JP4800759B2 - Manufacturing method of electronic tag and protective case suitable for the manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing an electronic tag that accommodates and protects electronic components such as a coil antenna and an IC chip, and a protective case suitable for the method.

  Patent Document 1 discloses a method in which an electronic component is accommodated in a protective case made of synthetic resin and then the protective case is covered with a resin mold. As for forming such a protective case, as shown in Patent Document 2, after the molten resin is injected into the mold and cooled and solidified, the protective case is protruded from the mold with the protruding pin arranged in the mold.

Japanese Patent Laid-Open No. 10-26934 (FIGS. 2 and 3) Japanese Patent Laid-Open No. 11-42684 (FIG. 1)

  In the protective case, burrs remain where the protruding pins hit. When this burr appears on the outer surface of the protective case, there is a problem in that the appearance of the protective case is deteriorated.

  In Patent Document 1, an electronic component such as a coil antenna is accommodated in a concave portion of a protective case and fixed with a curable resin. However, when a curable resin or the like is attached to a coil antenna, the frequency characteristics change. There is a risk.

  As a countermeasure, electronic parts are accommodated in the case body, and the electronic parts are accommodated and held in the protective case by superimposing the cover body vertically on the case body. It is conceivable that the lid is fixed to the case body by covering with a resin mold. According to this, it is not necessary to attach curable resin etc. to an electronic component.

  When the case main body and the lid body are molded, if the protruding pin hits the contact surface between the case main body and the lid body, the burr due to the protruding pin does not appear on the outer surface of the protective case. However, since burr is generated on the contact surface, a gap is generated between the case main body and the lid body due to the burr, and moisture enters the protective case through the gap. In addition, when the resin mold is molded, the molten resin may enter the protective case, which may cause heat damage of the electronic component.

  Accordingly, an object of the present invention is to provide a method for manufacturing an electronic tag in which burrs caused by protruding pins do not appear on the outer surface of the protective case, and a protective case suitable for the manufacturing method. In addition, an object of the present invention is to provide a method for manufacturing an electronic tag in which no gap is generated between the case main body and the lid by the burr, and a protective case suitable for the method.

Resin in the manufacturing method of the electronic tag to which the present invention is directed comprises a case main body 7 formed in the body molding die 13 as shown in FIGS. 4 and 6, the cover 9 formed by the cover mold 23 A protective case 1 is formed , and an electronic component such as an IC chip 3 is accommodated in the protective case 1 as shown in FIG. A plurality of main body side protrusions 10 project from the peripheral edge portion 7 b of the case main body 7. A plurality of lid-side projections 15 project from the peripheral edge portion 9 b of the lid body 9.

In the case of molding the case main body 7 , the case main body 7 is protruded from the main body molding die 13 by applying the protruding pin 11 disposed on the main body molding die 13 to the main body side protrusion 10 . Further, in forming the lid body 9, the lid body 9 is projected from the lid molding die 23 by applying the projecting pin 16 disposed on the lid molding die 23 to the lid-side protrusion 15 .

The outer surface of the protective case 1 including the main body side protrusion 10 and the lid side protrusion 15 can be covered with a resin mold 2 as shown in FIG. The resin mold 2 here includes one that covers the entire protective case 1 and one that covers a part of the outer periphery such as the side surface of the protective case 1, and further includes a main body side protrusion 10 and a lid side protrusion 15. What covers the whole and what covers a part of the main body side protrusion 10 and the lid side protrusion 15 are included.

  Specifically, the resin case main body 7 is formed with the main body molding die 13 shown in FIG. 4, the resin lid body 9 is molded with the lid molding die 23 shown in FIG. As shown in the figure, the case body 7 and the lid body 9 after molding are stacked one on top of the other and assembled in a temporarily assembled state, and then at least the side surface of the temporarily assembled product is covered with the resin mold 2 as shown in FIG.

In forming the case main body 7, as shown in FIGS. 4 and 5, the main body side protrusion 10 is formed to protrude from the case main body 7, and the protrusion pin 11 disposed on the main body forming mold 13 is applied to the main body side protrusion 10. Te, to project the case main body 7 from the main mold 13. Further, as shown in FIGS. 6 and 7, in forming the lid body 9, the lid-side protrusion 15 is formed to protrude from the lid body 9, and the protruding pin 16 disposed on the lid-molding mold 23 is applied to the lid-side protrusion 15. Then, the lid body 9 is protruded from the lid molding die 23. The main body side protrusion 10 and the lid side protrusion 15 are arranged on the outer peripheral surface of the case main body 7 and the lid body 9, and include cases where the main body side protrusion 10 and the lid side protrusion 15 are arranged on the outer peripheral side surface.

  More specifically, when the case main body 7 and the lid body 9 are temporarily stacked and temporarily assembled, the main body side protrusion 10 and the lid side protrusion 15 are arranged so that the main body side protrusion 10 and the lid side protrusion 15 do not overlap vertically. The position of is set.

  The main body side protrusion 10 and the lid side protrusion 15 can each be covered with the resin mold 2. The resin mold 2 here covers the entire temporary assembly made up of the case body 7 and the lid 9 and covers a part of the outer periphery such as the side surface of the temporary assembly, as described above. In addition, the main body side protrusion 10 and the lid side protrusion 15 are entirely covered, and the main body side protrusion 10 and the lid side protrusion 15 are partially covered.

The protective case of the electronic tag targeted by the present invention is suitable for the manufacturing method described above. As shown in FIG. 2, the case main body 7 molded with the main body molding die 13 and the lid molding die 23 are used. The molded lid body 9 is assembled by stacking up and down. A body-side protrusion 10 is formed on the peripheral edge 7b of the case body 7 so as to project the protruding pin 11 disposed on the main body molding die 13, and a lid molding die is provided on the peripheral edge 9b of the lid 9. A lid-side projection 15 is formed so as to project against the projection pin 16 disposed on the projection 23.

  As shown in the above-described manufacturing method, the main body side protrusion 10 and the lid side protrusion 15 are arranged so that the main body side protrusion 10 and the lid side protrusion 15 do not overlap vertically when the case main body 7 and the lid body 9 are vertically stacked. The position is set. Furthermore, the outer surfaces of the case main body 7 including the main body side protrusion 10 and the case main body 7 including the cover side protrusion 15 are covered with the resin mold 2 in a state where the case main body 7 and the lid body 9 are vertically stacked. .

According to the present invention, the projecting pins 11 and 16 are applied to the main body side projection 10 and the lid side projection 15 to project the case main body 7 from the main body molding die 13, and the lid body 9 from the lid molding die 23. Since it protrudes, it is prevented that the burr | flash by the protrusion pins 11 and 16 appears on the outer surface of the protective case 1, and it prevents that the external appearance of the protective case 1 becomes bad by a burr | flash. When the outer surface of the protective case 1 is covered with the resin mold 2, the main body side protrusion 10 and the lid side protrusion 15 can position the protective case 1 with the mold.

When the outer surface of the protective case 1 including the body-side projections 10 and the cover-side projections 15 are covered with the resin mold 2, in terms of such waterproof protection case 1 by the resin mold 2 can be reduced, become inconspicuous said both projections 10, 15 The appearance of the protective case 1 is improved.

  If the main body side protrusion 10 and the lid side protrusion 15 are set so as not to overlap each other, the burr 17 generated on the main body side protrusion 10 by the protrusion pin 11 hits the lid side protrusion 15 or the protrusion pin 16 causes the cover side The burr 19 generated on the protrusion 15 is prevented from hitting the main body side protrusion 10. Therefore, the burrs 17 and 19 prevent a gap from being formed between the case body 7 and the lid body 9, so that the case body 7 and the lid body 9 can be securely adhered to each other, and the protective case 1 can be reliably waterproofed. I can plan.

  As described above, since there is no gap between the case body 7 and the lid body 9, when the outer surfaces of the case body 7 and the lid body 9 are covered with the resin mold 2, the case body 7 and the lid body 9 It is possible to prevent the molten resin for molding the resin mold 2 from entering the protective case 1 from the gap, and reliably prevent the electronic component from being thermally damaged.

  Furthermore, since the main body side protrusion 10 and the lid side protrusion 15 do not overlap each other, the flow path cross-sectional area of the molten resin in the molding die 20 of the resin mold 2 is partially narrowed by the protrusions 10 and 15. This prevents the molten resin from being filled quickly in the entire mold 20.

(Embodiment 1) FIGS. 1 to 11 show Embodiment 1 of an electronic tag manufacturing method and a protective case suitable for the manufacturing method according to the present invention. As shown in FIG. A protective case 1 made of synthetic resin and a resin mold 2 that is coated on the outer surface of the protective case 1 are included.

  The protective case 1 has a thickness of 3 mm or less and is formed in a square shape. In the protective case 1, a film substrate 5 on which electronic components such as an IC chip 3 and a coil antenna shown in FIG. It is designed to be accommodated. The protective case 1 includes a case main body 7 in which an accommodation space 6 for accommodating the film substrate 5 is formed, and a lid body 9 that closes an upper end opening of the accommodation space 6 of the case main body 7.

  The protective case 1 is made of glass fiber reinforced polyphenylene sulfide (PPS) resin and contains 50% or more of the glass fiber. The protective case 1 may be a PPS resin containing 50% glass fiber and an inorganic additive. The resin mold 2 is formed of the same resin as the protective case 1 such as PPS resin or the same resin system. For example, when the protective case 1 is a PPS resin containing 50% glass fiber, the case where a PPS resin containing 30% glass fiber is set as the resin mold 2 corresponds to the same resin system.

  As shown in FIG. 5, the housing body 6 has the housing space 6 recessed in an upper surface 7 a facing the lid body 9, and a plurality of the housing bodies 7 shown in FIG. 2 outward from the side surface of the peripheral edge portion 7 b of the case body 7. A semicircular body-side protrusion 10 is formed to protrude. As shown in FIG. 4, the projecting pins 11 for projecting the case main body 7 from the main body molding die 13 respectively contact the upper surface of each main body side projection 10.

  As shown in FIG. 5, the peripheral portion 7b of the case body 7 has a small vertical thickness, and a space is formed below the peripheral portion 7b. When the molten resin for molding the resin mold 2 enters this space, the contact area between the case body 7 and the resin mold 2 is increased, and the adhesion of the resin mold 2 to the case body 7 is improved. The vertical thickness of each main body side protrusion 10 is made equal to the vertical thickness of the peripheral edge portion 7b.

  7 has a lower surface 9a facing the case body 7, and a plurality of semicircular lid-side protrusions 15 shown in FIG. 2 are formed outward from the side surface of the peripheral edge 9b of the lid 9. Protrusions are formed. As shown in FIG. 6, a protrusion pin 16 for protruding the lid body 9 from the lid molding die 23 hits the upper surface of each lid-side protrusion 15.

  The peripheral portion 9b of the lid body 9 has a small vertical thickness, and a space is formed above the peripheral portion 9b. When the molten resin for molding the resin mold 2 enters the space, the contact area between the lid body 9 and the resin mold 2 is increased, and the adhesion of the resin mold 2 to the lid body 9 is improved. The vertical thickness of each lid-side protrusion 15 is equal to the vertical thickness of the peripheral edge portion 9b as shown in FIG.

  As shown in FIG. 1, locking portions 12 are provided on a pair of sides facing each other in the protective case 1. As shown in FIG. 2, each locking portion 12 is disposed on the case main body 7 so that the projection 12 a protrudes upward, and the locking portion 12 is disposed on the lid 9 so that the projection 12 a is fitted therein. It comprises a lid-side locking portion 12c that is locked in a temporary locking shape.

  The film substrate 5 is accommodated in the accommodating space 6 of the case body 7, and the lid body 9 is overlaid on the upper side of the case body 7, so that the protrusions 12 a of the case body 7 are formed on the lid body 9 as shown in FIG. It fits in each lid side latching | locking part 12c, is each latched in the shape of a temporary stop, and is assembled in the temporary assembly state shown in FIG. Thereafter, the side surface of the temporary assembly is covered with the resin mold 2. The main body side protrusions 10 of the case main body 7 and the lid side protrusions 15 of the lid body 9 are arranged with their positions shifted so as not to overlap each other in the temporarily assembled state of FIG. 1 (see FIG. 8). .

  That is, as shown in FIG. 5, burrs 17 are generated on the upper surface of each main body side protrusion 10 of the case body 7 due to the pushing of the protruding pin 11, and on the upper surface of each cover side protrusion 15 of the lid body 9, FIG. As shown in FIG. 2, a burr 19 is generated by the pushing of the protruding pin 16.

  For this reason, if the main body side protrusion 10 of the case body 7 and the cover side protrusion 15 of the lid body 9 are arranged so as to overlap vertically, the burr 17 of the main body side protrusion 10 hits the lower surface of the lid side protrusion 15 and the case main body 7. A gap is generated between the lid 9 and the lid 9. Then, when the resin mold 2 is molded, the molten resin 25 (FIG. 10) enters the protective case 1 from the gap, causing damage to the electronic components. As described above, the main body side protrusions 10 and the lid side protrusions 15 are set so as not to overlap each other, so that the upper surface 7a of the case main body 7 and the lower surface 9a of the lid body 9 can be reliably adhered to each other. . Further, since the main body side protrusion 10 and the lid side protrusion 15 do not overlap vertically, the flow passage cross-sectional area of the molten resin in the mold 20 (FIG. 9) is partially narrowed by the protrusions 10 and 15. Is prevented.

  The resin mold 2 is molded through the following preparation process, pre-stage process, molding process, and post-treatment process.

(Preparation process) The protection case 1 of the temporarily assembled state of FIG. 1 is mounted | worn in the internal space of the shaping | molding metal mold | die 20 of the resin mold 2, as shown in FIG. At this time, the main body side protrusions 10 and the lid side protrusions 15 position the protective case 1 in the vertical and horizontal directions in the mold 20. The upper and lower surfaces of the protective case 1 are positioned by being sandwiched between the upper and lower surfaces of the internal space of the mold 20.

(Pre-stage Step) As shown in FIGS. 10 and 11, the lower mold 20a and the upper mold 20b of the mold 20 are joined and fixed. The lower mold 20 a has a plurality of protruding pins 22 arranged on the inner surface of the protective case 1 facing the lower surface of the case body 7.

(Molding process) As shown in FIG. 9 and FIG. 10, gates (side gates) 21 and 21 are arranged on the mold 20 at positions facing two opposite sides of the protective case 1, respectively. Each gate 21 is injected into the internal space of the mold 20 at the same timing and is held in pressure.

  That is, since the electronic tag is thin, the molten resin injected into the mold 20 is quickly solidified, and if only one gate 21 is provided, insufficient filling of the molten resin occurs. By arranging the pair of gates 21 and 21 so as to face each other across the protective case 1, the flow path length of the molten resin can be shortened, and the flow path length of the molten resin injected from both the gates 21 and 21 is almost the same. It is equally possible to fill quickly and properly throughout the interior space of the mold 20.

(Post-processing step) After the molten resin in the mold 20 is solidified, the lower mold 20a and the upper mold 20b are separated, and the electronic tag (see FIG. 3) after the molding of the resin mold 2 is formed by the protruding pin 22 It protrudes from the opened lower mold 20a. After this, the model number is engraved on the outer surface of the electronic tag with a laser or the like. On the outer surface of the electronic tag, a label, predetermined printing, or the like is arranged as necessary.

(Example 2) In Example 2, as shown in FIG. 12, the electronic tag is formed in a flat coin shape, and the case body 7 and the lid body 9 of the protective case 1 are respectively circular as shown in FIG. It is formed into a shape. Four body-side projections 10 project from the peripheral edge 7 b of the case body 7, and four lid-side projections 15 project from the peripheral edge 9 b of the lid 9.

  Even in the second embodiment, each main body side projection 10 of the case main body 7 and each lid side projection 15 of the lid body 9 of the protective case 1 do not overlap each other in the temporarily assembled state of FIG. The positions are shifted in the circumferential direction. Since the other points are the same as those of the first embodiment, description thereof is omitted.

  When the lower surface of the case main body 7 is covered with the resin mold 2, the main body side protrusion 10 may be formed to protrude from the lower surface of the case main body 7. When the upper surface of the lid body 9 is covered with the resin mold 2, the lid-side protrusion 15 may be formed to protrude from the upper surface of the lid body 9.

  The electronic tag may have a flat elliptical shape, a rectangular shape, a triangular shape, or the like, or may have a circular through hole at the center. The electronic tag may be provided with terminals for connection with an external device on the upper and lower surfaces thereof.

The perspective view of the protective case which concerns on the electronic tag of Example 1 Exploded perspective view of protective case Perspective view of electronic tag The perspective view which shows the relationship between a case main body and a protrusion pin BB sectional view of FIG. The perspective view which shows the relationship between a cover body and a protrusion pin CC sectional view of FIG. AA line sectional view of FIG. A plan view showing a state where a protective case is mounted in a mold DD sectional view of FIG. EE sectional view of FIG. The perspective view of the electronic tag of Example 2 The perspective view of the protective case of Example 2

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Protective case 2 Resin mold 7 Case main body 7a Upper surface 7b Peripheral part 9 Lid 9a Lower surface 9b Peripheral part 10 Main body side protrusion 11 * 16 Extrusion pin 12 Locking part 13 Main body shaping | molding die 15 Lid side protrusion 17 * 19 Burr 20 Mold 21 Gate 23 Mold for lid molding

Claims (6)

Body mold formation (13) the case body (7), forming a lid mold lid body formed in (23) (9) and de resin protective case (1), protection A method of manufacturing an electronic tag for housing an electronic component in a case (1), comprising:
A plurality of main body side protrusions (10) are formed to protrude from the peripheral edge (7b) of the case main body (7),
A plurality of lid-side protrusions (15) are formed to protrude from the peripheral edge (9b) of the lid (9),
In molding the case main body (7), the projecting pin (11) disposed on the main body molding die (13) is applied to the main body side projection (10) so that the main body molding die (13) Protruding the case body (7)
In the molding of the lid (9), projecting pins which arranged on the cover mold (23) to (16) against the cover-side projection (15), from the cover mold (23) A method for manufacturing an electronic tag, characterized by protruding the lid (9) . The method of manufacturing an electronic tag according to claim 1, wherein an outer surface of the protective case (1) including the main body side protrusion (10) and the lid side protrusion (15) is covered with a resin mold (2). A case body (7) made of resin is molded with the mold for main body molding (13), a lid body made of resin (9) is molded with the mold for molding lid (23), and the case body (7) after molding And a lid (9) are vertically assembled and assembled into a temporarily assembled state, and thereafter, at least a side surface of the temporarily assembled product is covered with a resin mold (2), and the electronic tag manufacturing method comprises:
In the molding of the case main body (7), the main body side protrusion (10) is formed to protrude from the case main body (7), and the protrusion pin (11) arranged on the main body molding die (13) is connected to the main body side protrusion (10 ) And project the case body (7) from the body molding die (13),
In forming the lid body (9), a lid-side protrusion (15) is formed in a protruding manner on the lid body (9), and an ejection pin (16) arranged on the lid-molding mold (23) is used as a lid-side protrusion (15). ) in against, and projecting the lid (9) from the lid mold (23),
When the case body (7) and the lid body (9) are vertically stacked and temporarily assembled, the body side protrusion (10) and the lid side protrusion (15) do not overlap vertically. And the lid-side protrusion (15) are set in positions . The method for manufacturing an electronic tag according to claim 3, wherein the main body side protrusion (10) and the lid side protrusion (15) are each covered with a resin mold (2) . An electronic tag protective case in which a case body (7) molded with a main body molding die (13) and a lid body (9) molded with a lid molding die (23) are stacked one on top of the other.
The peripheral part (7b) of the case main body (7) has a plurality of main body side protrusions (10) protruding from the protrusion pins (11) arranged on the main body molding die (13).
A plurality of lid-side projections (15) projectingly formed on the peripheral edge portion (9b) of the lid body (9) and hitting an ejection pin (16) disposed on the lid molding die (23) are formed.
When the case body (7) and the lid body (9) are vertically stacked and temporarily assembled, the body side protrusion (10) and the lid side protrusion (15) do not overlap vertically. A protective case for an electronic tag, wherein the positions of the projection and the lid-side protrusion (15) are set . The outer surface of the case main body (7) including the main body side protrusion (10) and the case main body (7) including the cover side protrusion (15) in a state where the case main body (7) and the cover body (9) are vertically stacked. The protective case for an electronic tag according to claim 5, wherein each of the protective cases is coated with a resin mold (2) .

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