JP4781337B2 - Deposition equipment - Google Patents

Description

  The present invention relates to a film forming apparatus, and more particularly to a film forming apparatus that supplies power to a substrate while changing the position of the substrate during the film forming process of the substrate.

  In recent years, an apparatus for forming a film while applying a voltage (positive, negative, high frequency, etc.) to the substrate has been developed (for example, Patent Document 1 and bias sputtering). Referring to FIG. 2 of the patent document, an evaporation source (6) and a substrate dome (5) on which a plurality of substrates (4) are mounted are disposed inside the vacuum chamber (1). The substrate dome (5) is rotated by the substrate dome rotating mechanism (9) and also supplied with high frequency power from the high frequency power feeding mechanism (16).

  Regarding the rotation of the substrate dome and the supply of electric power to the substrate dome, referring to FIG. 3 of the patent document, the electric power from the power supply mechanism is supplied to a part of the substrate dome (5) through the contact (21). More specifically, the contact (21) fixed to the vacuum chamber (1) (suspended by a spring or the like) rotates the substrate dome with respect to the vacuum chamber (1). ) To be in contact with a predetermined portion.

A schematic configuration of the above-described conventional film forming apparatus, particularly regarding power feeding, is shown in the block diagrams of FIGS.
FIG. 9A is a block diagram showing a vacuum chamber (1) (hereinafter referred to as “deposition chamber 103”) before the substrate dome is set. The film forming chamber 103 includes a power source 180, a contact mechanism 181 and a power source 190, which correspond to the conventional high-frequency power feeding mechanism (16), contact (21), and substrate dome rotation mechanism (9), respectively.
FIG. 9B is a block diagram showing the film forming chamber 103 when the substrate dome is mounted. Here, the drive system unit 170 (hereinafter referred to as “rotor unit 170”) corresponds to the substrate dome (5) in the conventional example. The rotator unit 170 is rotated by the power source 190, and the electric power from the power source 180 is contacted and supplied to the rotator unit 170 by the contact mechanism 181.
JP 2001-73136 A

The conventional configuration has the following problems.
The first problem is a decrease in the operation rate accompanying the maintenance of the apparatus. In the apparatus as described above, the member with the fastest wear is the contact mechanism 181, but the film forming apparatus cannot be used at all during the maintenance of the contact mechanism 181. Therefore, when performing maintenance as preventive maintenance (periodic maintenance or maintenance over time), processing and production of a substrate must be interrupted when the maintenance timing comes even during busy production. Further, in the case of maintenance by ex-post maintenance, that is, maintenance at the time of failure of the contact mechanism 181, the procurement time of the members related to the replacement contact mechanism 181, the time until the worker rushes and the time required for the replacement work are included. In addition, the non-operating time increases and the operating rate of the film forming apparatus decreases.

  The second problem is that the contact between the rotating body unit 170 and the contact mechanism 181 is not reliable. This problem is particularly problematic when the configuration of FIG. 9 is applied to an inline type or load lock type configuration. That is, for example, in a batch type apparatus in which an operator sets the rotary unit 170 at a predetermined position as in Patent Document 1, the contact state between the rotary unit 170 and the contact mechanism 181 can be confirmed at the time of setting. However, when the robot conveys and sets the rotating body unit 170 using the conveying means or the like, the contact state cannot be confirmed. Therefore, when there is a contact failure, the contact failure cannot be found at that time, and the existence of the contact failure is estimated only after the characteristics of the film-formed substrate are evaluated. Therefore, it is difficult to improve the yield when processing the substrate continuously.

  The third problem is related to the first and second problems, but is that the state of the contact mechanism 181 cannot be checked during the film forming process. The speed at which the contact mechanism 181 deteriorates depends on the temperature during film formation, the power to be supplied, the contact strength, and the like. Further, the contact mechanism 181 is accelerated and consumed due to a spark generated at the moment when contact failure occurs. Further, since the contact mechanism 181 is usually composed of a plurality of members and the deterioration mechanism of the contact mechanism 181 is complex, it is difficult to accurately predict the life and deterioration thereof. Therefore, it is necessary to check the state of the contact mechanism relatively frequently to confirm that there is no deterioration each time. However, as described above, it is necessary to interrupt the film forming operation in order to check the state of the contact mechanism. At that time, the vacuum deposition chamber is once opened to the atmosphere and evacuated again when the deposition is resumed after the check, so that the continuous processing time is shortened and it is difficult to improve the production efficiency.

  To summarize the above, in the conventional film forming apparatus, if the contact state is frequently checked and replaced in consideration of the yield improvement, the production efficiency is lowered. If priority is given to the improvement of the production efficiency, the yield is lowered as a result. In some cases, both were not compatible.

  In order to solve the above-mentioned problems, the present invention does not mount a contact configuration, which is important for management, in the main part of the apparatus (deposition chamber, etc.), but on the side of the substrate holder that is transported independently of the main part. The basic concept is to prepare for.

A first aspect of the present invention is a film forming apparatus including a vacuum film forming chamber having a power source and a power source, and a substrate holder set at a film forming position in the vacuum film forming chamber, the power source having a feeding electrode. The substrate holder is composed of a stationary unit that is stationary at the film forming position and a drive unit that is mounted on the stationary unit and is driven by a power source, and the stationary unit is in electrical contact with the feeding electrode. And a film forming apparatus having a contact mechanism for supplying power from the power receiving electrode to the drive system unit.
Here, the drive system unit may be a rotating body unit, and the rotating body unit may be rotated by a power source.
Furthermore, a transporting means for carrying one or more substrate holders into and out of the vacuum film forming chamber may be provided.

In the first aspect, the contact mechanism is constituted by a bearing, and the bearing is a side surface of the drive system unit that is perpendicular to the substrate or the back surface of the drive system unit and is horizontal to the substrate and is processed by the substrate. It was set as the structure contact | abutted to the surface on the opposite side to a surface.
Further, the contact mechanism is constituted by a brush, and the brush is a side surface of the drive system unit that is perpendicular to the substrate or a back surface of the drive system unit that is horizontal to the substrate and opposite to the substrate processing surface. It is good also as a structure contact | abutted to a surface.
Furthermore, you may provide the raising / lowering mechanism which makes a feeding electrode movable between a contact position and a cutting | disconnection position with respect to the said receiving electrode.

  According to a second aspect of the present invention, there is provided a film forming method in the film forming apparatus according to the first aspect, wherein the contact between the drive system unit on which the substrate is mounted and the contact mechanism is established on the substrate holder; A step of bringing the holder into the vacuum film formation chamber, a step of stopping the substrate holder at the film formation position, a step of electrically connecting the power feeding electrode and the power receiving electrode, a step of driving the drive system unit by a power source, and a power source A film forming method including a step of energizing by means.

  The third aspect of the present invention is a substrate holder set at a film forming position in a vacuum film forming chamber having a power source and a power source, and is mounted on the stationary system unit stationary at the film forming position and the stationary system unit The drive system unit is driven by a power source, and the stationary system unit includes a power receiving electrode for receiving power supply from a power source and a contact mechanism for supplying power from the power receiving electrode to the drive system unit It is a holder.

  The substrate holder is composed of a stationary system unit that is stationary at the film forming position and a driving system unit that is mounted on the stationary system unit and is driven by a power source. The stationary system unit receives power from the receiving electrode and the receiving electrode. Since the contact mechanism is provided to supply the contact mechanism, the contact mechanism can be maintained and the contact state can be confirmed without interrupting the film forming process, and the drive system unit and the contact mechanism can be reliably brought into contact with each other. It is possible to achieve both high yield and production efficiency.

Hereinafter, a film forming apparatus and a film forming method according to an embodiment of the present invention will be described.
FIG. 1 shows a load lock type sputtering apparatus 1. The apparatus 1 has a two-chamber configuration including a preparation chamber 2 and a film formation chamber 3, and the two chambers are partitioned by a valve 6. The preparation chamber 2 is connected to an exhaust device 8 via a valve 7, and the film formation chamber 3 is connected to an exhaust device 10 via a valve 9. Since the preparation chamber 2 and the film formation chamber 3 are provided with separate exhaust means, the atmosphere in each chamber can be controlled independently.

The film formation substrate 100 is carried by being mounted on a substrate holder 4 whose details will be described later.
The valve 5 of the preparation chamber 2 serves as a carry-in / out port when the substrate holder 4 is carried into the preparation chamber 2 and when the substrate holder 4 is carried out of the preparation chamber 2. Although the valve 5 may be connected to other devices, in the embodiment, it is used as a door for carrying the substrate holder 4 in and out of the atmosphere. The valve 6 serves as a loading / unloading port when the substrate holder 4 is carried into the film formation chamber 3 from the preparation chamber 2 and when the substrate holder 4 is carried out of the preparation chamber 2 from the film formation chamber 3. The preparation chamber 2 not only carries the unprocessed substrate into the film formation chamber 3 but also functions as a take-out chamber for carrying in the processed substrate from the film formation chamber 3. Although the two-room configuration is used in the embodiment, a three-room configuration in which an extraction chamber is separately provided may be used.

The substrate holder 4 is transported by the transport means 11.
The substrate holder 4 transported from the preparation chamber 2 is stopped at a predetermined film forming position where the substrate 100 faces the film forming material 101, and is connected to the rotating mechanism 21 and the power supply plate 18 at the film forming position.

  The film forming chamber 3 includes a sputtering gas introduction means 13, a valve 12 connected to the sputtering gas introduction means 13, a sputtering cathode 14, a sputtering cathode power supply 15, a substrate heating heater 16, a heater 16 power supply 17, a power supply plate 18, and a power supply. A lifting mechanism 19 for the plate 18, a power supply 20 for the power feeding plate, a rotating mechanism 21, and a control unit 22 are provided. A film forming material 101 is set on the sputter cathode 14.

  The control unit 22 includes a valve 6, an exhaust device 10, a transport unit 11, a sputter gas introduction unit 13, a power source 15 for the sputter cathode 14, a power source 17 for the heater 16, a feeding plate lifting / lowering mechanism 19, a power source 20 for the power feeding plate 18, and a rotating mechanism. 21 and the other operations of the exhaust device 8 in the charging chamber 2 are controlled.

  The substrate holder 4 will be described with reference to the schematic cross-sectional view shown in FIG. 2 and the schematic plan view shown in FIG. The substrate holder 4 is obtained by attaching each member described below on a base 31 having an opening window in the center. The opening window of the base 31 has a shape in which at least the film formation region of the substrate 100 is exposed to the film formation material 101. The shielding part of the base 31 also functions as a mask that shields the sputtered particles.

  A turntable 33 is attached to the base 31 via a bearing 32. In the embodiment, a gear is cut on the outer periphery of the turntable 33 and meshed with the drive gear 43 of the rotation mechanism 21 fixedly arranged in the film forming chamber 3 to rotate the turntable 33. The rotation mechanism 21 only needs to transmit a rotational force. For example, a magnetic pole may be formed on the outer periphery of the turntable 33, and a non-contact rotation transmission mechanism using magnetic force may be used.

A substrate tray holding plate 35 is attached to the turntable 33 via an insulator 34. The substrate 100 for film formation is placed on the substrate tray 30, and the substrate tray holding plate 35 holds the substrate tray 30. In the embodiment, the substrate tray 30 is provided with the same number of recesses as the mounting substrate (seven in the figure), holes are formed in the bottom wall of the recesses, and the film formation surface of the substrate 100 is set face down. The The hole has a shape equal to the film formation region of the substrate 100. The holding means for the substrate 100 is not limited to this and may be selected as appropriate. Further, the substrate 100 may be directly attached to the substrate tray holding plate 35 without using the substrate tray 30. By the rotation mechanism 21, the turntable 33, the insulator 34, the substrate tray holding plate 35, the substrate tray 30, and the substrate 100 are rotated together.
The substrate holding plate 35 and the substrate tray 30 are made of a conductor, and are electrically insulated from the turntable 33 by the insulator 34. The outer periphery of the substrate holding plate 35 is connected to a contact mechanism as a power introduction part.

  The contact mechanism includes a rotary bearing 40, a shaft 41 of the rotary bearing 40, a contact base 38 that supports the rotary bearing 40, a power receiving terminal 39 that supplies power to the contact base, a spring 42 that presses the rotary bearing, and a power feeding thin plate 44. The

The contact base 38 is attached via a lever 37 on a support 36 attached to the base 31 of the substrate holder 4. The base 31 and the contact mechanism are electrically insulated by the insulator 37.
The contact base 38 pivotally supports a contact bearing 40 around the pin 45. The spring 42 presses the contact bearing 40 against the outer peripheral side surface of the substrate tray holding plate 35, and rotates while the contact bearing 40 and the substrate tray holding plate 35 are in contact with each other. The contact bearing 40 rotates around the shaft 41.

The contact base 38 is provided with a power receiving terminal 39. At the film forming position, the power receiving terminal 39 is electrically connected to the power feeding plate 18. In the embodiment, the lifting mechanism 19 of the power feeding plate 18 connects and disconnects the power receiving terminal 39 and the power feeding plate 18. The configuration of the power feeding plate is not limited to this, and any configuration that can supply power to the power receiving terminal of the contact mechanism at the time of film formation may be used.
Electric power is supplied from the power source 20 to the contact bearing 40 via the power feeding plate 18, the contact base 38, and the power feeding thin plate 44. The electric power is supplied to the substrate tray holding plate 35 that rotates in contact with the contact bearing 40 and the substrate tray 30. Electric power is not applied to the base 31 insulated by the insulator 34 and the insulator 37. Although not shown, it is desirable that the shaft 41 is insulated from the power feeding path. In the embodiment, the feeding thin plate 44 is brought into direct contact with the contact bearing 40 to insulate the shaft 41.

  As described above, since the contact mechanism contacts the rotating body and supplies power, the bearings of the contact portion become consumable items and require maintenance. In the present invention, not only the substrate 100 but also the contact mechanism is mounted on the base 31 of the substrate holder 4, so that the contact mechanism can be maintained and inspected every time the substrate is collected. On the other hand, since such a consumable part is not attached to the main body portion (film formation chamber or the like) of the film forming apparatus, it contributes to extending the maintenance cycle of the load lock apparatus.

  As for the contact mechanism, it is most important to ensure contact with the rotating body. However, since the contact mechanism and the rotating body can be securely contacted in advance on the base 31, it is possible to supply power. There is also an advantage that it can be done reliably. Accordingly, the reliability is remarkably improved as compared with the conventional example in which the contact mechanism fixedly arranged in the film forming chamber and the rotating body conveyed in the film forming chamber are brought into contact with each other to supply power.

Here, as a comparison with FIG. 9 of the conventional example, a block diagram showing a schematic configuration of the present invention is shown in FIGS.
FIG. 7A is a block diagram of the substrate holder 4. In FIG. 7A, the substrate holder 4 includes a stationary system unit 60 and a drive system unit 70 (hereinafter referred to as “rotating body unit 70”). The stationary unit 60 includes a power receiving electrode 61, a base mechanism 62, and a contact mechanism 63. The power receiving terminal 39 in FIG. 2 corresponds to the power receiving electrode 61, and the base 31, the bearing 32, the column 36 and the insulator 37 belong to the base mechanism 62. The contact base 38, the rotary bearing 40, the shaft 41, the spring 42, the feeding thin plate 44, and the pin 45 belong to the contact mechanism 63. The rotating table 33, the insulator 34, the substrate tray holding plate 35, and the substrate tray 30 belong to the rotating body unit 70.

FIG. 7B shows a block diagram of the film forming chamber 3 before the substrate holder 4 is set. The film forming chamber 3 includes a power source 80 (that is, the power source 20), its power feeding electrode 81 (that is, the power feeding plate 18), and a power source 90 (that is, the rotating mechanism 21).
FIG. 7C shows a block diagram when the substrate holder 4 is set in the film forming chamber 3. When the substrate holder 4 is carried into the film forming chamber 3, the rotating body unit 70 is rotated by the power source 90, and the power from the power supply electrode 81 of the power source 80 receives the power receiving electrode 61 and the base mechanism 62 of the stationary unit 60. And is supplied to the rotary unit 70 via the contact mechanism 63.

As can be seen from comparison with FIG. 9, in the configuration of FIGS. 7A to 7C, a member with high wear such as a contact mechanism is mounted on the substrate holder 4 and is not mounted on the film forming chamber 3. Further, the contact portion between the power source 80 and the substrate holder 4 (that is, the power feeding electrode 81 and the power receiving electrode 61) is a static contact without friction, and the dynamic contact between the contact mechanism 181 and the rotating body unit 170 in the conventional example. It is much easier to ensure reliability than contact. Therefore, the maintenance and state check regarding the contact between the power supply electrode 81 and the power reception electrode 61 are basically unnecessary.
Therefore, almost no maintenance of the film forming chamber 3 is required, while the substrate holder 4 is in a state where maintenance and inspection can be performed for the contact mechanism of the other substrate holder even when one substrate holder is in the film forming operation. Therefore, it is possible to improve both the production efficiency and the yield in the film forming apparatus.

  Next, another embodiment of the contact mechanism will be described with reference to the schematic cross-sectional view shown in FIG. 4 and the schematic plan view shown in FIG. The contact mechanism shown in the figure is characterized in that a brush is used instead of a bearing at the contact portion with the rotating body. Parts similar to those of the substrate holder 4 shown in FIG. 2 and FIG.

  In FIG. 4, a support plate 51 is attached to the contact base 38, and one end of a brush 50 is fixed to the support plate 51. The other end of the brush 50 is brought into contact with the outer peripheral side surface of the substrate tray holding plate 35, and electric power is supplied to the rotating substrate tray holding plate 35 via the brush.

  2 to 5, the contact mechanism is connected to the outer peripheral side surface of the substrate tray holding plate 35. However, as shown in FIG. 6, the upper surface of the outer periphery of the substrate tray holding plate 35 (hereinafter also referred to as "rear surface"). It is good also as a structure which connects a contact mechanism to. In the contact mechanism shown in FIG. 6, the contact base 38 pivotally supports the contact bearing 40 around the pin 45. Although a bearing is used in FIG. 6, power may be supplied by bringing a brush into contact with the upper surface of the outer periphery of the substrate tray holding plate 35. In FIG. 6, the substrate tray holding plate 35 holds the outer peripheral side of the substrate tray 30, but the center side of the substrate tray 30 may be held and the contact mechanism may be provided on the rotating shaft side.

The film forming operation of the illustrated apparatus will be described.
First, the substrate tray 30 on which the substrate 100 for film formation is mounted is attached to the substrate tray holding plate 35 of the substrate holder 4. At this time, the state of the contact mechanism is checked, and the contact state between the bearing 40 and the substrate tray holding plate 35 is established. The substrate holder 4 is carried into the preparation chamber 2 from the valve 5. At this time, it is assumed that the valve 6 is closed, the film formation chamber 3 is previously maintained at a predetermined degree of vacuum, and the preparation chamber 2 is in an atmospheric pressure atmosphere. A desired film forming material 101 is disposed on the sputter cathode 14.

  After loading the substrate holder 4, the valve 5 is closed and the charging chamber 2 is evacuated by the exhaust device 8. When the degree of vacuum in the preparation chamber 2 becomes equal to the degree of vacuum in the film forming chamber 3, the valve 6 is opened. The substrate holder 4 is transferred from the preparation chamber 2 to a predetermined film formation position in the film formation chamber 3 by the transfer means 11. The turntable 33 of the substrate holder 4 is engaged with the drive gear 43. Further, the elevating mechanism 19 is driven to lower the power supply plate 18 to bring the power supply plate 18 into contact with the power receiving terminal 39 of the contact mechanism.

  The controller 22 controls the exhaust device 10, the sputtering gas introduction means 13, the sputtering cathode power supply 15, and the heater power supply 17 to prepare for film formation. At this time, a sputter particle is prevented from adhering to the substrate 100 by a shutter mechanism (not shown). The control unit 22 controls the rotation mechanism 21 to rotate the substrate 100 at a predetermined rotation speed, and controls the power supply 20 of the power supply plate 18 to apply power to the rotation substrate 100. When a desired film formation atmosphere is reached, a shutter (not shown) is opened, and film formation is performed on the substrate 100.

After the film formation, the sputtering gas introducing means 13, the sputtering cathode power source 15, the heater power source 17, the rotating mechanism 21, and the power supply plate power source 20 are turned off, and the valve 6 is opened.
The substrate holder 4 is unloaded from the film formation chamber 3 to the preparation chamber 2 by the transfer means 11 and the valve 6 is closed. For example, nitrogen is introduced into the preparation chamber 2 from a gas introduction means (not shown) of the preparation chamber 2. When the preparation chamber 2 reaches atmospheric pressure, the valve 5 is opened, the substrate holder 4 is taken out into the atmosphere, and the film-formed substrate 100 is taken out. The contact mechanism is maintained and inspected, a new undeposited substrate 100 is mounted on the substrate holder 4, and the same operation is repeated.

  In the above embodiment, the film forming process by sputtering has been described as an example, but the concept of the present invention can be applied to any film forming apparatus that applies power to the substrate while changing the position of the substrate during the film forming process. It is. For example, as for the deposition technique, in IAD (Ion Assist Deposition: vacuum deposition method etc.), the gas introduced into the inside of the vacuum chamber is ionized, and the deposited molecules are pressed against the substrate by the generated cations to form a dense thin film with strong adhesion. The present invention can also be applied to a vapor deposition apparatus using a method for forming a film.

  Further, in the above-described embodiment, the substrate tray holding plate driving method has been described with respect to the embodiment in which the substrate tray is rotated. However, the present invention can be applied to a reciprocating substrate tray. That is, a linear motion unit may be used as the drive system unit instead of the rotating body unit. For example, as shown in FIG. 8, the substrate tray 30 and the substrate tray holding plate 35 may be reciprocated in the direction of the arrow. It is necessary to use a power source for a linear motion system instead of the rotation mechanism 21. Of course, the brush 50 may be used instead of the rotary bearing 40 here, or instead of contacting the side surface of the substrate tray holding plate 35, the brush 50 may be contacted. Therefore, the driving method is not limited to the rotation system and the linear system described above, and the gist of the present invention can be applied to other types of motion.

As described above, the present invention is not limited to the illustrated embodiment, and can be applied to various embodiments without departing from the basic concept of providing the contact mechanism on the substrate holder side.
For example, it is generally advantageous that the contact mechanism is disposed in contact with the vicinity of the rotation axis, but the contact mechanism of the present invention may be disposed in contact with the vicinity of the outer peripheral end of the substrate holder. Supplementally, the closer to the rotation axis, the slower the rotation speed. Therefore, the contact mechanism can supply power more stably as it comes into contact at a position closer to the rotation axis. However, when the contact mechanism is provided on the rotating shaft, the contact mechanism is disposed on the back surface of the substrate. For example, when the height of the apparatus is limited, the contact mechanism must be disposed on the outer peripheral edge of the substrate. Even in this case, if the contact mechanism of the present invention is used, the contact state of the contact can be confirmed every time when the substrate is carried in and out, so that the failure (damage) compared to the case where the contact mechanism is fixed in the vacuum chamber (for example, near the rotating shaft). As a result, it is possible to detect the replacement time of the parts early due to the factors and wear, and as a result, there is an effect that the components can be used stably over a long period of time.

It is a figure which shows the film-forming apparatus of this invention. It is sectional drawing of the substrate holder in the Example of this invention. It is a top view of the substrate holder of FIG. It is sectional drawing of the other substrate holder of this invention. It is a top view of the substrate holder of FIG. It is sectional drawing of the other substrate holder of this invention. It is a block diagram explaining this invention. It is a top view of the other board | substrate holder of this invention. It is a block diagram explaining a prior art.

Explanation of symbols

1. 1. Load lock type sputtering equipment Preparation room 3. Deposition chamber 4. Substrate holders 5, 6, 7, 9, 12,. Valves 8, 10. Exhaust device 11. Transport means 13. Sputtering gas introduction means 14. Sputter cathode 15. Power supply 16. Heater 17. Power supply 18. Power feeding plate 19. Elevating mechanism 20. Power supply 21. Rotating mechanism 22. Control unit 30. Substrate tray 31. Base 32. Bearing 33. Turntable 34. Isogo 35. Substrate tray holding plate 36. Post 37. Isogo 38. Contact base 39. Power receiving terminal 40. Rotating bearing 41. Shaft 42. Spring 43. Drive gear 44. Feeding thin plate 45. Pin 50. Brush 51. Support plate 60. Stationary system unit 61. Power receiving electrode 62. Base mechanism 63. Contact mechanism 70. Drive unit (rotary unit)
80. Power supply 81. Feeding electrode 90. Power source 100. Substrate 101. Film forming material

Claims (8)

A film forming apparatus comprising a vacuum film forming chamber having a power source and a power source, and a substrate holder set at a film forming position in the vacuum film forming chamber,
The power source has a feeding electrode;
The substrate holder includes a stationary unit that is stationary at the deposition position and a drive unit that is mounted on the stationary unit and is driven by the power source, and the stationary unit is electrically connected to the power supply electrode. A film forming apparatus including a power receiving electrode to be connected and a contact mechanism for supplying electric power from the power receiving electrode to the drive system unit.   2. The film forming apparatus according to claim 1, wherein the drive system unit is a rotating body unit, and the rotating body unit is rotated by the power source. The film forming apparatus according to claim 1, further comprising:
A film forming apparatus comprising a transporting means for carrying one or more substrate holders into and out of the vacuum film forming chamber.   2. The film forming apparatus according to claim 1, wherein the contact mechanism includes a bearing, and the bearing is a side surface of the drive system unit and is a surface perpendicular to the substrate or the back surface of the drive system unit. A film forming apparatus that is in contact with a surface that is horizontal to the substrate and opposite to the substrate processing surface.   2. The film forming apparatus according to claim 1, wherein the contact mechanism includes a brush, and the brush is a side surface of the drive system unit that is perpendicular to the substrate or the back surface of the drive system unit. A film forming apparatus that is in contact with a surface that is horizontal to the substrate and opposite to the substrate processing surface.   The film forming apparatus according to claim 1, further comprising an elevating mechanism that makes the power feeding electrode movable with respect to the power receiving electrode between a contact position and a separation position. A film forming method in the film forming apparatus according to claim 1,
Establishing contact between the drive system unit on which a substrate is mounted and the contact mechanism on the substrate holder;
Carrying the substrate holder into the vacuum film forming chamber;
Stopping the substrate holder at the deposition position;
Electrically connecting the power feeding electrode and the power receiving electrode;
A film forming method comprising: driving the drive system unit with the power source; and energizing with the power supply means. A substrate holder set at a film forming position in a vacuum film forming chamber having a power source and a power source,
A stationary system unit stationary at the film forming position, and a drive system unit mounted on the stationary system unit and driven by the power source;
A substrate holder provided with a power receiving electrode for the stationary system unit to receive power supply from the power source, and a contact mechanism for supplying power from the power receiving electrode to the drive system unit.

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