JP3133847U - Ultrasonic cleaning equipment - Google Patents

Ultrasonic cleaning equipment Download PDF

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JP3133847U
JP3133847U JP2007003432U JP2007003432U JP3133847U JP 3133847 U JP3133847 U JP 3133847U JP 2007003432 U JP2007003432 U JP 2007003432U JP 2007003432 U JP2007003432 U JP 2007003432U JP 3133847 U JP3133847 U JP 3133847U
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substrate
ultrasonic
container
lower side
dust
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勝 大澤
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Ulvac Coating Corp
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Ulvac Coating Corp
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Abstract

【課題】基板の側面からの発塵がない超音波洗浄装置を提供する。
【解決手段】本考案の超音波洗浄装置１は、容器２と、超音波発生装置３と、保持装置４とを有し、基板１０を保持装置４に保持させ、容器１０に予め配置された洗浄液６に鉛直姿勢で基板１０全体を浸漬させる。基板１０の下側側面５ａ、５ｂと、容器２の底面の間には第一、第二の遮蔽板１５ａ、１５ｂが配置されており、容器２の底面に配置された超音波発生装置３によって、洗浄液６中に容器２の底面から洗浄液６の表面に向けて超音波が放出され、超音波の一部は基板１０の表面のダストに当たり、ダストを剥離させる。超音波の他の一部は、第一、第二の遮蔽板１５ａ、１５ｂに当たり、基板１０の下側側面５ａ、５ｂには直接照射されず、基板１０の下側側面５ａ、５ｂからダストは発生しない。
【選択図】図１
An ultrasonic cleaning apparatus that does not generate dust from the side surface of a substrate is provided.
An ultrasonic cleaning apparatus according to the present invention includes a container, an ultrasonic generator, and a holding device. The substrate is held by the holding device and is disposed in advance in the container. The entire substrate 10 is immersed in the cleaning liquid 6 in a vertical posture. First and second shielding plates 15 a and 15 b are disposed between the lower side surfaces 5 a and 5 b of the substrate 10 and the bottom surface of the container 2, and the ultrasonic generator 3 disposed on the bottom surface of the container 2 is used. Then, ultrasonic waves are emitted into the cleaning liquid 6 from the bottom surface of the container 2 toward the surface of the cleaning liquid 6, and a part of the ultrasonic waves hits dust on the surface of the substrate 10 to peel off the dust. The other part of the ultrasonic waves hits the first and second shielding plates 15a and 15b, and is not directly applied to the lower side surfaces 5a and 5b of the substrate 10. Dust is not emitted from the lower side surfaces 5a and 5b of the substrate 10. Does not occur.
[Selection] Figure 1

Description

本考案は、マスク、マスクブランクス、レティクル等を洗浄する超音波洗浄装置の技術に関する。   The present invention relates to a technique of an ultrasonic cleaning apparatus for cleaning a mask, a mask blank, a reticle and the like.

従来より、マスク、マスクブランクス、レティクル等を洗浄する方法には、超音波洗浄法が用いられており、例えば図３に示すような超音波洗浄装置１００が用いられている。
この超音波洗浄装置１００は、スタンド１０２に保持具１０８が吊り下げられており、保持具１０８下端に、基板１１０が鉛直に保持された状態で、水槽１０１内の洗浄液１１１に浸漬されている。 Conventionally, an ultrasonic cleaning method has been used as a method for cleaning a mask, mask blanks, reticles, etc., for example, an ultrasonic cleaning apparatus 100 as shown in FIG.
In this ultrasonic cleaning apparatus 100, a holder 108 is suspended from a stand 102, and is immersed in a cleaning liquid 111 in a water tank 101 with a substrate 110 held vertically at a lower end of the holder 108.

基板１１０は矩形であり、保持具１０８との接触面積が小さくなるように、基板１１０の四頂点のうちの二頂点が位置する付近が保持され、他の二頂点のうちの一方が鉛直上方、他方が鉛直下方を向くように、基板１１０は斜めに保持されており、容器１０１底面に配置された超音波発生装置１１２を動作させて超音波を放出すると、超音波は水槽１０２の底面側から洗浄液１１１の表面に向かって進行する。   The substrate 110 is rectangular, and the vicinity of two vertices of the four vertices of the substrate 110 is held so that the contact area with the holder 108 is small, and one of the other two vertices is vertically upward, The substrate 110 is held obliquely so that the other is directed vertically downward. When the ultrasonic generator 112 disposed on the bottom surface of the container 101 is operated to emit ultrasonic waves, the ultrasonic waves are generated from the bottom surface side of the water tank 102. Progress toward the surface of the cleaning liquid 111.

超音波洗浄装置１００に用いられる超音波の周波数には、２８ｋＨｚ〜４８ｋＨｚのｋＨｚ帯と、８００ｋＨｚ以上のＭＨｚ帯の二種類がある。
洗浄液１１１中にｋＨｚ帯の超音波が放出された場合は、基板１１０からの反射波との干渉によって泡が発生し、発生した泡が破裂する時に生じるエネルギーによって、基板１１０の表面に付着している微粒子や異物等のダストを剥離させることができる。 There are two types of ultrasonic frequencies used in the ultrasonic cleaning apparatus 100: a 28 kHz to 48 kHz kHz band and an 800 kHz or higher MHz band.
When ultrasonic waves in the kHz band are emitted into the cleaning liquid 111, bubbles are generated due to interference with the reflected wave from the substrate 110, and are attached to the surface of the substrate 110 by the energy generated when the generated bubbles burst. Dust such as fine particles and foreign matters can be peeled off.

ＭＨｚ帯の超音波が放出された場合は、超音波の振動周波数が高いため、放出された超音波は洗浄液１１１の内部を直進し、基板１１０に付着しているダストに衝突すると、ダストに大きなエネルギーが与えられ、ダストは基板１１０の表面から剥離する。
しかし、基板１１０の側面１０５が超音波発生装置１１２に向けられているため、いずれの周波数帯の超音波でも、基板１１０の表面だけではなく、基板１１０の側面１０５にも当たってしまう。 When ultrasonic waves in the MHz band are emitted, since the vibration frequency of the ultrasonic waves is high, the emitted ultrasonic waves travel straight through the cleaning liquid 111 and collide with dust adhering to the substrate 110. The energy is applied and the dust is separated from the surface of the substrate 110.
However, since the side surface 105 of the substrate 110 is directed to the ultrasonic generator 112, an ultrasonic wave in any frequency band hits not only the surface of the substrate 110 but also the side surface 105 of the substrate 110.

図４の符号１１３ａ、１１３ｂはｋＨｚ帯の超音波を示しており、図５の符号１１４ａ、１１４ｂはＭＨｚ帯の超音波を示しており、それらの一部の超音波１１３ｂ、１１４ｂが基板１１０の側面１０５に衝突し、他の大部分の超音波１１３ａ、１１４ａが、基板１１０とは衝突しないで通過している。   Reference numerals 113a and 113b in FIG. 4 indicate ultrasonic waves in the kHz band, reference numerals 114a and 114b in FIG. 5 indicate ultrasonic waves in the MHz band, and some of the ultrasonic waves 113b and 114b are formed on the substrate 110. Colliding with the side surface 105, most of the other ultrasonic waves 113a and 114a pass without colliding with the substrate 110.

いずれの場合も基板１１０表面からダストを除去することができるが、基板１１０の側面１０５は表面よりも加工が粗く、側面１０５に超音波が当たると、その一部が剥離され、大量のダストが発生する。発生したダストは洗浄液１１１中で拡散するため、一旦洗浄された基板１１０の表面に再付着し、基板１１０を汚染する等の問題がある。
従来技術の超音波洗浄装置は、例えば下記文献に記載されている。
特開２００２−２２２７８７号公報 In any case, dust can be removed from the surface of the substrate 110, but the side surface 105 of the substrate 110 is rougher than the surface, and when the ultrasonic wave hits the side surface 105, a part thereof is peeled off, and a large amount of dust is generated. appear. Since the generated dust diffuses in the cleaning liquid 111, there is a problem that the dust adheres again to the surface of the substrate 110 that has been cleaned once and contaminates the substrate 110.
Conventional ultrasonic cleaning apparatuses are described in, for example, the following documents.
JP 2002-222787 A

基板の側面からの発塵がない超音波洗浄装置を提供する。   An ultrasonic cleaning apparatus that does not generate dust from the side surface of a substrate is provided.

上記課題を解決するために、本考案は、容器と、超音波発生装置と、保持装置とを有し、基板を前記保持装置に保持させ、前記容器に配置された液体に浸漬し、前記超音波発生装置によって、前記容器底面から前記液体の表面に向けて進行する超音波を発生させ、前記基板の洗浄を行なう超音波洗浄装置であって、前記保持装置が前記基板を前記液体内で鉛直に保持した状態では、前記基板の下方を向く下側側面と前記容器の底面との間の位置に、前記下側側面に面する遮蔽板が設けられた超音波洗浄装置である。
また、本考案は、前記遮蔽板は前記下側側面と平行に面するように配置された超音波洗浄装置である。
また、本考案は、前記基板は矩形であり、頂点が最下端に位置するように斜めに配置され、前記下側側面は、前記基板の下方を向く二側面で構成され、前記遮蔽板は、前記二側面とそれぞれ平行に面するように配置された超音波洗浄装置である。
また、本考案は、前記超音波発生装置は、周波数８００ｋＨｚ以上の超音波を発生するように構成された超音波洗浄装置である。 In order to solve the above problems, the present invention has a container, an ultrasonic generator, and a holding device, holds the substrate in the holding device, immerses in a liquid disposed in the container, and An ultrasonic cleaning device that cleans the substrate by generating an ultrasonic wave traveling from the bottom surface of the container toward the surface of the liquid by a sound wave generator, wherein the holding device holds the substrate vertically in the liquid In an ultrasonic cleaning apparatus, a shielding plate facing the lower side surface is provided at a position between the lower side surface facing the lower side of the substrate and the bottom surface of the container.
Moreover, this invention is an ultrasonic cleaning apparatus arrange | positioned so that the said shielding board may face in parallel with the said lower side surface.
Further, in the present invention, the substrate is rectangular, and is arranged obliquely so that the apex is located at the lowermost end, the lower side surface is constituted by two side surfaces facing the lower side of the substrate, and the shielding plate is It is an ultrasonic cleaning apparatus arrange | positioned so that it may each face in parallel with the said 2 side.
Further, the present invention is an ultrasonic cleaning apparatus configured such that the ultrasonic generator generates ultrasonic waves having a frequency of 800 kHz or more.

本考案によれば、基板の側面からの発塵が起こらない。   According to the present invention, dust generation from the side surface of the substrate does not occur.

本考案の超音波洗浄装置１は、図１に示すように、容器２と、超音波発生装置３と、保持装置４を有している。
容器２の外部には、スタンド５が立てられており、スタンド５からは、腕部２０が水平に伸ばされている。
保持装置４は、第一、第二のロッド１９ａ、１９ｂと、第一、第二の支持部材１１ａ、１１ｂと、第一、第二の押さえ部材１２ａ、１２ｂを有している。 As shown in FIG. 1, the ultrasonic cleaning device 1 of the present invention has a container 2, an ultrasonic generator 3, and a holding device 4.
A stand 5 is erected outside the container 2, and an arm portion 20 is extended horizontally from the stand 5.
The holding device 4 includes first and second rods 19a and 19b, first and second support members 11a and 11b, and first and second pressing members 12a and 12b.

第一の支持部材１１ａと第一の押さえ部材１２ａは、第一のロッド１９ａに固定されており、第二の支持部材１１ｂと第二の押さえ部材１２ｂは、第二のロッド１９ｂに固定されている。
第一、第二の支持部材１１ａ、１１ｂの固定された位置は、第一、第二のロッド１９ａ、１９ｂの端部であり、第一、第二の押さえ部材１２ａ、１２ｂの固定された位置は、第一、第二の支持部材１１ａ、１１ｂよりも、第一、第二のロッド１９ａ、１９ｂの中央に近い位置である。
第一、第二のロッド１９ａ、１９ｂの反対側の端部は、腕部２０に対して着脱可能に構成されている。 The first support member 11a and the first pressing member 12a are fixed to the first rod 19a, and the second support member 11b and the second pressing member 12b are fixed to the second rod 19b. Yes.
The fixed positions of the first and second support members 11a and 11b are the ends of the first and second rods 19a and 19b, and the fixed positions of the first and second pressing members 12a and 12b. Is a position closer to the center of the first and second rods 19a and 19b than the first and second support members 11a and 11b.
The opposite ends of the first and second rods 19 a and 19 b are configured to be detachable from the arm portion 20.

図１は、第一、第二のロッド１９ａ、１９ｂが腕部２０に鉛直に取り付けられた状態を示している。
同図符号１０は、洗浄対象の四角形の基板である。 FIG. 1 shows a state in which the first and second rods 19 a and 19 b are vertically attached to the arm portion 20.
Reference numeral 10 in the figure is a rectangular substrate to be cleaned.

第一の支持部材１１ａと第二の支持部材１１ｂ、及び、第一の押さえ部材１２ａと第二の押さえ部材１２ｂは、互いに向き合う位置に配置されており、基板１０の四頂点のうち、互いに反対側に位置する二頂点の一方が第一の支持部材１１ａと第一の押さえ部材１２ａの間に挿入され、他方が第二の支持部材１１ｂと第二の押さえ部材１２ｂの間に挿入されており、第一、第二のロッド１９ａ、１９ｂが腕部２０から鉛直に吊り下げられた状態では、第一、第二の支持部材１１ａ、１１ｂは第一、第二のロッド１９ａ、１９ｂの下端に位置し、第一、第二の押さえ部材１２ａ、１２ｂは、第一、第二の支持部材１１ａ、１１ｂよりも上方に位置するから、基板１０は第一、第二の支持部材１１ａ、１１ｂの上に乗っており、第一、第二の支持部材１１ａ、１１ｂよりも上方の位置では、基板１０の表面は第一、第二の押さえ部材１２ａ、１２ｂに接触し、鉛直姿勢から倒れないように、第一、第二の押さえ部材１２ａ、１２ｂによって、押さえられている。   The first supporting member 11a and the second supporting member 11b, and the first pressing member 12a and the second pressing member 12b are arranged at positions facing each other, and are opposite to each other among the four vertices of the substrate 10. One of the two apexes located on the side is inserted between the first support member 11a and the first pressing member 12a, and the other is inserted between the second support member 11b and the second pressing member 12b. In the state where the first and second rods 19a and 19b are suspended vertically from the arm portion 20, the first and second support members 11a and 11b are at the lower ends of the first and second rods 19a and 19b. Since the first and second pressing members 12a and 12b are positioned above the first and second support members 11a and 11b, the substrate 10 is positioned on the first and second support members 11a and 11b. Riding on, first and second support At a position above the materials 11a and 11b, the surface of the substrate 10 is in contact with the first and second pressing members 12a and 12b, so that the first and second pressing members 12a and 12b do not fall from the vertical posture. It is pressed by.

ここでは、第一、第二の支持部材１１ａ、１１ｂと、第一、第二の押さえ部材１２ａ、１２ｂのうち、基板１０と接触する部分には、基板１０の厚みよりも幅広の溝が形成されており、基板１０のうち、第一、第二の押さえ部材１２ａ、１２ｂの間に挿入された部分は、それらの溝に嵌め込まれ、鉛直姿勢が維持されている。
容器２には、予め洗浄液６が配置されており、鉛直姿勢で全体が洗浄液６に浸漬されている。 Here, a groove wider than the thickness of the substrate 10 is formed in a portion of the first and second support members 11 a and 11 b and the first and second pressing members 12 a and 12 b that are in contact with the substrate 10. The portion of the substrate 10 inserted between the first and second pressing members 12a and 12b is fitted into the grooves, and the vertical posture is maintained.
A cleaning liquid 6 is disposed in the container 2 in advance, and the whole is immersed in the cleaning liquid 6 in a vertical posture.

この状態では、基板１０のうち、第一、第二の支持部材１１ａ、１１ｂと、第一、第二の押さえ部材１２ａ、１２ｂに挿入された二頂点は横方向を向けられており、他の二頂点のうち、一頂点が下方を向き、それと反対側に位置する一頂点が上方を向いており、従って、基板１０の四側面のうち、二側面が上側を向き、他の二側面が下方を向く下側側面５ａ、５ｂとなっている。   In this state, the two vertices inserted into the first and second support members 11a and 11b and the first and second pressing members 12a and 12b of the substrate 10 are oriented in the lateral direction, Of the two vertices, one vertex faces downward, and one vertex located on the opposite side faces upward. Therefore, of the four side surfaces of the substrate 10, two side surfaces face upward and the other two side surfaces are downward. Are the lower side surfaces 5a and 5b.

第一、第二のロッド１９ａ、１９ｂの下端には、取付棒によって、第一、第二の遮蔽板１５ａ、１５ｂが取り付けられている。
第一、第二の遮蔽板１５ａ、１５ｂは細長の板であり、基板１０の下側側面５ａ、５ｂと容器２の底面の間に配置されており、それぞれ下側側面５ａ、５ｂと面するように、下側側面５ａ、５ｂとそれぞれ平行にされている。 First and second shielding plates 15a and 15b are attached to lower ends of the first and second rods 19a and 19b by means of attachment rods.
The first and second shielding plates 15a and 15b are elongated plates and are disposed between the lower side surfaces 5a and 5b of the substrate 10 and the bottom surface of the container 2, and face the lower side surfaces 5a and 5b, respectively. Thus, the lower side surfaces 5a and 5b are parallel to each other.

容器２の底面下には超音波発生装置３が配置されており、超音波発生装置３を動作させると、容器２の底面から洗浄液６内部に超音波が放出され、超音波が洗浄液６内部を洗浄液６の液面方向に向けて進行すると、超音波の一部は基板１０の表面のダストに当たり、ダストを剥離させる。
超音波の他の一部は、第一、第二の遮蔽板１５ａ、１５ｂに当たる。 An ultrasonic generator 3 is disposed below the bottom surface of the container 2. When the ultrasonic generator 3 is operated, ultrasonic waves are emitted from the bottom surface of the container 2 into the cleaning liquid 6, and the ultrasonic waves pass through the cleaning liquid 6. When the cleaning liquid 6 proceeds toward the liquid level, a part of the ultrasonic waves hits the dust on the surface of the substrate 10 and peels off the dust.
The other part of the ultrasonic waves hits the first and second shielding plates 15a and 15b.

この超音波発生装置３は、周波数８００ｋＨｚ以上、１ＭＨｚ以下のＭＨｚ帯の周波数の超音波を放出しており、ＭＨｚ帯なので放出された超音波は直進し、第一、第二の遮蔽板１５ａ、１５ｂの影の部分になる、基板１０の下側側面５ａ、５ｂには、超音波は直接照射されない。   The ultrasonic generator 3 emits ultrasonic waves having a frequency in the MHz band of 800 kHz or more and 1 MHz or less, and the emitted ultrasonic waves go straight because of the MHz band, and the first and second shielding plates 15a, The ultrasonic waves are not directly applied to the lower side surfaces 5a and 5b of the substrate 10 which are shaded portions 15b.

図２は、基板１０と超音波６０の進行方向の関係を説明するための図面であり、第一、第二の遮蔽板１５ａ、１５ｂに当たった超音波６０が跳ね返される。
第一、第二の遮蔽板１５ａ、１５ｂは、基板１０の幅と同じか、それよりも僅かに幅広に形成されている。また、第一、第二の遮蔽板１５ａ、１５ｂの下端は互いに接触されており、基板１０の二個の下側側面５ａ、５ｂは、第一、第二の遮蔽板１５ａ、１５ｂの影になり、超音波６０は直接照射されないようになっている。従って、基板１０の下側側面５ａ、５ｂからダストは発生しない。 FIG. 2 is a diagram for explaining the relationship between the traveling direction of the substrate 10 and the ultrasonic wave 60, and the ultrasonic wave 60 that hits the first and second shielding plates 15a and 15b is rebounded.
The first and second shielding plates 15 a and 15 b are formed to have the same width as the substrate 10 or slightly wider than that. The lower ends of the first and second shielding plates 15a and 15b are in contact with each other, and the two lower side surfaces 5a and 5b of the substrate 10 are shaded by the first and second shielding plates 15a and 15b. Thus, the ultrasonic wave 60 is not directly irradiated. Accordingly, no dust is generated from the lower side surfaces 5a and 5b of the substrate 10.

第一、第二の遮蔽板１５ａ、１５ｂの材料には、樹脂（例えばテフロン等）、金属（例えばＳＵＳ等）などが用いられており、超音波６０に対して耐久性を有し、超音波６０が照射されても第一、第二の遮蔽板１５ａ、１５ｂからもダストが発生することはない。   Resin (for example, Teflon or the like), metal (for example, SUS or the like), or the like is used as the material for the first and second shielding plates 15a and 15b. Even when 60 is irradiated, dust is not generated from the first and second shielding plates 15a and 15b.

なお、第一、第二の遮蔽板１５ａ、１５ｂの材料は、テフロンや金属に限定されるものではなく、超音波６０に対して耐性を有し、超音波６０が直接当たった時に発塵しない材料であれば用いることができる。   The material of the first and second shielding plates 15a and 15b is not limited to Teflon or metal, and is resistant to the ultrasonic wave 60 and does not generate dust when the ultrasonic wave 60 directly hits it. Any material can be used.

第一、第二の遮蔽板１５ａ、１５ｂは分離可能に構成されており、第一、第二の遮蔽板１５ａ、１５ｂの先端同士を密着させて、基板１０の二側面上に超音波６０の影の部分が配置されるようにしたが、一枚の遮蔽板を折り曲げて基板の下方を向く二側面と平行にしても良い。   The first and second shielding plates 15 a and 15 b are configured to be separable. The tips of the first and second shielding plates 15 a and 15 b are brought into close contact with each other, and the ultrasonic wave 60 is applied to the two side surfaces of the substrate 10. Although the shadow portion is arranged, one shielding plate may be bent so as to be parallel to the two side surfaces facing the lower side of the substrate.

なお、上記実施例では、洗浄後に基板１０を容器２から取り出した際に水切れを良くするために、基板１０の一頂点を下方に向け、反対側の頂点を上方に向けたが、基板１０を鉛直にする際に、基板１０の四側面を水平又は鉛直のいずれかにし、一側面を下方に向けて洗浄液６に浸漬し、容器２の底面から放射される超音波によって超音波洗浄をしてもよい。   In the above embodiment, in order to improve drainage when the substrate 10 is taken out from the container 2 after cleaning, one vertex of the substrate 10 is directed downward and the other vertex is directed upward. When making the substrate vertical, the four side surfaces of the substrate 10 are either horizontal or vertical, immersed in the cleaning liquid 6 with one side surface facing downward, and subjected to ultrasonic cleaning with ultrasonic waves emitted from the bottom surface of the container 2. Also good.

この場合、下方を向いた一側面と平行に遮蔽板を配置すればいよい。
また、円形の基板を鉛直にして洗浄液６に浸漬し、容器２の底面から放射される超音波６０によって超音波洗浄をする場合、基板の側面のうち、少なくとも下側半分の部分を覆うような基板と同心の半円状の遮蔽板を設けてもよい。 In this case, the shielding plate may be arranged in parallel with the one side surface facing downward.
Further, when the circular substrate is vertically immersed in the cleaning liquid 6 and ultrasonic cleaning is performed by the ultrasonic wave 60 radiated from the bottom surface of the container 2, at least the lower half of the side surface of the substrate is covered. A semicircular shielding plate concentric with the substrate may be provided.

なお、本考案では、第一、第二の遮蔽板１５ａ、１５ｂの幅は基板１０の厚さと同程度にしたが、基板１０の厚さよりも狭い場合は、超音波の遮蔽効果を低下させるが、逆に、基板１０の厚さよりも広い場合、基板１０の表面への超音波の照射量が減少し、洗浄効果が低下するので、基板１０の厚さと同程度であることが望ましい。
上記実施例では、容器２内に洗浄液６を配置したが、この洗浄液６は、純水、薬品が溶解された水、有機溶剤等の液体を用いることができる。 In the present invention, the widths of the first and second shielding plates 15a and 15b are set to be approximately the same as the thickness of the substrate 10. However, if the width is smaller than the thickness of the substrate 10, the ultrasonic shielding effect is reduced. On the contrary, when the thickness is larger than the thickness of the substrate 10, the amount of ultrasonic irradiation on the surface of the substrate 10 is reduced and the cleaning effect is lowered.
In the above embodiment, the cleaning liquid 6 is disposed in the container 2, but the cleaning liquid 6 may be liquid such as pure water, water in which a chemical is dissolved, or an organic solvent.

本考案の超音波洗浄装置を説明するための容器内部の側面図The side view inside a container for explaining the ultrasonic cleaning device of the present invention 基板と超音波の進行方向の関係を説明するための容器内部の側面図Side view of the inside of the container for explaining the relationship between the substrate and the traveling direction of ultrasonic waves 従来の超音波洗浄装置を説明するための容器内部の側面図Side view of the inside of a container for explaining a conventional ultrasonic cleaning apparatus 基板とｋＨｚ帯の超音波の進行方向の関係を説明するための容器内部の側面図Side view of the inside of the container for explaining the relationship between the substrate and the traveling direction of ultrasonic waves in the kHz band 基板とＭＨｚ帯の超音波の進行方向の関係を説明するための容器内部の側面図Side view of the inside of the container for explaining the relationship between the substrate and the traveling direction of ultrasonic waves in the MHz band

符号の説明Explanation of symbols

１…超音波洗浄装置 ２…容器 ３…超音波発生装置 ４…保持装置 ５ａ、５ｂ…下側側面 ６…洗浄液 １０…基板 １５ａ、１５ｂ…第一、第二の遮蔽板 ６０…超音波   DESCRIPTION OF SYMBOLS 1 ... Ultrasonic cleaning apparatus 2 ... Container 3 ... Ultrasonic generator 4 ... Holding | maintenance apparatus 5a, 5b ... Lower side surface 6 ... Cleaning liquid 10 ... Substrate 15a, 15b ... 1st, 2nd shielding board 60 ... Ultrasonic

Claims (4)

容器と、超音波発生装置と、保持装置とを有し、
基板を前記保持装置に保持させ、前記容器に配置された液体に浸漬し、
前記超音波発生装置によって、前記容器底面から前記液体の表面に向けて進行する超音波を発生させ、前記基板の洗浄を行なう超音波洗浄装置であって、
前記保持装置が前記基板を前記液体内で鉛直に保持した状態では、前記基板の下方を向く下側側面と前記容器の底面との間の位置に、前記下側側面に面する遮蔽板が設けられた超音波洗浄装置。 A container, an ultrasonic generator, and a holding device;
Holding the substrate in the holding device, immersing in a liquid placed in the container;
The ultrasonic generator generates ultrasonic waves that travel from the bottom surface of the container toward the surface of the liquid to clean the substrate,
When the holding device holds the substrate vertically in the liquid, a shielding plate facing the lower side surface is provided at a position between the lower side surface facing the lower side of the substrate and the bottom surface of the container. Ultrasonic cleaning equipment. 前記遮蔽板は前記下側側面と平行に面するように配置された請求項１記載の超音波洗浄装置。   The ultrasonic cleaning apparatus according to claim 1, wherein the shielding plate is disposed so as to face the lower side surface. 前記基板は矩形であり、頂点が最下端に位置するように斜めに配置され、
前記下側側面は、前記基板の下方を向く二側面で構成され、前記遮蔽板は、前記二側面とそれぞれ平行に面するように配置された請求項１記載の超音波洗浄装置。 The substrate is rectangular and is arranged obliquely so that the apex is located at the lowest end,
The ultrasonic cleaning apparatus according to claim 1, wherein the lower side surface includes two side surfaces facing the lower side of the substrate, and the shielding plate is arranged to face each of the two side surfaces in parallel. 前記超音波発生装置は、周波数８００ｋＨｚ以上の超音波を発生するように構成された請求項１乃至請求項３のいずれか１項記載の超音波洗浄装置。   The ultrasonic cleaning apparatus according to claim 1, wherein the ultrasonic generator is configured to generate an ultrasonic wave having a frequency of 800 kHz or more.
JP2007003432U 2007-05-14 2007-05-14 Ultrasonic cleaning equipment Expired - Lifetime JP3133847U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107023390A (en) * 2015-12-15 2017-08-08 通用电气公司 Equip cleaning systems and method
CN108262304A (en) * 2016-12-30 2018-07-10 中核建中核燃料元件有限公司 One kind feeds intake container ultrasonic cleaning basket

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107023390A (en) * 2015-12-15 2017-08-08 通用电气公司 Equip cleaning systems and method
US20200009620A1 (en) * 2015-12-15 2020-01-09 General Electric Company Equipment Cleaning System And Method
CN107023390B (en) * 2015-12-15 2021-01-12 通用电气公司 Equipment cleaning system and method
CN108262304A (en) * 2016-12-30 2018-07-10 中核建中核燃料元件有限公司 One kind feeds intake container ultrasonic cleaning basket
CN108262304B (en) * 2016-12-30 2024-02-02 中核建中核燃料元件有限公司 Throw material container ultrasonic cleaning basket

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