JP4303276B2 - Electron beam and ion beam irradiation apparatus and sample preparation method - Google Patents

Description

  The present invention relates to a semiconductor wafer inspection technique, and in particular, detects a position where a defect (such as a minute foreign object or a pattern defect) on the wafer exists with high positional accuracy, and observes or analyzes a region including the defect existing position, or a defect. The present invention relates to a wafer inspection apparatus suitable for processing with high positional accuracy for purposes such as correction.

  In semiconductor device manufacturing, the number of products produced is large and there are many processes that require advanced control. Therefore, the occurrence of defects in one process leads to a significant decrease in manufacturing yield and the operation stop of the entire production line. The profitability is greatly affected. For this reason, careful inspection is performed after a specific process or after completion of a device at a semiconductor device manufacturing site, and efforts are made to eliminate defective products and to investigate the cause of defects. Actually, wafers and devices are extracted regularly or at regular intervals in the manufacturing process and inspected for the presence of defective parts. In the case of wafers, the inspection location and inspection items are determined in advance, and each wafer is constantly monitored to detect abnormalities in the manufacturing process, and the entire wafer after pattern completion is thoroughly inspected. If there is a defective part where there is a pattern defect or foreign matter, the device is discarded or a countermeasure is taken in pursuit of the cause of the defect.

  As an example of the inspection apparatus, there is an appearance inspection apparatus that detects defects (foreign matter adhesion, pattern defects, etc.) using light or an electron beam with respect to the appearance of the entire surface or a partial area of the wafer. According to this appearance inspection apparatus, it is possible to map the detection defect on the wafer. In particular, as a result of rapid miniaturization of semiconductor device pattern dimensions in recent years, among the above-described appearance inspection apparatuses, attention has been paid to appearance inspection apparatuses using electron beams capable of detecting finer defects.

  With regard to an appearance inspection apparatus using an electron beam, for example, Japanese Patent Laid-Open No. 5-258703 discloses a method for inspecting an X-ray mask or a pattern formed on a conductive substrate equivalent to the same using an electron beam and its A system configuration is disclosed.

  JP-A-59-160948 discloses that a semiconductor wafer surface is scanned in one direction with an electron beam, and a stage on which the wafer is placed is continuously moved in a direction perpendicular to the electron beam scanning direction. A technique for generating an electron beam scanning image of the wafer surface and inspecting a circuit pattern at high speed using the scanning image is disclosed.

  Furthermore, Japanese Patent Laid-Open No. 63-218803 discloses that the electron beam irradiation time on the surface of the semiconductor wafer at the time of acquiring an electron beam scanning image is precisely controlled so that charge-up and gradation drift of the semiconductor surface are acquired image quality. There is disclosed a technique for reducing the influence exerted and improving the reliability and sensitivity of an electron beam scanning image used for inspection.

  A conventional scanning electron microscope (hereinafter abbreviated as SEM) is used to perform detailed examinations such as shape observation and classification of the defects whose existence positions are identified by the appearance inspection apparatus as described above. There were many things. However, with the rapid integration of semiconductor devices, the observation of ultra-fine shapes that are no longer possible with the resolution of SEM, the observation of internal structures that cannot be observed with SEM in principle, It has become necessary to perform not only the observation of the structure but also the composition analysis thereof. For this reason, it is increasingly active to observe the shape and structure with a transmission electron microscope (hereinafter abbreviated as TEM) with higher resolution than SEM, and to evaluate the composition with secondary ion mass spectrometry, etc. for the presence of these defects. Have been doing. Further, along with the increase in added value due to the increase in size of wafers and the miniaturization of devices, it has become necessary to carry out removal of adhered foreign substances and correction of pattern defects in parallel with the determination of their positions.

JP-A-5-258703 JP 59-160948 A JP 63-218803 A

  As described above, in today's semiconductor integrated circuit device manufacturing technology field, an increase in the size of a wafer is progressing in step with the progress of high integration of circuit patterns. Therefore, inspection of a defect (foreign matter, pattern defect, etc.) on a wafer requires inspection over a wider area with higher resolution. As described above, in order to increase the resolution of appearance inspection, it is inevitably necessary to move from an inspection method using light to an inspection method using an electron beam. In this appearance inspection using an electron beam, a scanned image of secondary electrons (hereinafter referred to as an SEM image) is acquired at a speed several thousand to 10,000 times higher than that in a conventional SEM, and a foreign matter is obtained using the SEM image. And defect detection such as pattern defects. As described above, Japanese Patent Application Laid-Open No. 59-160948 discloses a method for speeding up circuit pattern inspection using an SEM image by using both electron beam scanning and continuous stage movement. By using a high-current electron optical system, a high-speed deflection / image acquisition mechanism, and the like in combination with such a method, high-speed acquisition of SEM images as described above can be realized.

  Further, there are further technical problems in performing the observation, analysis evaluation, foreign matter removal and pattern defect correction as described above for the defect portion extracted by the appearance inspection apparatus. It is a sample for observation and analysis even though the position of micron-sized or even minute defects can be detected with the same degree of accuracy as the appearance inspection device, especially the electron beam type appearance inspection device. It is very difficult to perform fabrication or processing for foreign substance removal and defect correction with the same positional accuracy as described above. Furthermore, there is a practical problem that much time and technical skill are required for the preparation and processing of the sample.

  In the following, a sample preparation technique for observing and analyzing the above-described defect portion will be described using a method for preparing a sample for TEM observation as an example. When the sample to be observed is a wafer, first, a mark is made on the region to be observed, and the wafer surface is cleaved with a diamond pen or the like without breaking the observation region, or divided using a dicing saw. In this way, two strip-shaped pellets are prepared, and both are bonded so that their observation regions face each other, thereby preparing a bonded sample. Next, this bonded sample is sliced with a diamond cutter, and the slice sample is cut out. The size of this slice sample is generally about 3 mm × 3 mm × 0.5 mm. Further, the slice sample is thinly polished on a polishing board using an abrasive to prepare a polished sample having a thickness of about 20 μm, and the polished sample is fixed on a single-hole TEM holder mounted on a TEM stage. . Then, ion polishing is performed by irradiating one or both surfaces of the polished sample with an ion beam. When a hole is formed in the center of the sample, the ion beam irradiation is stopped to obtain a sample for TEM observation. In this way, a TEM observation was performed on a region having a thickness of about 100 nm or less around the hole in the center of the sample. In the method as described above, when a portion that needs to be observed is specified at a micron level, it is very difficult to locate the observation portion.

  Conventionally, focused ion beam (hereinafter abbreviated as FIB) processing has been used as another method for producing a TEM sample. In this method, first, a strip-shaped pellet including a region to be observed is cut out by dicing. The size of the pellet is generally about 3 mm × 0.5 mm × 0.5 mm. Next, this strip-shaped pellet is fixed on a TEM sample holder made of a thin metal piece having a semi-circular shape. The observation region in the strip-shaped pellet is irradiated with FIB to form a wall-shaped flake portion (wall portion) having a thickness of about 100 nm (hereinafter referred to as wall processing). Then, a TEM holder holding the wall-processed pellet is mounted on a TEM stage, and TEM observation is performed using the wall portion as an observation region. This method makes it possible to locate the observation location at the micron level. However, there is a problem that FIB processing takes a very long time, and furthermore, although it can be positioned at a micron level in principle, highly technical skill is required to actually perform this. is required.

As described above, the conventional wafer inspection technology has the following problems.
(1) Coordinate problem: Even if the inspection of the whole surface of the wafer or a part of the wafer is performed by an appearance inspection apparatus and the coordinates of the defective part where foreign matter or pattern defect exists are clarified at the micron level, In order to perform sample preparation for analysis or processing for removing foreign substances or correcting defects, the inspected wafer must be transferred manually or automatically from the inspection position to the processing position. Therefore, even if accurate coordinate data of the defective portion is obtained by the above defect inspection, the positional accuracy cannot be fully utilized at the time of processing, and extra processing including a portion that is not originally required for processing can be performed. It was inevitable.
(2) Wafer condition problem: Even if a defect can be detected at a certain position as a result of inspecting the whole surface of the wafer or a part of it by an appearance inspection apparatus, for the purpose of observing and analyzing the defective portion, removing foreign matters, correcting defects, etc. If the wafer is transferred to another location, a new defect (foreign matter, etc.) will be generated, or the defect (foreign matter, etc.) that has been focused on will disappear, or another new defect (pattern damage, etc.) will occur. ), And it becomes impossible to observe and analyze the target defect portion.
(3) Problem of wafer breakage: Recently, the diameter of the wafer has increased to 200 mm, and since there is a tendency to further increase the diameter from 300 mm to more than that, only a few wafers on which many devices with high added value are mounted It is gradually becoming unacceptable from the viewpoint of production cost that it is separated by cutting or cleaving for inspection of a part and finally disposed as a disposal.

  The present invention has been made in view of the problems in the prior art as described above, and the object of the present invention is to perform a high-speed and high-resolution appearance inspection for defects existing on the wafer, and Based on the defect position information (coordinate data) on the wafer obtained by appearance inspection, it is complicated for a long time to accurately process or extract the part where the defect exists while maintaining the wafer shape. It is an object of the present invention to provide a wafer inspection apparatus that can be performed simply, reliably, and consistently without performing work.

  In order to achieve the above object, according to the present invention, a wafer inspection apparatus having the following configuration and functions is provided.

  First, an SEM image obtained by electron beam irradiation is used for appearance inspection for detecting foreign matters, circuit pattern defects, and the like present on the wafer. As described above, appearance inspection with high resolution is possible by SEM image observation. In addition, by using a continuous stage moving mechanism, a high-current electron optical system, a high-speed deflection / image acquisition mechanism, and the like, high-speed acquisition of an SEM image can be realized. In addition, a plurality of electron beams can be used for acquiring an SEM image. Therefore, the inspection speed can be further improved.

  Furthermore, in the present invention, a sample for TEM observation or various analysis is accurately extracted or detected from the position (defect location) where the defect (foreign matter, pattern defect, etc.) detected by the appearance inspection is present. In order to perform defect correction (removal of foreign matter, correction of pattern defects, etc.), the inspected wafer is mounted on the same stage as that used for inspection in the same apparatus as the SEM image observation apparatus used for visual inspection described above. The detected defect portion is processed or extracted in the state where it is placed.

  According to the wafer inspection apparatus of the present invention having the above-described configuration, based on the positional information (coordinate data) regarding the defect location that has been clarified as a result of the appearance inspection by the SEM image observation described above, for observation and analysis of these defect locations. A sample can be produced with high positional accuracy, or processing for correcting these defective portions can be performed. Further, since the above correction process can be performed without destroying the entire wafer as in the prior art, it is not necessary to discard an expensive large-diameter wafer for inspection.

  That is, the wafer inspection apparatus of the present invention can perform a high-resolution appearance inspection by SEM image observation at a high speed, and also prepare samples for observation and analysis of defect locations detected by this appearance inspection, The combined inspection apparatus is configured so that processing for correction processing can be performed consistently with high positional accuracy.

  As described above in detail, according to the present invention, the wafer is inspected and processed together on the same stage, whereby the wafer is transferred from the inspection apparatus to the processing apparatus and processed based on the coordinate data transferred together. Compared with the conventional method, the processing position accuracy is remarkably improved, and the required processing range can be greatly reduced and limited as compared with the conventional method. As a result, since the required amount of processing has been reduced, the processing time is shortened, processing-induced contamination is reduced, and the generation of new defects due to processing can be minimized. Similarly to the above, it is possible to improve the positional accuracy of the evaluation by performing the inspection and the evaluation together on the same stage.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<Example 1>
FIG. 1 shows a basic configuration of a wafer inspection apparatus according to an embodiment of the present invention. In FIG. 1, an SEM unit 1 includes an electron generator including a field emission electron source, an electronic scanning device including an electrostatic deflection system, an electron converging device including an electrostatic lens system, and a detection device including a semiconductor detector. It is composed of five. From the SEM unit 1, the converged electron beam 6 is scanned in one direction and irradiated onto the wafer 7. The wafer 7 is fixedly held on a stage 8 to which a retarding voltage can be applied. As the stage 8 is moved in the in-plane direction by the stage driving device 9, the wafer 7 is relatively two with respect to the SEM unit 1. Move in the dimension direction. Here, among the moving directions of the stage 8, the moving direction perpendicular to the scanning direction of the electron beam 6 is referred to as a continuous moving direction, and the moving direction parallel to the scanning direction of the electron beam 6 is referred to as a feeding direction. Secondary electrons generated in the electron beam 6 irradiated portion immediately below the SEM unit 1 are detected by the detection device 5, and a secondary electron signal is sent to the image generation device 11. The image generation device 11 generates a secondary electron image (SEM image) of the region from a signal corresponding to a predetermined inspection region width among the secondary electron signals while the stage 8 is moving in the continuous movement direction. Then, the image analysis apparatus 12 detects defects (foreign matter, pattern defects, etc.) using this SEM image, and further, position information (coordinate data) of locations (defect locations) where these defects exist on the wafer 7. ) Is generated. The operation of each part of these devices is optimally controlled by the inspection control device 13. In particular, in the inspection control device 13, the stage control device 10 is controlled so that the entire inspection region on the wafer 7 can be inspected thoroughly by the SEM unit 1.

  The machining control device 105 moves the stage 8 so that the machining site determined by the operator based on the coordinate data included in the defect map is directly below the machining unit 201 installed side by side with the SEM unit 1. An instruction is issued to the stage controller 10. Then, in the processing unit 201, processing of the processing site, characteristic evaluation, and the like (hereinafter collectively referred to as processing) are performed using an energy beam, a probe, or the like. The above inspection and processing are performed by the system controller 112 controlling the apparatus in an integrated manner.

  In this way, by performing inspection and processing together on the same stage 8, the wafer 7 is transferred from the inspection apparatus to the processing apparatus, and compared with the conventional method of performing processing based on the coordinate data transferred together. The processing position accuracy has been significantly improved, and the processing range can be greatly reduced and limited. As a result, the required amount of processing has been greatly reduced, so that processing time has been shortened, processing-induced contamination has been reduced, and the occurrence of new damage due to processing has been minimized.

  The combination of inspection and processing on the same stage makes it possible to fully utilize the high positional accuracy even when the positional accuracy in the inspection is very high. In the case of a significant effect. However, it goes without saying that this method can be effectively used for inspection by an inspection apparatus using other energy beams such as light.

<Example 2>
Next, another embodiment of the present invention will be described with reference to FIG. In FIG. 2, an SEM unit 1 includes an electron generator including a field emission electron source, an electronic scanning device including an electrostatic deflection system, an electron converging device including an electrostatic lens system, and a detection device including a semiconductor detector. It is composed of five. The SEM unit 1 is provided with N sets (4 sets in the embodiment of FIG. 2; N = 4), and the electron beam 6 converged from each set is irradiated onto the wafer 7 while being scanned in one direction. The The wafer 7 is fixedly held on a stage 8 to which a retarding voltage can be applied. As the stage 8 moves in the in-plane direction by the stage driving device 9, the wafer 7 is two-dimensionally relative to the SEM unit 1. Move in the direction. Here, as in the case of the first embodiment, among the moving directions of the stage 8, the moving direction perpendicular to the scanning direction of the electron beam 6 is the continuous moving direction, and the moving direction parallel to the scanning direction of the electron beam 6 is set. It will be referred to as the feed direction. Secondary electrons generated in the electron beam 6 irradiated portion immediately below the SEM unit 1 are detected by the detection device 5, and a secondary electron signal is sent to the image generation device 11. The image generation device 11 generates a secondary electron image (SEM image) of the region from a signal corresponding to the inspection region width of each SEM unit 1 among the secondary electron signals that the stage 8 is moving in the continuous movement direction. To do. Then, the image analysis apparatus 12 detects defects (foreign matter, pattern defects, etc.) using this SEM image, and further, position information (coordinates) of the locations (defect locations) where these defects exist on the wafer 7. Data) is generated. The operation of each part of these devices is optimally controlled by the inspection control device 13. In particular, in the inspection control device 13, the entire inspection area on the surface of the wafer 7 is covered by a plurality of sets of SEM units 1, and N times when using one set of SEM units 1 (four times in the case of this embodiment). The stage control device 10 is controlled so that the inspection can be performed at a speed of).

  Further, in FIG. 2, an ion beam unit 101 installed side by side with a plurality of SEM units 1 includes an ion beam generation device 102 including an ion beam source, an ion beam scanning device 103 including an electrostatic deflection system, and an electrostatic lens. The system includes an ion beam focusing device 104 including the system. The defect map generated by the image analysis device 12 is transferred to the processing control device 105 via the inspection control device 13. The processing control device 105 gives an instruction to move the stage 8 so that the observation site determined by the operator based on the coordinate data included in the defect map is directly below the ion beam unit 101. . Then, using the focused ion beam 106 from the ion beam unit 101, the manipulator 107 having a high-precision fine movement mechanism, and the gas from the gas supply device 108, the observation site determined by the above-described procedure can be observed with a TEM or the like. Samples for various analyzes are extracted and fixed on the manipulator 107.

  Here, in addition to the sample extraction described above, foreign matter removal by the ion beam 106, writing of a marker for indicating the location of the foreign matter or pattern defect, and ions from the gas supply device 108 are used. It is also possible to correct pattern defects by assist deposition.

  Then, the manipulator 107 that holds and holds the sample is carried to a position directly below the second ion beam unit 101 installed outside the stage 8 by the manipulator moving device 113 controlled by the manipulator control device 111. Then, the sample is transferred onto the sample holder 109, and the sample is processed for observation and analysis of the defective portion.

  Next, the above-described sample preparation procedure will be described with reference to FIG. 3, taking as an example the case of preparing a thin film sample for TEM observation. First, the ion beam 106 is irradiated to the periphery of the observation region 110 from the ion beam unit 101, and the periphery of the observation region 110 is shaved until the small piece including the observation region 110 is connected to the wafer 7 only at one end thereof (see FIG. FIG. 3 a, b, c). Next, ion beam-assisted bonding is performed with the bonding gas from the gas supply device 108 and the ion beam 106 with the tip of the manipulator 107 in contact with the upper surface of the small piece, and the small piece is fixed to the tip of the manipulator 107 (FIG. 3 d). Then, the connection portion of the small piece with the wafer 7 is separated by the ion beam 106 (e in FIG. 3). Thereby, the small piece including the observation site 110 can be extracted from the wafer 7 with high positional accuracy. The manipulator 107 is driven to move the small piece from above the wafer 7 onto the sample holder 109 just below the second ion beam portion 101 (f, g in FIG. 3), and ion beam assisted bonding is performed again there, and the small piece is obtained. Is fixed to the tip of the sample holder 109 (h in FIG. 3). Further, after the manipulator 107 is separated from the above-mentioned small piece by the ion beam 106 (i in FIG. 3), the observation site 110 is thinned by the ion beam 106 (j in FIG. 3), whereby a target thin film for TEM observation is obtained. The sample is completed with the sample holder 109 fixedly held at the tip. The sample preparation procedure described above is advanced by controlling the ion beam unit 101, the manipulator control device 111, the gas supply device 108, the stage control device 10 and the like in FIG.

  Next, the wafer inspection procedure described so far will be described with reference to FIG. When the inspection is started, an appearance inspection is first performed using the electron beam 6 to detect the positions of foreign matters and pattern defects on the wafer 7 to generate the above-described defect map. This result is provided to the operator of the apparatus as defect data. At the same time, the operator determines an observation site based on the defect map. Then, for the determined observation site, sample extraction from the wafer 7 and processing for sample preparation for observation / analysis are sequentially performed by the ion beam 106, thereby completing the preparation of the sample that can be attached to the observation / analysis apparatus. . The above inspection procedure is performed by integrated control by the system controller 112 in FIG.

<Example 3>
Still another embodiment of the present invention will be described with reference to FIG. In FIG. 5, an SEM unit 1 includes an electron generator including a field emission electron source 2, an electronic scanning device including an electrostatic deflection system, an electron converging device including an electrostatic lens system 4, and a detection device including a semiconductor detector. It is composed of five. The SEM unit 1 is provided with N sets (4 sets in this embodiment; N = 4), and the electron beam 6 converged from each set is scanned in one direction and irradiated onto the wafer 7. The wafer 7 is fixedly held on a stage 8 to which a retarding voltage can be applied, and relative to the SEM unit 1 as the stage 8 is moved in the in-plane direction by the stage driving device 9. Move in two dimensions. Here, as in the first and second embodiments, among the movement directions of the stage 8, the movement direction perpendicular to the scanning direction of the electron beam 6 is the continuous movement direction, and the movement direction parallel to the scanning direction of the electron beam 6. Is the feed direction. Secondary electrons generated in the portion irradiated with the electron beam 6 immediately below the SEM unit 1 are detected by the detection device 5, and a secondary electron signal is sent to the image generation device 11. The image generation device 11 generates a secondary electron image (SEM image) of the area from the signal corresponding to the inspection area width of each SEM unit 1 among the secondary electron signals that the stage 8 is moving in the continuous movement direction. To do. Then, the image analyzer 12 detects foreign matter and pattern defects on the wafer 7 using this SEM image, and further, the position of the foreign matter or defect on the wafer 7 (defect location). A defect map including information (coordinate data) is generated. The operation of each part of these devices is optimally controlled by the inspection control device 13. In particular, in the inspection control apparatus 13, the entire inspection area on the wafer 7 is reduced by a plurality of sets of SEM units 1, and N times when using one set of SEM units (in this example, 4 times). The stage controller 10 is controlled so that the inspection can be performed at a speed of The above apparatus configuration is the same as that of the second embodiment of the present invention described with reference to FIG.

  In FIG. 5, an ion beam unit 101 installed side by side with a plurality of sets of SEM units 1 includes an ion beam generation device 102 including an ion beam source, an ion beam scanning device 103 including an electrostatic deflection system, and an electrostatic lens system. It is comprised from the ion beam converging apparatus 104 containing these. The defect map generated by the image analysis device 12 is transferred to the processing control device 105 via the inspection control device 13. The processing control device 105 issues an instruction to the stage control device 10 to move the stage 8 so that the observation site determined by the operator based on the coordinate data included in the defect map is directly below the ion beam unit 101. Then, using the ion beam 106 from the ion beam unit 101, the manipulator 107 having a high-precision fine movement mechanism, and the gas from the gas supply device 108, the observation site determined by the above procedure is used for observation with a TEM or the like. A sample for analysis is extracted and fixedly held on the sample holder 109.

  In the present embodiment, extraction of the sample from the wafer 7, fixation to the sample holder 109, and processing of the sample for observation and analysis are performed consistently on the stage 8 using the same ion beam unit 101. Do. Note that the above inspection and processing are performed by the system controller 112 controlling the apparatus in an integrated manner. In this embodiment, since the apparatus configuration is simplified compared to the embodiment shown in FIG. 2, even if the processing procedure described above is adopted, it is useful when contamination and damage of the wafer 7 are not particularly problematic. It is.

<Reference example>
FIG. 6 shows a reference example related to the present invention. In FIG. 6, an SEM unit 1 includes an electron generator including a field emission electron source, an electronic scanning device including an electrostatic deflection system, an electron converging device 4 including an electrostatic lens system, and a detection device including a semiconductor detector. It is composed of five. The electron beam 6 converged from the SEM unit 1 is scanned in one direction and irradiated onto the wafer 7. The wafer 7 is fixedly held on a stage 8 to which a retarding voltage can be applied, and is relative to the SEM unit 1 as the stage 8 is moved in the plane of the stage 8 by the stage driving device 9. Moved in a two-dimensional direction. Here, as in the case of the first to third embodiments, the movement direction perpendicular to the scanning direction of the electron beam 6 among the movement directions of the stage 8 is the continuous movement direction, and the movement is parallel to the scanning direction of the electron beam 6. The direction is referred to as the feeding direction. Secondary electrons generated in the electron beam 6 irradiated portion immediately below the SEM unit 1 are detected by the detection device 5, and a detected secondary electron signal is sent to the image generation device 11. The image generation device 11 generates a secondary electron image (SEM image) corresponding to the region width from a signal corresponding to a predetermined inspection region width among the secondary electron signals while the stage 8 is moving in the continuous movement direction. Then, the image analysis apparatus 12 detects defects (foreign matter, pattern defects, etc.) using the SEM image, and further generates a defect map including position information (coordinate data) of these defects on the wafer 7. . The operation of each part of these devices is optimally controlled by the inspection control device 13. In particular, in the inspection control device 13, the stage control device 10 is controlled so that the required inspection area on the wafer 7 can be thoroughly inspected by the SEM unit 1.

  In addition, the electrical characteristic / probe force evaluation apparatus 301 includes a probe 302 having a fine movement mechanism in which an evaluation part determined by an operator based on coordinate data included in a defect map is effectively placed side by side with the SEM unit 1. The stage controller 10 is instructed to move the stage 8 so that it is directly below. Under precise position control by the position control device 303, the probe 302 comes into contact with the evaluation site to detect the electrical characteristics of the same site, or approaches the very vicinity of the evaluation site and approaches the probe 302 and the evaluation site. It is used to detect the force acting between the two. Further, a heating device 304 is attached to the probe 302, and by controlling this with the heating control device 305, the temperature and temperature of the tip of the probe 302 are changed. It is possible to set to a value necessary for this. With these mechanisms, it is possible to evaluate the electrical characteristics, surface shape, and dimensions of the evaluation part, and also to perform heating correction of the part with high positional accuracy. Note that the above inspection and evaluation are performed by the system controller 112 controlling the apparatus in an integrated manner.

  The present invention has been described with reference to various embodiments. However, in the present invention, the SEM unit 1 and the processing unit 201 are installed in the same apparatus, and the inspection by the SEM unit 1 and the processing by the processing unit 201 are performed. As long as the configuration of the apparatus is such that the evaluation can be performed with the wafer 7 placed on the same stage, the configuration is not limited to the above-described embodiment, and any other configuration and function are provided. Needless to say, the present invention can be applied in exactly the same manner as in the above-described embodiment. In addition, the SEM unit 1 includes an electron generator including an electron source other than a field emission type, an electronic scanning device including a deflection system other than an electrostatic type, an electron converging device including a lens system other than an electrostatic type, and detection other than a semiconductor. Needless to say, even if the detection apparatus includes a detector, it can be implemented in exactly the same manner as in the above embodiment. Further, in the case where a plurality of sets of SEM units 1 are used, only the case of four sets has been described in the above embodiment, but it is needless to say that other sets can be used.

1 is a diagram showing a basic configuration of a wafer inspection apparatus according to a first embodiment of the present invention. The figure which shows the basic composition of the wafer inspection apparatus which becomes the 2nd Example of this invention. The figure explaining the function and operation | movement of the apparatus which become the above-mentioned 2nd Example. The figure explaining the test | inspection and the process sequence by the apparatus which become above-described 2nd Example. The figure which shows the basic composition of the wafer inspection apparatus which becomes the 3rd Example of this invention. The figure which shows the basic composition of the reference example regarding this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... SEM part, 2 ... Electron generator, 3 ... Electron scanning device, 4 ... Electron convergence apparatus, 5 ... Detection apparatus, 6 ... Electron beam, 7 ... Wafer, 8 ... Stage, 9 ... Stage drive device, 10 ... Stage Control device, 11 ... Image generation device, 12 ... Image analysis device, 13 ... Inspection control device, 101 ... Ion beam unit, 102 ... Ion beam generation device, 103 ... Ion beam scanning device, 104 ... Ion beam focusing device, 105 ... Processing control device 106 ... Ion beam 107 ... Manipulator 108 ... Gas supply device 109 ... Sample holder 110 ... Observation site 111 ... Manipulator control device 112 ... System control device 113 ... Manipulator moving device 201 ... Processing , 301 ... Electrical characteristic / probe force evaluation device, 302 ... Probe, 303 ... Position control device, 304 ... Heating device, 3 5 ... heating controller.

Claims (9)

A stage on which the wafer is placed;
A scanning electron microscope unit that irradiates the wafer placed on the stage with an electron beam;
A sample for observing and analyzing the foreign matter or defect with a transmission electron microscope is prepared in a vacuum sample chamber, having at least an ion beam portion that is processed by irradiating an ion beam around the foreign matter or defect of the wafer. An electron beam and ion beam irradiation device,
  Furthermore, a secondary electron detector that detects secondary electrons generated by electron beam irradiation,
An image generating device for generating a secondary electron image from the secondary electron signal;
An image analysis device that detects the foreign matter or defect of the wafer from the secondary electron image and generates a defect map including position coordinate data where the foreign matter or defect exists;
Based on the defect map, processing the sample containing the foreign matter and defects by irradiation of the ion beam to the wafer on the stage,
A manipulator that moves the sample separated from the wafer;
An electron beam and ion beam irradiation apparatus comprising: a sample holder for holding the separated sample in the vacuum sample chamber. The electron beam and ion beam irradiation apparatus according to claim 1, comprising a plurality of the scanning electron microscope units. 3. The electron beam and ion beam irradiation apparatus according to claim 2, further comprising means for generating a plurality of secondary electron images corresponding to each of the plurality of scanning electron microscope units. apparatus. 2. The electron beam and ion beam irradiation apparatus according to claim 1, wherein the stage moves in a two-dimensional direction relative to the scanning electron microscope unit. 2. The electron beam and ion beam irradiation apparatus according to claim 1, wherein the scanning electron microscope unit and the ion beam unit are arranged side by side. 2. The electron beam and ion beam irradiation apparatus according to claim 1, wherein the ion beam unit includes an ion beam generation apparatus that generates the ion beam, an ion beam scanning apparatus that scans the ion beam, and the ion beam. And an ion beam irradiation apparatus. 2. The electron beam and ion beam irradiation apparatus according to claim 1, wherein the scanning electron microscope unit includes an electron beam generating unit that emits the electron beam, an electron beam scanning unit that scans the electron beam, and the electron beam. An electron beam and ion beam irradiation apparatus, comprising: an electron beam converging unit that converges; and a detection unit that detects secondary electrons generated by irradiating the electron beam on a wafer. The electron beam and ion beam irradiation apparatus according to claim 1, further comprising a gas supply device that supplies a gas for fixing the sample to the manipulator. A scanning electron microscope that irradiates the wafer on the stage with an electron beam;
A sample preparation method in a vacuum sample chamber by an electron beam and an ion beam irradiation apparatus having at least an ion beam portion for performing processing by irradiating the wafer with an ion beam,
Generating a secondary electron image including foreign matter and defects of the wafer on the stage by an electron beam ;
Generating a defect map including the position coordinate data of the foreign matter and the defect;
Irradiating the wafer with an ion beam so as to separate a small sample including foreign matter and defects determined based on the position coordinate data included in the defect map from the wafer on the stage;
Moving the small piece sample relative to the sample holder in the vacuum sample chamber by a manipulator installed in the vacuum sample chamber;
Fixing and holding the small sample on the sample holder in the vacuum sample chamber;
And a step of processing the small piece sample into a thin piece that can be observed and analyzed by a transmission electron microscope.

Images