JP4791572B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP4791572B2 JP4791572B2 JP2009288617A JP2009288617A JP4791572B2 JP 4791572 B2 JP4791572 B2 JP 4791572B2 JP 2009288617 A JP2009288617 A JP 2009288617A JP 2009288617 A JP2009288617 A JP 2009288617A JP 4791572 B2 JP4791572 B2 JP 4791572B2
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- 239000004065 semiconductor Substances 0.000 title claims description 95
- 230000005669 field effect Effects 0.000 claims description 77
- 239000000758 substrate Substances 0.000 claims description 31
- 230000002441 reversible effect Effects 0.000 claims description 5
- 239000000969 carrier Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 45
- 229910052710 silicon Inorganic materials 0.000 description 45
- 239000010703 silicon Substances 0.000 description 45
- 238000000034 method Methods 0.000 description 22
- 230000005684 electric field Effects 0.000 description 17
- 230000000694 effects Effects 0.000 description 16
- 239000012535 impurity Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000005468 ion implantation Methods 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 230000015556 catabolic process Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 238000004904 shortening Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010336 energy treatment Methods 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41766—Source or drain electrodes for field effect devices with at least part of the source or drain electrode having contact below the semiconductor surface, e.g. the source or drain electrode formed at least partially in a groove or with inclusions of conductor inside the semiconductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
Description
ここで、Rchはチャネル抵抗、Raccはアキュミレーション抵抗、RjfetはJFET抵抗、Rdriftはn−型シリコン領域2の抵抗、Rsubはn+型シリコン基板の抵抗である。上記成分のうち、チャネル抵抗Rchが最も大きいので、p型ウェル3を浅くする(即ちチャネルを短くする)ことでチャネル抵抗Rchを低減し、オン抵抗Rds(on)を低くすることができる。
本実施の形態1では、チャネル抵抗の低いトレンチゲート型の電界効果型トランジスタを例示する。
本実施の形態2では、上記実施の形態1で例示した、チャネル抵抗の低い電界効果型のパワートランジスタを、電源装置に適用した例を説明する。
2 n−型シリコン領域(第1半導体領域)
3 p型ウェル(半導体ウェル領域)
4 p+型半導体領域
5 n+型半導体領域(第2半導体領域)
6 ゲート酸化膜(ゲート絶縁膜)
7 絶縁膜
8 ゲート電極
9 トレンチ(溝部)
11 ソース電極
12 ドレイン電極
13 チャネル領域
21 ゲート電極深さ
22 ゲート電極はみ出し距離
23 ウェル深部の深さ
24 チャネル長
25 ゲート幅
26 セルピッチ
31 電源制御コントローラ
32 ドライバ
33 プロセッサ
S1 第1主面
S2 第2主面
A 第1方向
B 第2方向
CH コンタクトホール
U ユニットセル
BG ゲート電極底部(ゲート電極の底部)
BW ウェル底部
DBW ウェル深部
SBW ウェル浅部
Vin 直流電圧源
GND グランド電位
Cin 入力容量
Cout 出力容量
QH1 ハイサイド電界効果型トランジスタ(第1電界効果型トランジスタ)
QL1 ローサイド電界効果型トランジスタ(第2電界効果型トランジスタ)
DP1,DP2 ダイオード
L 出力インダクタ
Claims (2)
- 厚さ方向に沿って互いに反対側に位置する第1主面および第2主面を持つ半導体基板に、トレンチゲート型の電界効果型トランジスタを有する半導体装置であって、
前記トレンチゲート型の電界効果型トランジスタは、
前記半導体基板の第1主面側に設けられた第1導電型キャリアを有するドレイン用の第1半導体領域と、
前記半導体基板の第2主面側に設けられた前記第1導電型キャリアを有するソース用の第2半導体領域と、
前記第1半導体領域の第2主面側に設けられ、前記第1導電型キャリアを前記第1半導体領域よりも低い濃度で備える第3半導体領域と、
前記第3半導体領域と前記第2半導体領域との間に設けられ、前記第1導電型キャリアと極性が逆で、前記第3半導体領域のキャリア濃度より高い濃度の第2導電型キャリアを有する半導体ウェル領域と、
前記半導体基板の第2主面に交差する第1方向に、前記第2主面から延びるように形成された溝部と、
前記溝部の内面に形成されたゲート絶縁膜と、
前記ゲート絶縁膜を覆い、前記溝部を埋め込むように形成されたゲート電極とを備え、
前記ゲート電極の底部は、前記第3半導体領域にあり、
前記半導体ウェル領域と前記第3半導体領域との接合部であるウェル底部は、
前記半導体基板の第2主面から前記ウェル底部までの前記第1方向に沿った距離が、比較して長いウェル深部と、比較して短いウェル浅部とを有し、
前記ウェル深部は、前記ゲート絶縁膜に対して、前記ウェル浅部よりも遠い領域にあり、
前記ゲート電極のうち、前記第3半導体領域にある部分の前記第1方向に沿った長さであるゲート電極はみ出し距離は、前記半導体基板の第2主面から前記ゲート電極の底部までの距離であるゲート電極深さの20%以上であり、
前記ウェル底部のうち、前記半導体基板の第2主面から前記ウェル深部までの、前記第1方向に沿った距離である前記ウェル深部の深さは、前記ゲート電極深さの80%以上であり、かつ、前記ゲート電極の底部よりも浅く、
前記ドレイン用の前記第1半導体領域と、前記ソース用の前記第2半導体領域の間に、逆方向電圧を印加した際、前記ゲート電極の底部から前記第3半導体領域に延びる空乏層と、前記ウェル深部から前記第3半導体領域に延びる空乏層が接触することを特徴とする半導体装置。 - 請求項1記載の半導体装置において、
前記半導体ウェル領域における前記ゲート絶縁膜との接合部であるチャネル領域の、前記第1方向に沿った長さであるチャネル長は、1μm以下であることを特徴とする半導体装置。
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JP2009288617A JP4791572B2 (ja) | 2009-12-21 | 2009-12-21 | 半導体装置 |
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JP2009288617A JP4791572B2 (ja) | 2009-12-21 | 2009-12-21 | 半導体装置 |
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JP2007054156A Division JP2008218711A (ja) | 2007-03-05 | 2007-03-05 | 半導体装置およびその製造方法、ならびに電源装置 |
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JP2010166997A Division JP2010283368A (ja) | 2010-07-26 | 2010-07-26 | 半導体装置の製造方法 |
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JP2010098326A JP2010098326A (ja) | 2010-04-30 |
JP4791572B2 true JP4791572B2 (ja) | 2011-10-12 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6290526B2 (ja) | 2011-08-24 | 2018-03-07 | ローム株式会社 | 半導体装置およびその製造方法 |
JP6524279B2 (ja) * | 2011-08-24 | 2019-06-05 | ローム株式会社 | 半導体装置およびその製造方法 |
JP6584857B2 (ja) | 2015-08-11 | 2019-10-02 | 株式会社東芝 | 半導体装置 |
JP6808766B2 (ja) * | 2019-01-11 | 2021-01-06 | 株式会社東芝 | 半導体装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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US5558313A (en) * | 1992-07-24 | 1996-09-24 | Siliconix Inorporated | Trench field effect transistor with reduced punch-through susceptibility and low RDSon |
US5341011A (en) * | 1993-03-15 | 1994-08-23 | Siliconix Incorporated | Short channel trenched DMOS transistor |
US5689128A (en) * | 1995-08-21 | 1997-11-18 | Siliconix Incorporated | High density trenched DMOS transistor |
US6348712B1 (en) * | 1999-10-27 | 2002-02-19 | Siliconix Incorporated | High density trench-gated power MOSFET |
US6472678B1 (en) * | 2000-06-16 | 2002-10-29 | General Semiconductor, Inc. | Trench MOSFET with double-diffused body profile |
JP4813762B2 (ja) * | 2003-12-25 | 2011-11-09 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
US7285822B2 (en) * | 2005-02-11 | 2007-10-23 | Alpha & Omega Semiconductor, Inc. | Power MOS device |
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