JP4793937B2 - Electronic component connection jig - Google Patents

Description

  The present invention relates to an electronic component connecting jig used when connecting an electronic component such as a liquid crystal display device provided with a large number of lead terminals to a socket provided on a substrate.

As a conventional jig of this type, there is known a board mounting jig having a plurality of guide holes that are obtained by vertically cutting a mortar, and having a positioning projection and a contact portion on the lower surface and the back surface, respectively. (For example, refer to Patent Document 1). In this board mounting jig, a jig projection is inserted into a jig positioning hole provided in the printed circuit board, and the jig is positioned by bringing the contact portion of the jig into contact with the end surface of the printed circuit board. By inserting the lead terminal of the electronic component into the hole, the lead terminal is inserted into the lead insertion hole of the printed board located under the guide hole.
Japanese Utility Model Publication No. 7-3200

  In the above prior art, a jig positioning hole must be provided in the printed circuit board in order to position the jig. For this reason, it is necessary to process the printed circuit board in advance. Further, in the above-described conventional technology, since the jig is fixed by inserting the protrusion of the jig on the printed circuit board or contacting the contact portion, a large load is applied to the printed circuit board and the printed circuit board is damaged. There was also a problem that the jig rattled and positioning was insufficient.

  The problem to be solved by the present invention is to solve the above-mentioned problems of the prior art, position the electronic component by securely holding it without placing a burden on the substrate, and easily remove the electronic component. It is in providing tools.

  An electronic component connecting jig according to the present invention is an electronic component connecting jig for connecting a plurality of lead terminals of an electronic component to a socket provided on the substrate, and has a holding portion for mounting and holding the substrate. A plurality of portions, a rising portion rising from the base portion, and a plurality of protrusions protruding from the upper end of the rising portion to the inside of the holding portion, guiding the plurality of lead terminals, facing the socket, and opening in a vertical direction and a protruding direction. And a guide portion having a guide hole. The holding portion in the electronic component connecting jig is formed of a concave portion in which the substrate is fitted. Further, the base part is provided with a takeout part which is formed in a part of the edge of the holding part, which is a recess or a through hole deeper than the holding part, and which makes it easy to take out the substrate from the holding part. Further, in the holding portion, a relief portion including a concave portion or a through hole serving as a relief of a component protruding to the back surface side of the substrate is provided. The holding portion is set to a depth substantially the same as the thickness of the substrate, and the upright portion is set to a height substantially the same as the height of the socket.

  In the electronic component connecting jig according to the present invention, a holding portion including a concave portion is provided on the base portion, and the entire substrate is held and positioned by placing the substrate in the holding portion. A large load is not applied to a part, and the substrate can be reliably held without being damaged.

  In addition, since an extraction part consisting of a recess or a through-hole is provided in a part of the edge of the holding part, it is easy to put a finger etc. into this extraction part and push up the back and end surfaces of the substrate placed in the holding part The substrate can be taken out.

  Moreover, since the escape part which consists of a recessed part or a through-hole is provided in the holding | maintenance part, a board | substrate can be hold | maintained flat by putting the component which protrudes in the back side of the board | substrate mounted in the holding | maintenance part in an escape part. . Thereby, the position of a guide hole and a socket can be match | combined correctly.

  In addition, the holding part is set to approximately the same depth as the board thickness, and the upright part is set to approximately the same height as the socket, so the socket fits under the guide part provided at the upper end of the upright part. And it can hold | maintain reliably so that it may not move to the up-down direction of a socket with a board | substrate.

  The electronic component connecting jig according to the present invention includes a base portion having a holding portion for holding the substrate, a rising portion that rises from the base portion, and a guide portion that protrudes upward from the upper end of the rising portion toward the inside of the holding portion. The guide portion is provided with a plurality of guide holes that open in the vertical direction and the protruding direction. The holding portion is formed of a concave portion to which the substrate fits, and the substrate is positioned and held in the front-rear and left-right directions (XY directions) by placing the substrate thereon. In addition, the upright part is set to almost the same height as the socket of the board, and the socket fits under the guide part protruding from the upper end of the upright part, and the socket and the board are moved in the vertical direction (Z direction). Positioning and holding. In addition, the base part is provided with an extraction part made of a recess or a through hole in a part of the edge of the holding part.

  As described above, the electronic component connecting jig according to the present invention can securely hold the board provided with the socket, and after holding the socket in this way, the lead terminal of the electronic component is inserted into the guide hole of the guide portion. A plurality of lead terminals can be connected to the socket simply by inserting. Thereafter, when taking out the substrate from the electronic component connecting jig, it can be easily taken out from the holding portion by putting a finger or the like into the take-out portion and lifting the substrate.

  FIG. 1 is a perspective view showing an electronic component connecting jig according to an embodiment of the present invention, FIGS. 2A and 2B are a plan view of the guide portion shown in FIG. FIG. 4 is a perspective view showing a substrate to which a socket is attached, and FIG. 4 is a perspective view showing an electronic component having a plurality of lead terminals.

  Reference numeral 2 denotes an electronic component connecting jig, which is composed of a base portion 4 having a substantially rectangular parallelepiped shape, an upright portion 6 having a substantially rectangular parallelepiped shape rising from the surface thereof, and a guide portion 8 provided thereon.

  The base part 4 has a holding part 4a composed of a shallow concave part at the center of the surface thereof. The holding portion 4 a has substantially the same planar shape as the substrate 10 shown in FIG. 3 and is set to a depth substantially the same as the thickness of the substrate 10. In addition, on the bottom surface of the holding portion 4a, a relief portion 4b including a recess or a through hole that escapes the protruding components is provided at a position corresponding to the components protruding to the back side of the substrate 10. In addition, on the surface of the base part 4, a part of the edge of the holding part 4a is provided with an extraction part 4c formed of a recess or a through hole deeper than the holding part 4a extending inside and outside the holding part.

  The upright part 6 is located at the edge of the holding part 4a, and is set to a height substantially equal to the height of the socket 12 of the substrate 10 shown in FIG.

  The guide portion 8 is provided at the upper end of the upright portion 6. In this embodiment, the base portion 4 and the upright portion 6 are formed by integral molding of plastic or the like, and the guide portion 8 is formed of a separate member such as a metal plate by screwing or the like on the upright portion 6. It has become attached. The guide portion 8 protrudes from the upper end of the upright portion 6 to the inside of the holding portion 4a and is disposed so as to cover the socket 12 of the substrate 10 placed in the holding portion 4a. A plurality of guide holes 8 a that open in the up-down direction and the protruding direction are provided at the distal end portion of the guide portion 8 in the protruding direction. The guide hole 8a has a mortar shape in which the upper diameter is large and the lower diameter is small, and opens in the protruding direction with a width of the lower diameter. The guide hole 8a is positioned so that the opening position below the guide hole 8a faces the insertion hole 12a of the socket 12 of the substrate 10 housed in the holding portion 4a.

  Next, a state when the lead terminal 16 of the electronic component 14 is connected to the socket 12 of the substrate 10 using the electronic component connecting jig 2 having the above configuration will be described. First, a schematic configuration of the substrate 10 and the electronic component 14 used in this embodiment will be described. The board 10 shown in FIG. 3 is provided with many conductive patterns (not shown) and parts (not shown) on the front or back surface thereof, and sockets for connecting the electronic parts 14 shown in FIG. Two 12 are fixed. The socket 12 has a rectangular parallelepiped shape, and a plurality of connection insertion holes 12a are provided in a row on the upper surface thereof. The electronic component 14 shown in FIG. 4 is a liquid crystal display device in this embodiment, and a plurality of lead terminals 16 are drawn downward from the end of the glass substrate 14a. Further, below the end of the frame 14b of the electronic component 14, there are provided an engaging portion 14c and the like for attaching to the substrate 10, and the engaging portion 14c is provided with a recess, a hole or the like (illustrated) provided on the substrate 10. It is attached to the substrate 10 by being fitted and engaged.

  When the electronic component 14 is connected to the socket 12 of the substrate 10 as described above, the substrate 10 is first fitted into the holding portion 4 a of the base portion 4 in the electronic component connecting jig 2. At this time, as shown in FIGS. 5 and 6, the socket 12 enters under the guide portion 8, and the component 18 attached to the back surface of the substrate 10 is accommodated in the escape portion 4 b. Accordingly, as shown in FIGS. 6 and 7, the substrate 10 is held flat so as not to move back and forth, right and left, and up and down by being fitted flatly on the holding portion 4a.

  When the substrate 10 is held by the holding portion 4 a as described above, the insertion hole 12 a of the socket 12 is positioned directly below the guide hole 8 a of the guide portion 8. Here, as shown in FIGS. 8 and 9, the lead terminal 16 of the electronic component 14 is inserted into the guide hole 8a from above. Note that the electronic component 14 in FIG. 9 is an integrated circuit provided with a large number of lead terminals 16. At this time, even if the tip of the lead terminal 16 is slightly deviated from the position of the insertion hole 12 a of the socket 12, it can be easily inserted into the guide hole 8 a where the upper opening is widened. The lead terminal 16 inserted into the guide hole 8a in this way is guided to the insertion hole 12a of the socket 12 by the guide hole 8a, and is inserted into the insertion hole 12a as shown in FIG. At this time, the electronic component 14 in this embodiment is fixed to the substrate 10 by the engaging portion 14c engaging the substrate 10.

  Thereafter, a finger or the like is inserted into the extraction portion 4c shown in FIG. 7, the substrate 10 is lifted from the holding portion 4a, and the electronic component 14 and the substrate 10 are removed from the holding portion 4a while pulling out the lead terminal 16 from the opening in the protruding direction of the guide hole 8a. Take out.

  As described above, when the electronic component connecting jig 2 is used, the lead terminal 16 of the electronic component 14 can be easily connected to the socket 12 of the substrate 10.

  In this embodiment, since the guide portion 8 is formed as a separate component from the base portion 4 and the upright portion 6, only the guide portion 8 can be used to change the number and position of the sockets 12 and the insertion holes 12a. It is possible to respond by simply exchanging It is also possible to form this guide portion 8 integrally with the upper end of the upright portion 6.

It is a perspective view which shows the electronic component connection jig | tool which concerns on one Example of this invention. (A), (b) is the top view of the guide part shown in FIG. 1, and its AA sectional drawing. It is a perspective view which shows the board | substrate with which the socket was attached. It is a perspective view which shows the electronic component which has several lead terminals. It is principal part sectional drawing which shows a state when mounting a board | substrate in a holding | maintenance part. It is principal part sectional drawing which shows the state which mounted the board | substrate in the holding | maintenance part. It is a perspective view which shows the state which mounted the board | substrate in the holding | maintenance part. It is principal part sectional drawing which shows a state when inserting a lead terminal in a guide hole. It is a perspective view which shows a state when inserting a lead terminal in a guide hole. It is sectional drawing which shows the state which inserted the lead terminal in the guide hole.

Explanation of symbols

2 Electronic component connecting jig 4 Base portion 6 Standing upper portion 8 Guide portion 4a Holding portion 4b Escape portion 4c Extraction portion 8a Guide hole 10 Substrate 12 Socket 12a Insertion hole 14 Electronic component 14a Glass substrate 14b Frame 14c Engaging portion 16 Lead terminal 18 parts

Claims (5)

An electronic component connection jig for connecting a plurality of lead terminals of an electronic component to a socket provided on a substrate,
A pedestal having a holding part for placing and holding the substrate;
An upright standing up from the platform;
A guide portion that protrudes from the upper end of the upright portion to the inside upper side of the holding portion, guides the plurality of lead terminals, faces the socket, and has a plurality of guide holes that open in the vertical and protruding directions;
An electronic component connecting jig comprising: The electronic component connecting jig according to claim 1, wherein the holding portion includes a concave portion to which the substrate is fitted. The base portion is provided with an extraction portion that is formed in a part of an edge of the holding portion, which is a recess or a through-hole deeper than the holding portion, and makes it easy to take out the substrate from the holding portion. Item 3. The electronic component connecting jig according to Item 2. 4. The electronic component connecting jig according to claim 2, wherein a concave portion or a relief portion is provided in the holding portion. The concave portion is a relief portion of a component protruding toward the back side of the substrate. 5. The holder according to claim 2, wherein the holding portion is set to a depth substantially the same as a thickness of the substrate, and the upright portion is set to a height substantially the same as the height of the socket. The electronic component connecting jig described in 1.

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