JP4784977B2 - Radical generator - Google Patents

Description

  The present invention relates to a radical generator capable of supplying various radical sources and independently controlling the generation of various radicals.

  Recently, techniques such as film formation and etching using plasma are known. For example, as shown in Patent Document 1 below, an apparatus and a method for generating radicals and coating the surface of a workpiece with the radicals are known. In Patent Document 1, a micro hollow cathode is used as an apparatus for efficiently generating radicals at atmospheric pressure.

JP 2004-356558 A

  However, according to Patent Document 1, there is a problem that only one type of radical can be generated. In recent complicated treatments, various radicals are selected and generated to use the most suitable radical species according to the processing stage, or mixed radicals with the optimum mixing ratio of the most suitable radical species according to the processing stage. It is necessary to use this for precise processing and film formation.

  However, in the conventional technique, it is difficult to control the type of such radicals or to control the concentration ratio of each radical type of the mixed radical.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to variably control the generation of various radical species and to variably control the concentration ratio of a mixture of radical species. That is.

The present invention has a number of first through-hole for introducing different kinds of gases, respectively, and each of the positive electrodes of the ring-shaped to each of the first through-hole, a connected to each of the positive electrode independently Voltage a first flat plate is disposed to the wiring layer can be applied, having a first through-hole and the plurality of second through-hole formed coaxially with each of the second through-hole in a ring-shaped cathode, respectively A second flat plate electrically insulatively separated from the first flat plate and disposed in parallel with the first flat plate, and a wiring layer to which a ground potential is applied in contact with the negative electrode of the first flat plate; A plurality of third through-holes formed coaxially with the first and second through-holes, each of the third through-holes being connected to a ring-shaped neutralization electrode and each of the neutralization electrodes independently. were provided with a wiring layer can be applied a voltage relative to the second plate, it is electrically insulated and isolated A third flat plate was, between the positive electrode and the negative electrode with respect to each of the plurality of through holes, a first voltage application means for applying a voltage independently for each of the plurality of through-holes A second voltage applying means for independently applying a voltage between the negative electrode and the neutralizing electrode, and controlling the type of the gas to control the type of radical generated; The concentration ratio of each radical species in the generated mixed radical can be controlled by controlling the voltage applied by the first voltage applying unit and the voltage applied by the second voltage applying unit. It is a radical generator.

  According to the present invention, a voltage can be applied independently to each electrode disposed in the plurality of through holes. Therefore, by supplying different types of gas to each of the through holes, the types of radicals generated by the gas can be controlled independently. In addition, when a mixture of a plurality of types of radicals is generated, the concentration ratio can be controlled.

  The best mode for carrying out the present invention will be described. The embodiments will be specifically described in order to facilitate understanding of the inventive concept, and the present invention should not be construed as being limited to the following examples.

  FIG. 1 is a cross-sectional view showing the configuration of the radical generator 20. The 1st flat plate 11, the 2nd flat plate 12, and the 3rd flat plate 13 are arrange | positioned in parallel. These flat plates are made of ceramics, and a plurality of first through holes 31a, 31b, 31c are formed in the first flat plate 11. Similarly, a large number of second through holes 32a, 32b, 32c are formed in the second flat plate 12. Similarly, the third flat plate 13 is formed with a large number of third through holes 33a, 33b, 33c. Further, an insulating plate 14 made of ceramics is provided between the first flat plate 11 and the second flat plate 12, and a plurality of through holes 34a, 34b, 34c are formed therein. Similarly, an insulating plate 15 is provided between the second flat plate 12 and the third flat plate 13, and a plurality of through holes 35 a, 35 b, and 35 c are formed in the insulating plate 15.

  And the 1st through-hole 31a, the 2nd through-hole 32a, the 3rd through-hole 33a, and the through-holes 34a and 35a are each arrange | positioned coaxially, These are connected and one through-hole is formed. . Similarly, the first through-hole 31b, the second through-hole 32b, the third through-hole 33b, and the through-holes 34b and 35b are arranged coaxially and are connected to form one through-hole. Yes. Similarly, the first through-hole 31c, the second through-hole 32c, the third through-hole 33c, and the through-holes 34c and 35c are arranged coaxially and are connected to form one through-hole. Yes.

  FIG. 2 is a diagram showing only three through holes as representatives among the many through holes. Ring-shaped positive electrodes 41a, 41b, and 41c are disposed on the inner peripheral surfaces of the first through holes 31a, 31b, and 31c, respectively. Similarly, ring-shaped negative electrodes 42a, 42b, and 42c are disposed on the inner peripheral surfaces of the second through holes 32a, 32b, and 32c, respectively. Similarly, ring-shaped neutralization electrodes 43a, 43b, and 43c are disposed on the inner peripheral surfaces of the third through holes 33a, 33b, and 33c, respectively. In addition, wiring layers 51a, 51b, 51c are formed in contact with the end faces of the positive electrodes 41a, 41b, 41c of the first flat plate 11. The wiring layer is drawn out to the side surface of the first flat plate 11, and is configured such that a voltage can be applied independently from each terminal.

  As shown in FIG. 3, the wiring layer 52 is uniformly formed on the surface of the second flat plate 12 in contact with the end surfaces of the negative electrodes 42 a, 42 b, 42 c of the second flat plate 12. The ground potential is applied to the end face of the wiring layer 52 drawn to the end face of the second flat plate 12.

  Also, as shown in FIG. 4, wiring layers 53a, 53b, and 53c are formed in contact with the end faces of the neutralization electrodes 43a, 43b, and 43c of the third flat plate 13. This wiring layer is drawn out to the side surface of the third flat plate 13, and is configured such that a voltage can be applied independently from each terminal.

  The positive electrodes 41a, 41b, 41c, the negative electrodes 42a, 42b, 42c, the neutralization electrodes 43a, 43b, 43c, and the inner diameter are about 0.1 mm in diameter. In other words, the through holes formed by the inner surfaces of these electrodes are called micro hollows.

  In the above configuration, different types of gases are introduced from the through holes 31a, 31b, 31c of the first flat plate 11, respectively. In addition, a voltage having an optimum magnitude is applied between the electrodes so as to obtain a target radical species and its concentration by converting each gas into plasma. The reaction chamber 60 has a cylindrical casing 61, and the radical generator 20 is installed on the upper portion of the casing 61. The reaction chamber 60 is provided with a substrate stage 62 on which an object to be plasma-treated is placed, and an alternating voltage is applied to the mesh electrode 16 provided below the third flat plate 13. The reaction chamber 60 is exhausted to the outside.

  When a DC voltage is applied between the positive electrodes 41a, 41b, 41c and the negative electrodes 42a, 42b, 42c while flowing various gases into the reaction chamber 60, the negative electrodes 42a, 42b, 42c (micro A discharge is generated inside the hollow cathode) to obtain plasma. When the plasma particles pass through the internal spaces of the neutralization electrodes 43a, 43b, and 43c of the third flat plate 13, electrons are captured and ions are neutralized. In this way, particles passing through the neutralization electrodes 43a, 43b, and 43c can be made radical particles, and various radicals can be selectively supplied to the reaction chamber 60 to perform desired processing and processing. Can do. At this time, the concentration of radicals passing through each negative electrode 42a, 42b, 42c is adjusted by adjusting the magnitude of the voltage applied between the positive electrode 41a, 41b, 41c and the negative electrode 42a, 42b, 42c. Can be adjusted. Of course, the amount of radicals supplied can also be controlled by controlling the gas flow rate.

  The present invention is effective for the treatment of an object using radical reaction such as film formation, etching, and cleaning.

The block diagram which showed the structure of the radical generator which concerns on the specific Example of this invention. The top view which showed the structure of the 1st flat plate used for the radical generator. The top view which showed the structure of the 2nd flat plate used for the radical generator. The top view which showed the structure of the 3rd flat plate used for the radical generator.

DESCRIPTION OF SYMBOLS 11 ... 1st flat plate 12 ... 2nd flat plate 13 ... 3rd flat plate 31a, 31b, 31c ... 1st through-hole 32a, 32b, 32c ... 2nd through-hole 33a, 33b, 33c ... 3rd through-hole 35a, 35b, 35c ... through holes 14, 15 ... insulating plates 41a, 41b, 41c ... positive electrodes 42a, 42b, 42c ... negative electrodes 43a, 43b, 43c ... neutralization electrodes 51a, 51b, 51c ... wiring layers 52 ... wiring layers 53a, 53b 53c ... wiring layer

Claims (1)

Has a number of first through-hole for introducing different kinds of gases, respectively, and each of the first through-hole in a ring-shaped respective anode wiring layer can be applied a voltage and connected to each of the positive electrode independently A first flat plate on which is disposed;
Has a number of second through-hole formed in said first through hole coaxial with a ring-shaped cathode in each of the second through hole, the wiring layer ground potential contact with the respective negative electrodes are applied A second flat plate electrically insulated from the first flat plate and disposed in parallel with the first flat plate,
A plurality of third through-holes formed coaxially with the first and second through-holes, each of the third through-holes being connected to a ring-shaped neutralization electrode and each of the neutralization electrodes independently; A third flat plate that is electrically insulated and separated from the second flat plate , wherein a wiring layer to which a voltage can be applied is disposed ;
First voltage applying means for independently applying a voltage between the positive electrode and the negative electrode for each of a plurality of through holes;
A second voltage applying means for independently applying a voltage between the negative electrode and the neutralization electrode for each of a plurality of through holes;
Have
By controlling the type of gas, the type of radical generated is controlled, and the voltage applied by the first voltage application unit and the voltage applied by the second voltage application unit are controlled, Controllable concentration ratio of each radical species in the generated mixed radical
A radical generator characterized by that .

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