JP4806801B2 - 接合応力が軽減されたプリントヘッド及び方法 - Google Patents
接合応力が軽減されたプリントヘッド及び方法 Download PDFInfo
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- JP4806801B2 JP4806801B2 JP2009514498A JP2009514498A JP4806801B2 JP 4806801 B2 JP4806801 B2 JP 4806801B2 JP 2009514498 A JP2009514498 A JP 2009514498A JP 2009514498 A JP2009514498 A JP 2009514498A JP 4806801 B2 JP4806801 B2 JP 4806801B2
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- JP
- Japan
- Prior art keywords
- holder
- thickness
- glass
- glass plate
- print head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title description 6
- 239000011521 glass Substances 0.000 claims description 55
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 49
- 229910052710 silicon Inorganic materials 0.000 claims description 46
- 239000010703 silicon Substances 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 18
- 230000002238 attenuated effect Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000002861 polymer material Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 238000013016 damping Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14362—Assembling elements of heads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Ink Jet (AREA)
Description
Claims (8)
- 熱膨張係数αsを有するシリコンインクジェットチップと、
前記シリコンチップを担持及び支持するように構成され、ホルダ肉厚、及びαsとは実質的に異なる熱膨張係数αhを有するプリントヘッドホルダと、
αsと実質的に同様である熱膨張係数αg、及び前記ホルダ肉厚と少なくとも同じ大きさの厚みを有するガラス板とを備え、
前記シリコンチップは、前記シリコンチップの両側に配置される一対の前記ガラス板に接合され、前記ガラス板の反対側は前記ホルダに接合され、それによって、前記シリコンチップと前記ホルダとの間の熱膨張差によって生成される応力が減衰されることを特徴とするインクジェットプリントヘッド。 - 前記ガラス板の前記厚みは、前記ガラス材料の弾性率と前記プリントヘッドホルダの材料の弾性率との比に比例する厚みよりも大きいことを特徴とする請求項1に記載のインクジェットプリントヘッド。
- 前記ガラス板の前記厚みは前記ホルダ肉厚の約2倍であることを特徴とする請求項1に記載のインクジェットプリントヘッド。
- 前記ホルダ肉厚は0.5mm以下であり、前記ガラス板の前記厚みは少なくとも0.7mmであることを特徴とする請求項1に記載のインクジェットプリントヘッド。
- 前記ガラス板は同様の大きさ及び形状の一対のガラス板を含み、ガラス板はそれぞれ、前記シリコンチップの両側に対する第1の側と、前記ホルダに対する第2の側に対称的に接合されることを特徴とする請求項1に記載のインクジェットプリントヘッド。
- αs及びαgは約3×10-6/℃の範囲内にあり、αhは15〜17×10-6/℃の範囲内にあることを特徴とする請求項1に記載のインクジェットプリントヘッド。
- 前記インクジェットチップを包囲すると共に、前記インクジェットチップと前記ガラス板との間に接合されるガラス膜をさらに備えることを特徴とする請求項1に記載のインクジェットプリントヘッド。
- 前記ガラス膜は前記ガラス板の約1/10の厚みを有することを特徴とする請求項7に記載のインクジェットプリントヘッド。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/447,333 | 2006-06-06 | ||
US11/447,333 US7589420B2 (en) | 2006-06-06 | 2006-06-06 | Print head with reduced bonding stress and method |
PCT/US2007/070423 WO2007146676A2 (en) | 2006-06-06 | 2007-06-05 | Print head with reduced bonding stress and method |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009539650A JP2009539650A (ja) | 2009-11-19 |
JP4806801B2 true JP4806801B2 (ja) | 2011-11-02 |
Family
ID=38692366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009514498A Expired - Fee Related JP4806801B2 (ja) | 2006-06-06 | 2007-06-05 | 接合応力が軽減されたプリントヘッド及び方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7589420B2 (ja) |
EP (1) | EP2024184B1 (ja) |
JP (1) | JP4806801B2 (ja) |
CN (1) | CN101466547B (ja) |
WO (1) | WO2007146676A2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016060107A (ja) * | 2014-09-18 | 2016-04-25 | セイコーエプソン株式会社 | 液体噴射ヘッドおよび液体噴射装置 |
WO2016159934A1 (en) | 2015-03-27 | 2016-10-06 | Hewlett-Packard Development Company, L.P. | Circuit package |
US9802405B2 (en) | 2015-12-23 | 2017-10-31 | Océ-Technologies B.V. | Inkjet printhead |
US10259223B2 (en) * | 2016-11-29 | 2019-04-16 | Océ Holding B.V. | Print head having a chip-carrying tile with stress relief plate |
US10286663B2 (en) * | 2016-11-29 | 2019-05-14 | Océ Holding B.V. | Ejection device with uniform ejection properties |
US11933600B2 (en) * | 2018-12-04 | 2024-03-19 | Ofs Fitel, Llc | High resolution distributed sensor utilizing offset core optical fiber |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000141683A (ja) * | 1998-11-12 | 2000-05-23 | Seiko Instruments Inc | ヘッドユニットの接続構造 |
JP2005014454A (ja) * | 2003-06-27 | 2005-01-20 | Sii Printek Inc | インクジェット記録ヘッドおよびインクジェット記録装置 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
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DE2517743C3 (de) * | 1975-04-22 | 1980-03-06 | Jenaer Glaswerk Schott & Gen., 6500 Mainz | Passivierender Schutzüberzug für Siliziumhalbleiterbauelemente |
US4295117A (en) * | 1980-09-11 | 1981-10-13 | General Motors Corporation | Pressure sensor assembly |
US4532530A (en) * | 1984-03-09 | 1985-07-30 | Xerox Corporation | Bubble jet printing device |
US4700273A (en) * | 1986-06-03 | 1987-10-13 | Kaufman Lance R | Circuit assembly with semiconductor expansion matched thermal path |
US4771639A (en) * | 1987-09-02 | 1988-09-20 | Yokogawa Electric Corporation | Semiconductor pressure sensor |
US5528272A (en) * | 1993-12-15 | 1996-06-18 | Xerox Corporation | Full width array read or write bars having low induced thermal stress |
JP2730481B2 (ja) | 1994-03-31 | 1998-03-25 | 日本電気株式会社 | インクジェット記録ヘッドの製造方法 |
JPH08240497A (ja) | 1995-03-03 | 1996-09-17 | Omron Corp | 半導体センサ |
CN1146953A (zh) * | 1995-04-24 | 1997-04-09 | 李韫言 | 单片集成的热汽喷墨打印头 |
US5774148A (en) * | 1995-10-19 | 1998-06-30 | Lexmark International, Inc. | Printhead with field oxide as thermal barrier in chip |
TW408351B (en) * | 1997-10-17 | 2000-10-11 | Semiconductor Energy Lab | Semiconductor device and method of manufacturing the same |
US6281572B1 (en) * | 1997-12-05 | 2001-08-28 | The Charles Stark Draper Laboratory, Inc. | Integrated circuit header assembly |
US6020646A (en) * | 1997-12-05 | 2000-02-01 | The Charles Stark Draper Laboratory, Inc. | Intergrated circuit die assembly |
US6186622B1 (en) * | 1999-05-26 | 2001-02-13 | Hewlett-Packard Company | Low expansion snout insert for inkjet print cartridge |
EP1065059B1 (en) | 1999-07-02 | 2007-01-31 | Canon Kabushiki Kaisha | Method for producing liquid discharge head, liquid discharge head, head cartridge, liquid discharging recording apparatus, method for producing silicon plate and silicon plate |
US6897123B2 (en) * | 2001-03-05 | 2005-05-24 | Agityne Corporation | Bonding of parts with dissimilar thermal expansion coefficients |
CN1206105C (zh) * | 2001-03-26 | 2005-06-15 | 研能科技股份有限公司 | 喷墨头芯片的制造方法 |
AUPR399501A0 (en) * | 2001-03-27 | 2001-04-26 | Silverbrook Research Pty. Ltd. | An apparatus and method(ART107) |
JP3761857B2 (ja) * | 2002-10-11 | 2006-03-29 | 三菱電機株式会社 | 半導体装置 |
JP2004279091A (ja) * | 2003-03-13 | 2004-10-07 | Denso Corp | 圧力センサ |
JP3760926B2 (ja) * | 2003-04-25 | 2006-03-29 | セイコーエプソン株式会社 | 液滴吐出装置、及び液滴吐出方法 |
US7055392B2 (en) * | 2003-07-04 | 2006-06-06 | Robert Bosch Gmbh | Micromechanical pressure sensor |
US7566122B2 (en) * | 2004-04-15 | 2009-07-28 | Hewlett-Packard Development Company, L.P. | Fluid ejection device utilizing a one-part epoxy adhesive |
US7222934B2 (en) * | 2004-11-22 | 2007-05-29 | Xerox Corporation | Method and apparatus for mounting an inkjet printhead |
JP5231719B2 (ja) * | 2006-03-30 | 2013-07-10 | 富士通株式会社 | 電界効果トランジスタの製造方法 |
-
2006
- 2006-06-06 US US11/447,333 patent/US7589420B2/en active Active
-
2007
- 2007-06-05 WO PCT/US2007/070423 patent/WO2007146676A2/en active Application Filing
- 2007-06-05 JP JP2009514498A patent/JP4806801B2/ja not_active Expired - Fee Related
- 2007-06-05 EP EP07812021A patent/EP2024184B1/en not_active Ceased
- 2007-06-05 CN CN200780021193.7A patent/CN101466547B/zh not_active Expired - Fee Related
-
2009
- 2009-08-10 US US12/538,655 patent/US8388778B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000141683A (ja) * | 1998-11-12 | 2000-05-23 | Seiko Instruments Inc | ヘッドユニットの接続構造 |
JP2005014454A (ja) * | 2003-06-27 | 2005-01-20 | Sii Printek Inc | インクジェット記録ヘッドおよびインクジェット記録装置 |
Also Published As
Publication number | Publication date |
---|---|
US20100032075A1 (en) | 2010-02-11 |
EP2024184A2 (en) | 2009-02-18 |
CN101466547A (zh) | 2009-06-24 |
US8388778B2 (en) | 2013-03-05 |
CN101466547B (zh) | 2011-03-23 |
EP2024184B1 (en) | 2011-08-17 |
JP2009539650A (ja) | 2009-11-19 |
US7589420B2 (en) | 2009-09-15 |
US20070279455A1 (en) | 2007-12-06 |
WO2007146676A3 (en) | 2008-02-14 |
WO2007146676A2 (en) | 2007-12-21 |
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