiment, and the difference from the manufacturing method of the first embodiment is mainly described. In the following.

  Also in the manufacturing method of the present embodiment, basically, a bump forming step is performed in the same manner as in the first embodiment, and then the adhesive film 400 composed of two layers 401 and 402 is formed one by one on the sensor chip 100. Or a two-layer integrated product is attached to one surface of the sensor chip 100.

  Here, in this manufacturing method, in the bump formation process, the bump 80 is formed such that the height of the bump 80 formed on one surface of the sensor chip 100 is larger than the thickness of the adhesive film 400 applied in the film application process. Form.

  Thereby, in the film attaching process of this manufacturing method, the adhesive film 400 is attached in a state where the height dimension of the bump 80 provided on one surface of the sensor chip 100 is larger than the thickness dimension of the adhesive film 400. It is done. Therefore, as shown in FIG. 5, the tip of the bump 80 protrudes from the adhered adhesive film 400.

  Thereafter, a bump bonding step is performed in the same manner as in the first embodiment. Thus, when the two chips 100 and 200 are overlapped, the tip of the bump 80 protruding from the adhesive film 400 is applied to the bump on the circuit chip 200 side.

  As in the first embodiment, the two chips 100 and 200 are joined and then attached to the package 300, whereby the angular velocity sensor device S1 similar to that shown in FIG. Is completed.

  According to the manufacturing method of the present embodiment, when the bumps of both the chips 100 and 200 are joined, as shown in FIG. 5, the tip of the bump 80 protrudes from the adhesive film 400. However, the bump 80 can be easily applied to the circuit chip 200 side.

  Therefore, in the present embodiment, the entire adhesive film 400 can be hardened to ensure the shape of the hollow portion 410. Therefore, according to the manufacturing method of the present embodiment, it is possible to achieve both ensuring of the bump bonding property and ensuring of the shape of the hollow portion 410 during the bump bonding process.

  And in the manufacturing method of this embodiment, since the adhesive film 400 may be a hard thing as the said effect, the 2nd layer 402 of the adhesive film 400 is a softer thing than the 1st layer 401. There is no need for both, and they may be of the same hardness. Furthermore, the first layer 401 and the second layer 401 may be made of the same material.

  In the manufacturing method of the present embodiment, the adhesive film 400 does not have to be composed of the two layers 401 and 402 as shown in FIG. 5 but may be composed of only one layer. In this case, the height dimension of the bump 80 provided on one surface of the sensor chip 100 may be made larger than the thickness dimension of the adhesive film made of this one layer in the film attaching process.

(Third embodiment)
FIG. 6 is a process diagram showing the main part of the manufacturing method of the angular velocity sensor device according to the third embodiment of the present invention, and shows a state immediately after the adhesive film 400 is attached to one surface of the sensor chip 100 in the manufacturing method. It is a schematic sectional drawing shown.

  In the manufacturing method of the present embodiment, the film attaching step is changed in the manufacturing method shown in the first embodiment, and the difference from the manufacturing method of the first embodiment will be mainly described.

  Also in the manufacturing method of the present embodiment, basically, the bump forming step is performed as in the first embodiment. Next, in the film attaching step, as shown in FIG. 6, the first layer 401 constituting the adhesive film 400 is attached to one surface of the sensor chip 100 as in the first embodiment.

  Next, the second layer 402 is pasted on the first layer 401 to form the hollow portion 410. In this embodiment, the second layer 402 is bumped by punching using a punch or the like. A portion having a through hole 404 of a size that allows the bump 80 to pass through is attached to a portion facing the portion 80.

  Thus, the film attaching process of the present manufacturing method is completed, and as shown in FIG. 6, the hollow portion 410 is formed by the laminated first and second layers 401 and 402, and the through hole 404 is formed. The adhesive film 400 thus formed is attached to one surface of the sensor chip 100 on the first layer 401 side, and the bumps 80 are bitten into the first layer 401.

  Thereafter, a bump bonding step is performed in the same manner as in the first embodiment. Thereby, when the two chips 100 and 200 are overlapped, the bump 80 on the sensor chip 100 side passes through the through hole 404 of the second layer 402 in the adhesive film 400 and hits the bump on the circuit chip 200 side. That is, in this manufacturing method, it is substantially unnecessary for the bump 80 to break through the adhesive film 400 at the time of bump bonding.

  As in the first embodiment, the two chips 100 and 200 are joined and then attached to the package 300, whereby the angular velocity sensor device S1 similar to that shown in FIG. Is completed.

  According to the manufacturing method of the present embodiment, even when the first layer 401 and the second layer 402 are hard so as to appropriately retain the shape of the hollow portion 410 when the two chips 100 and 200 are bonded to the bumps, The bump 80 can easily cross the adhesive film 400 through the through hole 404 of the second layer 402. For this reason, it is possible to achieve both the securing of the bump bondability during the bump bonding and the securing of the shape of the hollow portion 410.

  And in the manufacturing method of this embodiment, since the two layers 401 and 402 of the adhesive film 400 may be hard as described above, the second layer 402 is softer than the first layer 401. They do not have to be the same, and they may be the same hardness or the same material.

  Here, FIG. 7 is a schematic cross-sectional view showing another example of the manufacturing method of the present embodiment. In the manufacturing method shown in FIG. 7, in the film attaching step, not only the second layer 402 but also the portion corresponding to the through hole 404 of the second layer 402 of the first layer 401 as the adhesive film 400. Also, a hole provided with a through hole 403 of a size that allows the bump 80 to pass through is attached to one surface of the sensor chip 100.

  The first layer 401 having such a through hole 403 can be easily formed by drilling with a punch or the like. In this case, the first layer 401 having the through hole 403 is attached to one surface of the sensor chip 100. At this time, as shown in FIG. 7, the first layer 401 is bumped to the first layer 401 through the through hole 403. Ingest 80.

  Thereafter, as in the above manufacturing method, the second layer 402 is pasted to complete the film pasting process. As shown in FIG. 7, both through holes 403, 403 of both layers 401, 402 are formed. The bumps 80 are disposed inside the communicating holes. After this, it is the same as the manufacturing method of the above-described embodiment.

  Even in the case of the example shown in FIG. 7, it goes without saying that the operational effects of the manufacturing method of the present embodiment described above are exerted, and further, the first hole 401 formed in the first layer 401 has the first effect. The bumps 80 can be easily bited into the layer 401.

  Further, in the overlapping process of both the chips 100 and 200, the bump 80 on the sensor chip 100 side faces the circuit chip 200 through both the through holes 403 and 404, and between the bump 80 and the circuit chip 200. Since the adhesive film 400 is not substantially present, further improvement in bump bonding can be expected.

  Also in this embodiment, as described above, the adhesive film 400 composed of the two layers 401 and 402 may be attached to one surface of the sensor chip 100 layer by layer. It is also possible to adopt a method of attaching the integrated one to one surface of the sensor chip 100.

(Fourth embodiment)
FIG. 8 is a process diagram showing the main part of the manufacturing method of the angular velocity sensor device according to the fourth embodiment of the present invention, and is a schematic sectional view of the adhesive film 400 used in the manufacturing method.

  The manufacturing method of this embodiment is different from the manufacturing method shown in the first embodiment in that the hollow portion 410 of the adhesive film 400 before the film attaching step is processed. I will focus on the differences.

  In the manufacturing method of the present embodiment, as in the first embodiment, first, a bump forming process is performed, and then the adhesive film 400 including two layers 401 and 402 is attached to one surface of the sensor chip 100 by a film attaching process. Paste to.

  Here, in this manufacturing method, as shown in FIG. 8, the first layer 401 and the second layer 402 are laminated as the adhesive film 400, and the first and second layers are formed by pressing. A hollow portion 410 is formed such that 401 and 402 form a dome shape that protrudes from the first layer 401 side toward the second layer 402 side.

  Thereafter, in the film attaching step, the adhesive film 400 shown in FIG. 8 is attached to one surface of the sensor chip 100 on the first layer 401 side. Thereafter, a bump bonding step is performed in the same manner as in the first embodiment.

  Thus, when the two chips 100 and 200 are overlapped, the bump 80 on the sensor chip 100 side penetrates the adhesive film 400 and hits the bump on the circuit chip 200 side.

  As in the first embodiment, the two chips 100 and 200 are joined and then attached to the package 300, whereby the angular velocity sensor device S1 similar to that shown in FIG. Is completed.

  According to the manufacturing method of the present embodiment, as shown in FIG. 8, the hollow portion 410 and the hollow portion 410 are movable by processing the hollow portion 410 of the adhesive film 400 into a dome shape in advance before the film attaching step. The distance with the part 10 can be made larger than the said 1st Embodiment. Therefore, the shape of the hollow portion 410 can be appropriately maintained without making the adhesive film 400 hard.

  And since it is not necessary to make the adhesive film 400 hard, the breakage of the adhesive film 400 by the bump 80 at the time of bump bonding can be performed at a conventional level, and conventional bump bondability can be realized. Therefore, according to the manufacturing method of the present embodiment, it is possible to achieve both ensuring of the bump bonding property at the time of bump bonding and ensuring the shape of the hollow portion 410.

  And since this manufacturing method has such an effect, it is not necessary to make the hardness of the 1st layer 401 and the 2nd layer 402 which comprise the adhesive film 400 different, and it is good also as the same thing. However, also in the present embodiment, as in the first embodiment, the adhesive film 400 in which the second layer 402 is softer than the first layer 401 may be used, and the above effect can be expected.

  9, FIG. 10, and FIG. 11 are schematic cross-sectional views showing a first modification, a second modification, and a third modification, respectively, of the adhesive film 400 used in the manufacturing method of the present embodiment. It is.

  As the adhesive film 400 of the present embodiment, as shown in FIG. 8 and FIGS. 9 to 11, the first and second layers 401 and 402 are formed by pressing in the state before the film attaching process. Any hollow portion 410 may be used as long as it forms a dome shape that protrudes from the first layer 401 side toward the second layer 402 side.

  In the first modification shown in FIG. 9, the through holes 403 through which the bumps 80 can pass through both the first and second layers 401 and 402, similar to those shown in FIG. 404 is formed.

  Further, as in the second modification example shown in FIG. 10, a through hole 404 is provided only in the second layer 402, or only in the first layer 401 as in the third modification example shown in FIG. You may provide the through-hole 403 in this. The method of creating the through holes 403 and 404 as provided in each of these modifications is as described above.

  Also in these modified examples, in addition to the effect of the present embodiment by the dome-shaped hollow portion 410 described above, the effect of the through holes 403 and 404 as described in the above embodiment can be expected.

  Further, in the manufacturing method of the present embodiment, the adhesive film 400 as shown in FIGS. 8 to 11 is formed before the film attaching step. As this forming method, two layers 401 and 402 are attached. After that, the dome-shaped hollow portion 410 may be formed by pressing all at once, or after forming the dome shape by pressing one layer at a time, the layers 401 and 402 may be attached to form two layers. .

(Fifth embodiment)
By the way, in the manufacturing method of each said embodiment, although the process of the adhesive film 400 is performed as a part of the said manufacturing process, as above-mentioned, this process is the punching process using a punch, or the press using a press die. This is done by processing. These are performed in a state where the adhesive film 400 is brought into contact with a jig having a mold or a guide, and the adhesive film 400 is removed from the jig after processing.

  In such a case, the processed adhesive film 400 and the jig may stick together and become difficult to separate, and there is a demand for an improvement in detachability from the jig. The present embodiment provides a method for facilitating the removal of the adhesive film 400 from the jig in the processing method of the adhesive film 400 using such a jig.

  FIG. 12 is a view for explaining a processing method of the adhesive film 400 according to the fifth embodiment of the present invention, and is a diagram schematically showing the configuration of the jig 500 by taking a punching process using a punch as an example. . This drilling process is employed, for example, for forming the through holes 403 and 404 in the above embodiments.

  The basic structure of the jig 500 is the same as that of a general punching jig. In other words, the jig 500 is moved up and down on the die 502 by the base 501, the die 502 mounted and supported on the base 501, the rail 503 supported on the die 502, and the rail 503. A possible guide 504 and a punch 505 for making a hole through an opening 504a provided in the guide 504 are provided.

  Here, the processed adhesive film 400 is sandwiched and fixed between the die 502 and the guide 504. In this state, after punching the adhesive film 400 with the punch 505, the guide The guide 504 is removed from the adhesive film 400 by raising 504 upward.

  Conventionally, when the guide 504 is removed, the guide 504 and the adhesive film 400 are hardly separated. Therefore, in the present embodiment, the surface of the jig 500 that contacts the adhesive film 400, that is, the surface of the guide 504 that contacts the adhesive film 400 is processed into a surface on which the adhesive film 400 is easily separated.

  Specifically, the surface of the guide 504 that comes into contact with the adhesive film 400 has water repellency so that the wettability with the resin is reduced, or the contact area is reduced as an uneven surface, whereby the above-described easily separated surface. It is said. In the case of having water repellency, a thin film made of fluorine resin, silicone resin, or the like is formed on the surface of the guide 504 that contacts the adhesive film 400 by a film forming method such as coating and curing.

  Further, when the surface of the guide 504 that comes into contact with the adhesive film 400 is an uneven surface, the uneven surface can be obtained by knurling the surface or roughening the surface by sandblasting or sputtering. May be formed.

  As described above, in this embodiment, the surface of the guide 504 that contacts the adhesive film 400 is a surface on which the adhesive film 400 is easily separated, so that the adhesive film 400 can be easily detached from the jig 500 after processing. .

(Sixth embodiment)
FIG. 13 is a view for explaining a processing method of the adhesive film 400 according to the sixth embodiment of the present invention.

  Similarly to the fifth embodiment, in the present embodiment, in the punching process, after the adhesive film 400 is processed in a state where the adhesive film 400 is in contact with the jig 500, the adhesive film 400 is removed from the jig 500. A method for processing a film is provided.

  In the present embodiment, as shown in FIG. 13, an air passage 504 b through which air can flow is provided inside the guide 504 by performing cutting or mold processing on the guide 504.

  The air passage 504b is for supplying pressurized air from the outside of the guide 504, for example, from the side surface of the guide 504, by a compressor (not shown). And the exit of the air passage 504b is provided in the contact surface with the adhesive film 400 in the guide 504, and the said pressurized air blows off from this exit.

  Thus, the processed adhesive film 400 is pressed away from the surface of the guide 504 that contacts the adhesive film 400 by the pressurized air sent into the air passage 504b.

  As described above, according to the processing method of the present embodiment, when the jig 500 is removed from the adhesive film 400, air is blown against the adhesive film 400 from the side of the jig 500 to pressurize, thereby bonding after processing. Removal of the film 400 from the jig 500 can be facilitated.

(Seventh embodiment)
FIG. 14 is a view for explaining a processing method of the adhesive film 400 according to the seventh embodiment of the present invention.

  Similarly to the fifth embodiment, in the present embodiment, in the punching process, after the adhesive film 400 is processed in a state where the adhesive film 400 is in contact with the jig 500, the adhesive film 400 is removed from the jig 500. A method for processing a film is provided.

  In the present embodiment, as shown in FIG. 14, a negative pressure passage 502 a is provided inside the die 502 by performing cutting or mold processing on the die 502. The negative pressure passage 502a is sucked from the outside of the die 502, for example, from the side surface of the die 502 by a vacuum pump (not shown). The outlet of the negative pressure passage 502a is a contact surface of the die 502 with the adhesive film 400. Is provided.

  Thus, the processed adhesive film 400 is easily separated from the surface of the guide 504 that contacts the adhesive film 400 by applying a negative pressure so as to be pulled toward the die 502 side by suction from the negative pressure passage 502a.

  As described above, according to the processing method of the present embodiment, when the jig 500 is removed from the adhesive film 400, the adhesive film 400 is viewed from the side opposite to the guide 504 that is a part of the jig 500 where the adhesive film 400 is to be removed. By applying a negative pressure to the adhesive film 400 so as to suck the air, it is possible to easily remove the adhesive film 400 from the jig 500 after processing.

(Other embodiments)
In addition, the processing method of the adhesive film 400 shown to the said 5th-7th embodiment is applicable not only to the above-mentioned punching process, but in the case of the press processing of the adhesive film 400 as shown in FIG. This press work is employed, for example, in the step of forming the dome-shaped hollow portion 410.

  In the press jig 600 shown in FIG. 15, the first press die 603 and the second press die 604 are opposed to each other via the rail 602 on the base 601, and both the press dies 603 and 604 are opposed to each other. The pressing is performed with the adhesive film 400 interposed therebetween.

  In this case, the surfaces of the press dies 603 and 604 that are in contact with the adhesive film 400 are unlikely to be separated from the adhesive film 400 after the press working. As countermeasures, in FIG. 15, for example, the surfaces of both press dies 603 and 604 that are in contact with the adhesive film 400 may have the above-described water repellency or irregular surfaces.

  Alternatively, the above-described air passage or negative pressure passage is formed in the first press die 603 or the second press die 604, and the adhesive film 400 after press working is formed by performing the same pressurization or negative pressure as described above. It can be easily removed from both press dies 603 and 604.

  Moreover, although the processing method shown to the said 5th-7th embodiment may each be performed independently, of course, in the said punch process and press process, you may carry out in combination with each other. For example, in the punching process, if the guide 504 is subjected to a water repellent process and the air passage 504b is formed, and the negative pressure passage 502a is formed in the die 502, the effects of the adhesive film 400 can be further improved. It is expected that removal will be easy.

  In the manufacturing method of the angular velocity sensor device shown in the above embodiment, the bump 80 on the sensor chip 100 side hits the circuit chip 200 via the bump 80 on the circuit chip 200 side, beyond the adhesive film 400. The bumps 80 on the circuit chip 200 side may be omitted.

  In other words, the bump 80 on the sensor chip 100 side hitting the circuit chip 200 side may directly hit the pad 210 of the circuit chip 200 beyond the adhesive film 400.

  In addition, regarding the through holes 403 and 403 having a size that allows the bump 80 to pass through in the adhesive film 400 shown in each of the above embodiments, the hole shape may be any shape that allows the bump 80 to pass through. But you can. The size of the hole may be slightly larger than that of the bump 80, but may be smaller than the bump 80 as long as the bump 80 can push through the hole and pass through.

  In addition to the angular velocity sensor chip described above, the sensor chip as an electronic component may be an acceleration sensor chip. In the case of the acceleration sensor chip, the movable part as the detection part is displaced in one direction when the acceleration is applied, and obtains the acceleration by detecting the degree of displacement as a capacitance change.

  In addition to the movable part such as the beam structure in the angular velocity sensor or the acceleration sensor, the movable part as the detection part may be a diaphragm in the pressure sensor. In addition to the sensor chip described above, any electronic component may be used as long as it has a detection unit on one surface, such as a BGA (ball grid array) or a flip chip.

  In addition to the movable part that is displaced by mechanical quantities such as angular velocity, acceleration, and pressure, the electronic part detection part is a humidity detection part in a humidity sensor or the like, or a circuit part in which some circuit is formed. Also good. In short, the detection unit is a part of one surface of the electronic component that the adhesive film should not contact.

  In addition to the circuit chips described above, various circuit boards and wiring boards such as printed boards and ceramic wiring boards, lead frames, bus bars and the like can be used as the base material.

1 is an overall schematic cross-sectional view of an angular velocity sensor device as an electronic device according to a first embodiment of the present invention. 2 is a schematic plan view showing a surface configuration of a circuit chip on a bump 80 side in the angular velocity sensor device shown in FIG. It is process drawing which shows the manufacturing method of the angular velocity sensor apparatus of 1st Embodiment. It is a schematic sectional drawing which shows another example of the manufacturing method of 1st Embodiment. It is process drawing which shows the principal part of the manufacturing method of the angular velocity sensor apparatus which concerns on 2nd Embodiment of this invention. It is process drawing which shows the principal part of the manufacturing method of the angular velocity sensor apparatus which concerns on 3rd Embodiment of this invention. It is a schematic sectional drawing which shows another example of the manufacturing method of 3rd Embodiment. It is process drawing which shows the principal part of the manufacturing method of the angular velocity sensor apparatus which concerns on 4th Embodiment of this invention. It is a schematic sectional drawing which shows the 1st modification of the manufacturing method of 4th Embodiment. It is a schematic sectional drawing which shows the 2nd modification of the manufacturing method of 4th Embodiment. It is a schematic sectional drawing which shows the 3rd modification of the manufacturing method of 4th Embodiment. It is a figure for demonstrating the processing method of the adhesive film which concerns on 5th Embodiment of this invention. It is a figure for demonstrating the processing method of the adhesive film which concerns on 6th Embodiment of this invention. It is a figure for demonstrating the processing method of the adhesive film which concerns on 7th Embodiment of this invention. It is a figure for demonstrating the processing method of the adhesive film which concerns on other embodiment.

Explanation of symbols

10 ... movable part as a detection part, 80 ... bump,
100 ... sensor chip as an electronic component, 200 ... circuit chip as a substrate,
400 ... Adhesive film, 401 ... First layer, 402 ... Second layer,
403, 404 ... through hole, 410 ... hollow part, 500 ... jig.

Claims (5)

An electronic component (100) having a detection unit (10) on one side and a base material (200) are prepared,
A bump (80) is provided on a portion of the one surface of the electronic component (100) other than the detection unit (10),
Next, with respect to one surface of the electronic component (100), a film-like adhesive film (400) having a hollow portion (410) separated from the detection portion (10) in a portion facing the detection portion (10). ) To cover the bump (80) and the detection unit (10),
Thereafter, one surface of the electronic component (100) is made to face the base material (200), the electronic component (100) and the base material (200) are overlapped, and the bump (80) is attached to the adhesive film. Manufacturing of an electronic device in which the electronic component (100) and the base material (200) are electrically connected by the bump (80) by making contact with the base material (200) side beyond (400) In the method
As the adhesive film (400), a first layer (401) and a second layer (402) that is softer than the first layer (401) are laminated, and face the detection unit (10). At the site, an opening is formed in the first layer (401) and the hollow portion (410) is configured so that the opening is covered by the second layer (402) .
In the step of attaching the adhesive film (400) to one surface of the electronic component (100), the adhesive film (400) is attached to one surface of the electronic component (100) on the first layer (401) side. In addition , the hollow portion (410) is supported by the first layer (401) which is harder than the second layer (402 ), and the bump (80) is bitten into the first layer (401). And let
In the step of superimposing the electronic component (100) and the substrate (200), the bump (80) penetrates the second layer (402) of the adhesive film (400) and the substrate (200). A method for manufacturing an electronic device, wherein the method hits the side. Before SL adhesive film (400) is provided with the bump (80) through hole of a size capable of that entering (403) a position corresponding to the bumps (80) of said first layer (401) Shall be
In the step of attaching the adhesive film (400) to one surface of the electronic component (100), the bump (80) is bitten into the first layer (401) through the through hole (403). A method for manufacturing an electronic device according to claim 1. An electronic component (100) having a detection unit (10) on one side and a base material (200) are prepared,
A bump (80) is provided on a portion of the one surface of the electronic component (100) other than the detection unit (10),
Next, with respect to one surface of the electronic component (100), a film-like adhesive film (400) having a hollow portion (410) separated from the detection portion (10) in a portion facing the detection portion (10). ) To cover the bump (80) and the detection unit (10),
Thereafter, one surface of the electronic component (100) is made to face the base material (200), the electronic component (100) and the base material (200) are overlapped, and the bump (80) is attached to the adhesive film. Manufacturing of an electronic device in which the electronic component (100) and the base material (200) are electrically connected by the bump (80) by making contact with the base material (200) side beyond (400) In the method
As the adhesive film (400), a first layer (401) and a second layer (402) that is softer than the first layer (401) are laminated, and face the detection unit (10). At the site, an opening is formed in the first layer (401) and the hollow portion (410) is configured so that the opening is covered by the second layer (402).
A height dimension of the bump (80) is larger than a total thickness dimension of the first layer (401) and the second layer (402) of the adhesive film (400) ;
In the step of attaching the adhesive film (400) to one surface of the electronic component (100), the adhesive film (400) is attached to one surface of the electronic component (100) on the first layer (401) side. In addition, the hollow portion (410) is supported by the first layer (401) which is harder than the second layer (402), and the bump (80) is supported by the first layer (401) and the first layer (401). Penetrating through the second layer (402) so that the tip of the bump (80) protrudes from the adhesive film (400),
In the step of superimposing the electronic component (100) and the base material (200), the tip of the bump (80) is applied to the base material (200) side. Method. An electronic component (100) having a detection unit (10) on one side and a base material (200) are prepared,
A bump (80) is provided on a portion of the one surface of the electronic component (100) other than the detection unit (10),
Next, with respect to one surface of the electronic component (100), a film-like adhesive film (400) having a hollow portion (410) separated from the detection portion (10) in a portion facing the detection portion (10). ) To cover the bump (80) and the detection unit (10),
Thereafter, one surface of the electronic component (100) is made to face the base material (200), the electronic component (100) and the base material (200) are overlapped, and the bump (80) is attached to the adhesive film. Manufacturing of an electronic device in which the electronic component (100) and the base material (200) are electrically connected by the bump (80) by making contact with the base material (200) side beyond (400) In the method
As the adhesive film (400), a first layer (401) and a second layer (402) that is softer than the first layer (401) are laminated, and face the detection unit (10). At the site, an opening is formed in the first layer (401) and the hollow portion (410) is configured so that the opening is covered by the second layer (402) .
Further, the adhesive film (400) is formed by forming a through hole (404) having a size through which the bump (80) can pass in a portion of the second layer (402) facing the bump (80). age,
In the step of attaching the adhesive film (400) to one surface of the electronic component (100), the adhesive film (400) is attached to one surface of the electronic component (100) on the first layer (401) side. In addition , the hollow portion (410) is supported by the first layer (401) which is harder than the second layer (402 ), and the bump (80) is bitten into the first layer (401). And let
In the step of superimposing the electronic component (100) and the substrate (200), the bump (80) passes through the through hole (404) of the second layer (402) in the adhesive film (400). The method for manufacturing an electronic device is characterized in that it contacts the base material (200) side. As for the said adhesive film (400), the said 1st and 2nd layer (401, 402) becomes convex toward the said 2nd layer (402) side from the said 1st layer (401) side by press work. a method of manufacturing an electronic device according to any one of claims 1 to 4, characterized in that constitute the hollow portion is formed so as to form a dome shape (410).

Images