JP2007324364A - Airtight container - Google Patents

Airtight container Download PDF

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Publication number
JP2007324364A
JP2007324364A JP2006152857A JP2006152857A JP2007324364A JP 2007324364 A JP2007324364 A JP 2007324364A JP 2006152857 A JP2006152857 A JP 2006152857A JP 2006152857 A JP2006152857 A JP 2006152857A JP 2007324364 A JP2007324364 A JP 2007324364A
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sealing
lid
container
layer
tin
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JP2006152857A
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Hirokazu Kobayashi
宏和 小林
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Kyocera Crystal Device Corp
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Kyocera Crystal Device Corp
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Priority to JP2006152857A priority Critical patent/JP2007324364A/en
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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a container structure which is not affected by the sealing condition of the container in order to improve the factor which causes frequency fluctuation etc. according to the conditions during hermetic sealing of a piezoelectric vibrator. <P>SOLUTION: The problem in the airtight container which is sealed by a container and a lid is solved so that the joint surface processing of the lid forms a silver layer and a tin layer on the lid material through a joint member, and it joins to the lid by ultrasonic vibration, thereby reducing the unit price being reduced. By the use of ultrasonic sealing, it becomes possible to lower the sealing temperature by stabilizing frequency fluctuation before and after the sealing. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、圧電振動子の気密封止時の条件により周波数変動などを起こす要因を改善するための、容器の封止材に関するものである。   The present invention relates to a container sealing material for improving a factor that causes a frequency variation or the like depending on conditions at the time of hermetic sealing of a piezoelectric vibrator.

小型SMD振動子のパッケージはセラミック、ガラス、金属、樹脂などが用いられ、精度を要求されるものは耐湿度性、気密性の良いセラミック、金属、ガラスが用いられている。樹脂パッケージは吸湿性と気密性から比較的安定性に余裕がある一般民生製品に使用されている。   Ceramic, glass, metal, resin, and the like are used for the package of the small SMD vibrator, and ceramic, metal, and glass with high humidity resistance and airtightness are used for those that require accuracy. Resin packages are used for general consumer products that have relatively high stability due to their hygroscopicity and airtightness.

蓋については、パッケージ同様、気密性、耐湿性のよい金属、セラミック、ガラスなどが使用され、その封止方法には、金属リッドのシーム溶接、金スズ融着、セラミックキャップのガラス融着、金属ベースと金属キャップの溶接などが用いられ、電子ビーム、レーザなども使用、検討されている。   As for the lid, metal, ceramic, glass, etc. with good airtightness and moisture resistance are used in the same way as the package. Sealing methods include seam welding of metal lids, gold-tin fusion, glass fusion of ceramic caps, metal Welding of the base and metal cap is used, and electron beams and lasers are also being used and studied.

昨今携帯端末の用途はICタグ、テレビモジュール、GPS受信機、ハードディスク(HDD)モジュールなど拡大を続け、そのアプリケーションは増加し続け、機能を満たすためにGPSモジュール、HDDモジュール、チューナモジュールなど端末に搭載される機能部品は増加する傾向にある。その一方で端末機器自体の大きさは制限があるため、精度、気密性、耐湿性はそのままで部品に対する小型低背化要求は更に強くなってきている。   Recently, the use of mobile terminals continues to expand, such as IC tags, TV modules, GPS receivers, hard disk (HDD) modules, and the applications continue to increase. In order to satisfy the functions, GPS modules, HDD modules, tuner modules, etc. are installed in terminals. There is a tendency to increase the number of functional parts. On the other hand, since the size of the terminal device itself is limited, there is an increasing demand for reducing the size and height of parts while maintaining accuracy, airtightness, and moisture resistance.

製品単価についても厳しい要求がなされ、いかに材料費投資を抑え生産性を上げるかが課題となっている。しかしながら精度、信頼性を確保しつつ超小型低背化を達成するためには、底面、および蓋の肉厚を薄くする必要がある。セラミック材料のパッケージの主流は、蓋を金属製のものを使用することから、セラミック容器、蓋の熱膨張係数の違いにより、溶接、封止時には熱ストレスが加わり歪みが残留し、パッケージ強度が保てないことから、材料、封止方法も限定されてきており、現在では外形寸法で2.5mm×2.0mm以下の小型の気密封止方法は金スズリッドの熱融着方式あるいは、Agロウクラッドリッド電子ビームによる溶接が主流となっている。   Strict demands are also made on the unit price of products, and the issue is how to increase the productivity by reducing the investment in material costs. However, in order to achieve ultra-compact and low profile while ensuring accuracy and reliability, it is necessary to reduce the thickness of the bottom surface and the lid. The mainstream of ceramic material packages is that the lid is made of metal, and due to the difference in the thermal expansion coefficient between the ceramic container and the lid, thermal stress is applied during welding and sealing, strain remains, and the package strength is maintained. Therefore, materials and sealing methods are also limited. At present, a small hermetic sealing method with an outer dimension of 2.5 mm × 2.0 mm or less is a gold tin lid heat fusion method or an Ag wax cladding. Welding with lid electron beams is the mainstream.

昨今では、水晶ウエハからフォトリソグラフィーにより一括で振動子を形成し、ウエハ状態のまま陽極接合により一括封止を行う方法も提案されている。また、ベース(パッケージ)にガラスを用い短冊形状の振動子を個々に実装調整した後にウエハ状態で一括封止を行う方法も提案されている。またその一方で、端末機器自体の大きさは制限があるため、精度、気密性、耐湿性はそのままで部品に対する小型低背化要求は更に強くなってきている現状にもある。
特開平7−96610号公報 なお、出願人は前記した先行技術文献情報で特定される先行技術文献以外には、本発明に関連する先行技術文献を、本件出願時までに発見するに至らなかった。
In recent years, there has also been proposed a method in which vibrators are collectively formed from a quartz wafer by photolithography and collectively sealed by anodic bonding in the wafer state. In addition, a method has been proposed in which glass is used for a base (package) and strip-shaped vibrators are individually mounted and adjusted and then collectively sealed in a wafer state. On the other hand, since the size of the terminal device itself is limited, there is an increasing demand for reducing the size and height of parts while maintaining accuracy, airtightness, and moisture resistance.
JP, 7-96610, A In addition to the prior art document specified by the above-mentioned prior art document information, the applicant has not found prior art documents related to the present invention by the time of filing of the present application. .

一般的な圧電振動子は気密封止を持った容器形態の中に、圧電振動素板として圧電材料の平板の両面に励振用の電極を形成した振動片を収納した構成となっている。そのため、圧電振動子容器の封止精度、気密、耐湿性を両立させるためには、ガラス、セラミック、金属など無機系の材料をパッケージに使用するのが一般的だが、低背化する上では底面、および蓋の肉厚をより薄くすることで、容器全体を小型化し同時に薄型化する必要がある。   A general piezoelectric vibrator has a configuration in which a vibrating piece in which electrodes for excitation are formed on both surfaces of a flat plate of a piezoelectric material is housed as a piezoelectric vibrating element plate in a container shape having an airtight seal. Therefore, in order to achieve both the sealing accuracy, airtightness, and moisture resistance of the piezoelectric vibrator container, it is common to use inorganic materials such as glass, ceramic, and metal for the package. Further, it is necessary to make the entire container smaller and thinner at the same time by reducing the thickness of the lid.

しかしながら、セラミック材料のパッケージの主流は、蓋を金属製のものを使用することから、セラミック容器、蓋の熱膨張係数の違いにより、溶接、封止時には熱ストレスが加わり歪みが残留するなどの工程上の課題がある。
従来の封止例として例えば金スズ共晶合金を用いた熱融着は、溶接手段による封止に比べれば容器の接合部に対する熱ストレスを低く抑えることができるものの、封止材料に金材料(金スズ共晶合金)を使用するため材料費が高価になってしまい、また金相場という市場の中での変動にも左右される現状があることからコスト変動の要因となっている。
However, the mainstream of ceramic material packages is that the lid is made of metal, and due to differences in the thermal expansion coefficient of the ceramic container and lid, thermal stress is applied during welding and sealing, and strain remains. There is an upper problem.
As a conventional sealing example, for example, heat fusion using a gold-tin eutectic alloy can suppress the thermal stress on the joint portion of the container to a low level as compared with sealing by welding means, but a gold material ( Since the use of a gold-tin eutectic alloy), the material cost becomes high, and the current situation depends on the market fluctuation of the gold market, which causes the cost fluctuation.

また、銀ロウクラッドの封止材料を電子ビームにより溶接した容器の場合では、容器に対して封止時のストレスが加わることから封止後の接合部に応力歪みが残留していまうという現象も発生する。また、加熱により容器の収納する圧電振動子に対して熱歪みを与えてしまえことから、周波数が変動するなどの問題があった。   In addition, in the case of a container welded with a silver wax clad sealing material by an electron beam, a stress at the time of sealing is applied to the container, resulting in a phenomenon that stress strain remains in the joint after sealing. To do. In addition, there is a problem that the frequency fluctuates because the piezoelectric vibrator housed in the container is thermally strained by heating.

そこで上述する課題を解決するために本発明は、容器と蓋とで気密封止をする気密容器において、前記蓋の接合面処理が、蓋材の上に接合部材を介して銀層とスズ層を形成し超音波振動により前記容器と接合されている気密容器である。   Therefore, in order to solve the above-described problems, the present invention provides an airtight container that is hermetically sealed with a container and a lid, wherein the joint surface treatment of the lid is performed on the lid material by a silver layer and a tin layer via a joint member. And an airtight container joined to the container by ultrasonic vibration.

要するに本発明は、従来から用いていた金スズ材料に代えて、銀層とスズ層の封止材料を用いて接合し、接合時には超音波振動による振動と熱と圧力を加えることで容器と蓋とを一体化し密閉容器を構成するものである。   In short, the present invention uses a sealing material of a silver layer and a tin layer instead of the conventionally used gold-tin material, and at the time of joining, the container and the lid are applied by applying vibration, heat and pressure by ultrasonic vibration. Are integrated to form a sealed container.

本発明では、従来の金スズ共晶合金封止材料を加熱方式で容器と蓋とを接合するのでは無く、銀層とスズ層の封止材料を超音波により接合することで、従来に挙げる課題である熱歪みや応力歪みを大幅に改善することで課題を解決する。   In the present invention, the conventional gold-tin eutectic alloy sealing material is not conventionally bonded to the container and the lid by a heating method, but is conventionally cited by bonding the silver layer and the tin layer sealing material by ultrasonic waves. The problem is solved by greatly improving the thermal strain and stress strain that are the issues.

本発明によれば、封止材料に銀層とスズ層を形成することで、リッド単価を低減し、超音波封止を用いることにより、封止温度を下げることが可能となり、封止前後の周波数変動が安定する。また、超音波封止を用いることで、本封止前の仮封止が不要となり、設備や製造コストの削減ができる。   According to the present invention, by forming the silver layer and the tin layer in the sealing material, the lid unit price can be reduced, and by using ultrasonic sealing, the sealing temperature can be lowered, and before and after sealing. Frequency fluctuation is stable. In addition, by using ultrasonic sealing, temporary sealing before main sealing is not necessary, and facilities and manufacturing costs can be reduced.

以下、添付図面に従ってこの発明の実施例を説明する。
図1は本発明の蓋2に注目した断面図である。例えば蓋材料に金属、セラミックを基材として容器1と接する側、すなわち封止面の少なくとも封止面に直接に当たる箇所に接合部材を介して銀層3とスズ層4を形成した蓋2と接合する容器である。
Embodiments of the present invention will be described below with reference to the accompanying drawings.
FIG. 1 is a cross-sectional view focusing on the lid 2 of the present invention. For example, the lid 2 is bonded to the lid 2 in which the silver layer 3 and the tin layer 4 are formed via a bonding member on the side that comes into contact with the container 1 using a metal, ceramic as a base material, that is, at least a portion of the sealing surface that directly contacts the sealing surface. Container.

容器1の基材には銀層3スズ層4を接合するための接合材として例えば下地に用いる金属材料であるチタン、クロム、ニッケルを介した後に銀層3スズ層4を処理した蓋2となっている。そして、容器1との接合には超音波振動により蓋2とを接合することで、従来に比べて熱歪みやストレスによる応力歪みの発生を解消することにより、容器1と蓋2とを接合することで発生する水晶振動子に与える影響を大幅に解消することができる。   A lid 2 in which the silver layer 3 tin layer 4 is treated after passing through titanium, chromium, nickel, which are metal materials used for the base, for example, as a bonding material for bonding the silver layer 3 tin layer 4 to the base material of the container 1 It has become. Then, the container 1 and the lid 2 are joined to each other by joining the lid 2 to the container 1 by ultrasonic vibration so as to eliminate the occurrence of stress distortion due to thermal distortion or stress compared to the conventional case. The influence on the crystal resonator generated by this can be largely eliminated.

図2に示すのは、本発明の蓋2を用いた製造工程のフロー図である。図2(a)では一連の流れを示すものであるが、全体的に従来工法と差異は無いが、本発明では蓋2の接合面に銀層3スズ層4を形成し、接合手段に超音波振動を与えて気密封止を実現するものである。従来では金スズ共晶合金により封止をしていた工程を従来技術に記載する不具合を解消する目的で本発明に示すように封止工程を改善したものである。その結果、図2(b)に示すような圧電振動子の斜視図のような構成を得ることになる。この場合、容器1側の接合面に形成されるメタライズ層と、蓋に形成される前記の銀層3とスズ層4のうちスズ層4が前記メタライズ層と接合することで気密封止を実現する。なお、本発明の封止部分は銀層3とスズ層4の厚みが一対一の比率でも良好な封止ができる。   FIG. 2 is a flowchart of a manufacturing process using the lid 2 of the present invention. Although FIG. 2A shows a series of flows, there is no difference from the conventional method as a whole. However, in the present invention, a silver layer 3 tin layer 4 is formed on the joining surface of the lid 2 and the joining means is super A hermetic seal is realized by applying sonic vibration. Conventionally, the sealing process is improved as shown in the present invention in order to eliminate the problems described in the prior art of the process that has been sealed with the gold-tin eutectic alloy. As a result, a configuration as shown in a perspective view of the piezoelectric vibrator as shown in FIG. In this case, the metallized layer formed on the bonding surface on the container 1 side and the silver layer 3 and the tin layer 4 formed on the lid, the tin layer 4 is bonded to the metallized layer to achieve hermetic sealing. To do. In addition, the sealing part of this invention can perform favorable sealing even if the thickness of the silver layer 3 and the tin layer 4 is a one-to-one ratio.

なお、上述する超音波振動については、一例として発振周波数が20KHz〜50KHz、印加時間としては100〜500msec、加圧量としては、1〜10Nで封止処理を行うものである。上記の条件の中で最も良好と考えられるのは、封止部分における加熱温度が150℃前後になったものが特にデータの掲載は無いが実験的に良好とされている。   In addition, about the ultrasonic vibration mentioned above, a sealing process is performed by an oscillation frequency of 20 KHz-50 KHz as an example, 100-500 msec as an application time, and 1-10N as a pressurization amount. Among the above conditions, the best condition is considered that the heating temperature at the sealed portion is around 150 ° C., although no data is published, but it is experimentally favorable.

本発明の蓋の構造を説明する概念図である。It is a conceptual diagram explaining the structure of the lid | cover of this invention. 本発明の製造工程の流れを示すフロー図と、圧電振動子の概念図である。It is the flowchart which shows the flow of the manufacturing process of this invention, and the conceptual diagram of a piezoelectric vibrator.

符号の説明Explanation of symbols

1 容器
2 蓋
3 銀層
4 スズ層
1 container 2 lid 3 silver layer 4 tin layer

Claims (1)

容器と蓋とで気密封止をする気密容器において、
前記蓋の接合面処理が、蓋材の上に接合部材を介して銀層とスズ層を形成し超音波振動により前記容器と接合されていることを特徴とする気密容器。
In an airtight container that hermetically seals the container and lid,
An airtight container characterized in that the bonding surface treatment of the lid forms a silver layer and a tin layer on a lid member via a bonding member and is bonded to the container by ultrasonic vibration.
JP2006152857A 2006-05-31 2006-05-31 Airtight container Pending JP2007324364A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
JP2006152857A JP2007324364A (en) 2006-05-31 2006-05-31 Airtight container

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JP2007324364A true JP2007324364A (en) 2007-12-13

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003046010A (en) * 2001-07-31 2003-02-14 Daishinku Corp Hermetically-sealed electronic component
JP2003188294A (en) * 2001-12-21 2003-07-04 Murata Mfg Co Ltd Manufacturing method of electronic component
JP2004179361A (en) * 2002-11-27 2004-06-24 Kyocera Corp Covering member and container for housing electronic components using the same
JP2007043106A (en) * 2005-06-30 2007-02-15 Hitachi Metals Ltd Lid material for airtight sealing and manufacturing method therefor, as well as package for electronic components

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003046010A (en) * 2001-07-31 2003-02-14 Daishinku Corp Hermetically-sealed electronic component
JP2003188294A (en) * 2001-12-21 2003-07-04 Murata Mfg Co Ltd Manufacturing method of electronic component
JP2004179361A (en) * 2002-11-27 2004-06-24 Kyocera Corp Covering member and container for housing electronic components using the same
JP2007043106A (en) * 2005-06-30 2007-02-15 Hitachi Metals Ltd Lid material for airtight sealing and manufacturing method therefor, as well as package for electronic components

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