JP4781925B2 - Airtight container - Google Patents
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- JP4781925B2 JP4781925B2 JP2006182556A JP2006182556A JP4781925B2 JP 4781925 B2 JP4781925 B2 JP 4781925B2 JP 2006182556 A JP2006182556 A JP 2006182556A JP 2006182556 A JP2006182556 A JP 2006182556A JP 4781925 B2 JP4781925 B2 JP 4781925B2
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- container
- lid
- sealing
- airtight container
- glass
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000007789 sealing Methods 0.000 description 23
- 239000000463 material Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000003566 sealing material Substances 0.000 description 7
- 230000035882 stress Effects 0.000 description 5
- 239000006023 eutectic alloy Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010894 electron beam technology Methods 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000004021 metal welding Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000007500 overflow downdraw method Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
本発明は、圧電振動子の気密封止時の条件により周波数変動などを起こす要因を改善するための、気密容器の封止材に関するものである。 The present invention relates to a sealing material for an airtight container for improving a factor that causes a frequency variation or the like depending on conditions at the time of hermetic sealing of a piezoelectric vibrator.
小型ＳＭＤ振動子のパッケージはセラミック、ガラス、金属、樹脂などが用いられ、精度を要求されるものは耐湿度性、気密性の良いセラミック、金属、ガラスが用いられている。樹脂パッケージは吸湿性と気密性から比較的安定性に余裕がある一般民生製品に使用されている。 Ceramic, glass, metal, resin, and the like are used for the package of the small SMD vibrator, and ceramic, metal, and glass with high humidity resistance and airtightness are used for those that require accuracy. Resin packages are used for general consumer products that have relatively high stability due to their hygroscopicity and airtightness.
蓋については、パッケージ同様、気密性、耐湿性のよい金属、セラミック、ガラスなどが使用され、その封止方法には、金属リッドのシーム溶接、金スズ融着、セラミックキャップのガラス融着、金属ベースと金属キャップの溶接などが用いられ、電子ビーム、レーザなども使用、検討されている。 As for the lid, metal, ceramic, glass, etc. with good airtightness and moisture resistance are used in the same way as the package. Sealing methods include seam welding of metal lids, gold-tin fusion, glass fusion of ceramic caps, metal Welding of the base and metal cap is used, and electron beams and lasers are also being used and studied.
昨今携帯端末の用途はＩＣタグ、テレビモジュール、ＧＰＳ受信機、ハードディスク（ＨＤＤ）モジュールなど拡大を続け、そのアプリケーションは増加し続け、機能を満たすためにＧＰＳモジュール、ＨＤＤモジュール、チューナモジュールなど端末に搭載される機能部品は増加する傾向にある。その一方で端末機器自体の大きさは制限があるため、精度、気密性、耐湿性はそのままで部品に対する小型低背化要求は更に強くなってきている。 Recently, the use of mobile terminals continues to expand, such as IC tags, TV modules, GPS receivers, hard disk (HDD) modules, and the applications continue to increase. In order to satisfy the functions, GPS modules, HDD modules, tuner modules, etc. are installed in terminals. There is a tendency to increase the number of functional parts. On the other hand, since the size of the terminal device itself is limited, there is an increasing demand for reducing the size and height of parts while maintaining accuracy, airtightness, and moisture resistance.
製品単価についても厳しい要求がなされ、いかに材料費投資を抑え生産性を上げるかが課題となっている。しかしながら精度、信頼性を確保しつつ超小型低背化を達成するためには、底面、および蓋の肉厚を薄くする必要がある。セラミック材料のパッケージの主流は、蓋を金属製のものを使用することから、セラミック容器、蓋の熱膨張係数の違いにより、溶接、封止時には熱ストレスが加わり歪みが残留し、パッケージ強度が保てないことから、材料、封止方法も限定されてきており、現在では外形寸法で２．５ｍｍ×２．０ｍｍ以下の小型の気密封止方法は金スズリッドの熱融着方式あるいは、Ａｇロウクラッドリッド電子ビームによる溶接が主流となっている。 Strict demands are also made on the unit price of products, and the issue is how to increase the productivity by reducing the investment in material costs. However, in order to achieve ultra-compact and low profile while ensuring accuracy and reliability, it is necessary to reduce the thickness of the bottom surface and the lid. The mainstream of ceramic material packages is that the lid is made of metal, and due to the difference in the thermal expansion coefficient between the ceramic container and the lid, thermal stress is applied during welding and sealing, strain remains, and the package strength is maintained. Therefore, materials and sealing methods are also limited. At present, a small hermetic sealing method with an outer dimension of 2.5 mm × 2.0 mm or less is a gold tin lid heat fusion method or an Ag wax cladding. Welding with lid electron beams is the mainstream.
昨今では、水晶ウエハからフォトリソグラフィーにより一括で振動子を形成し、ウエハ状態のまま陽極接合により一括封止を行う方法も提案されている。また、ベース（パッケージ）にガラスを用い短冊形状の振動子を個々に実装調整した後にウエハ状態で一括封止を行う方法も提案されている。またその一方で、端末機器自体の大きさは制限があるため、精度、気密性、耐湿性はそのままで部品に対する小型低背化要求は更に強くなってきている現状にもある。
一般的な圧電振動子は気密封止を持った容器形態の中に、圧電振動素板として圧電材料の平板の両面に励振用の電極を形成した振動片を収納した構成となっている。そのため、圧電振動子容器の封止精度、気密、耐湿性を両立させるためには、ガラス、セラミック、金属など無機系の材料をパッケージに使用するのが一般的だが、低背化する上では底面、および蓋の肉厚をより薄くすることで、気密容器全体を小型化し同時に薄型化する必要がある。 A general piezoelectric vibrator has a configuration in which a vibrating piece in which electrodes for excitation are formed on both surfaces of a flat plate of a piezoelectric material is housed as a piezoelectric vibrating element plate in a container shape having an airtight seal. Therefore, in order to achieve both the sealing accuracy, airtightness, and moisture resistance of the piezoelectric vibrator container, it is common to use inorganic materials such as glass, ceramic, and metal for the package. Further, it is necessary to make the entire hermetic container smaller and thinner at the same time by making the wall thickness of the lid thinner.
しかしながら、セラミック材料のパッケージの主流は、蓋を金属製のものを使用することから、セラミック容器、蓋の熱膨張係数の違いにより、溶接、封止時には熱ストレスが加わり歪みが残留するなどの工程上の課題がある。
従来の封止例として例えば金スズ共晶合金だけを用いた熱融着は、溶接手段による封止に比べれば気密容器の接合部に対する熱ストレスを低く抑えることができるものの、封止材料に金材料（金スズ共晶合金）を主流として使用するため材料費が高価になってしまい、このことは金相場という市場の中での変動にも左右される現状があることからコスト変動の要因となっている。
However, the mainstream of ceramic material packages is that the lid is made of metal, and due to differences in the thermal expansion coefficient of the ceramic container and lid, thermal stress is applied during welding and sealing, and strain remains. There is an upper problem.
As a conventional sealing example, for example, heat fusion using only a gold-tin eutectic alloy can suppress the thermal stress on the joint portion of the hermetic container as compared with sealing by welding means, but the sealing material is made of gold. Since the material (gold-tin eutectic alloy) is used as the mainstream, the material cost becomes high, and this is a factor of cost fluctuation because there is a current situation that is also influenced by fluctuations in the market of gold prices. It has become.
また、銀ロウクラッドの封止材料を電子ビームにより溶接した気密容器の場合では、気密容器に対して封止時のストレスが加わることから封止後の接合部に応力歪みが残留していまうという現象も発生する。また、加熱により容器の収納する圧電振動子に対して熱歪みを与えてしまえことから、周波数が変動するなどの問題があった。 In addition, in the case of an airtight container in which a silver wax clad sealing material is welded by an electron beam, a stress at the time of sealing is applied to the airtight container, so that a stress strain remains in the joint after sealing. Also occurs. In addition, there is a problem that the frequency fluctuates because the piezoelectric vibrator housed in the container is thermally strained by heating.
そこで上述する課題を解決するために本発明は、ガラス容器とガラス蓋とで気密封止をする気密容器において、超音波振動により前記気密容器は接合され、前記気密容器の接合面にアルミニウム層が形成され、前記蓋の接合面にアルミニウムあるいは、銀スズあるいは、ハンダのいずれかの接合層が形成されている気密容器である。 Therefore, in order to solve the above-described problems, the present invention provides an airtight container that is hermetically sealed with a glass container and a glass lid, wherein the airtight container is joined by ultrasonic vibration, and an aluminum layer is formed on the joining surface of the airtight container. The airtight container is formed and has a bonding layer of aluminum, silver tin, or solder formed on the bonding surface of the lid.
要するに本発明は、従来から用いていた金スズ材料に代えて、気密容器の接合面にアルミニウム層が形成され、アルミニウムあるいは、銀スズあるいは、ハンダのいずれかの封止材料を形成することで、金スズ材料を主材料とすることの無い接合部を構成することにより、接合材料の費用を低減し、接合時には超音波振動による振動と熱と圧力を加えることで容器と蓋とを一体化し密閉容器を構成するものである。 In short, in the present invention, instead of the conventionally used gold-tin material, an aluminum layer is formed on the joint surface of the airtight container, and by forming a sealing material of either aluminum, silver tin, or solder, By constructing joints that do not use gold-tin material as the main material, the cost of the joint material is reduced, and the container and lid are integrated and sealed by applying vibration, heat, and pressure by ultrasonic vibration during joining. It constitutes a container.
本発明では、従来の金スズ共晶合金封止材料を加熱方式で容器と蓋とを接合するのでは無く、アルミニウムあるいは、銀スズあるいは、ハンダのいずれかの封止材料を超音波により接合することで、例えば従来に用いられている陽極接合のように、接合面に高電圧を付加して接合するのでは無く、超音波振動により接合することにより、従来に挙げる課題である熱歪みや応力歪みを大幅に改善することで課題を解決する。 In the present invention, the conventional gold-tin eutectic alloy sealing material is not bonded to the container and the lid by a heating method, but any sealing material of aluminum, silver tin, or solder is bonded by ultrasonic waves. Thus, for example, conventional anodic bonding is not performed by applying a high voltage to the bonding surface, but by ultrasonic vibration, which is a problem that has been conventionally raised, such as thermal strain and stress. The problem is solved by greatly improving the distortion.
本発明によれば、封止材料に銀層とスズ層を形成することで、リッド単価を低減し、超音波封止を用いることにより、封止温度を下げることが可能となり、封止前後の周波数変動が安定する。また、超音波封止を用いることで、本封止前の仮封止が不要となり、設備や製造コストの削減ができる。 According to the present invention, by forming the silver layer and the tin layer in the sealing material, the lid unit price can be reduced, and by using ultrasonic sealing, the sealing temperature can be lowered, and before and after sealing. Frequency fluctuation is stable. In addition, by using ultrasonic sealing, temporary sealing before main sealing is not necessary, and facilities and manufacturing costs can be reduced.
以下、添付図面に従ってこの発明の実施例を説明する。
図１は本発明の蓋２に注目した断面図である。蓋材料にガラスを基材として容器１と接する側、すなわち封止面の少なくとも封止面に直接に当たる箇所に接合部材として蓋の接合面にアルミニウムあるいは、銀スズあるいは、ハンダのいずれかの接合層が形成されている。一方容器１もガラス材料を基台として、容器１の接合面にはアルミニウム金属で層が形成されている。
Embodiments of the present invention will be described below with reference to the accompanying drawings.
FIG. 1 is a cross-sectional view focusing on the lid 2 of the present invention. Bonding layer of either aluminum, silver tin, or solder on the bonding surface of the lid as a bonding member on the side of the lid material that comes into contact with the container 1 using glass as a base material, that is, at least a portion of the sealing surface that directly contacts the sealing surface Is formed. On the other hand, the container 1 is also based on a glass material, and a layer of aluminum metal is formed on the joint surface of the container 1.
そして、容器１との接合には超音波振動により蓋２とを接合することで、従来に比べて熱歪みやストレスによる応力歪みの発生を解消することにより、容器１と蓋２とを接合することで発生する水晶振動子に与える影響を大幅に解消することができる。 Then, the container 1 and the lid 2 are joined to each other by joining the lid 2 to the container 1 by ultrasonic vibration so as to eliminate the occurrence of stress distortion due to thermal distortion or stress compared to the conventional case. The influence on the crystal resonator generated by this can be largely eliminated.
図２に示すのは、本発明の蓋２を用いた製造工程のフロー図である。図２（ａ）では一連の流れを示すものであるが、全体的に従来工法と差異は無いが、本発明では、容器１の接合面にアルミニウム層が形成され、前記蓋の接合面にアルミニウムあるいは、銀スズあるいは、ハンダのいずれかの接合層が形成され、接合手段に超音波振動を与えて気密封止を実現するものである。従来では金スズ共晶合金により封止をしていた工程を従来技術に記載する不具合を解消する目的で本発明に示すように封止工程を改善したものである。その結果、図２（ｂ）に示すような圧電振動子の斜視図のような構成を得ることになる。この場合、容器１側の接合面に形成されるアルミニウム層と、蓋に形成される前記の接合層とにより接合することで気密封止を実現する。 FIG. 2 is a flowchart of a manufacturing process using the lid 2 of the present invention. Although FIG. 2A shows a series of flows, there is no difference from the conventional method as a whole, but in the present invention, an aluminum layer is formed on the joint surface of the container 1 and aluminum is formed on the joint surface of the lid. Alternatively, a bonding layer of either silver tin or solder is formed, and an ultrasonic vibration is applied to the bonding means to realize hermetic sealing. Conventionally, the sealing process is improved as shown in the present invention in order to eliminate the problems described in the prior art of the process that has been sealed with the gold-tin eutectic alloy. As a result, a configuration as shown in a perspective view of the piezoelectric vibrator as shown in FIG. In this case, hermetic sealing is realized by bonding with the aluminum layer formed on the bonding surface on the container 1 side and the bonding layer formed on the lid.
なお、上述する超音波振動については、一例として発振周波数が２０ＫＨｚ〜５０ＫＨｚ、印加時間としては１００〜５００ｍｓｅｃ、加圧量としては、１〜１０Ｎで封止処理を行うものである。上記の条件の中で最も良好と考えられるのは、封止部分における加熱温度が１５０℃前後になったものが特にデータの掲載は無いが実験的に良好とされている。 In addition, about the ultrasonic vibration mentioned above, a sealing process is performed by an oscillation frequency of 20 KHz-50 KHz as an example, 100-500 msec as an application time, and 1-10N as a pressurization amount. Among the above conditions, the best condition is considered that the heating temperature at the sealed portion is around 150 ° C., although no data is published, but it is experimentally favorable.
Claims (1)
超音波振動により前記気密容器は接合され、前記気密容器の接合面にアルミニウム層が形成され、前記蓋の接合面にアルミニウムあるいは銀スズあるいは、ハンダのいずれかの接合層が形成されていることを特徴とする気密容器。 In an airtight container that hermetically seals with a glass container and a glass lid,
The hermetic container is bonded by ultrasonic vibration, an aluminum layer is formed on the bonding surface of the hermetic container, and a bonding layer of aluminum, silver tin, or solder is formed on the bonding surface of the lid. Characteristic airtight container.
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| JP2006182556A JP4781925B2 (en) | 2006-06-30 | 2006-06-30 | Airtight container |
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| JP2006182556A JP4781925B2 (en) | 2006-06-30 | 2006-06-30 | Airtight container |
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| JP2008010794A JP2008010794A (en) | 2008-01-17 |
| JP4781925B2 true JP4781925B2 (en) | 2011-09-28 |
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