JP4793989B2 - Gold alloy wire for bonding wire with high initial bondability, high bond reliability and high roundness of crimped ball - Google Patents

Gold alloy wire for bonding wire with high initial bondability, high bond reliability and high roundness of crimped ball Download PDF

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JP4793989B2
JP4793989B2 JP2006089892A JP2006089892A JP4793989B2 JP 4793989 B2 JP4793989 B2 JP 4793989B2 JP 2006089892 A JP2006089892 A JP 2006089892A JP 2006089892 A JP2006089892 A JP 2006089892A JP 4793989 B2 JP4793989 B2 JP 4793989B2
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一誠 牧
有治 中田
昌芳 長尾
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Tanaka Denshi Kogyo KK
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Description

利用分野Field of use

この発明は、広い温度範囲で使用することができるトランジスタ、ＬＳＩ、ＩＣなど半導体素子のチップ電極と外部リード部とを接続するための高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線に関するものであり、このボングワイヤ用金合金線は２３μｍ以下の線径を有するものである。   The present invention provides a high initial bonding property, a high bonding reliability and a high roundness of a press-bonded ball for connecting a chip electrode of a semiconductor element such as a transistor, LSI, and IC that can be used in a wide temperature range and an external lead part. This gold alloy wire for bonding wire has a wire diameter of 23 μm or less.

近年、トランジスタ、ＬＳＩ、ＩＣなど半導体素子は、広い温度範囲で使用されるようになっている。例えば、高周波用ＩＣなどは動作温度がますます高くなる傾向にあり、かかる高温を含む広い温度環境下に曝されても高度の信頼性が要求されている。   In recent years, semiconductor elements such as transistors, LSIs, and ICs have been used in a wide temperature range. For example, high-frequency ICs and the like tend to have higher operating temperatures, and high reliability is required even when exposed to a wide temperature environment including such high temperatures.


かかる広い温度範囲の環境下で使用されるＩＣチップ上の電極と外部リード部を接続するボンディングワイヤ用金合金線として、Ｐｄ：０．１〜０．８質量％を含有し、Ｃａ，Ｂｅ，Ｇｅおよび希土類元素の内の少なくとも１種を合計でＡｐｐｍ、Ｓｒ，Ｂａ，Ｉｎ，Ｓｎ，Ｔｉの内の少なくとも１種を合計でＢｐｐｍとした場合、Ａ＋Ｂ：３〜１００ｐｐｍとなるように含有し、残部がＡｕおよび不可避不純物からなる成分組成を有するボンディングワイヤ用金合金線が知られている（特許文献１参照）。この従来のボンディングワイヤ用金合金線はいずれも白金族金属を多めに含有させて高温での圧着ボールとＡｌパッドの接合強度を向上させ、さらに硬さを高くしてループの安定性を向上させており、これらボンディングワイヤ用金合金線を使用してＩＣチップ上の電極と外部リード部を接続するには、一般に金合金線を超音波併用熱圧着ボンディングする方法が主として用いられている。
特許第３０８５０９０号明細書
As a gold alloy wire for bonding wire that connects an electrode on an IC chip and an external lead part used in an environment of such a wide temperature range, it contains Pd: 0.1 to 0.8% by mass, Ca, Be, When a total of at least one of Ge and rare earth elements is Appm and at least one of Sr, Ba, In, Sn, and Ti is Bppm in total, A + B is contained so as to be 3 to 100 ppm, There is known a gold alloy wire for bonding wires having a component composition consisting of Au and inevitable impurities in the balance (see Patent Document 1). All of these conventional gold alloy wires for bonding wires contain a large amount of platinum group metal to improve the bonding strength between the press-bonded ball and the Al pad at high temperature, and further increase the hardness to improve the loop stability. In order to connect the electrode on the IC chip and the external lead portion using the gold alloy wire for bonding wire, generally, a method of bonding the gold alloy wire by ultrasonic thermocompression bonding is mainly used.
Japanese Patent No. 3085090


近年、半導体素子の集積化が進むことにより、ボンディングワイヤ用金合金線には下記の特性が一層強く求められている。

（イ）半導体素子のＡｌパッド面積が小さくなり、Ａｌパッド上へのボールボンディング時において従来よりも低温かつ小さい接合面積で、良好な初期接合性（Ａｌパッド上へのボールボンディング時における圧着ボールのＡｌパッドからの剥がれ難さ）を得ること。
（ロ）半導体素子のＡｌパッド面積が小さくなっており、ボールボンディングでの圧着ボールの真円性が低いと、圧着ボールの一部がＡｌパッドからはみ出し、隣の圧着ボールと接触することによるショート不良が発生し、このショート不良は、Ａｌパッド面積の縮小により益々発生しやすくなることから、従来よりも圧着ボールが高い真円性を有すること。

（ハ）高温の過酷な使用環境で高度の信頼性が要求される車載用ＩＣや、動作温度が高くなる高周波用ＩＣなどでは、ボールボンディングによる接合界面における接合強度の低下や電気抵抗の上昇による接合不良の発生が問題視されており、これらの接合不良は、上記の低温接合や接合面積の縮小等のボンディング条件の悪化により、益々発生しやすくなる傾向があるため、従来よりも高い接合信頼性（ある環境下でのボールボンディングによる接合界面における接合強度や電気抵抗の持続性）を確保すること。
（ニ）ボンディング時にＡｌパッドを損傷しないこと。
In recent years, with the progress of integration of semiconductor elements, the following characteristics are further strongly demanded for gold alloy wires for bonding wires.

(A) The Al pad area of the semiconductor element is reduced, and the initial bondability of the press-bonded ball at the time of ball bonding onto the Al pad is improved with a lower bonding area and lower bonding area than before when ball bonding onto the Al pad. To obtain the difficulty of peeling from the Al pad).
(B) When the Al pad area of the semiconductor element is small and the roundness of the press-bonded ball in ball bonding is low, a part of the press-bonded ball protrudes from the Al pad and comes into contact with the adjacent press-bonded ball. A defect occurs, and this short-circuit defect is more likely to occur due to the reduction of the Al pad area, so that the press-bonded ball has a higher roundness than before.

(C) For in-vehicle ICs that require high reliability in high-temperature harsh usage environments, and high-frequency ICs that have high operating temperatures, this is due to a decrease in bonding strength or an increase in electrical resistance due to ball bonding. The occurrence of bonding defects is regarded as a problem, and these bonding defects tend to be more likely to occur due to deterioration of bonding conditions such as the above-described low-temperature bonding and reduction of the bonding area. Ensuring the durability (bonding strength and durability of electrical resistance at the bonding interface by ball bonding in a certain environment).
(D) Do not damage the Al pad during bonding.

しかし、前記従来のボンディングワイヤ用金合金線は、前記要求をある程度満たすものの、ボンディングして得られた圧着ボールの中には歪んだ円形の圧着ボールが生成することがあり、圧着ボールがすべて真円となるような真円性が一層高いボンディングワイヤ用金合金線が求められていた。   However, although the conventional gold alloy wire for bonding wire satisfies the above requirements to some extent, a distorted circular pressure-bonded ball may be generated in the pressure-bonded ball obtained by bonding. There has been a demand for a gold alloy wire for bonding wires having a higher roundness that is a circle.

そこで、本発明者らは、高い初期接合性、高い接合信頼性およびＡｌパッドの非損傷性に優れるとともに、さらに圧着ボールが歪んだ円形となることなくすべて真円となるような一層高い真円性を有するボンディングワイヤ用金合金線を開発すべく研究を行った。その結果、イリジウム（Ｉｒ）が圧着ボールの真円性に大きく影響を及ぼし、Ｐｔおよび／またはＰｄの内の１種または２種を合計で２０００ｐｐｍ〜２質量％、Ｓｒ：１〜５０ｐｐｍ、Ｂｅ：１〜５０ｐｐｍを含有した金合金にさらにＩｒ：１〜２００ｐｐｍを含有させた金合金線は、これを用いてボンディングを行うと、高い初期接合性、高い接合信頼性およびＡｌパッドの非損傷性に優れるとともに、さらに歪んだ円形の圧着ボールの生成がなくなり、すべて円形となって一層真円性の高いボンディングワイヤ用金合金線を得ることができる、という研究結果が得られたのである。   Therefore, the present inventors have a higher roundness that is excellent in high initial joining property, high joining reliability, and non-damaging property of the Al pad, and that the pressure-bonded ball becomes a perfect circle without becoming a distorted circle. Research was conducted to develop a gold alloy wire for bonding wires that has the characteristics. As a result, iridium (Ir) greatly affects the roundness of the press-bonded ball, and one or two of Pt and / or Pd are combined in a total of 2000 ppm to 2% by mass, Sr: 1 to 50 ppm, Be: A gold alloy wire containing Ir: 1 to 200 ppm in addition to a gold alloy containing 1 to 50 ppm is bonded to the gold alloy wire, so that high initial bondability, high bonding reliability, and non-damage of Al pads are obtained. The result of the research was that it was excellent and the generation of a further distorted circular press-bonded ball was eliminated, and a gold alloy wire for bonding wire having a higher roundness could be obtained.

この発明は、かかる研究結果に基づいて成されたものであって、
（１）ＰｔおよびＰｄの内の１種または２種を合計で２０００ｐｐｍ〜２質量％、
Ｉｒ：１〜２００ｐｐｍ、
Ｓｒ：１〜５０ｐｐｍ、
Ｂｅ：１〜５０ｐｐｍ、
を含有し、残りがＡｕおよび不可避不純物からなる成分組成を有する高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線、に特徴を有するものである。
The present invention has been made based on such research results,
(1) A total of 2000 ppm to 2% by mass of one or two of Pt and Pd,
Ir: 1 to 200 ppm,
Sr: 1 to 50 ppm,
Be: 1 to 50 ppm,
And the remainder is characterized by high initial bondability having a component composition consisting of Au and inevitable impurities, high bonding reliability, and a gold alloy wire for bonding wires having a high roundness of a press-bonded ball.


前記（１）記載のボンディングワイヤ用金合金線には、さらに、必要に応じて、Ｃａ：１〜５０ｐｐｍ、またはＥｕ、Ｌａ、Ｙの内の少なくとも１種を合計で：１〜８０ｐｐｍ、またはＣａ：１〜５０ｐｐｍおよびＥｕ、Ｌａ、Ｙの内の少なくとも１種を合計で：１〜８０ｐｐｍを含有させることができる、という研究結果が得られたのである。したがって、この発明は、
（２）ＰｔおよびＰｄの内の１種または２種を合計で２０００ｐｐｍ〜２質量％、
Ｉｒ：１〜２００ｐｐｍ、
Ｓｒ：１〜５０ｐｐｍ、
Ｂｅ：１〜５０ｐｐｍを含有し、
さらに、Ｃａ：１〜５０ｐｐｍを含有し、残りがＡｕおよび不可避不純物からなる成分組成を有する高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線、
（３）ＰｔおよびＰｄの内の１種または２種を合計で２０００ｐｐｍ〜２質量％、
Ｉｒ：１〜２００ｐｐｍ、
Ｓｒ：１〜５０ｐｐｍ、
Ｂｅ：１〜５０ｐｐｍを含有し、
さらに、Ｅｕ、Ｌａ、Ｙの内の少なくとも１種を合計で：１〜８０ｐｐｍを含有し、残りがＡｕおよび不可避不純物からなる成分組成を有する高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線、
（４）ＰｔおよびＰｄの内の１種または２種を合計で２０００ｐｐｍ〜２質量％、
Ｉｒ：１〜２００ｐｐｍ、
Ｓｒ：１〜５０ｐｐｍ、
Ｂｅ：１〜５０ｐｐｍを含有し、
さらに、Ｃａ：１〜５０ｐｐｍを含有し、
さらに、Ｅｕ、Ｌａ、Ｙの内の少なくとも１種を合計で：１〜８０ｐｐｍを含有し、残りがＡｕおよび不可避不純物からなる成分組成を有する高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線、に特徴を有するものである。
In the gold alloy wire for bonding wire described in the above (1), if necessary, Ca: 1 to 50 ppm, or at least one of Eu, La, and Y in total: 1 to 80 ppm, or Ca The result of the study was that 1 to 50 ppm and at least one of Eu, La and Y can be contained in a total of 1 to 80 ppm. Therefore, the present invention
(2) One or two of Pt and Pd in total 2000 ppm to 2% by mass,
Ir: 1 to 200 ppm,
Sr: 1 to 50 ppm,
Be: contains 1 to 50 ppm,
Furthermore, a gold alloy wire for bonding wire having a high initial bondability, a high bond reliability, and a high roundness of a press-bonded ball having a component composition comprising Ca: 1 to 50 ppm and the remainder consisting of Au and inevitable impurities,
(3) A total of 2000 ppm to 2% by mass of one or two of Pt and Pd,
Ir: 1 to 200 ppm,
Sr: 1 to 50 ppm,
Be: contains 1 to 50 ppm,
Further, at least one of Eu, La, and Y in total: 1 to 80 ppm in total, the remainder having a component composition consisting of Au and inevitable impurities, high initial bondability, high bonding reliability, and high pressure-bonded ball Gold alloy wire for bonding wire with roundness,
(4) One or two of Pt and Pd in total 2000 ppm to 2% by mass,
Ir: 1 to 200 ppm,
Sr: 1 to 50 ppm,
Be: contains 1 to 50 ppm,
Furthermore, it contains Ca: 1-50 ppm,
Further, at least one of Eu, La, and Y in total: 1 to 80 ppm in total, the remainder having a component composition consisting of Au and inevitable impurities, high initial bondability, high bonding reliability, and high pressure-bonded ball It is characterized by a gold alloy wire for bonding wire having roundness.


この発明のボンディングワイヤ用金合金線に含まれるＳｒ、Ｂｅ、Ｃａ、Ｅｕ、Ｌａ、Ｙは、１０ｐｐｍ≦Ｓｒ、Ｂｅ、Ｃａ、Ｅｕ、Ｌａ、Ｙの合計≦１００ｐｐｍでかつ１／６≦Ｂｅ／（Ｓｒ、Ｃａ、Ｅｕ、Ｌａ、Ｙの合計）≦３の条件を満たす範囲内にあることが一層高い初期接合性および接合信頼性を有するようになるので一層好ましい、という研究結果が得られたのである。
Sr, Be, Ca, Eu, La, and Y contained in the gold alloy wire for bonding wire of the present invention are 10 ppm ≦ Sr, Be, Ca, Eu, La, and Y ≦ 1 ppm ≦ 1/6 ≦ Be / (Sr, Ca, Eu, La, Y) (Sum, Ca, Eu, La, Y) is within the range that satisfies the condition of ≦ 3. It is.

この発明は、かかる研究結果に基づいてなされたものであって、

（５）前記ＳｒおよびＢｅは、１０ｐｐｍ≦ＳｒおよびＢｅの合計≦１００ｐｐｍでかつ１／６≦Ｂｅ／Ｓｒ≦３の条件を満たす範囲内にある前記（１）記載の高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線、

（６）前記Ｓｒ、ＢｅおよびＣａは、１０ｐｐｍ≦Ｓｒ、ＢｅおよびＣａの合計≦１００ｐｐｍでかつ１／６≦Ｂｅ／（ＳｒおよびＣａの合計）≦３の条件を満たす範囲内にある前記（２）記載の高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線、
（７）前記Ｓｒ、Ｂｅ、Ｅｕ、ＬａおよびＹは、１０ｐｐｍ≦Ｓｒ、Ｂｅ、Ｅｕ、Ｌａ、Ｙの合計≦１００ｐｐｍでかつ１／６≦Ｂｅ／（Ｓｒ、Ｅｕ、Ｌａ、Ｙの合計）≦３の条件を満たす範囲内にある前記（３）記載の高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線、

（８）前記Ｓｒ、Ｂｅ、Ｃａ、Ｅｕ、Ｌａ、Ｙは、

１０ｐｐｍ≦Ｓｒ、Ｂｅ、Ｃａ、Ｅｕ、Ｌａ、Ｙの合計≦１００ｐｐｍでかつ１／６≦Ｂｅ／（Ｓｒ、Ｃａ、Ｅｕ、Ｌａ、Ｙの合計）≦３の条件を満たす範囲内にある前記（４）記載の高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線、に特徴を有するものである。
The present invention has been made based on the results of such research,

(5) The high initial bondability and the high bond according to (1), wherein the Sr and Be are within a range satisfying the condition of 10 ppm ≦ Sr and Be ≦ 100 ppm and 1/6 ≦ Be / Sr ≦ 3 Gold alloy wire for bonding wire with high reliability and high roundness of crimped ball,

(6) The Sr, Be, and Ca are within a range that satisfies the condition of 10 ppm ≦ total of Sr, Be, and Ca ≦ 100 ppm and 1/6 ≦ Be / (total of Sr and Ca) ≦ 3 (2 ) Gold alloy wire for bonding wire having high initial bondability, high bond reliability and high roundness of crimped ball,
(7) Sr, Be, Eu, La and Y are 10 ppm ≦ total of Sr, Be, Eu, La, Y ≦ 100 ppm and 1/6 ≦ Be / (total of Sr, Eu, La, Y) ≦ A gold alloy wire for bonding wire having high initial bondability, high bond reliability, and high roundness of a press-bonded ball according to the above (3), which is in a range satisfying the condition of 3.

(8) The Sr, Be, Ca, Eu, La, and Y are

10 ppm ≦ total of Sr, Be, Ca, Eu, La, Y ≦ 100 ppm and within the range satisfying the condition of 1/6 ≦ Be / (total of Sr, Ca, Eu, La, Y) ≦ 3 ( 4) A gold alloy wire for bonding wire having high initial bondability, high bonding reliability, and high roundness of a press-bonded ball as described above.


前記（１）、（２）、（３）、（４）、（５）、（６）、（７）または（８）記載のボンディングワイヤ用金合金線に、さらにＡｇ：１〜1０ｐｐｍを含有させた成分組成を有しても良い。したがって、この発明は、

（９）さらにＡｇ：１〜１０ｐｐｍを含有する前記（１）〜（８）の内のいずれかに記載の高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線、に特徴を有するものである。
The gold alloy wire for bonding wire according to (1), (2), (3), (4), (5), (6), (7) or (8) further contains Ag: 1 to 10 ppm You may have the made component composition. Therefore, the present invention

(9) For bonding wires having high initial bondability, high bonding reliability, and high roundness of a press-bonded ball according to any one of (1) to (8), further containing Ag: 1 to 10 ppm It is characterized by a gold alloy wire.

次に、この発明の高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線において、その成分組成を前述のように限定した理由を説明する。
Next, the reason why the component composition of the gold alloy wire for bonding wire having the high initial bonding property, high bonding reliability, and high roundness of the press-bonded ball according to the present invention is limited as described above will be described.

（ａ）Ｐｔ、Ｐｄ：
ＰｔおよびＰｄは、共にＡｕと全率固溶する元素であり、圧着ボールとＡｌパッドとの接合強度の劣化を抑えることができるという接合信頼性を向上させる効果を有する。接合界面近傍でＰｔやＰｄを含む相が層状に生成し、その相がＡｕの拡散速度を低下させる層(いわゆるＡｕ拡散に対するバリア層)として作用するために、Ａｕの拡散に伴い接合部に発生するボイドの生成速度を抑制し、その結果として、圧着ボールとＡｌパッドとの接合強度の劣化を抑えて接合信頼性を向上しているものと考えられる。この接合強度の劣化の抑制（接合信頼性を向上する）効果はＰｔやＰｄの量が多いほど高くなる。すなわち、ＰｔおよびＰｄの内の１種または２種の合計が２０００ｐｐｍ未満では接合強度劣化の抑制効果が限定されるので好ましくなく、一方、ＰｔおよびＰｄの内の１種または２種の合計が２質量％を越えて含まれると、ボールの硬度が高くなりすぎてボンディング時にＩＣチップの割れやＡｌパッドに損傷を与えるようになり、さらに初期接合性も低下するので好ましくない。したがって、ＰｔおよびＰｄの内の１種または２種の合計を２０００ｐｐｍ〜２質量％に定めた。
(A) Pt, Pd:
Pt and Pd are both elements that are solid-dissolved with Au, and have the effect of improving the bonding reliability that can suppress the deterioration of the bonding strength between the press-bonded ball and the Al pad. A phase containing Pt and Pd is formed in the vicinity of the bonding interface, and the phase acts as a layer that reduces the diffusion rate of Au (so-called barrier layer against Au diffusion). It is considered that the generation rate of voids to be suppressed is suppressed, and as a result, deterioration of the bonding strength between the press-bonded ball and the Al pad is suppressed to improve the bonding reliability. The effect of suppressing the deterioration of the bonding strength (improving the bonding reliability) becomes higher as the amount of Pt or Pd increases. That is, if the total of one or two of Pt and Pd is less than 2000 ppm, it is not preferable because the effect of suppressing deterioration in bonding strength is limited. On the other hand, the total of one or two of Pt and Pd is 2 If the content exceeds 50% by mass, the hardness of the ball becomes too high, and the IC chip is cracked or the Al pad is damaged during bonding, and the initial bondability is also deteriorated. Therefore, the total of one or two of Pt and Pd was set to 2000 ppm to 2% by mass.

（ｂ）Ｉｒ：
Ｉｒは、金合金の高温における粒成長(結晶粒の粗大化)を抑制する作用を有し、そのため、フリーエアボールを形成する際に、ボール部からの熱の影響により、ボール直上のワイヤ部(熱影響部)の結晶粒が粗大化することを防ぐと共に、凝固したフリーエアボール部は多数の微細な結晶粒から形成され、接合時に圧着ボールが放射状に均等に広がり、圧着ボールの真円性を向上させる効果を有するが、Ｉｒの含有量が１ｐｐｍ未満では所定の効果が得られず、一方、ＰｔおよびＰｄのうちの1種または２種を合計で２０００ｐｐｍ〜２質量％を含有するボンディングワイヤ用金合金線においてＩｒが２００ｐｐｍを超えても上記効果は飽和し、添加による効果の明確な向上が認められない上に、ボールの硬度が高くなり、ＩＣチップの破壊あるいは損傷が生じるようになるので好ましくない。したがって、Ｉｒの含有量を１〜２００ｐｐｍに定めた。
(B) Ir:
Ir has an effect of suppressing grain growth (crystal grain coarsening) at a high temperature of the gold alloy. Therefore, when forming a free air ball, the wire portion directly above the ball is affected by the influence of heat from the ball portion. In addition to preventing the crystal grains in the (heat-affected zone) from becoming coarse, the solidified free air ball part is formed of a large number of fine crystal grains, and the crimped balls spread radially and evenly during bonding, resulting in a perfect circle of the crimped balls. Bonding that has the effect of improving the properties, but the desired effect cannot be obtained if the Ir content is less than 1 ppm, while one or two of Pt and Pd contains 2000 ppm to 2 mass% in total. Even if Ir exceeds 200 ppm in the gold alloy wire for wire, the above effect is saturated, the effect of the addition is not clearly improved, the ball hardness is increased, and the IC chip is broken. Undesirably it becomes as damage occurs. Therefore, the content of Ir is set to 1 to 200 ppm.

（ｃ）Ｓｒ：

アルカリ土類金属であるＳｒは、金属結合半径がＡｕの金属結合半径より大きく、Ａｕの結晶格子に歪みを与えて、ボンディングワイヤ用金合金線の機械的強度およびフリーエアボールの加工硬化性を高め、さらに再結晶温度を上げ、金合金線のループ高さを低くする効果があるが、Ｓｒの含有量が１ｐｐｍ未満では高い初期接合性が得られず、さらに高い信頼性が得られない場合が多い。すなわち、フリーエアボールの加工硬化性が低いことから、ボンディング時にＡｌパッドが十分に塑性変形できず、したがってＡｌパッドの酸化皮膜が完全に破壊されず、Ａｌ新生面の生成面積が減少することから、Ａｌパッドと圧着ボールの接合面積が減少し、初期接合性と接合信頼性が低下するので好ましくない。一方、Ｓｒが５０ｐｐｍを越えて含有すると、ボールボンディングの際に形成するフリーエアボールの表面に多量の酸化物が生成し、さらにフリーエアボールの底部中央の接合に寄与できない大きな引け巣が形成され、ボールボンディングの初期接合性と接合信頼性が低下するので好ましくない。したがって、Ｓｒの含有量を1〜５０ｐｐｍに定めた。 (C) Sr:

Sr, an alkaline earth metal, has a metal bond radius larger than the metal bond radius of Au, strains the crystal lattice of Au, and improves the mechanical strength of the gold alloy wire for bonding wires and the work hardenability of free air balls. Although it has the effect of increasing the recrystallization temperature and lowering the loop height of the gold alloy wire, if the Sr content is less than 1 ppm, high initial bondability cannot be obtained, and even higher reliability cannot be obtained. There are many. That is, since the work hardenability of the free air ball is low, the Al pad cannot be sufficiently plastically deformed at the time of bonding, and therefore the oxide film of the Al pad is not completely destroyed, and the generation area of the Al new surface is reduced. The bonding area between the Al pad and the press-bonded ball is decreased, and the initial bonding property and bonding reliability are deteriorated. On the other hand, if the Sr content exceeds 50 ppm, a large amount of oxide is generated on the surface of the free air ball formed at the time of ball bonding, and a large shrinkage nest that cannot contribute to the bonding at the center of the bottom of the free air ball is formed. This is not preferable because the initial bonding property and bonding reliability of ball bonding are deteriorated. Therefore, the content of Sr is set to 1 to 50 ppm.


（ｄ）Ｂｅ：
Ｂｅは金属結合半径がＡｕの金属結合半径より小さく、やはりＡｕの結晶格子に歪みを与えて、ボンディングワイヤ用金合金線の機械的強度ならびにフリーエアボールの加工硬化性を高め、再結晶温度を下げる効果を有することから、ループ高さを上げることができ、そのため適切なループ高さを実現できるので添加するが、その添加量が１ｐｐｍ未満では高い初期接合性が得られず、さらに高い信頼性が得られない場合が多い。すなわち、フリーエアボールの加工硬化性が低いことから、ボンディング時にＡｌパッドが十分に塑性変形できず、したがってＡｌパッドの酸化皮膜が完全に破壊されず、Ａｌ新生面の生成面積が減少することから、Ａｌパッドと圧着ボールの接合面積が減少し、初期接合性と接合信頼性が低下するので好ましくない。一方、Ｂｅを５０ｐｐｍを越えて含有させると、フリーエアボールの表面に多量の酸化物が生成し、さらにフリーエアボールの底部中央に接合に寄与できない大きな引け巣が形成されるため、フリーエアボールの初期接合性と接合信頼性が低下し、さらに、ボール直上部及びボール部の結晶粒径の増大が生じて圧着ボール部の真円性が低下するので好ましくない。したがって、Ｂｅの含有量を１〜５０ｐｐｍに定めた。
(D) Be:
Be has a metal bond radius smaller than that of Au and also distorts the crystal lattice of Au, increasing the mechanical strength of the gold alloy wire for bonding wire and the work hardenability of the free air ball, and increasing the recrystallization temperature. Because it has the effect of lowering, the loop height can be raised, so that an appropriate loop height can be realized, so it is added. However, if the addition amount is less than 1 ppm, high initial joining properties cannot be obtained, and further high reliability Is often not obtained. That is, since the work hardenability of the free air ball is low, the Al pad cannot be sufficiently plastically deformed at the time of bonding, and therefore the oxide film of the Al pad is not completely destroyed, and the generation area of the Al new surface is reduced. The bonding area between the Al pad and the press-bonded ball is decreased, and the initial bonding property and bonding reliability are deteriorated. On the other hand, when Be exceeds 50 ppm, a large amount of oxide is generated on the surface of the free air ball, and a large shrinkage nest that cannot contribute to bonding is formed at the center of the bottom of the free air ball. In this case, the initial bondability and the bonding reliability are reduced, and the crystal grain size of the ball upper part and the ball part is increased, and the roundness of the press-bonded ball part is lowered. Therefore, the content of Be is set to 1 to 50 ppm.

（ｅ）Ｃａ：
アルカリ土類金属であるＣａは、金属結合半径がＡｕの金属結合半径より大きく、Ａｕの結晶格子に歪みを与えて、ボンディングワイヤ用金合金線の機械的強度ならびにフリーエアボールの加工硬化性を高め、さらに再結晶温度を上げ、金合金線のループ高さを低くする効果があるので必要に応じて添加するが、Ｃａの含有量が１ｐｐｍ未満では所定の効果が得られないので好ましくなく、一方、Ｃａの含有量が５０ｐｐｍを越えると、ボールボンディングの際にフリーエアボールの表面に多量の酸化物が生成し、さらにフリーエアボールの底部中央に接合に寄与できない大きな引け巣が形成されるため、ボールボンディングの初期接合性と接合信頼性が低下するので好ましくない。したがって、Ｃａの含有量を１〜５０ｐｐｍに定めた。
(E) Ca:
Ca, an alkaline earth metal, has a metal bond radius larger than the metal bond radius of Au, strains the Au crystal lattice, and improves the mechanical strength of the gold alloy wire for bonding wires and the work hardening of free air balls. Increase, further increase the recrystallization temperature, lower the loop height of the gold alloy wire is added as necessary, but if the Ca content is less than 1 ppm, it is not preferable because the predetermined effect cannot be obtained, On the other hand, if the Ca content exceeds 50 ppm, a large amount of oxide is generated on the surface of the free air ball during ball bonding, and a large shrinkage cavity that cannot contribute to bonding is formed at the center of the bottom of the free air ball. For this reason, the initial bondability and bonding reliability of ball bonding are deteriorated, which is not preferable. Therefore, the content of Ca is set to 1 to 50 ppm.

（ｆ）Ｅｕ，Ｌａ，Ｙ：
希土類元素であるＥｕ，Ｌａ，Ｙは、金属結合半径がＡｕの金属結合半径より大きく、Ａｕの結晶格子に歪みを与えて、ボンディングワイヤ用金合金線の機械的強度ならびにフリーエアボールの加工硬化性を高めるとともに、再結晶温度を上げ、金合金線のループ高さを低くする効果があるので必要に応じて添加するが、Ｅｕ，Ｌａ，Ｙの含有量が１ｐｐｍ未満では所望の効果が得られず、一方、Ｅｕ，Ｌａ，Ｙの含有量が８０ｐｐｍを越えると、ボールボンディングの際に形成するフリーエアボールの表面に多量の酸化物が生成し、さらにフリーエアボールの底部中央に接合に寄与できない大きな引け巣が形成されるため、ボールボンディングの初期接合性と接合信頼性が低下するので好ましくない。したがって、Ｅｕ，Ｌａ，Ｙの含有量を１〜８０ｐｐｍに定めた。
(F) Eu, La, Y:
Eu, La, and Y, which are rare earth elements, have a metal bond radius larger than that of Au, strain the Au crystal lattice, and mechanical strength of gold alloy wire for bonding wire and work hardening of free air balls It is effective in increasing the recrystallization temperature and lowering the loop height of the gold alloy wire, and is added as necessary. However, if the content of Eu, La, Y is less than 1 ppm, the desired effect is obtained. On the other hand, if the content of Eu, La, and Y exceeds 80 ppm, a large amount of oxide is generated on the surface of the free air ball formed at the time of ball bonding, and further joined to the center of the bottom of the free air ball. Since a large shrinkage cavity that cannot contribute is formed, the initial bondability and bonding reliability of ball bonding are lowered, which is not preferable. Therefore, the contents of Eu, La, and Y are set to 1 to 80 ppm.

（ｇ）Ｓｒ、Ｂｅ、Ｃａ、Ｅｕ、ＬａおよびＹの関係
この発明のボンディングワイヤ用金合金線に含まれるＳｒ、Ｂｅ、Ｃａ、Ｅｕ、ＬａおよびＹが１０≦Ｓｒ、Ｂｅ、Ｃａ、Ｅｕ、ＬａおよびＹの合計≦１００でかつ１／６≦Ｂｅ／（Ｓｒ、Ｃａ、Ｅｕ、Ｌａ、Ｙの合計）≦３の条件を満たす範囲内にあるように選定することによりボールボンディングの初期接合性と接合信頼性が一層高くなるので一層好ましい。その理由として、前記Ｓｒ、Ｃａ、Ｅｕ、Ｌａ、ＹはいずれもＡｕの金属結合半径よりも大きい金属結合半径を有するので前記Ｓｒ、Ｃａ、Ｅｕ、Ｌａ、ＹはいずれもＡｕに置換型で固溶し、内部歪により転移の移動を抑制し、一方、金属結合半径がＡｕの金属結合半径よりも小さいＢｅは、侵入型で固溶し、転移を固着するものと考えられ、上記条件では、その双方の作用が相乗効果を及ぼし、フリーエアボールの加工硬化性が非常に高くなるために、ボンディング時にＡｌパッドが十分に塑性変形し、Ａｌパッドの酸化皮膜が破壊され、広くＡｌ新生面が生成し、ＡｌパッドとＡｕ圧着ボールが広い領域で接合するために初期接合性と接合信頼性が一層高くなるものと考えられる。
(G) Relationship between Sr, Be, Ca, Eu, La and Y Sr, Be, Ca, Eu, La and Y contained in the gold alloy wire for bonding wire of the present invention are 10 ≦ Sr, Be, Ca, Eu, Initial bondability of ball bonding by selecting so that the sum of La and Y ≦ 100 and 1/6 ≦ Be / (sum of Sr, Ca, Eu, La, Y) ≦ 3 is satisfied. This is more preferable because the bonding reliability is further improved. The reason is that all of the Sr, Ca, Eu, La, and Y have a metal bond radius larger than that of Au, so that the Sr, Ca, Eu, La, and Y are all substituted and fixed to Au. It is considered that Be, whose metal bond radius is smaller than the metal bond radius of Au, dissolves in an intrusive type and fixes the transition, and the transition is fixed by internal strain. Both of these actions have a synergistic effect, and the work hardenability of the free air ball becomes extremely high. Therefore, the Al pad is sufficiently plastically deformed during bonding, and the oxide film of the Al pad is destroyed, resulting in a wide Al new surface. In addition, since the Al pad and the Au press-bonded ball are bonded in a wide area, it is considered that the initial bonding property and the bonding reliability are further improved.

Ａｇ：
Ａｇが１〜１０ｐｐｍ含有されても上記特性にほとんど影響を与えないので必要に応じて添加するが、しかし１０ｐｐｍを越えると初期接合性の低下が認められるようになるので好ましくない。 Ag:
Even if Ag is contained in an amount of 1 to 10 ppm, the above properties are hardly affected, so that it is added as necessary. However, if it exceeds 10 ppm, a decrease in initial joining property is recognized, which is not preferable.

上述のように、この発明のボンディングワイヤ用金合金線は、初期接合性、接合信頼性に優れ、特に、圧着ボールの真円性が優れているので、この金合金線を使用してボンディングを行うと、半導体素子の高集積化に対応できるなどなど産業上すぐれた効果をもたらすものである。   As described above, the gold alloy wire for bonding wire of the present invention is excellent in initial bondability and bonding reliability, and in particular, since the roundness of the press-bonded ball is excellent, bonding using this gold alloy wire is possible. Doing so brings about excellent industrial effects such as being able to cope with high integration of semiconductor elements.

線径：５０μｍを有し、表１〜３に示される成分組成を有する金合金線素材を伸線加工することにより線径：２０μｍを有する金合金線を作製し、この金合金線を破断伸び率が３〜５％になるように焼鈍することにより本発明ボンディングワイヤ用金合金線（以下、本発明ワイヤという）１〜４２、比較ボンディングワイヤ用金合金線（以下、比較ワイヤという）１〜１７および従来ボンディングワイヤ用金合金線（以下、従来ワイヤという）１を製造し、半径：２５ｍｍの中間スプールに巻き取った。中間スプールに巻き取られたワイヤをさらに半径：２５ｍｍのスプールに２０００ｍ巻取り、これらワイヤの先端１５ｍを捨てた。
A gold alloy wire having a wire diameter of 20 μm was produced by drawing a gold alloy wire material having a wire diameter of 50 μm and having the composition shown in Tables 1 to 3, and this gold alloy wire was stretched at break. By annealing to a rate of 3 to 5%, gold alloy wires for bonding wires of the present invention (hereinafter referred to as wires of the present invention) 1 to 42, gold alloy wires for comparative bonding wires (hereinafter referred to as comparative wires) 1 to 1 17 and a conventional gold alloy wire for bonding wire (hereinafter referred to as conventional wire) 1 were manufactured and wound on an intermediate spool having a radius of 25 mm. The wire wound on the intermediate spool was further wound up to 2000 m on a spool having a radius of 25 mm, and the tip 15 m of these wires was discarded.

これら表１〜３に示される成分組成を有する本発明ワイヤ１〜４２、比較ワイヤ１〜２０および従来ワイヤ１をＫｕｌｉｃｋｅ＆Ｓｏｆｆａ製のワイヤボンダー（マクサムプラス）にセットし、半導体ＩＣチップが搭載された基板に、
加熱温度：１６０℃、
ループ長さ：５ｍｍ、
ループ高さ：２５０μｍ、
圧着ボール径：４０μｍ、
圧着ボール高さ：９μｍ、
の条件でボンディングを行って、下記の測定を行うことにより初期接合性、Ａｌパッドの非損傷性、圧着ボールの真円性および接合信頼性についての評価を行った。

ループは台形ループと呼ばれる圧着ボール直上ならびに２ｎｄボンド側近傍に曲がり（キンク）を有する形状を採用した。 A substrate on which a semiconductor IC chip is mounted by setting the wires 1 to 42 of the present invention having the composition shown in Tables 1 to 3, the comparative wires 1 to 20 and the conventional wire 1 to a wire bonder (Maxam Plus) manufactured by Kulicke & Soffa In addition,
Heating temperature: 160 ° C
Loop length: 5mm,
Loop height: 250 μm,
Pressure ball diameter: 40 μm,
Crimp ball height: 9μm
Bonding was performed under the conditions described above, and the following measurements were performed to evaluate initial bondability, non-damage of the Al pad, roundness of the press-bonded ball, and bonding reliability.

The loop has a shape having a bend (kink) immediately above the press-bonded ball called a trapezoidal loop and in the vicinity of the 2nd bond side.

初期接合性評価：
各サンプルにつき１００００ループをボンディングし、ファーストボンド部で接合していない数（ボールリフト数）を測定し、その結果を表４〜６に示すことにより初期接合性を評価した。
Initial bondability evaluation:
10000 loops were bonded to each sample, the number of unbonded balls (number of ball lifts) at the first bond portion was measured, and the results are shown in Tables 4 to 6 to evaluate the initial bondability.

Ａｌパッドの非損傷性評価
各サンプルにつき１００個のファーストボンド部を観察し、Ａｌパッドの損傷を調べ、損傷したＡｌパッド数をカウントし、その結果を表４〜６に示すことによりＡｌパッドの非損傷性を評価した。 Evaluation of non-damage of Al pads 100 first bond portions were observed for each sample, the damage of Al pads was examined, the number of damaged Al pads was counted, and the results are shown in Tables 4 to 6 to show the results of Al pads. Non-damage was evaluated.

圧着ボールの真円性評価：
各サンプルにつき１００個の圧着ボールを観察し、比較サンプル対比で評価した。すなわち、図１の圧着ボールの上から撮った写真に示されるようにその外周に凹凸が存在しない圧着ボールを真円性が高いと判定し、図２の圧着ボールの上から撮った写真に示されるようにその外周に明らかに凹凸が存在する圧着ボールを真円性が低いと判定し、外周に明らかに凹凸が存在する真円性が低い圧着ボール（不良ボール）の数をカウントし、その結果を表４〜６に示すことにより圧着ボールの真円性を評価した。
Evaluation of roundness of crimped ball:
100 pressure-bonded balls were observed for each sample and evaluated by comparison with comparative samples. That is, as shown in the photograph taken from above the pressure-bonded ball in FIG. 1, a pressure-bonded ball having no irregularities on its outer periphery is judged to have high roundness, and is shown in the photograph taken from above the pressure-bonded ball in FIG. It is determined that the roundness of the press-bonded ball having the irregularities on the outer periphery is low, and the number of the press-bonded balls (defective balls) having the low roundness clearly having the irregularities on the outer periphery is counted. The roundness of the press-bonded ball was evaluated by showing the results in Tables 4-6.

接合信頼性評価：
ボンディングしたサンプルを、１７５℃の空気中で１５００時間保管した後に、圧着ボール直上のループの曲がり(ファーストボンド側直上のキンク)にツールを引っかけてプル試験(各サンプルにつき１００個)を行った。プル試験での破断は、接合性が良好な場合はネック部で破断するが、接合性が劣化している場合は圧着ボールとＡｌパッドの接合界面、すなわち金属間化合物内にて破断(ボールリフト)する。圧着ボールを観察し、ボールリフト数をカウントし、その結果を表４〜６に示すことにより接合信頼性を評価した。 Bonding reliability evaluation:
The bonded sample was stored in air at 175 ° C. for 1500 hours, and then a pull test (100 pieces for each sample) was performed by hooking the tool to the bending of the loop immediately above the press-bonded ball (kink directly above the first bond side). In the pull test, when the bondability is good, it breaks at the neck, but when the bondability is degraded, it breaks at the bonding interface between the press-bonded ball and the Al pad, that is, in the intermetallic compound (ball lift ) The bonded balls were observed, the number of ball lifts was counted, and the results were shown in Tables 4 to 6 to evaluate the bonding reliability.

Figure 0004793989
Figure 0004793989

Figure 0004793989
Figure 0004793989

Figure 0004793989
Figure 0004793989

Figure 0004793989
Figure 0004793989

Figure 0004793989
Figure 0004793989

Figure 0004793989
Figure 0004793989

表１〜６に示される結果から、本発明ワイヤ１〜４２は、従来ワイヤ１に比べて特に圧着ボールの真円性が良好であることが分かる。しかし、この発明の範囲から外れた成分組成を有する比較ワイヤ１〜１７は、接合信頼性、Ａｌパッドの非損傷性、圧着ボールの真円性、接合信頼性の少なくともいずれか一つの特性が不良となることが分かる。 From the results shown in Tables 1 to 6, it can be seen that the inventive wires 1 to 42 have particularly good roundness of the press-bonded ball as compared with the conventional wire 1. However, Comparative Wires 1 to 17 having a component composition outside the scope of the present invention are poor in at least one of the characteristics of bonding reliability, Al pad non-damage, crimped ball roundness, and bonding reliability. It turns out that it becomes.

真円性が高いと判定された圧着ボールの写真である。It is a photograph of a press-bonded ball determined to have high roundness. 真円性が低いと判定された圧着ボールの写真である。It is a photograph of a press-bonded ball determined to have low roundness.

Claims (9)

ＰｔおよびＰｄの内の１種または２種を合計で２０００ｐｐｍ〜２質量％、
Ｉｒ：１〜２００ｐｐｍ、
Ｓｒ：１〜５０ｐｐｍ、
Ｂｅ：１〜５０ｐｐｍ、
を含有し、残りがＡｕおよび不可避不純物からなる成分組成を有することを特徴とする高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線。 One or two of Pt and Pd in total 2000 ppm to 2% by mass,
Ir: 1 to 200 ppm,
Sr: 1 to 50 ppm,
Be: 1 to 50 ppm,
A gold alloy wire for bonding wire having a high initial bondability, a high bonding reliability, and a high roundness of a press-bonded ball, characterized in that it has a component composition consisting of Au and the inevitable impurities. ＰｔおよびＰｄの内の１種または２種を合計で２０００ｐｐｍ〜２質量％、
Ｉｒ：１〜２００ｐｐｍ、
Ｓｒ：１〜５０ｐｐｍ、
Ｂｅ：１〜５０ｐｐｍを含有し、
さらに、Ｃａ：１〜５０ｐｐｍを含有し、残りがＡｕおよび不可避不純物からなる成分組成を有することを特徴とする高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線。 One or two of Pt and Pd in total 2000 ppm to 2% by mass,
Ir: 1 to 200 ppm,
Sr: 1 to 50 ppm,
Be: contains 1 to 50 ppm,
Further, for bonding wires having high initial bondability, high bonding reliability, and high roundness of a press-bonded ball, characterized in that it contains Ca: 1 to 50 ppm and the remainder has a composition composed of Au and inevitable impurities. Gold alloy wire. ＰｔおよびＰｄの内の１種または２種を合計で２０００ｐｐｍ〜２質量％、
Ｉｒ：１〜２００ｐｐｍ、
Ｓｒ：１〜５０ｐｐｍ、
Ｂｅ：１〜５０ｐｐｍを含有し、
さらに、Ｅｕ、Ｌａ、Ｙの内の少なくとも１種を合計で：１〜８０ｐｐｍを含有し、残りがＡｕおよび不可避不純物からなる成分組成を有することを特徴とする高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線。 One or two of Pt and Pd in total 2000 ppm to 2% by mass,
Ir: 1 to 200 ppm,
Sr: 1 to 50 ppm,
Be: contains 1 to 50 ppm,
Furthermore, at least one of Eu, La, and Y in total: 1 to 80 ppm in total, and the remainder has a component composition consisting of Au and unavoidable impurities, and high initial bondability and high bonding reliability And a gold alloy wire for bonding wire having a high roundness of a press-bonded ball. ＰｔおよびＰｄの内の１種または２種を合計で２０００ｐｐｍ〜２質量％、
Ｉｒ：１〜２００ｐｐｍ、
Ｓｒ：１〜５０ｐｐｍ、
Ｂｅ：１〜５０ｐｐｍを含有し、
さらに、Ｃａ：１〜５０ｐｐｍを含有し、
さらに、Ｅｕ、Ｌａ、Ｙの内の少なくとも１種を合計で：１〜８０ｐｐｍを含有し、残りがＡｕおよび不可避不純物からなる成分組成を有することを特徴とする高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線。
One or two of Pt and Pd in total 2000 ppm to 2% by mass,
Ir: 1 to 200 ppm,
Sr: 1 to 50 ppm,
Be: contains 1 to 50 ppm,
Furthermore, it contains Ca: 1-50 ppm,
Furthermore, at least one of Eu, La, and Y in total: 1 to 80 ppm in total, and the remainder has a component composition consisting of Au and unavoidable impurities, and high initial bondability and high bonding reliability And a gold alloy wire for bonding wire having a high roundness of a press-bonded ball.
前記ＳｒおよびＢｅは、１０ｐｐｍ≦ＳｒおよびＢｅの合計≦１００ｐｐｍでかつ１／６≦Ｂｅ／Ｓｒ≦３の条件を満たす範囲内にあることを特徴とする請求項１記載の高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線。 2. The high initial bondability and the high according to claim 1, wherein the Sr and Be are within a range satisfying a condition of 10 ppm ≦ total of Sr and Be ≦ 100 ppm and 1/6 ≦ Be / Sr ≦ 3. Gold alloy wire for bonding wire with high bonding reliability and high roundness of crimped ball. 前記Ｓｒ、ＢｅおよびＣａは、１０ｐｐｍ≦Ｓｒ、ＢｅおよびＣａの合計≦１００ｐｐｍでかつ１／６≦Ｂｅ／（ＳｒおよびＣａの合計）≦３の条件を満たす範囲内にあることを特徴とする請求項２記載の高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線。
The Sr, Be and Ca are in a range where 10 ppm ≦ total of Sr, Be and Ca ≦ 100 ppm and 1/6 ≦ Be / (total of Sr and Ca) ≦ 3. Item 3. A gold alloy wire for bonding wire having high initial bondability, high bonding reliability and high roundness of a press-bonded ball according to Item 2.
前記Ｓｒ、Ｂｅ、Ｅｕ、ＬａおよびＹは、１０ｐｐｍ≦Ｓｒ、Ｂｅ、Ｅｕ、Ｌａ、Ｙの合計≦１００ｐｐｍでかつ１／６≦Ｂｅ／（Ｓｒ、Ｅｕ、Ｌａ、Ｙの合計）≦３の条件を満たす範囲内にあることを特徴とする請求項３記載の高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線。 The Sr, Be, Eu, La and Y are the conditions of 10 ppm ≦ total of Sr, Be, Eu, La and Y ≦ 100 ppm and 1/6 ≦ Be / (total of Sr, Eu, La and Y) ≦ 3 The gold alloy wire for a bonding wire having high initial bondability, high bond reliability, and high roundness of a press-bonded ball according to claim 3, wherein the gold alloy wire has a high initial bondability, high bond reliability, and high roundness of a press-bonded ball. 前記Ｓｒ、Ｂｅ、Ｃａ、Ｅｕ、Ｌａ、Ｙは、
１０ｐｐｍ≦Ｓｒ、Ｂｅ、Ｃａ、Ｅｕ、Ｌａ、Ｙの合計≦１００ｐｐｍでかつ１／６≦Ｂｅ／（Ｓｒ、Ｃａ、Ｅｕ、Ｌａ、Ｙの合計）≦３の条件を満たす範囲内にあることを特徴とする請求項４記載の高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線。 The Sr, Be, Ca, Eu, La, and Y are
10 ppm ≦ total of Sr, Be, Ca, Eu, La, Y ≦ 100 ppm and 1/6 ≦ Be / (total of Sr, Ca, Eu, La, Y) ≦ 3 5. The gold alloy wire for bonding wire according to claim 4, which has high initial bondability, high bonding reliability, and high roundness of a press-bonded ball. さらにＡｇ：１〜１０ｐｐｍを含有することを特徴とする請求項１〜８の内のいずれかの請求項に記載の高い初期接合性、高い接合信頼性および圧着ボールの高い真円性を有するボンディングワイヤ用金合金線。 Furthermore, Ag: 1-10ppm is contained, Bonding which has the high initial joining property, the high joining reliability, and the high roundness of a press-bonded ball | bowl of any one of Claims 1-8 characterized by the above-mentioned Gold alloy wire for wire.
JP2006089892A 2006-03-29 2006-03-29 Gold alloy wire for bonding wire with high initial bondability, high bond reliability and high roundness of crimped ball Expired - Fee Related JP4793989B2 (en)

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