TW200829047A - Micro electro-mechanical system device and manufacturing method thereof - Google Patents

Abstract

A micro electro-mechanical system (MEMS) device and a manufacturing method thereof. The MEMS device includes a substrate, a MEMS die, a cap and a molding compound. The MEMS die is disposed on the substrate. The cap disposed on the MEMS die partially covers the MEMS die. The molding compound is disposed on the substrate and covers the substrate, the MEMS die and at least a portion of the cap.

Description

200829047

达达号·· TW3334PA IX. Description of the Invention: [Technical Field] The present invention relates to a microelectromechanical system device and a method of fabricating the same, and more particularly to a microelectromechanical system as a microelectromechanical microphone Device and method of manufacturing the same. [Prior Art]

In order to cope with the miniaturization and functional complexity of electronic products in today's market, the application of Micro Electro-Mechanical

System, MEMS) technology to integrate and miniaturize the system is the direction of research and development in the industry. ^ Generally speaking, the MEMS system uses sensors (%1150]:), actuators (^(^11纣〇):), circuits, etc. on the Shihwa wafer substrate by micro-integration technology. It can be widely used in wireless §fl, optical communication, medical, bio-wafer and semiconductor. Common commercial MEMS systems such as digital microlens components, inkjet electrostatic heads, acceleration sensors, pressure Sensor, blood cell measurement sensor, three-axis acceleration sensor and micro-electromechanical microphone, etc. Zhongyu Yu: The overall structure of the electromechanical system is quite small and precise, so that its interference '+ π is exhibited, The system reduces the versatility of the micro-electromechanical system. The micro-electromechanical microphone of the micro-electromechanical microphone; == board:; and = micro-microphone chip and other passive elementary board, then add the metal, and Metal cover or metal plate covers the substrate: Component Board ::: 5 200829047

Sanda number: TW3334PA covers and protects these components. However, the manner of providing the metal cover or the metal plate needs to be separately set on each package, which increases the overall process steps and increases the time and cost required for the process. The present invention relates to a microelectromechanical system device and a method of fabricating the same, in which a wafer level cover structure is directly disposed on a microelectromechanical wafer in a process, so that according to the present invention The MEMS device and its C manufacturing method have the advantages of shortening the process time, simplifying the process steps, and saving costs. According to one aspect of the invention, a MEMS device is provided, comprising a substrate, a MEMS wafer, a cover structure, and a glue. The MEMS wafer is disposed on the substrate. The cover structure is disposed on the MEMS wafer and only partially covers the MEMS wafer. The encapsulant is disposed on the substrate and covers the substrate, the microelectromechanical wafer, and at least a portion of the cover structure. According to another aspect of the present invention, a method of manufacturing a MEMS device is proposed. This manufacturing method includes the following steps. First, a cover wafer and a MEMS wafer are provided. The lid wafer and MEMS wafer are then bonded. Next, the MEMS wafer is placed on a tape. Second, the bonded cover wafer and MEMS wafer are cut to form a plurality of MEMS structures. Then, the MEMS structures are connected to a substrate. Further, the substrate is encapsulated by a glue and the MEMS structure, the seal covering the substrate and at least a portion of the top surface of each of the MEMS structures. Finally, the MEMS structure and substrate are cut. 6 200829047

。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Detailed description of the invention. However, the present invention is not limited thereto, and the embodiments are not intended to limit the scope of the invention. Furthermore, the illustrations in the embodiments also omit unnecessary elements to clearly show the technical features of the present invention.第一: In the first embodiment, please refer to FIGS. 1 and 2A to 2H, and FIG. 1 is a flow chart showing a method of manufacturing the MEMS device according to the first embodiment of the present invention; FIGS. 2A to 2H are respectively shown A schematic diagram of steps 101 to 108 in Fig. 1. First, as shown in steps 101 and 2A, a cap wafer 11 and a MEMS wafer 13 are provided, and the cover wafer 11 is bonded to the MEMS. Wafer 13, on. In the present embodiment, the cover wafer 11 has a plurality of through holes 11c which penetrate the upper surface 11a of the cover wafer 11 and the lower surface lib. Next, in step 102, a film is adhered to the cover wafer 11. As shown in Fig. 2B, the film 15 covers the through holes 11c, which ensures that other foreign matter or chemicals do not enter the through holes 11c during the manufacturing process, thereby preventing the MEMS wafer 13 from being contaminated. The film 15 is preferably a transparent material. 7 200829047

Sanda number = TW3334PA Next, proceeding to step 103, the MEMS wafer 13 is placed on a tape. As shown in Fig. 2C, the bonded cover wafer 11 and the MEMS wafer 13 are fixed to the tape 16. This tape 16 is, for example, a UV tape. • Then, proceed to step 104, as shown in FIG. 2D, to cut and bond the cover wafer 11 and the MEMS wafer 13, and the cover wafer 11 is cut into a plurality of cover structures 12, MEMS The circular 13 series is cut into a plurality of microelectromechanical wafers 14. Each of the cover structures 12 has a through hole 11c, and one of the upper surfaces 14a of each of the microelectromechanical wafers 14 has a wire-bonding region 141, and the wire bonding region 141 is exposed to the cover. Structure 12 is outside. In addition, each of the cover structures 12 and each of the microelectromechanical wafers 14 form a MEMS structure 17. Then, as shown in steps 105 and 2E, the MEMS structure 17 is attached to the substrate 18 by the tape 16, and the wire bonding regions 141 and the substrate 18 of each MEMS wafer 14 are wire bonded to each. A microelectromechanical wafer 14 is electrically connected to the substrate 18. The substrate 18 includes an integrated circuit wafer 19 thereon. In the present embodiment, each MEMS structure 17 is disposed adjacent to each integrated circuit die 19. However, those skilled in the art can understand that the technology of the present invention is not limited thereto, and each MEMS structure 17 can also be disposed on the integrated circuit chip 19, that is, the integrated circuit chip 19 is located. Between each microelectromechanical wafer 14 and the substrate 18, the space of the substrate 18 can be eliminated. Then, in step 106, the substrate 18 and the MEMS structures 17 are encapsulated with a glue. As shown in Figure 2F, the sealant 8 200829047

The TW3334PA 20 is disposed on the substrate 18 and covers the integrated circuit wafer 19 and a portion of the surface of each MEMS structure 17. Further, the film 15 described above is not covered by the sealant 20 and is exposed to the outside of the sealant 20. Next, as shown in steps 107 and 2G, the film 15 is removed. Since the sealant 20 is disposed so as not to cover the adhesive film 15, the through holes 11c are exposed to the outside of the sealant 20 after the adhesive film 15 is removed. Thus, a signal S can pass through the through holes 11 (: is transmitted to the microelectromechanical wafers n. Further, the steps 1 and 8 are performed, and the microelectromechanical system 17 and the substrate 18 are singUlating. 2H The MEMS device 100 according to the first embodiment of the present invention is illustrated. The MEMS device 1 manufactured according to the above steps 101 to 108 includes a cover structure 12, a microelectromechanical wafer 14, and a substrate. 18. Integrated circuit chip 19 and encapsulant 20. The MEMS device 1 is, for example, a microelectromechanical microphone, and the microcomputer package 14 is adapted to receive a signal such as an acoustic signal. S 'and correspondingly generate an electrical signal, and the integrated circuit chip 19 is used to receive the electrical signal.

The MEMS device according to the first embodiment of the present invention and the method of manufacturing the same according to the first embodiment of the present invention are provided by providing a cover wafer such that the cover structure is disposed on the MEMS wafer while the MEMS device is being fabricated. The MEMS device has a wafer ferrd cover structure that simplifies the process steps and reduces costs. And preferably set through

The film is placed on the cover wafer to ensure that the MEMS wafer is not contaminated during the process. S 200829047

Sanda number: TW3334PA Second embodiment The MEMS device of the present embodiment is different from the MEMS device 100 of the first embodiment described above (shown in FIG. 2H) in the position of the through hole, and the rest are the same. The department will not repeat them. Please refer to FIG. 3, which is a schematic diagram of a microcomputer "electric system device according to a second embodiment of the present invention. The MEMS device 200 includes a cover structure 22, a microelectromechanical wafer 14, a substrate 28, an integrated circuit wafer 19, and a sealant 30. f. The cover structure 22 and the MEMS wafer 14 form a MEMS structure 2?. The substrate 28 has a through hole 28c which penetrates through one of the upper surface 28a and the lower surface 28b of the substrate 28. When the microcomputer system structure 27 is connected to the substrate 28 by the tape 26, the MEMS structure 27 corresponds to the position of the through hole 28c. Further, the tape 26 has an opening 26a at the corresponding through hole 28c so that a signal S can be transmitted to the microelectromechanical wafer 14 through the through hole 28c and the opening 26a. In the present embodiment, the integrated circuit wafer 19 is disposed adjacent to the microelectromechanical crystal (the sheet 14 and the encapsulant 30 covers the integrated circuit wafer 19 and the MEMS structure 27. That is, all of the substrate 28 The components are all encapsulated in the encapsulant 30, so that the MEMS device 2 〇〇 has good protection. The MEMS device and the manufacturing method thereof according to the preferred embodiment of the present invention utilize the bonded cover wafer and The MEMS wafer is fabricated and packaged together to provide a wafer-level cover structure for the MEMS package system. The advantage is that the method of simultaneously cutting and packaging the two wafers is used in the process. In the middle, the cover structure is formed in the microcomputer 200829047

The three-dimensional number: TW3334PA' on the electric wafer simplifies the process steps and simultaneously completes multiple MEMS devices. This increases productivity, reduces process time and saves manufacturing costs. In addition, the microelectromechanical wafer is protected by the cover structure during the cutting and packaging steps, and the microelectromechanical wafer is prevented from being contaminated by the adhesive film covering the through holes. The micro-electromechanical crystal and the film are processed in the process, and the processing operations can be performed more easily. In the above, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the invention. It is to be understood by those skilled in the art without departing from the spirit and scope of the invention. Various changes and modifications may be made. Therefore, the scope of the present invention is defined by the scope of the appended claims. 11 200829047

Sanda number: TW3334PA [Simplified description of the drawings] Fig. 1 is a flow chart showing a method of manufacturing a microelectromechanical system device according to a first embodiment of the present invention; and Fig. 2A is a schematic view showing a step 101 in Fig. 1; 2B is a schematic diagram of step 102 in FIG. 1; FIG. 2C is a schematic diagram showing step 103 in FIG. 1; FIG. 2D is a schematic diagram showing step 104 in FIG. 1; FIG. 2F is a schematic diagram of step 106 in FIG. 1; FIG. 2G is a schematic diagram showing step 107 in FIG. 1; FIG. 2H is a schematic diagram showing step 108 in FIG. 1; And Figure 3 is a schematic diagram of a MEMS device in accordance with a second embodiment of the present invention. 12 200829047

Sanda number: TW3334PA ' [Main component symbol description] 11 : Cover wafer 11a: Cover wafer upper surface lib: Cover wafer lower surface 11c, 28c: Through hole • 12, 22 ·• Cover Structure 13 · MEMS wafer 14 : MEMS wafer ( 14a : MEMS upper surface 15 · film 16 , 26 : tape 17 , 27 · MEMS structure 18 , 28 : substrate 19 : integrated Circuit wafer 20, 30: sealant 26a: opening '28a: substrate upper surface 28b: substrate lower surface 100, 200: MEMS device 141: wire bonding area S: signal 13

Claims (1)

200829047 Sanda number: TW3334PA X. Patent application scope: 1. A Micro Electro-Mechanical System (MEMS) device, including a substrate; a microelectromechanical chip disposed on the substrate; The body structure is disposed on the MEMS wafer, and the cover structure partially covers the MEMS wafer; and a wide adhesive is disposed on the substrate, the sealant covering the substrate, the f MEMS wafer And at least a portion of the cover structure. 2. The MEMS device of claim 1, wherein the cover structure has a through hole that penetrates the upper surface and the lower surface of the cover structure. A via hole for transmitting a "^* signal to the MEMS chip. 3. The MEMS device of claim 2, wherein the MEMS device is a MEMS f Microphone, and the signal is a chirped sound signal. 4. The MEMS device of claim 2, further comprising: an integrated circuit chip disposed on the substrate and located adjacent to the MEMS wafer, the integrated circuit chip for receiving the The MEMS chip transmits an electrical signal. 5. The MEMS device of the fourth item of the patent application scope, wherein the sealant covers the integrated circuit chip. The MEMS device of claim 2, further comprising: an integrated circuit chip disposed between the MEMS chip and the substrate, the integrated circuit chip Receiving an electrical signal transmitted by the MEMS chip. 7. The MEMS device of claim 1, wherein an upper surface of the MEMS wafer has a wire bonding region, and the MEMS wafer is wire bonded via the wire bonding region. The base f-plate is electrically connected to the substrate. 8. The MEMS device of claim 7, wherein the cover structure does not cover the wire bond area. 9. The MEMS device of claim 1, wherein the substrate has a through hole extending through the upper surface and the lower surface of the substrate for transmitting a signal to the MEMS wafer. 10. The MEMS device of claim 9, wherein the MEMS device is a microelectromechanical microphone, and the signal system I is an acoustic signal. 11. The MEMS device of claim 9, wherein the sealant completely covers the cover structure. 12. The MEMS device of claim 9, further comprising: an integrated circuit chip disposed on the substrate and located adjacent to the MEMS wafer, the integrated circuit chip for receiving the The MEMS chip transmits an electrical signal. The MEMS device of claim 12, wherein the sealant covers the integrated circuit chip. 14. A method of fabricating a microelectromechanical system device, comprising: providing a cap wafer and a MEMS wafer; 'bonding the lid wafer and the MEMS wafer; The electromechanical system wafer is on a tape; dicing the bonded cover wafer and the MEMS wafer to form a plurality of MEMS structures; f connecting the MEMS structures to a substrate; An adhesive encapsulating the substrate and the MEMS structures, the encapsulant covering at least a portion of the surface of the substrate and each of the MEMS structures; and singulating the MEMS structures and the substrate. 15. The manufacturing method according to claim 14, wherein in the cutting step, the cover wafer is cut into a plurality of cover structures, and the MEMS wafer is cut into a plurality of MEMS wafers. The MEMS V system structures each include each of the cover structures and each of the MEMS wafers. 16. The manufacturing method of claim 15, wherein the cover wafer has a plurality of through holes extending through the upper surface and the lower surface of the cover wafer for performing the cutting. After the step, the through holes are respectively disposed corresponding to each of the cover structures. 17. The manufacturing method of claim 16, after the step of bonding, further comprising: adhering a film to the cover wafer to cover the through holes. The method of manufacturing the invention of claim 17, wherein the film is a transparent material. 19. The method of manufacturing of claim 17, further comprising: removing the film after the step of packaging. 20. The manufacturing method of claim 16, wherein in the encapsulating step, the encapsulant exposes the through holes. 2L. The method of claim 15, wherein the upper surface of the f-microelectromechanical wafer has a wire bonding region, the cover structure not covering the wire bonding region. 22. The manufacturing method of claim 21, after the connecting step, further comprising: wire bonding the wire bonding region and the substrate for electrically connecting the MEMS pad to the Substrate. 23. The method of claim 15, wherein the substrate has a plurality of vias extending through the upper surface " the lower surface of the substrate. 24. The method of manufacture of claim 23, wherein in the joining step, each of the MEMS structures is coupled to a location on the substrate corresponding to each of the vias. 17