JP4804322B2 - Equipment for processing substrates and its base - Google Patents

Description

  The present invention relates to an apparatus, and more particularly to an exposure apparatus.

  FIG. 10 shows a conventional exposure apparatus 1 including a chamber 2, a base 6 and an X-ray generator 4. The base 6 and the X-ray generator 4 are installed in the chamber 2. The glass substrate 3 is disposed on the base 6. The X-ray generator 4 emits X-rays 5 toward the glass substrate 3 and removes static electricity therefrom. However, the X-ray 5 removes only static electricity from the upper surface of the glass substrate 3, and the static electricity remaining on the lower surface of the substrate 3 is attracted to the base 6 by electrostatic force. Thus, as shown in FIG. 11, when the support structure (support column) 7 of the base 6 raises and contacts the glass substrate, the electrostatic force between the glass substrate 3 and the base 6 causes the glass substrate 3 to bend. There is a possibility of damage.

  As such a countermeasure, Patent Document 1 (Japanese Patent Application Laid-Open No. 2003-258071) uses a flexible conductive member attached across a holding member and a pedestal member, and uses at least the conductivity of the holding member. There has been proposed a substrate holding device in which a portion to which a member is attached is polished. Patent Document 2 (Japanese Patent Laid-Open No. 2002-158277) discloses a substrate holder in which a plurality of static elimination needles are provided on a substrate holding portion or an antistatic agent is applied to the substrate holding portion.

JP 2003-258071 A JP 2002-158277 A

  However, even if such measures are adopted, static electricity from the substrate surface on the base is not sufficiently removed in the chamber of the exposure apparatus.

  Accordingly, it is an object of the present invention to effectively remove static electricity from the upper and lower surfaces of a substrate, reduce the electrostatic force between the glass substrate and the base, and process the substrate to prevent the substrate from bending and breaking. And providing its base.

  The present invention provides an apparatus for processing a substrate including a base, at least one support structure, at least one protruding column, and an ion gas generator. The support structure is installed and supported on the base. The protruding column is installed on the base. The ion gas generator creates ion gas and communicates with the support structure and the protruding column. The ion gas is selectively ejected from the support structure or the protruding column toward the substrate, or is simultaneously ejected from both the support structure and the protruding column toward the substrate to remove static electricity from the surface.

  According to the present invention, static electricity can be effectively removed from the upper and lower surfaces of the substrate, the electrostatic force between the glass substrate and the base can be reduced, and the substrate can be prevented from being bent and broken.

  In order that the objects, features, and advantages of the present invention will be more clearly understood, embodiments will be described below in detail with reference to the drawings.

  FIG. 1 shows a base 110 of an exposure apparatus according to the first embodiment of the present invention, and includes a plurality of support structures (support columns) 111 and a plurality of openings 112. The support structures 111 are arranged in a matrix and are movable between a first position (shown in FIG. 1) and a second position (shown in FIG. 2). As shown in FIG. 3, the substrate 3 is placed on the base 110 when the support structure 111 is in the second position. As shown in FIG. 4, after the substrate 3 is exposed, the support structure 111 moves to the first position and raises the substrate 3. FIG. 5 shows the exposure apparatus 100 of the present invention including a chamber 120, a base 110 and an ion gas generator 114. The base 110 is installed in the chamber 120. The ion gas generator 114 is installed in the base 110. The base 110 further includes a pipe 113 communicating with the opening 112 and the ion gas generator 114. In order to remove static electricity, the substrate 3 is placed on the base 110. The ion gas 115 is produced by the ion gas generator 114, passes through the pipe 113, contacts the lower surface of the substrate 3, and removes static electricity therefrom.

  Please refer to FIG. The exposure apparatus 100 further includes an X-ray generator 130 that is installed in the chamber 120 and generates X-rays 131. The ion gas 115 and the X-ray 131 remove static electricity from the upper surface and the lower surface of the substrate 3.

  The present invention effectively removes static electricity from the upper and lower surfaces of the substrate and reduces the electrostatic force between the glass substrate and the base to prevent the substrate from bending and breaking.

  FIG. 7 shows an exposure apparatus 100 ′ according to the second embodiment of the present invention, and further includes a plurality of protruding columns (nozzles) 116 installed on the upper surface of the base 110. The ion gas 115 is ejected from the protruding column 116 and comes into contact with the upper surface of the substrate 3 to remove static electricity therefrom. In the second embodiment, the X-rays are replaced by the protruding pillars 116 to remove static electricity from the upper surface of the substrate 3.

  Please refer to FIG. In the modification of the present embodiment, the protruding column 116 surrounds the substrate 3 and supplies the ion gas uniformly thereto. The base 110 is substantially rectangular and the protruding post 116 is installed at the corner.

  In the first and second embodiments, the aperture 112 can communicate with another vacuum pipe (not shown) to attract and stabilize the substrate 3 during the exposure process. Also, after the exposure process, the exposure equipment provides dry gas to the apertures 112 and breaks the vacuum seal. Next, ion gas is provided from the opening 112 to remove static electricity from the lower surface of the substrate 3.

  FIG. 9 shows an exposure apparatus 200 according to the third embodiment of the present invention, and a vent 117 is formed on a support structure 111 that communicates with a pipe 113. The ion gas 115 is created by the ion gas generator 114, passes through the pipe 113 and the vent 117, and comes into contact with the lower surface of the substrate 3.

  The exposure apparatus 200 of the third embodiment can increase the contact area between the ion gas and the lower surface of the substrate by using the aperture of the first embodiment, and more effectively remove static electricity therefrom. Can do. The exposure apparatus 200 can remove static electricity from the upper surface of the substrate using the X-ray generator of the first embodiment.

  The exposure apparatus 200 of the third embodiment can provide ion gas to the upper surface of the substrate using the protruding pillars of the second embodiment, and can remove static electricity therefrom.

  The vent 117 can further communicate with a vacuum pipe (not shown) to attract and stabilize the substrate 3 during the exposure process. Also, after the exposure process, the exposure equipment provides dry gas to the vent 117 and breaks the vacuum seal. Next, ion gas is provided from the vent 117 to remove static electricity from the lower surface of the substrate 3.

  The preferred embodiments of the present invention have been described above, but this does not limit the present invention, and a few changes and modifications that can be made by those skilled in the art without departing from the spirit and scope of the present invention. It is possible to add. Accordingly, the scope of the protection claimed by the present invention is based on the scope of the claims.

  According to the present invention, static electricity can be effectively removed from the upper and lower surfaces of the substrate, the electrostatic force between the glass substrate and the base can be reduced, and the substrate can be prevented from being bent and broken. Therefore, the present invention can be suitably used for a substrate exposure apparatus.

It is a perspective view showing the base of the exposure apparatus of 1st Embodiment of this invention. It is a perspective view showing the support structure of the 2nd position of 1st Embodiment. It is a perspective view showing the board | substrate located in the base of 1st Embodiment. It is a perspective view showing the support structure which has raised the board | substrate. It is a schematic sectional drawing showing the exposure apparatus of 1st Embodiment of this invention. It is a schematic sectional drawing showing the exposure apparatus of 1st Embodiment containing an X-ray generator. It is a schematic sectional drawing showing the exposure apparatus of 2nd Embodiment of this invention. It is a perspective view showing the protrusion pillar surrounding the board | substrate of 2nd Embodiment. It is a schematic sectional drawing showing the exposure apparatus of 3rd Embodiment of this invention. It is a schematic sectional drawing which shows the conventional exposure apparatus. It is a schematic sectional drawing showing the support structure which contacted the glass substrate of the conventional exposure apparatus.

Explanation of symbols

1, 100, 100 ′, 200 Exposure apparatus 2, 120 Chamber 3 Substrate 4, 130 X-ray generator 5, 131 X-ray 6, 110 Base 7, 111 Support structure
112 Opening 113 Pipe 114 Ion gas generator 115 Ion gas 116 Protruding column 117 Vent

Claims (9)

A device for processing a substrate,
A base having a pipe leading to the plurality of apertures and and the hole is placed inside installed on the front surface,
At least one protruding post installed on the base and having a vent leading to the pipe ;
An ion gas generator that generates ion gas through the pipe;
Including
The ion gas generated from the ion gas generator is ejected from the opening and the vent of the projecting column through the pipe toward the lower surface and the upper surface of the substrate, thereby removing static electricity from the substrate. Equipment characterized by that . The apparatus of claim 1, further comprising a support structure for supporting the substrate . 3. The apparatus of claim 2, wherein the support structure further includes a vent leading to the pipe, and the ion gas is jetted to a lower surface of the substrate through the vent of the support structure . A device for processing a substrate,
Base and
Placed on the base, at least one support structure for supporting and lifting the substrate,
At least one protruding column installed on the base,
An ion gas generator for generating ion gas;
Including
The ion gas generator leads to the projecting columns and the support structure, the ion gas generated from the ion gas generator, toward the bottom surface or top surface of the selectively the substrate and the support structure from the projecting columns is ejected, or the support structure and the projecting columns both are ejected simultaneously towards the bottom surface and the upper surface of the substrate from the, apparatus characterized that you remove static electricity from the surface of the substrate. The support structure, apparatus according to claim 4, further comprising a vent passing through the drying gas. The apparatus according to claim 4, wherein the support structure is in contact with the substrate, and the protruding column is separated from the substrate. The projecting columns are a plurality, apparatus according to any of claims 1 to 6, wherein the plurality of projecting columns are installed on the edge portion of the substrate. The support structure according to any one of claims 2 to 6 , wherein a plurality of the support structures are arranged in a matrix on the base , and the protruding pillars protrude to an edge portion of the base. machine. The device according to any one of claims 1 to 6, wherein the protruding column is a nozzle.

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