JP4803551B2 - Beam processing apparatus and beam observation apparatus - Google Patents

Description

  The present invention relates to a beam processing apparatus that processes a processing object using a beam, and a beam observation apparatus that observes an observation object using a beam.

  Conventionally, a focused ion beam processing apparatus that processes a workpiece with a focused ion beam is known as a processing apparatus that processes a workpiece (workpiece) (for example, see Patent Document 1). An electron beam processing apparatus that processes a workpiece with an electron beam is also known as a processing apparatus that performs processing on the workpiece (see, for example, Patent Document 2).

  In the focused ion beam processing apparatus described in Patent Document 1, a focused ion beam is irradiated onto a workpiece set on a stage disposed in a vacuum chamber in order to prevent the focused ion beam from being scattered. Processing is performed. Similarly, in the electron beam processing apparatus described in Patent Document 2, in order to prevent scattering of the electron beam, the workpiece set on the stage disposed in the vacuum chamber is irradiated with the electron beam, Is processed.

  A focused ion beam observation apparatus that observes an observation object using a focused ion beam is also known (see, for example, Patent Document 3). In general, an electron beam observation apparatus for observing an observation object using an electron beam is also known. Even in such focused ion beam observation apparatus and electron beam observation apparatus, the observation target object is observed by irradiating the observation target object set on the stage disposed in the vacuum chamber with the focused ion beam or electron beam. Is called.

JP 2006-32154 A JP 2004-167536 A Japanese Patent Laid-Open No. 10-162766

  However, in the focused ion beam processing apparatus described in Patent Document 1 and the electron beam processing apparatus described in Patent Document 2, since the stage on which the work is set is disposed in the vacuum chamber, the work movement range by the stage is within the range. There are limits. That is, with the focused ion beam processing apparatus described in Patent Document 1 and the electron beam processing apparatus described in Patent Document 2, it is difficult to process a large workpiece over a wide range.

  Here, even the focused ion beam processing apparatus described in Patent Document 1 and the electron beam processing apparatus described in Patent Document 2 can process a large workpiece in a wide range by increasing the vacuum chamber. However, when the vacuum chamber is enlarged, the processing apparatus becomes larger and the manufacturing cost and running cost of the processing apparatus increase. Similar problems also occur in conventional focused ion beam observation apparatuses and electron beam observation apparatuses.

  Therefore, an object of the present invention is to provide a beam processing apparatus capable of processing a processing object in a wide range with a simple configuration. Another object of the present invention is to provide a beam observation apparatus capable of observing an observation object in a wide range with a simple configuration.

In order to solve the above-described problems, a beam processing apparatus according to the present invention includes a beam emission source that emits an ion beam for processing a workpiece, and a first beam through which the beam emitted from the beam emission source passes. To emit a beam toward a vacuum chamber having a path to which the beam emission source is attached, a second path that communicates with the first path, passes through the first path, and the workpiece. In a beam processing apparatus having a local vacuum chamber having a plurality of exit holes, a detection means having an irradiated member disposed in the exit direction of the beam in the exit hole, in order to detect the irradiation position of the beam, comprising an image generating device for imaging the detected current value obtained by detecting the current flowing through the irradiated member when irradiated with beam member, a vacuum chamber and topical vacuum Chang The workpiece to be at least partially arranged in the atmospheric pressure outside is moved by moving means that can move in each direction of XYZ, and a part of the workpiece is in a vacuum state below the local vacuum chamber. It arrange | positions so that it may face local space which becomes and processes the processing target object using the said beam, It is characterized by the above-mentioned.

In order to solve the above problems, a beam observation apparatus according to the present invention includes a beam emission source that emits an ion beam for observing an observation target, and a first beam through which the beam emitted from the beam emission source passes. A vacuum chamber having a path to which a beam emitting source is attached; a second path communicating with the first path; a second path through which the beam that has passed through the first path passes; and an exit hole for emitting the beam toward the observation object In a beam observation apparatus having a local vacuum chamber, in order to detect the irradiation position of the beam, a detection means having an irradiated member arranged in the beam emitting direction in the emission hole, and irradiating the irradiated member with the beam the detected current value obtained by detecting the current flowing through the irradiated member when that includes an image generating apparatus for imaging, in the external atmospheric pressure of the vacuum chamber and local vacuum chamber At least a part of the observation object to be arranged is moved by moving means that can move in each direction of XYZ so that a part of the observation object faces a local space in a vacuum state below the local vacuum chamber. The observation object is observed using a beam.

  Here, in this specification, the “local vacuum chamber” refers to a vacuum chamber for making only a part of the object to be processed or the object to be observed a vacuum state.

In the beam processing apparatus of the present invention, the processing object at least a part of which is arranged in the atmospheric pressure outside the vacuum chamber and the local vacuum chamber is moved by moving means that can move in each direction of XYZ, A part is arranged so as to face a local space in a vacuum state below the local vacuum chamber, and the object to be processed is processed using a beam. Therefore, it is possible to process the processing object in a wide range with a simple configuration in which the processing object is moved using a predetermined moving means arranged in the atmospheric pressure outside the vacuum chamber and the local vacuum chamber. In the beam observation apparatus of the present invention, an observation object at least a part of which is arranged in the atmospheric pressure outside the vacuum chamber and the local vacuum chamber is moved by a moving means that can move in each direction of XYZ, and the observation object A part of the object is placed so as to face a local space in a vacuum state below the local vacuum chamber, and the object to be observed is observed using a beam. Therefore, in the atmospheric pressure outside the vacuum chamber and the local vacuum chamber It is possible to observe the observation object in a wide range with a simple configuration in which the observation object is moved using a predetermined moving means arranged in the area.

Moreover, the beam processing apparatus and the beam observation apparatus of the present invention include an image generation apparatus that images a detected current value detected by a processing object or an observation object as an irradiated member . Therefore, the object or even when the observed object is located outside the vacuum chamber and local vacuum chamber, appropriate processing of the machining object, or to allow proper observation of the observed object Become.

In the present invention, a beam deflecting device arranged in the first path and / or the second path is provided, and the image generating device is based on a detected current value detected by the irradiated member and a beam deflection position by the deflecting device. and Turkey to image the detected current value corresponding to the deflection position Te is preferred. With this configuration, by checking the imaged detected current value visually Ru can detect the irradiation position of the beam.

Furthermore, beam processing apparatus is provided with a position adjusting hand stage for performing alignment between the traveling direction and the exit aperture of the beam preferred.

As described above, since the position adjusting means is provided, even if the workpiece is placed outside the vacuum chamber and the local vacuum chamber, the position adjusting means is used to reliably emit the beam from the emission hole. Then, it becomes possible to irradiate the workpiece. As a result, it is possible to appropriately process the workpiece.

Furthermore, the beam observation apparatus preferably includes a position adjusting means for aligning the beam traveling direction with the exit hole.

As described above, since the position adjusting means is provided, the beam is surely emitted from the emission hole by using the position adjusting means even when the observation object is arranged outside the vacuum chamber and the local vacuum chamber. Thus, it becomes possible to irradiate the observation object. As a result, it is possible to appropriately observe the observation object.

  In the present invention, the local vacuum chamber includes a beam emitting portion in which an emission hole is formed, and the position adjusting means includes a moving mechanism that moves the beam emitting portion in a direction orthogonal to the beam emitting direction, and a beam emitting portion. It is preferable to include a fixing mechanism for fixing. With this configuration, it is possible to align the beam traveling direction and the exit hole by directly moving the exit hole from which the beam is emitted, so that it is easy to align the beam traveling direction and the exit hole. become.

  In the present invention, the local vacuum chamber is formed with an intake port disposed on the outer peripheral side of the emission hole, and the beam processing device and the beam observation device perform intake from the intake port toward the inside of the local vacuum chamber. It is preferable to provide an intake means. If comprised in this way, even if it is a case where a processing target object or an observation target object is arranged outside a vacuum chamber and a local vacuum chamber, a processing part of a processing target object or an observation part of an observation target object The surrounding pressure can be lowered appropriately. For this reason, it is possible to irradiate the processing object or the observation object with an appropriate beam.

  In the beam processing apparatus of the present invention, the beam emitted from the exit hole is a focused ion beam, and the beam processing apparatus includes a laser emitting means for emitting a laser beam for processing a workpiece, and also includes focused ions. It is preferable to process an object to be processed using a beam and a laser beam. Due to the characteristics of the laser beam, direct processing using a laser beam can only perform processing at a level of several μm (micrometer) on a processing target. On the other hand, in processing using a focused ion beam, it is possible to process an object to be processed at a level of several hundred nm (nanometers) to several tens of nm, but a level of several hundred nm to several tens of nm. When it is necessary to perform processing at a level of several μm on the object to be processed in addition to the processing at, the focused ion beam takes processing time and the productivity is lowered.

  Therefore, with this configuration, it is possible to perform rough processing with relatively low accuracy with a laser beam and perform fine processing with high accuracy with a focused ion beam. Therefore, for example, even when it is necessary to process a workpiece from the tens of μm level to the tens of nm level, it is possible to perform fine machining on the workpiece in a short time. Become. Further, since the object to be processed is arranged outside the vacuum chamber and the local vacuum chamber, laser processing using the laser beam emitted from the laser emitting means can be performed in the atmosphere. Therefore, even when an assist gas is required during laser processing, it is possible to perform appropriate laser processing using the assist gas.

  In the present invention, the beam processing apparatus includes a fixing means for fixing the processing target, an ion beam processing region where the processing target is processed with a focused ion beam, and processing of the processing target with a laser beam. It is preferable to provide a moving means for moving the fixing means between the laser processing region. With this configuration, it is not necessary to attach or detach the object to be processed between the processing using the focused ion beam and the processing using the laser beam. Therefore, even when a workpiece is processed using both a focused ion beam and a laser beam, there is no error in attaching / detaching the workpiece, and the processing accuracy of the workpiece can be increased.

  In the present invention, the beam processing apparatus includes a measuring unit that measures a machining state of the workpiece, and the moving unit can move the fixing unit to a measurement region where the machining state of the workpiece is measured by the measuring unit. It is preferable to be configured. If comprised in this way, the processing state of a process target object can be measured in the middle of a process, without attaching / detaching a process target object. Therefore, the processing accuracy of the processing object can be increased.

  As described above, in the beam processing apparatus of the present invention, it is possible to process an object to be processed in a wide range with a simple configuration. Moreover, in the beam observation apparatus of the present invention, it is possible to observe an observation object in a wide range with a simple configuration.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Schematic configuration of beam processing equipment)
FIG. 1 is a perspective view schematically showing a schematic configuration of a beam processing apparatus 1 according to an embodiment of the present invention. FIG. 2 is a diagram schematically showing the configuration of the main part of the beam processing apparatus 1 shown in FIG.

  The beam processing apparatus 1 according to the present embodiment uses a focused ion beam as a beam for processing a predetermined workpiece (work) 2 and a laser beam to perform fine processing such as removal processing on the workpiece 2. This is a processing system that performs processing. As shown in FIGS. 1 and 2, the beam processing apparatus 1 performs processing of a workpiece 2 and a beam emitting source 13 and a vacuum chamber 3 for emitting a focused ion beam (FIB (Focused Ion Beam)). The laser emitting means 4 for emitting the laser beam, the vacuum generating means 5 for preventing the diffusion of the FIB, the measuring means 6 for measuring the processing state of the work 2, the work 2 and the work 2 being mounted. A moving means 7 for moving, a control unit 8 for performing various controls of the beam processing apparatus 1, a main body frame 9 to which the vacuum chamber 3, the measuring means 6 and the like are fixed, and the main body frame 9 are fixed and the moving mechanism 7 Etc., a vibration damping device 11 for removing relative vibration between the installation surface of the beam processing apparatus 1 and the main body base 10, and FI. And a detection unit 12 constituting detection means 57 described later for detecting the irradiation position of B. In addition, the beam processing apparatus 1 of this form is arrange | positioned in atmospheric pressure. In the following, as shown in FIG. 1, the front-rear direction Y direction, the left-right direction in FIG.

  The beam emission source 13 emits an ion beam using a liquid metal such as gallium (Ga) as an ion source. Further, the beam emission source 13 is attached to one end side (the upper end side in FIG. 2) of the vacuum chamber 3. A first path 34 through which the ion beam emitted from the beam emission source 13 passes is formed inside the vacuum chamber 3. In the first path 34, a predetermined ion optical system (not shown) for focusing an ion beam passing therethrough is disposed. In addition, a part of a deflecting device 59 constituting a detection means 57 described later is arranged on the first path 34 (see FIG. 10). In this embodiment, FIB is emitted from the other end side (lower end side in FIG. 2) of the vacuum chamber 3. For example, a Ga ion beam (that is, FIB) accelerated to 20 to 30 kV is emitted, and the workpiece 2 is processed using a sputtering phenomenon. In this embodiment, the work 2 is processed at a level of several hundred nm by this FIB. Note that the beam processing apparatus 1 of this embodiment includes a vacuum pump (not shown) for bringing the first path 34 into a vacuum state.

  The laser emitting means 4 is configured to emit a plurality of types of laser beams. The laser emission means 4 of this embodiment is configured to emit three types of laser beams. As shown in FIG. 2 and the like, the first laser emission mechanism 14, the second laser emission mechanism 15, and the third laser emission. Three laser emission mechanisms of the mechanism 16 are provided.

  The first laser emission mechanism 14 is configured to emit a short-wavelength laser beam having a relatively short wavelength, and is fixed to the main body frame 9 and the first laser light source 17 that generates the laser beam. The first laser head 18 for irradiating the laser beam from the first laser head 18 and an optical path 19 configured by a predetermined optical system and guiding the laser beam generated by the first laser light source 17 to the first laser head 18 are provided. The first laser emission mechanism 14 of this embodiment emits a UV (ultraviolet) laser beam. In this embodiment, the workpiece 2 is processed at a level of several tens of μm by the UV laser beam emitted from the first laser emission mechanism 14.

  The second laser emission mechanism 15 is configured to emit an extremely short pulse laser beam having a pulse duration of picoseconds (ps) or femtoseconds (fs), and generates a laser beam. 20, a second laser head 21 fixed to the main body frame 9 and irradiating a laser beam toward the workpiece 2 from the lower end, and a laser beam generated by the second laser light source 20 configured by a predetermined optical system. An optical path 22 leading to the head 21 is provided. The second laser emission mechanism 15 of this embodiment emits an fs laser beam having a pulse time width of femtoseconds. In this embodiment, the work 2 is processed at a level of several μm by the fs laser beam emitted from the second laser emission mechanism 15.

  The third laser emission mechanism 16 is configured to emit a beam-shaped laser beam. The third laser emission mechanism 16 of this embodiment is a fiber laser that emits an infrared laser beam, is fixed to the third laser light source 23 that generates the laser beam, and the main body frame 9, and is formed from the lower end toward the workpiece 2. A third laser head 24 for irradiating the laser beam, and a fiber cable 25 for guiding the laser beam generated by the third laser light source 23 to the third laser head 24. In this embodiment, the workpiece 2 is processed to a level of 10 μm by the beam-formed infrared laser beam emitted from the third laser emission mechanism 16.

  The laser emitting means 4 of this embodiment includes a gas injection device (not shown) for injecting an assist gas during laser processing in order to appropriately perform laser processing of the workpiece 2. The assist gas injected from the gas injection device is, for example, nitrogen gas or helium gas for preventing oxidation of the workpiece 2 during laser processing or removing scattered matters generated by laser processing.

  The vacuum generating means 5 is attached to the other end side of the vacuum chamber 3 and has a local vacuum chamber 27 through which the FIB passes, various devices and control devices for making the inside of the local vacuum chamber 27 into a vacuum state, and the like. And a vacuum device main body 28. The detailed configuration of the vacuum generating means 5 will be described later.

  The measuring means 6 is configured to measure the processing state (processed shape) of the workpiece 2 processed by FIB or laser beam, and is fixed to the main body frame 9. The measuring means 6 of the present embodiment is an atomic force microscope, and utilizes a change in atomic force acting between a probe (not shown) fixed to the tip of a cantilever and a processing part of the workpiece 2, The three-dimensional shape of the processed part of the workpiece 2 is measured at a level of several nm. The measuring means 6 may be any means that can measure a fine shape, and may be, for example, a scanning laser microscope.

  As shown in FIG. 2, the moving means 7 includes a Z-direction moving mechanism 30 that is attached with a fixing means 29 such as a chuck to which the work 2 is fixed, and moves the work 2 in the Z direction. This is a so-called XYZ stage including an X-direction moving mechanism 31 that moves the workpiece 2 in the X-direction and a Y-direction moving mechanism 32 that moves the workpiece 2 in the Y-direction together with the Z-direction moving mechanism 30 and the X-direction moving mechanism 31. In this embodiment, the Z direction moving mechanism 30, the X direction moving mechanism 31, and the Y direction moving mechanism 32 are arranged in this order from the workpiece 2 side. However, the Z direction moving mechanism 30, the X direction moving mechanism 31 and the Y direction moving mechanism 32 are arranged. The direction moving mechanism 32 may be arranged in any order from the workpiece 2 side.

  Each of the Z direction moving mechanism 30, the X direction moving mechanism 31, and the Y direction moving mechanism 32 includes a drive source such as a motor. The Z direction moving mechanism 30, the X direction moving mechanism 31, and the Y direction moving mechanism 32 are each connected to a moving mechanism control unit 33. Based on a control command from the moving mechanism control unit 33, the workpiece is moved in each direction. Move 2. Note that each of the Z-direction moving mechanism 30, the X-direction moving mechanism 31, and the Y-direction moving mechanism 32 of the present embodiment can move the workpiece 2 in each direction at a level of several tens of nm. Further, the movement range (stroke) of the X-direction moving mechanism 31 and the Y-direction moving mechanism 32 of this embodiment is 250 mm.

  The beam processing apparatus 1 according to this embodiment is configured such that a workpiece is placed below any of the local vacuum chamber 27, the first to third laser heads 18, 21, 24, and the measuring unit 6 by the X direction moving mechanism 31 and the Y direction moving mechanism 32. 2 can be arranged. In other words, in the present embodiment, the moving means 7 is provided under the local vacuum chamber 27 which is an ion beam processing region where the workpiece 2 is processed by FIB and a laser processing region where the workpiece 2 is processed by the laser beam. The workpiece 2 can be moved together with the fixing means 29 between the first to third laser heads 18, 21, and 24 and the measurement means 6, which is a measurement region in which the machining state of the work 2 is measured. Is possible.

  As shown in FIG. 2, the control unit 8 includes a beam emission source 13, first to third laser light sources 17, 20, and 23, a measuring unit 6, a vacuum device main body 28, a moving mechanism control unit 33, a detection unit 12, and the like. Is connected. In this embodiment, the control unit 8 is configured by a plurality of individual control units (not shown) to which these devices are individually connected. The individual control unit to which the detection unit 12 is connected includes control circuits such as a signal mixing circuit 60 and an image processing circuit 61 which will be described later, together with the detection unit 12 and the like, and a detection unit 57 which will be described later (see FIG. 9). ). Detailed configurations of the signal mixing circuit 60 and the image processing circuit 61 will be described later. Note that the individual control unit to which the detection unit 12 is connected may be separated from the control unit 8 and a control unit having control circuits such as the signal mixing circuit 60 and the image processing circuit 61 may be provided separately.

  The main body frame 9 is formed of, for example, stone and has a gate shape. First to third laser heads 18, 21, and 24 are fixed to the main body frame 9 so that the upper surface of the work 2 can be irradiated with a laser beam, and the upper surface of the work 2 can be irradiated with FIB. Thus, the vacuum chamber 3 is fixed. The measuring means 6 is fixed to the main body frame 9 so that the tip of the probe of the measuring means 6 can be opposed to the upper surface of the workpiece 2.

  The main body base 10 is a so-called stone surface plate formed of a thick stone plate into a flat plate shape. In addition to the main body frame 9, a first laser light source 17, a second laser light source 20, a Y-direction moving mechanism 32 and the like are attached to the main body base 10.

  The vibration damping device 11 is, for example, an active vibration damping device that moves a weight (not shown) in a direction opposite to the direction of shaking of the main body base 10 with respect to the installation surface of the beam processing device 1 to cancel the shaking of the main body base 10.

  As described above, the detection unit 12 constitutes a part of the detection means 57 for detecting the FIB irradiation position. As shown in FIG. 2 (see an enlarged portion of the K portion), the detection unit 12 electrically connects the detection electrode 53, the substrate 54 to which the detection electrode 53 is fixed, and the detection electrode 53 and the substrate 54. And a connection line 55 connected to.

  The detection electrode 53 includes a conductive core wire 53 a and an insulating coating 53 b that covers the periphery of the core wire 53 a, and is fixed to the substrate 54 so as to protrude from the surface of the substrate 54. Further, as will be described later, the detection electrode 53 is inserted into an emission hole 78a described later formed in the local vacuum chamber 27 when detecting the FIB irradiation position. The substrate 54 functions as a fixing jig for fixing the detection electrode 53 inserted into the emission hole 78a. Further, as will be described later, a current amplifying circuit 58 that converts a detection current detected by the detection electrode 53 into a voltage and amplifies it is mounted on the substrate 54. The connection line 55 electrically connects the core wire 53a and the current amplification circuit 58. In this embodiment, the detection electrode 53 is an irradiated member that is irradiated with the FIB when the irradiation position of the FIB is detected.

(Configuration of local vacuum chamber)
FIG. 3 is a plan view of the local vacuum chamber 27 shown in FIG. 4 is a cross-sectional view showing an EE cross section of FIG. 3. FIG. 5 is a cross-sectional view showing the FF cross section of FIG. 3. FIG. 6 is a cross-sectional view showing the HH cross section of FIG. 3. FIG. 7 is an enlarged cross-sectional view showing a J portion of FIG. 4 in an enlarged manner.

  As shown in FIGS. 3 to 7, the local vacuum chamber 27 is formed in a substantially cylindrical shape with a flange having a bottom. The local vacuum chamber 27 is formed with a substantially cylindrical main body portion 35, a first bottom surface portion 76 and a second bottom surface portion 37 that form the bottom portion, and an emission hole 78a through which the FIB is emitted toward the workpiece 2. The position of the beam emitting portion 78 is adjusted in the radial direction (that is, the direction orthogonal to the FIB emitting direction) with respect to the beam emitting portion 78 and the first bottom surface portion 76, so that the FIB traveling direction and the emitting hole 78a are adjusted. Position adjusting means 80 (see FIG. 7).

  The main body portion 35 has a double structure including an inner cylinder portion 35a disposed on the radially inner side and an outer cylinder portion 35b disposed on the radially outer side of the inner cylinder portion 35a. In addition, a flange 35c that extends radially outward is formed at the upper end of the main body 35. A plurality of through holes 35 d are formed in the flange portion 35 c through which a fixing screw (not shown) for fixing the main body portion 35 is inserted into the lower end of the vacuum chamber 3. In this embodiment, a first space 40 is formed in the central portion in the radial direction of the local vacuum chamber 27 by the inner cylinder portion 35a, the first bottom surface portion 76, and the like, and the inner cylinder portion 35a, the outer cylinder portion 35b, and the first bottom surface. A second space 41 is formed radially outward and below the first space 40 by the portion 76, the second bottom surface portion 37, and the like. The first space 40 communicates with the first path 34 of the vacuum chamber 3 (see FIG. 8). In the present embodiment, the first space 40 is a second path through which the FIB that has passed through the first path 34 passes.

  Further, as will be described later, the main body portion 35 is formed with a first exhaust hole 35e for exhausting the first space 40 in a vacuum state so as to communicate with the first space 40 from the outer peripheral surface (see FIG. 5), a second exhaust hole 35f for exhausting the second space 41 to be in a vacuum state is formed so as to communicate with the second space 41 from the outer peripheral surface (see FIG. 4).

  The first bottom surface portion 76 is formed in a substantially disc shape, and as shown in FIG. 7, the upper surface and the lower surface of the first bottom surface portion are gently inclined downward from the radially outer side toward the inner side. A through hole 76a through which the FIB passes is formed at the radial center position of the first bottom surface portion 76. The through hole 76a has a diameter that decreases toward the lower side. Further, a concave portion 76 b in which a beam emitting portion 78 and a fixing member 81 described later are disposed is formed on the lower surface of the first bottom surface portion 76. The first bottom surface portion 76 is fixed to the lower end of the inner cylinder portion 35a. Further, a seal member 42 that prevents air leakage from the first space 40 is disposed between the inner cylinder portion 35 a and the first bottom surface portion 76.

  The position adjusting means 80 includes a substantially cylindrical fixing member 81 fixed to the first bottom surface portion 76, and an adjustment screw 82 that protrudes from the inner peripheral side of the fixing member 81 and adjusts the position of the beam emitting portion 78. Yes. The fixing member 81 is fixed to the lower surface of the first bottom surface portion 76 by a fixing screw 83 while being disposed in the recess 76 b of the first bottom surface portion 76. The adjusting screw 82 is a hexagon socket set screw having no head, and is screwed into a screw hole 81a formed in the fixing member 81 so as to penetrate in the radial direction from the inner peripheral side of the fixing member 81. It protrudes. In the present embodiment, for example, screw holes 81a are formed in the fixing member 81 at four positions at a pitch of 90 °, and adjustment screws 82 are screwed into the respective screw holes 81a. A drive mechanism such as a motor for rotating the adjustment screw 82 may be provided in the position adjustment unit 80.

  The beam emission part 78 is formed in a substantially cylindrical shape with a hook having an emission hole 78a penetrating in the vertical direction and a flange part 78b extending radially outward on the upper end side. The upper end side of the emission hole 78a is formed in a substantially mortar shape whose diameter gradually increases toward the upper side, and the emission hole 78a is formed in the first space 40 via the through hole 76a of the first bottom surface portion 76. Communicating with The beam emitting portion 78 is disposed in the recess 76 b of the first bottom surface portion 76 in a state of being disposed on the inner peripheral side of the fixing member 81, and between the lower surface of the first bottom surface portion 76 and the upper surface of the fixing member 81. Is fixed to the first bottom surface portion 76 with the collar portion 78b sandwiched therebetween. Further, a seal member 43 for preventing air leakage from the first space 40 is disposed between the lower surface of the first bottom surface portion 76 and the flange portion 78b.

  As shown in FIG. 7, an adjustment screw 82 abuts on the outer peripheral surface of the beam emitting portion 78, and the radial position adjustment of the beam emitting portion 78 is performed according to the screwing amount of the adjusting screw 82 into the screw hole 81 a. . That is, in this embodiment, a moving mechanism that moves the beam emitting portion 78 in a direction orthogonal to the FIB emitting direction is configured by the screw hole 81 a formed in the fixing member 81 and the adjusting screw 82. In this embodiment, the fixing member 81 and the fixing screw 83 constitute a fixing mechanism that fixes the beam emitting portion 78.

  The second bottom surface portion 37 is formed in a substantially disc shape. A through hole 37 a in which the lower end side of the beam emitting portion 78 is disposed is formed at the center of the second bottom surface portion 37. Further, the upper surface of the second bottom surface portion 37 is an inclined surface 37b that gently inclines downward as it goes from the radially outer side to the inner side. A space formed between the lower surface of the first bottom surface portion 76, the lower surface of the fixing member 81, and the inclined surface 37 b is a part of the second space 41. Furthermore, the lower surface of the second bottom surface portion 37 is formed so as to be inclined upward in the radial direction outward from the first flat surface 37c formed around the through hole 37a and the first flat surface 37c. It is comprised from the inclined surface 37d and the 2nd flat surface 37e formed toward the radial direction outward from 37d of inclined surfaces. The 2nd bottom face part 37 is being fixed to the lower end of the outer cylinder part 35b. Further, a seal member 44 for preventing air leakage from the second space 41 is disposed between the outer cylinder portion 35 b and the second bottom surface portion 37.

  The diameter of the through hole 37 a of the second bottom surface portion 37 is larger than the outer diameter D 1 of the lower end portion of the beam emitting portion 78. In the present embodiment, the bottom surface 78d of the beam emitting portion 78 and the first flat surface 37c are arranged on the same plane. An air inlet 45 that communicates from the bottom surface of the local vacuum chamber 27 to the second space 41 is formed outside the beam emitting portion 78 in the through hole 37a. In other words, the local vacuum chamber 27 of the present embodiment is formed with an intake port 45 disposed on the outer peripheral side of the emission hole 78a.

  Note that the diameter of the exit hole 78a is preferably 0.1 to 2 mm, the outer diameter D1 of the lower end portion of the beam exit part 78 is preferably 1 to 60 mm, and the outer diameter of the intake port 45 (that is, the penetration) The diameter of the hole 37a and the inner diameter of the first flat surface 37c) are preferably 5 to 100 mm, and the outer diameter D2 of the first flat surface 37c is preferably 25 to 120 mm. In this embodiment, for example, the outer diameter D3 of the inclined surface 37d is 57 mm, the inner diameter of the inner cylinder part 35a is 53 mm, the outer diameter of the inner cylinder part 35a is 73 mm, the inner diameter of the outer cylinder part 35b is 100 mm, and the outer cylinder part 35b. The outer diameter is 120 mm. The distance D4 between the first flat surface 37c and the second flat surface 37e is 3 mm, for example.

(Configuration of vacuum generation means)
FIG. 8 is a schematic diagram for explaining a connection relationship between the local vacuum chamber 27 and the first vacuum pump 47 and the like shown in FIG. FIG. 9 is a table showing measured data of the degree of vacuum in the first space 40 and the second space 41 when various parameters are changed in the vacuum generating means 5 shown in FIG.

  In this embodiment, as shown in FIG. 8, the local vacuum chamber 27 is attached to the lower end of the vacuum chamber 3 and is disposed between the vacuum chamber 3 and the workpiece 2 when the workpiece 2 is processed by FIB. Then, the FIB that has passed through the first path 34 passes through the first space 40 (that is, the second path), exits from the exit hole 78a, and is disposed in the ion beam processing region via the minute gap G. Focus on work 2. That is, the vacuum generating means 5 of the present embodiment makes the first space 40 in a vacuum state, and the lower surface (specifically, the bottom surface 78d of the beam emitting unit 78) of the local vacuum chamber 27 arranged to face the gap G. ) And the workpiece 2 (hereinafter referred to as “local space 50”) is also in a vacuum state to prevent the FIB from diffusing toward the workpiece 2. The gap G is, for example, 10 μm. The gap G is preferably 10 μm to 200 μm.

  In order to prevent the diffusion of FIB, it is necessary to depressurize the first space 40 and the local space 50 to a predetermined degree of vacuum. However, if only the first space 40 is in a vacuum state, it is difficult to depressurize the first space 40 and the local space 50 to a predetermined degree of vacuum. Therefore, in this embodiment, the second space 41 is also in a vacuum state, whereby the first space 40 and the local space 50 can be decompressed to a predetermined degree of vacuum. That is, the vacuum generation means 5 of this embodiment is a so-called differential exhaust type vacuum apparatus.

  In addition, as shown in FIG. 8, it arrange | positions so that a part of workpiece | work 2 centering on the process part of the workpiece | work 2 in which processing may be performed may face the local space 50 used as a vacuum state, The other part of the workpiece | work 2 is local. It is disposed in the atmospheric pressure outside the vacuum chamber 3.

  As described above, the vacuum generating means 5 includes the vacuum device main body 28 in addition to the local vacuum chamber 27. The vacuum apparatus main body 28 includes a first pump 47 and a second pump 48 for bringing the first space 40 into a vacuum state. That is, the first space 40 becomes a vacuum space through which the FIB toward the workpiece 2 passes by the first pump 47 and the second pump 48. The vacuum device main body 28 includes a third pump 49 for making the second space 41 into a vacuum state. In the present embodiment, the third pump 49 is an intake unit that performs intake from the intake port 45 toward the inside of the local vacuum chamber 27. Further, as shown in FIG. 8, the first pump 47 and the second pump 48 are connected to the first space 40 via a pipe 50 connected to the first exhaust hole 35e, and the third pump 49 is connected to the first pump 40. 2 It is connected to the second space 41 through a pipe 51 connected to the exhaust hole 35f.

  The first pump 47 is a pump having a relatively small suction capacity but capable of obtaining a relatively high degree of vacuum (that is, capable of depressurizing the first space 40 to a relatively low pressure). For example, a turbo molecular pump. The second pump 48 and the third pump are pumps that have a large suction capacity but cannot achieve a high degree of vacuum, and are, for example, rotary pumps.

  In the vacuum generating means 5 of the present embodiment, when the work 2 is moved by the moving means 7 and is disposed to face the lower surface of the local vacuum chamber 27 via the gap G, first, the third pump 49 is operated, The two spaces 41 are depressurized. When the second space 41 is depressurized, air is sucked from the air inlet 45 and the local space 50 is also depressurized. When the second space 41 is depressurized to a predetermined degree of vacuum, the second pump 48 and the first pump 47 operate in this order. Since the local space 50 is depressurized by the action of the third pump 49, the second pump 48 and the first pump 47 cause the first space 40 and the local space 50 to have a vacuum necessary for preventing the FIB from spreading. The pressure is reduced to a short time.

  In this embodiment, the bottom surface 78d of the beam emitting portion 78 and the first flat surface 37c are arranged on the same plane, and an inclined surface 37d is formed radially outward of the first flat surface 37c. Yes. Therefore, the bottom surface 78d of the beam emitting portion 78 and the workpiece 2 can be brought close to each other while preventing the interference between the second bottom surface portion 37 and the workpiece 2. Moreover, since the 1st flat surface 37c and the workpiece | work 2 can be made to adjoin, when depressurizing the 1st space 40 or the 2nd space 41, inflow of the air to the local space 50 is prevented, and the local space 50 Can be decompressed efficiently.

In the vacuum generating means 5 of this embodiment, the diameter of the emission hole 78a, the outer diameter D1 of the lower end portion of the beam emission part 78, the outer diameter of the intake port 45, the outer diameter D2 of the first flat surface 37c, and the gap G As a parameter, the degree of vacuum of the first space 40 and the second space 41 measured when each parameter is changed is as shown in FIG. For example, the diameter of the emission hole 78a is 1 mm, the outer diameter D1 of the lower end of the beam emission part 78 is 5 mm, the outer diameter of the intake port 45 is 20 mm, the outer diameter D2 of the first flat surface 37c is 35 mm, and the gap G is 10 μm. In some cases, the degree of vacuum in the first space 40 was 5 × 10 ⁻³ Pa, and the degree of vacuum in the second space 41 was 30 Pa.

(Configuration of detection means)
FIG. 10 is a diagram showing a schematic configuration of the detection means 57 for detecting the irradiation position of the focused ion beam (FIB) shown in FIG. FIG. 11 is a diagram illustrating a state of the detection unit 12 when the irradiation position of the focused ion beam (FIB) illustrated in FIG. 8 is detected. FIG. 12 is a diagram schematically illustrating an example of an image displayed on the display device 62 illustrated in FIG. 10.

  As described above, the beam processing apparatus 1 of the present embodiment includes the detection means 57 for detecting the FIB irradiation position. As shown in FIG. 10, in addition to the detection unit 12, the detection unit 57 includes a deflection device 59 disposed inside the first path 34, a signal mixing circuit 60 that forms part of the control unit 8, and image processing. A circuit 61 and a display device 62 are provided.

  As described above, the detection unit 12 includes the detection electrode 53, the substrate 54, and the connection line 55. A current amplification circuit 58 is mounted on the substrate 54 (see FIG. 10), and the detection current detected by the detection electrode 53 is converted into a voltage by the current amplification circuit 58 and amplified. When detecting the irradiation position of the FIB, as shown in FIG. 11, the detection unit 12 is arranged. That is, the substrate 54 is fixed to the beam emitting portion 78 in a state where the detection electrode 53 is inserted into the emission hole 78 a and the upper surface of the substrate 54 is in contact with the bottom surface 78 d of the beam emitting portion 78. In this embodiment, the detection unit 12 is detached from the beam emitting unit 78 and stored in a predetermined storage unit, except when the FIB irradiation position is detected. The detection unit 12 may be fixed to the fixing unit 29, and the detection unit 12 may be arranged by the moving unit 7 as shown in FIG.

  The deflection device 59 deflects and scans the ion beam emitted from the beam emission source 13 in the first path 34 and the first space 40 (that is, the second path). As shown in FIG. 10, the deflecting device 59 deflects the ion beam in the X direction and scans it, so that the pair of X-direction deflecting electrodes 64 arranged in the first path 34 and the ion beam in the Y direction. In order to deflect and scan, a pair of Y-direction deflection electrodes 65 arranged in the first path 34, an X-direction scanning signal generation circuit 66 that outputs an X-direction scanning signal for controlling the X-direction deflection electrode 64, and Y And a Y-direction scanning signal generation circuit 67 that outputs a Y-direction scanning signal for controlling the direction deflection electrode 65. For example, the deflection device 59 of this embodiment scans the FIB in the X direction and the Y direction by 1.2 mm, respectively.

  As shown in FIG. 10, the signal mixing circuit 60 includes a voltage signal amplified by the current amplification circuit 58, an X-direction scanning signal output from the X-direction scanning signal generation circuit 66, and a Y-direction scanning signal generation circuit 67. The Y-direction scanning signal output from is input. Further, the signal mixing circuit 60 outputs an output signal in which the FIB deflection position based on the X direction scanning signal and the Y direction scanning signal is associated with the detected current value detected by the detection electrode 53. Based on the output signal from the signal mixing circuit 60, the image processing circuit 61 performs predetermined processing such as AD conversion for imaging the detected current value corresponding to the FIB deflection position. In this embodiment, the detection current value corresponding to the deflection position based on the detection current value detected by the detection electrode 53 and the deflection position of the FIB by the deflection device 59 by the signal mixing circuit 60 and the image processing circuit 61. An image generation apparatus for imaging the image is configured.

  On the display device 62, based on the output signal from the image processing circuit 61, the detected current value corresponding to each deflection position within the FIB scanning range is imaged and displayed. Specifically, as shown in FIG. 12, the magnitude of the detected current value corresponding to each FIB deflection position is displayed on the display device 62 by shading. That is, the magnitude of the detected current value corresponding to each FIB deflection position is converted into brightness and displayed on the display device 62. More specifically, as shown in FIG. 12, when the detection electrode 53 is within the FIB scanning range, the detection current value becomes large at the location where the FIB deflection position coincides with the core wire 53a. Is displayed with a dark core corresponding part 153a. Further, the thin coating corresponding portion 153 b corresponding to the location where the FIB deflection position coincides with the coating 53 b is lighter than the core corresponding portion 153 a, and the portion corresponding to the location where the FIB deflection position deviates from the detection electrode 53. The image becomes a lighter color than the covering corresponding portion 153b.

  As shown in FIG. 12, a circular exit hole corresponding line 178a corresponding to the exit hole 78a also appears on the screen of the display device 62. In addition, when the detection electrode 53 and the emission hole 78a are not within the FIB scanning range, the entire screen of the display device 62 is light.

  In this embodiment, as described above, the current amplification circuit 58 is mounted on the substrate 54 to which the detection electrode 53 is fixed. That is, the current amplifier circuit 58 is disposed at a position close to the detection electrode 53. Since the current detected by the detection electrode 53 is a very small amount (for example, 5 to 10 nA), this configuration reduces the noise of the detection current detected by the detection electrode 53 and amplified by the current amplification circuit 58. Can be reduced. The signal mixing circuit 60 and the image processing circuit 61 are arranged inside the control unit 8 or inside or in the vicinity of an individual personal computer or the like, and are arranged away from the current amplification circuit 58. Therefore, it is possible to suppress the generation of noise in the current amplification circuit 58 caused by the signal mixing circuit 60 and the image processing circuit 61.

  (Positioning method of focused ion beam and exit hole)

  In this embodiment, when the beam processing apparatus 1 is initially set, the FIB irradiation position is detected by using the detection unit 57, and the FIB is appropriately emitted by the position adjustment unit 80 so that the FIB is appropriately emitted from the emission hole 78a. The advancing direction and the exit hole 78a are aligned. Further, since the beam emission source 13 is consumed over time, the beam emission source 13 needs to be replaced periodically. After the replacement, the irradiation position of the FIB emitted from the beam emission source 13 may be shifted. Therefore, after the beam emission source 13 is replaced, the FIB irradiation position is detected using the detection means 57, and the FIB traveling direction and the emission hole 78a are aligned by the position adjustment means 80.

  Specifically, in a state where the second bottom surface portion 37 is removed, the detection electrode 53 is inserted into the emission hole 78a, the upper surface of the substrate 54 is brought into contact with the bottom surface 78d of the beam emission portion 78, and the substrate 54 is placed in the beam. It fixes to the emission part 78. FIG. After that, the FIB is scanned within a predetermined range by the deflecting device 59, and the display device 62 displays the detected current value corresponding to each deflection position of the FIB. Then, while confirming the display on the display device 62, the screwing amount of the adjusting screw 82 into the screw hole 81a is changed until the detection electrode 53 appears in the FIB scanning range, and the FIB traveling direction and the emission hole 78a are changed. Align with.

  For example, in a state where no voltage is applied to the X direction deflection electrode 64 and the Y direction deflection electrode 65 (that is, when the amount of deflection in the X direction and Y direction of the FIB by the X direction deflection electrode 64 and the Y direction deflection electrode 65 is 0). When the FIB traveling direction matches the center position on the screen of the display device 62, as shown in FIG. 12, the center position on the screen of the display device 62 matches the center position of the core corresponding part 153a. As described above, while confirming the display on the display device 62, the screwing amount of the adjusting screw 82 into the screw hole 81a is changed to align the FIB traveling direction with the emission hole 78a.

(Main effects of this form)
As described above, the beam processing apparatus 1 according to the present embodiment is configured such that the work 2, which is disposed outside the local vacuum chamber 27 via the minute gap G and most of which is disposed in the atmospheric pressure, is formed by the FIB. Processing. Therefore, a wide range of processing can be performed on the workpiece 2 using the FIB while moving the workpiece 2 arranged in the atmospheric pressure outside the local vacuum chamber 27 by the moving means 7. That is, even if the workpiece 2 is large, it is not necessary to separately cover the entire workpiece 2 (or the moving means 7 in addition to the workpiece 2) with a vacuum chamber. However, a wide range of machining can be performed on the workpiece 2 using the FIB.

  In addition, the beam processing apparatus 1 includes a detection unit 57 for detecting the FIB irradiation position. Therefore, even when the workpiece 2 is arranged outside the local vacuum chamber 27, the FIB can be reliably emitted from the emission hole 78a and irradiated onto the workpiece 2 based on the detection result of the detection means 57. It becomes possible. Further, the beam processing apparatus 1 of this embodiment includes a position adjusting means 80 for aligning the traveling direction of the FIB and the emission hole 78a. Therefore, even when the workpiece 2 is disposed outside the local vacuum chamber 27, the position of the emission hole 78a can be adjusted to reliably irradiate the workpiece 2 with the FIB emitted from the emission hole 78a. . In other words, the FIB can be appropriately focused at the processing site of the workpiece 2, and as a result, the workpiece 2 can be appropriately processed.

  In this embodiment, the detection means 57 includes a detection electrode 53 disposed in the emission hole 78a, a deflection device 59 disposed in the first path 34 and deflecting the ion beam emitted from the beam emission source 13, and the detection Based on the detected current value detected by the electrode 53 and the FIB deflection position by the deflecting device 59, a signal mixing circuit 60 and an image processing circuit 61 for imaging the detected current value corresponding to each deflection position are provided. Therefore, by visually confirming the imaged detection current value, the FIB irradiation position can be detected, and the FIB irradiation position can be easily detected. Further, while visually confirming the imaged detection current value, the position adjusting means 80 can be used to align the FIB traveling direction with the exit hole 78a, and the FIB traveling direction and the exit hole 78a can be aligned. It becomes easy to align.

  In this embodiment, the position adjusting means 80 is fixed to the screw hole 81a and the adjustment screw 82 as a moving mechanism for moving the beam emitting portion 78 in the radial direction, and the fixing member 81 as a fixing mechanism for fixing the beam emitting portion 78. And a screw 83. Therefore, it is possible to directly move the emission hole 78a from which the FIB is emitted to align the FIB traveling direction with the emission hole 78a, and to easily align the FIB traveling direction with the emission hole 78a. .

  In the present embodiment, the local vacuum chamber 27 is formed with the air inlet 45 disposed on the outer peripheral side of the emission hole 78 a, and the third pump 49 sucks the air from the air inlet 45 toward the inside of the local vacuum chamber 27. Is going. Therefore, even when the processing part of the workpiece 2 is disposed outside the local vacuum chamber 27 (specifically, the local space 50), the pressure in the local space 50 can be appropriately reduced. As a result, the work 2 can be appropriately irradiated with FIB.

  In this embodiment, the beam processing apparatus 1 includes a beam emitting source 13 that emits FIB, a vacuum chamber 3, and the like, and laser emitting means 4 that emits a laser beam, and processes the workpiece 2 using the FIB and the laser beam. It is carried out. Therefore, in the beam processing apparatus 1, rough processing with relatively low accuracy can be performed with a laser beam, and fine processing with high accuracy can be performed with FIB. Therefore, for example, even when it is necessary to process the workpiece 2 from the tens of μm level to the several hundred nm level, the workpiece 2 can be finely processed in a short time. Moreover, the single beam processing apparatus 1 can perform integrated processing from rough processing to fine finishing. In particular, since the laser emitting means 4 of this embodiment is configured to emit three types of laser beams, it is possible to perform efficient and appropriate laser processing according to processing accuracy and processing amount.

  In this embodiment, the local vacuum chamber 27 in which the first space 40 through which the FIB toward the workpiece 2 passes is formed is attached to the lower end of the vacuum chamber 3, and when the workpiece 2 is processed by the FIB, the minute gap G is interposed. The local space 50 formed between the bottom surface 78d of the beam emitting portion 78 disposed opposite to the workpiece 2 and the workpiece 2 is in a vacuum state. Therefore, FIB scattering is suppressed, and the workpiece 2 can be appropriately processed by the FIB. Further, since the local vacuum chamber 27 is disposed between the vacuum chamber 3 and the workpiece 2, laser processing using the laser beam emitted from the laser emitting means 4 is performed in the atmosphere. Therefore, assist gas can be easily and appropriately injected from a gas injection device (not shown) during laser processing. Therefore, in this embodiment, appropriate laser processing using the assist gas can be performed.

  In this embodiment, the beam processing apparatus 1 includes a moving unit 7 that moves the fixing unit 29 to which the workpiece 2 is fixed between the ion beam processing region and the laser processing region. Therefore, it is not necessary to attach / detach the workpiece 2 between the ion beam processing and the laser processing. Therefore, even when the workpiece 2 is processed using the laser beam and the FIB, an attachment / detachment error of the workpiece 2 is eliminated, and the processing accuracy of the workpiece 2 can be improved. Further, in this embodiment, the moving means 7 can move the fixing means 29 to which the work 2 is fixed to the measurement region, so that the machining state of the work 2 can be measured without attaching or detaching the work 2. Therefore, the processing accuracy of the workpiece 2 can be further increased.

  In the present embodiment, based on the measurement result of the processing state of the workpiece 2 by the measuring means 6, it is selected which of the three types of laser beams and FIB is used for subsequent processing of the workpiece 2. The workpiece 2 can be processed with a laser beam or FIB. Therefore, the processing of the workpiece 2 can be continued by selecting a more appropriate laser beam or FIB according to the processing state of the workpiece 2. As a result, the workpiece 2 can be appropriately processed.

(Other embodiments)
In the embodiment described above, the local vacuum chamber 27 includes the position adjusting means 80 for adjusting the position of the beam emitting portion 78 and aligning the FIB traveling direction with the emitting hole 78a. In addition to this, for example, when the position adjustment means of the beam emission source 13 for aligning the traveling direction of the FIB and the exit hole 78a is provided, or the traveling direction and exit of the FIB using the detecting means 57 In the case where alignment with the hole 78a can be performed, the local vacuum chamber 27 may not include the position adjusting means 80. In this case, the local vacuum chamber 27 may be configured as shown in FIG. Hereinafter, the configuration of the local vacuum chamber 27 not provided with the position adjusting means 80 will be described with reference to FIG. In FIG. 13, the same reference numerals are given to the configurations common to the above-described embodiments.

  The local vacuum chamber 27 shown in FIG. 13 is formed with the main body portion 35 and the second bottom surface portion 37, the first bottom surface portion 36 fixed to the lower end of the inner cylinder portion 35a, and the emission hole 38a from which the FIB is emitted. The beam emitting unit 38 is provided. The first bottom surface portion 36 includes a side wall portion 36a and a bottom portion 36b that are gently inclined downward from the outside in the radial direction toward the inside, and a beam emitting portion 38 is fixed to the center of the bottom portion 36b. A hole 36c is formed. Further, the beam emitting portion 38 includes an emitting hole 38 a penetrating in the vertical direction and a seal fixing portion 38 b for fixing the seal member 43. The lower surface of the seal fixing portion 38b is an inclined surface 38c that is inclined downward as it goes from the radially outer side to the inner side. The beam emitting portion 38 is fixed to the fixing hole 36c with its upper end side positioned in the radial direction by the fixing hole 36c. The bottom surface 38d of the beam emitting portion 38 and the first flat surface 37c are arranged on the same plane.

  The beam processing apparatus 1 does not necessarily include a position adjusting unit that aligns the FIB traveling direction with the emission hole 78a, and includes a detecting unit 57 that detects the FIB irradiation direction. It does not have to be.

  In the embodiment described above, the vacuum generating means 5 is a so-called differential exhaust type vacuum apparatus. In addition, for example, if the local space 50 can be appropriately depressurized, the vacuum generating means 5 may not be a differential exhaust type vacuum apparatus. That is, as long as the local space 50 can be appropriately depressurized, the vacuum generating means 5 may perform intake from only the emission hole 78a. In the embodiment described above, the local vacuum chamber 27 has a double structure having the first space 40 and the second space 41. However, the vacuum generating means 5 has a local vacuum chamber 27 having a multiple structure of a triple structure or more. May be a differential exhaust type vacuum device.

  In the embodiment described above, the beam processing apparatus 1 uses FIB as a beam for processing the workpiece 2, but the beam may be an electron beam. Even in this case, a wide range of processing can be performed on the workpiece 2 using the electron beam while moving the workpiece 2 arranged outside the local vacuum chamber 27 by the moving means 7. Even when the workpiece 2 is arranged outside the local vacuum chamber 27, the position of the emission hole 78a can be adjusted to reliably irradiate the workpiece 2 with the electron beam emitted from the emission hole 78a. it can.

  In the above-described embodiment, the FIB is generated by a predetermined ion optical system or the like disposed in the vacuum chamber 3. However, the ion beam emitted from the beam emission source 13 is emitted as it is toward the workpiece 2. Also good. Note that a laser beam may be used instead of the FIB. In this case, since the local space 50 can be made into a vacuum state, it becomes possible to suppress the oxidation of the workpiece | work 2 at the time of laser processing. In the case where a laser beam is used instead of the FIB, a detection unit having a photodetector or a CCD as an irradiated member may be used instead of the detection unit 57 described above.

  In the embodiment described above, the beam processing apparatus 1 includes the laser emitting unit 4, but the beam processing apparatus 1 may not include the laser emitting unit 4. Even in this case, a wide range of processing can be performed on the workpiece 2 using the FIB while moving the workpiece 2 arranged outside the local vacuum chamber 27 by the moving means 7. Even if the workpiece 2 is disposed outside the local vacuum chamber 27, the workpiece 2 can be reliably irradiated with the FIB emitted from the emission hole 78a.

  In the embodiment described above, the detection unit 12 includes the detection electrode 53 fixed so as to protrude from the substrate 54, but the detection electrode may be mounted on the substrate 54. Further, the workpiece 2 itself may be used as a detection electrode. That is, the detection electrode as the irradiated member may be disposed outside the emission hole 78a in the emission direction of the FIB emitted from the emission hole 78a.

  In the above-described embodiment, the laser emitting unit 4 emits three types of laser beams. However, the laser emitting unit 4 may emit two types of laser beams or one type of laser beam. May be. Also, four or more types of laser beams may be emitted.

  In the above-described embodiment, the configuration of the beam processing apparatus 1 has been described as an embodiment of the present invention. However, the same configuration as the beam processing apparatus 1 is applied to a beam observation apparatus that observes an observation object. Can do. That is, it is possible to observe an observation object at least a part of which is arranged in the atmospheric pressure outside the local vacuum chamber 27 by using the beam emission source 13, the vacuum chamber 3, and the vacuum generation means 5. Note that when a configuration similar to that of the beam processing apparatus 1 is applied to the beam observation apparatus, a predetermined detector is arranged in the local space 50.

  Thus, in the beam observation apparatus to which the same configuration as that of the beam processing apparatus 1 is applied, the same effect as that of the beam processing apparatus 1 can be obtained. That is, an effect that the observation object can be observed in a wide range with a simple configuration in which the observation object is moved using the moving means 7 arranged outside the local vacuum chamber 27, and the detection means 57 and position adjustment. Even when the work 2 is arranged outside the local vacuum chamber 27 by the means 80, the position of the emission hole 78a can be adjusted to reliably irradiate the observation object with the FIB emitted from the emission hole 78a. Such effects can be obtained. Even if the measuring means 6 is not provided, the processing state of the work 2 can be observed with a beam observation apparatus using the work 2 processed by the laser emitting means 4 as an observation object.

The perspective view which shows typically schematic structure of the beam processing apparatus concerning embodiment of this invention. The figure which shows typically the structure of the principal part of the beam processing apparatus shown in FIG. The top view of the local vacuum chamber shown in FIG. Sectional drawing which shows the EE cross section of FIG. Sectional drawing which shows the FF cross section of FIG. Sectional drawing which shows the HH cross section of FIG. The expanded sectional view which expands and shows the J section of FIG. The schematic diagram for demonstrating the connection relationship between the local vacuum chamber shown in FIG. 2, a 1st vacuum pump, etc. FIG. The table | surface which shows the actual measurement data of the vacuum degree of 1st space and 2nd space when various parameters are changed in the vacuum production | generation means shown in FIG. The figure which shows schematic structure of the detection means for detecting the irradiation position of the focused ion beam (FIB) shown in FIG. The figure which shows the state of the detection part at the time of detecting the irradiation position of the focused ion beam (FIB) shown in FIG. The figure which shows typically an example of the image displayed on the display apparatus shown in FIG. The expanded sectional view which shows the periphery structure of the beam emission part concerning the other form of this invention.

Explanation of symbols

1 Beam processing device 2 Workpiece (working object)
DESCRIPTION OF SYMBOLS 3 Vacuum chamber 4 Laser emitting means 6 Measuring means 7 Moving means 13 Beam emitting source 27 Local vacuum chamber 29 Fixing means 34 First path 38 Beam emitting part 38a Emission hole 40 First space (second path)
45 Intake port 49 Third pump (intake means)
53 Detection electrode (irradiated member)
57 Detection means 59 Deflection device 60 Signal mixing circuit (part of image generation device)
61 Image processing circuit (part of image generation device)
78 Beam emitting part 78a Emission hole 80 Position adjusting means 81 Fixing member (fixing mechanism)
81a Screw hole (movement mechanism)
82 Adjustment screw (movement mechanism)
83 Fixing screw (fixing mechanism)

Claims (13)

A beam emission source that emits an ion beam for processing a workpiece, a vacuum chamber that has a first path through which the beam emitted from the beam emission source passes, and in which the beam emission source is attached; A beam processing apparatus having a second path through which the beam that has passed through the first path passes, and a local vacuum chamber having an exit hole for emitting the beam toward the object to be processed. ,
In order to detect the irradiation position of the beam, a detecting means having an irradiated member arranged in the beam emitting direction in the emission hole, and the irradiated member when the irradiated member is irradiated with the beam flow An image generation device for imaging a detected current value obtained by detecting a current is provided, and the workpiece to be processed at least partially in atmospheric pressure outside the vacuum chamber and the local vacuum chamber is each of XYZ It is moved by a moving means that can move in a direction, and a part of the processing object is arranged so as to face a local space that is in a vacuum state below the local vacuum chamber, and the processing of the processing object is performed with the beam. A beam processing apparatus characterized by being used.   The beam deflection device arranged in the first path and / or the second path is provided, and the image generation device detects a detected current value detected by the irradiated member and a deflection position of the beam by the deflection device. The beam processing apparatus according to claim 1, wherein the detected current value corresponding to the deflection position is imaged based on   3. The beam processing apparatus according to claim 1, further comprising position adjusting means for aligning the traveling direction of the beam and the exit hole.   The local vacuum chamber includes a beam emitting unit in which the emission hole is formed, and the position adjusting unit moves the beam emitting unit in a direction orthogonal to the beam emitting direction, and the beam emitting unit. The beam processing apparatus according to claim 3, further comprising a fixing mechanism that fixes the portion.   The local vacuum chamber is formed with an intake port disposed on the outer peripheral side of the emission hole, and further includes an intake unit that performs intake from the intake port toward the inside of the local vacuum chamber. The beam processing apparatus of any one of Claim 1 to 4.   The beam emitted from the emission hole is a focused ion beam, and includes laser emitting means for emitting a laser beam for processing the workpiece, and using the focused ion beam and the laser beam. The beam processing apparatus according to claim 1, wherein the processing object is processed.   The moving means includes an ion beam processing region where the processing target is processed with the focused ion beam, and the processing target is processed with the laser beam. The beam processing apparatus according to claim 6, wherein the fixing means is moved between a laser processing region to be performed.   Measuring means for measuring the processing state of the object to be processed is provided, and the moving means is configured to be able to move the fixing means to a measurement region where the processing state of the processing object is measured by the measuring means The beam processing apparatus according to claim 7. A beam emission source for emitting an ion beam for observing an observation object, a vacuum chamber having a first path through which the beam emitted from the beam emission source passes, and the beam emission source being attached; A beam observation apparatus having a second path through which the beam that has passed through the first path passes, and a local vacuum chamber having an emission hole for emitting the beam toward the observation object. ,
In order to detect the irradiation position of the beam, a detecting means having an irradiated member arranged in the beam emitting direction in the emission hole, and the irradiated member when the irradiated member is irradiated with the beam flow An image generation device for imaging a detected current value obtained by detecting a current is provided, and the observation object at least a part of which is arranged in the atmospheric pressure outside the vacuum chamber and the local vacuum chamber is represented by each of XYZ moved by movable transportation direction, a portion of the observed object is arranged so as to face the local space of a vacuum of below the local vacuum switch Yanba over, the beam observation of the observed object A beam observation apparatus characterized in that the beam observation apparatus is used.   The beam deflection device arranged in the first path and / or the second path is provided, and the image generation device detects a detected current value detected by the irradiated member and a deflection position of the beam by the deflection device. The beam observation apparatus according to claim 9, wherein the detected current value corresponding to the deflection position is imaged based on:   The beam observation apparatus according to claim 9, further comprising a position adjusting unit configured to align the traveling direction of the beam with the exit hole.   The local vacuum chamber includes a beam emitting unit in which the emission hole is formed, and the position adjusting unit moves the beam emitting unit in a direction orthogonal to the beam emitting direction, and the beam emitting unit. The beam observation apparatus according to claim 11, further comprising a fixing mechanism that fixes the unit.   The local vacuum chamber is formed with an intake port disposed on the outer peripheral side of the emission hole, and further includes an intake unit that performs intake from the intake port toward the inside of the local vacuum chamber. The beam observation apparatus according to any one of claims 9 to 12.

Images