JP4780311B2 - Non-reciprocal circuit device and communication device using the same - Google Patents

Description

  The present invention relates to a non-reciprocal circuit device and a communication device using the same.

  In recent years, in mobile communication, the frequency has rapidly increased from 2 GHz to 5 GHz. In general, when the frequency is increased, the DC magnetic field applied to the magnetic rotor can be reduced, so that the shape of the magnet, the magnetic rotor, and the like can be reduced in size and the assembly structure thereof can be simplified. However, even though it can be simplified, there is a limit to it, and it has a structure with excellent mechanical strength, a structure that does not sacrifice non-reciprocal circuit characteristics, and excellent reflow resistance. Needs of other frequency variations to be possible must of course be met.

  More specifically, as one of the problems associated with higher frequencies, there is a problem of how to connect the center electrode body constituting the magnetic rotor to the terminal electrode. For example, in a conventional distributed constant type non-reciprocal circuit device, the magnetic rotor is configured by forming a central electrode in a film shape on a ferrite substrate. This magnetic rotor is combined with the terminal substrate so that the central electrode film on the ferrite substrate faces in the same direction as the terminal electrode film on the terminal electrode, and in the state where both are combined, the terminal is connected by a connection ribbon or the like. The electrode film and the center electrode film are connected.

  However, according to the configuration in which the terminal electrode film and the center electrode film are connected using the connection ribbon in this way, the number of assembling steps is increased by the amount of the connection ribbon, the manufacturing yield is deteriorated, and the parts are increased by the amount of the connection ribbon. The number of points increases, leading to an increase in cost.

  Further, when the number of parts is increased, there is a higher risk of lowering mechanical strength and lowering reliability. For example, when the connection ribbon is broken or dropped, the electrical connection between the terminal electrode film and the center electrode is broken. Furthermore, the longer the connecting ribbon connecting the terminal electrode film and the center electrode film, the longer the loss and the greater the insertion loss.

  This type of non-reciprocal circuit element is not premised on use in a high frequency region of 5 GHz or more, but for example, the one described in Patent Document 1 can be cited. The non-reciprocal circuit device described in Patent Document 1 has a lower ferrite substrate and an upper ferrite substrate facing each other with a center electrode film interposed therebetween, and a lower conductor plate and an upper conductor plate facing each other with the upper conductor substrate sandwiched therebetween. The upper and lower ferrite substrates have magnets that apply a magnetic field in a fixed direction on the upper surface of the plate.

  According to this structure, it is said that it has a simple structure and is easy to assemble, can be directly mounted on a circuit board, can be reduced in height and size, and is advantageous in terms of cost.

However, with the configuration of Patent Document 1, it can be predicted that the number of parts, the number of assembly steps, the cost of the ferrite substrate will increase, and the above-described problems are sufficiently solved. Absent.
Japanese Patent Laid-Open No. 2005-80087

  Still another object of the present invention is to provide a non-reciprocal circuit device and a communication device that are excellent in non-reciprocal circuit characteristics, mechanical strength, and reflow resistance.

  Still another object of the present invention is to provide a non-reciprocal circuit device and a communication device having a structure that has a small number of parts and an assembling man-hour and is effective for cost reduction.

  Still another object of the present invention is to provide a non-reciprocal circuit element and a communication device that can easily change frequency variations and add additional circuits.

  In order to solve the above-described problems, the non-reciprocal circuit device according to the present invention includes a terminal substrate, a center electrode substrate, and a ferrite substrate. The terminal substrate has a plurality of terminal electrode films on one surface, and the center electrode substrate has a center electrode film on one surface. Here, the center electrode substrate is combined with the terminal substrate so that the center electrode film faces the terminal electrode film, and the end portion of the center electrode film is bonded to the terminal electrode film by the conductive bonding agent. Has been. Further, the ferrite substrate is disposed in a relationship facing the center electrode film between the opposing surfaces of the terminal substrate and the center electrode substrate.

  One of the features of the non-reciprocal circuit device according to the present invention is that a central electrode film used as a magnetic rotor by being combined with a ferrite substrate is formed on one surface of the central electrode substrate.

  According to this configuration, the center electrode substrate and the terminal substrate are combined in a relationship in which the respective electrode film forming surfaces face each other, and the ferrite substrate is disposed between the opposing surfaces of the center electrode substrate and the terminal substrate. However, in the state of being arranged in a relationship facing the center electrode film, the end of the center electrode film and the terminal electrode film face each other in a region outside the plate surface of the ferrite substrate, and both are bonded by a conductive bonding agent. can do. Therefore, it is not necessary to use, for example, a connection ribbon for electrical connection between the center electrode and the terminal electrode film, so that the number of parts and the number of assembling steps can be reduced and the cost can be reduced.

  Moreover, since the center electrode film and the terminal electrode film are combined in a mutually facing relationship, it is not necessary to use a connection ribbon for electrical connection between them. Therefore, the loss that should occur between the center electrode film and the terminal electrode film can be reduced, and the irreversible circuit characteristics can be improved. Furthermore, since it is not necessary to use a connection ribbon, a breakage accident and a dropout accident of the connection ribbon are avoided, and reliability is improved.

  Further, the ferrite substrate constituting the magnetic rotor by being combined with the center electrode film is arranged in a relationship facing the center electrode film between the opposing surfaces of the terminal substrate and the center electrode substrate. That is, since the center electrode film is formed on the center electrode substrate in a manner independent of the ferrite substrate, the frequency variation of the magnetic rotor can be easily changed by appropriately replacing the ferrite substrate.

  In the nonreciprocal circuit device according to the present invention, the center electrode substrate has a center electrode film on one surface. That is, since the center electrode film is surface-supported by the center electrode substrate, the mechanical strength is improved and the nonreciprocal circuit characteristics are improved. In addition, since a well-known film forming technique can be used for forming an electrode film on such a substrate, the manufacturing cost can be reduced and the center electrode film is suitable for electrical connection with the terminal electrode film. It is easy to mold into a different shape.

  The nonreciprocal circuit device according to the present invention can include a magnet and a magnetic plate, as in a general nonreciprocal circuit device. The magnet is mounted on the surface of the center electrode substrate that faces the surface on which the center electrode film is formed. The magnetic plate is disposed between the opposing surfaces of the terminal substrate and the center electrode substrate. According to this configuration, the DC magnetic field applied from the magnet to the central electrode substrate passes through the central electrode substrate (and the ferrite substrate) and is not immediately expanded but is sucked into the magnetic plate. For this reason, the straightness of the DC magnetic field passing through the magnetic rotor is ensured, and the nonreciprocal circuit characteristics are improved.

  In the nonreciprocal circuit device according to the present invention, at least one of the terminal substrate and the center electrode substrate may have a concave portion that houses the ferrite substrate. For example, the center electrode substrate has a concave portion on one surface, and according to the configuration in which the ferrite substrate is accommodated in the concave portion, the end portion of the center electrode film and the terminal in the region outside the plate surface of the ferrite substrate The electrode film can be directly faced and bonded with the conductive bonding agent in a state in which the surfaces of the two electrode films facing each other substantially coincide with each other. Therefore, it is possible to minimize the connection path between the center electrode film and the terminal electrode film, improve the connection reliability, and improve the reflow resistance.

  Further, for example, according to the configuration in which the central electrode substrate has a concave portion on one surface, one surface of the combined terminal substrate becomes the bottom surface with respect to the opening end surface of the concave portion, so that the inside of the concave portion A storage space is formed. Accordingly, the process of arranging the ferrite substrate in the concave portion is facilitated, and the arrangement posture of the ferrite substrate in the concave portion is easily stabilized, thereby improving the nonreciprocal circuit characteristics.

  The communication device according to the present invention is used, for example, as a base station, and is characterized in that the above-described nonreciprocal circuit element is used in a necessary part such as a transmission unit.

  Other objects, configurations and advantages of the present invention will be described in more detail with reference to the accompanying drawings. The accompanying drawings are merely examples.

As described above, according to the present invention, the following effects can be obtained.
(A) It is possible to provide a nonreciprocal circuit element and a communication device excellent in nonreciprocal circuit characteristics, mechanical strength, and reflow resistance.
(B) It is possible to provide a non-reciprocal circuit device and a communication device having a structure that has a small number of parts and a small number of assembly steps and is effective for cost reduction.
(C) It is possible to provide a non-reciprocal circuit element and a communication device that can easily change frequency variations and add additional circuits.

  1 is a perspective view of a non-reciprocal circuit device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view schematically showing the internal structure of the non-reciprocal circuit device shown in FIG. 1, and FIG. It is a perspective view which decomposes | disassembles and shows the internal structure of the nonreciprocal circuit device shown in FIG. 4 is a perspective view showing the structure on the other surface side of the central electrode substrate 4 shown in FIG. 3, and FIG. 5 is a perspective view showing the structure on the other surface side of the terminal substrate 1 shown in FIG.

  The nonreciprocal circuit device shown in FIGS. 1 to 5 includes a terminal substrate 1, a magnetic substrate 2, a ferrite substrate 3, a center electrode substrate 4, and a magnet 5.

  The terminal substrate 1 has a plurality (three in the embodiment) of terminal electrode films 11 to 13 on one surface and a ground electrode film 14 on the other surface. The terminal substrate 1 can be used without any problem as long as it is a resin material used in this type of nonreciprocal circuit device. Moreover, the external shape is arbitrary and may be other polygonal shape besides circular shape of illustration, and also circular shape.

  Each of the three terminal electrode films 11 to 13 is used as an input / output terminal and passes through the side surface of the terminal substrate 1 and is led to the other surface side where the ground electrode film 14 is provided. Connection portions 110, 120, and 130 separated from the electrode film 14 by gaps G11, G12, and G13 are configured.

  Further, the terminal substrate 1 includes a terminal forming portion 15 for forming the terminal electrode films 11 to 13 and a concave portion 16. The terminal forming portion 15 constitutes one surface of the terminal substrate 1, and the concave portion 16 has a concave shape that falls from the terminal forming portion 15. Further, the terminal substrate 1 of FIGS. 1 to 5 has a conductive film 17 at least in the bottom surface of the concave portion 16, and the conductive film 17 is a ground electrode film provided on the other surface (lower surface) of the terminal substrate 1. 14 is electrically connected through a through hole 18 or the like. Thereby, a terminal structure capable of surface mounting is obtained.

  The magnetic substrate 2 can be composed of a metal material containing Fe as a main component, a ferrite magnetic material, a composite magnetic material in which magnetic powder and a synthetic resin are mixed, and the like. As long as it is necessary, it may be magnetic, and the outer shape may be arbitrary.

  The ferrite substrate 3 is preferably made of a soft magnetic material such as yttrium / iron / garnet (YIG) that is widely used in this type of nonreciprocal circuit device. In general, the dielectric constant of YIG takes a value of 15-16. The ferrite substrate 3 can take other external shapes such as a square shape in addition to the circular shape shown in the figure.

  1 to 5, the magnetic substrate 2 is dropped into the concave portion 16, and the ferrite substrate 3 is dropped into the concave portion 16 on one surface of the magnetic substrate 2. . That is, the concave portion 16 described above can be set following the shape of the magnetic substrate 2 and the ferrite substrate 3 accommodated therein. In other words, as long as the recessed portion 16 can accommodate the magnetic substrate 2 and the ferrite substrate 3, the recessed portion 16 does not have to have a closed recessed hole shape having a continuous inner peripheral surface as shown in FIG. For example, on one surface of the terminal substrate 1, the recessed portion 16 that relatively falls can be formed by partially projecting the terminal forming portion 15. In this case, the concave portion 16 has an open concave shape having no inner peripheral surface other than the portion of the terminal forming portion 15.

  The central electrode substrate 4 has a central electrode film 41 on one surface, and the central electrode film 41 is combined with the terminal substrate 1 so as to face the terminal electrode films 11 to 13. End portions (lead electrodes) 411 to 413 of the electrode film 41 are bonded to the terminal electrode films 11 to 13 by a conductive bonding agent 6 such as solder. More specifically, the center electrode substrate 4 includes a substrate portion 40 and a center electrode film 41.

  The board | substrate part 40 is a dielectric material film etc., for example, Comprising: It can select from the range of 0.1-1.0 mm, Furthermore, about 0.3-0.6 mm is suitable from a viewpoint of mechanical strength. Further, the substrate portion 40 preferably has a lower dielectric constant than the ferrite substrate 3 in order to improve nonreciprocal circuit characteristics. Specifically, by using PPE (polyphenylene ether), glass epoxy, resin, Teflon (registered trademark), etc., the dielectric constant of the base portion 40 can be suppressed to a value of about 2 to 4. According to this structure, the board | substrate part 40 can be used as a spacer. In addition, a dielectric resin substrate, a dielectric resin sheet, a dielectric ceramic substrate, and the like can be used for the substrate portion 40.

  The center electrode film 41 and the lead electrode films 411 to 413 extending from the center electrode film 41 toward the end portion are subjected to a process such as printing, sputtering, or vapor deposition on one surface of the substrate unit 40. Can be formed. In addition, a metal foil such as a copper foil may be attached to one surface of the substrate portion 40 and then patterned by a photolithography process.

  In the central electrode substrate 4, the lead electrode films 411 to 413 are combined with the terminal substrate 1 so as to face the terminal electrode films 11 to 13, and the lead electrode films 411 to 413 are electrically conductive bonding agents. 6 is joined to the terminal electrode films 11 to 13.

  The magnetic substrate 2 described above is dropped into the concave portion 16 so as to face the conductive film 17 and the terminal electrode films 11 to 13 between the opposing surfaces of the terminal substrate 1 and the central electrode substrate 4. The ferrite substrate 3 is dropped into the concave portion 16 on the magnetic substrate 2 so as to face the center electrode film 41.

  The magnet 5 is mounted on the surface of the center electrode substrate 4 opposite to the surface on which the center electrode film 41 is formed. In the embodiment, the magnet 5 is disposed so as to face the center electrode film 41 through the substrate portion 40 of the center electrode substrate 4. In the figure, there is only one magnet 5. The outer shape of the magnet 5 is arbitrary. The terminal board 1, the magnetic board 2, the ferrite board 3, the center electrode board 4, and the magnet 5 are preferably integrated using a conductive bonding agent or the like.

  One of the features of the non-reciprocal circuit elements shown in FIGS. 1 to 5 is that a central electrode film 41 used as a magnetic rotor by being combined with the ferrite substrate 3 is formed on one surface of the central electrode substrate 4. There is in point.

  According to this configuration, in a state where the center electrode film 41 of the center electrode substrate 4 and the terminal electrode films 11 to 13 of the terminal substrate 1 are combined so as to face each other, the lead electrode films 411 to 413 and the terminal electrodes The films 11 to 13 can directly face each other and can be bonded by the conductive bonding agent 6. That is, in order to electrically connect the center electrode film 41 and the terminal electrode films 11 to 13, for example, it is not necessary to use a connection ribbon, so that the number of parts and the number of assembling steps can be reduced and the cost can be reduced. Can do. Further, since it is not necessary to use a connection ribbon, a breakage accident and a dropout accident of the connection ribbon are avoided, and reliability is improved.

  In particular, the center electrode substrate 4 shown in FIGS. 1 to 5 has a concave portion 16 for accommodating the magnetic substrate 2 and the ferrite substrate 3 in a plane opposite to the terminal electrode films 11 to 13 of the terminal substrate 1. Have. The recessed portion 16 has a recessed hole shape that falls from the terminal forming portion 15, and with respect to the opening end surface, one surface of the combined terminal board 1 functions as a bottom surface, so that a storage space shielded inside. have. The ferrite substrate 3 is stored in the storage space of the concave portion 16 so as to face the center electrode film 41. According to this configuration, the ferrite substrate 3 and the center electrode film 41 can be directly opposed in the region of the concave portion 16 to form a magnetic rotor, and the lead electrode films 411 to 413 and the terminal electrode films 11 to 11 can be formed. 13 can be directly faced to each other in the region outside the plate surface of the ferrite substrate 3 (terminal forming portion 15), and the two electrode films facing each other can be joined together by the conductive bonding agent 6 in a state where the surfaces of the two electrode films substantially coincide with each other. . Therefore, it is possible to minimize the connection path between the lead electrode films 411 to 413 and the terminal electrode films 11 to 13, improve the connection reliability, and improve the reflow resistance.

  Furthermore, since the shape and depth of the concave portion 16 can be set so as to be able to follow the shape and thickness of the magnetic substrate 2 and the ferrite substrate 3, the magnetic substrate 2 and the ferrite are added to the concave portion 16. The step of arranging the substrate 3 is facilitated, and the arrangement posture of the magnetic substrate 2 and the ferrite substrate 3 in the concave portion 16 can be easily stabilized, thereby improving the nonreciprocal circuit characteristics.

  Moreover, even when the shape and thickness of the ferrite substrate 3 change due to changes in the output capacity and frequency, the thickness is generally increased by following the design change of the terminal substrate 1 and the recessed portion 16. It is possible to cope with frequency variations without any problem.

  As described above, in the nonreciprocal circuit device of FIGS. 1 to 5, the central electrode film 41 constituting the magnetic rotor is formed on the central electrode substrate 4 in a manner independent of the ferrite substrate 3. Accordingly, the frequency variation of the magnetic rotor can be easily changed by appropriately adjusting the thickness dimension of the ferrite substrate 3 and the like. Further, since there is no structural requirement that the ferrite substrate 3 should have in particular, the cost of the ferrite substrate 3 is not increased.

  Furthermore, since the center electrode film 41 is surface-supported by the center electrode substrate 4, the arrangement posture of the center electrode film 41 in the nonreciprocal circuit element is stabilized, and the mechanical strength of the center electrode film 41 itself is improved. Therefore, the irreversible circuit characteristics can be improved. In addition, since a known film forming technique can be used to form such a center electrode film 41, the manufacturing cost can be reduced, and for example, the lead electrode films 411 to 413 of the center electrode film 41 can be formed. It is easy to form into a shape suitable for electrical connection with the terminal electrode films 11 to 13.

  The magnet 5 is mounted on the surface of the center electrode substrate 4 opposite to the surface on which the center electrode film 41 is formed. The magnetic substrate 2 is disposed on the terminal electrode films 11 to 13 side between the opposing surfaces of the terminal substrate 1 and the center electrode substrate 4. According to this configuration, the direct-current magnetic field applied from the magnet 5 to the central electrode substrate 4 passes through the central electrode substrate 4 (and the ferrite substrate 3) and is not immediately expanded but is sucked into the magnetic substrate 2. . For this reason, the straightness of the DC magnetic field passing through the center electrode substrate 4 is ensured, and the nonreciprocal circuit characteristics are improved.

  Furthermore, since the center electrode substrate 4 having a lower dielectric constant than that of the ferrite substrate 3 is preferably disposed as a spacer between the ferrite substrate 3 and the magnet 5, the electromagnetic field formed by the center electrode film 41 is reduced to the magnet 5. It is possible to suppress the phenomenon of leaking to the side where is disposed and improve the characteristics.

  The terminal substrate 1 has a conductive film 17 at least on the inner surface of the concave portion 16, and the conductive film 17 is electrically connected to the ground electrode film 14 provided on the other surface (lower surface) of the terminal substrate 1. Therefore, since the magnetic substrate 2 comes into contact with the conductive film 17 having the ground potential and becomes the ground potential, a favorable result in terms of characteristics can be obtained.

  The communication device according to the present invention is used, for example, as a base station, and is characterized in that the above-described nonreciprocal circuit element is used in a necessary part such as a transmission unit. Next, an embodiment of a communication device using the nonreciprocal circuit device described with reference to FIGS. 1 to 5 will be described with reference to FIG. FIG. 6 is a block diagram of a communication device using the nonreciprocal circuit device according to the present invention.

  The communication device of FIG. 6 is provided in a base station in a mobile communication system, for example, and includes a reception circuit unit 7 and a transmission circuit unit 8, both of which are connected to a transmission / reception antenna 9. The reception circuit unit 7 includes a reception amplification circuit 72 and a reception circuit 71 that processes a received signal. The transmission circuit unit 8 includes a transmission circuit 81 that generates an audio signal, a video signal, and the like, and a power amplification circuit 82. In the communication device described above, the nonreciprocal circuit elements 83 and 84 according to the present invention are used in the circuit from the antenna 9 to the reception circuit unit 7 and the transmission circuit unit 8 and the output stage of the power amplification circuit 82. The nonreciprocal circuit element 83 functions as a circulator, and the nonreciprocal circuit element 84 functions as an isolator having a termination resistor R0.

  According to the communication device of FIG. 6, it is possible to provide a communication device having all the advantages of the non-reciprocal circuit device described with reference to FIGS. 1 to 5.

  FIG. 7 is a sectional view showing another embodiment of the non-reciprocal circuit device according to the present invention. 8 is a perspective view showing the center electrode substrate 4 used in the non-reciprocal circuit device shown in FIG. 7, and FIG. 9 shows the terminal substrate 1 used in the non-reciprocal circuit device shown in FIG. It is a perspective view. 7 to 9, the same reference numerals are given to the parts corresponding to the constituent parts appearing in FIGS. 1 to 5. The feature of this embodiment is that the center electrode substrate 4 has a concave portion 46 on one surface of the base portion 40.

  Even in the structure shown in FIG. 7 to FIG. 9, in the state where the ferrite substrate 3 is disposed so as to face the center electrode film 41 between the opposing surfaces of the terminal substrate 1 and the center electrode substrate 4, In the region outside the plate surface of the ferrite substrate 3, the end portions 411 to 413 of the center electrode film 41 and the terminal electrode films 11 to 13 can be directly faced, and both can be bonded by the conductive bonding agent 6. It has a structure substantially equivalent to the embodiment of FIGS. 1 to 5 described above, and the effects described with reference to FIGS. 1 to 5 can be obtained.

  FIG. 10 is a sectional view showing still another embodiment of the non-reciprocal circuit device according to the present invention. In FIG. 10, parts corresponding to the constituent parts appearing in FIGS. 1 to 9 are given the same reference numerals. The feature of this embodiment is that each of the terminal substrate 1 and the center electrode substrate 4 has concave portions 16 and 46 for accommodating the ferrite substrate 3 in a surface facing the other electrode film forming surface, It is in the point which has the sealed internal space for accommodating the magnetic board | substrate 2 and the ferrite board | substrate 3 in the inside of the recessed parts 16 and 46 which face each other. Even with such a structure, it is possible to obtain the same effects as those of the embodiments described above.

  FIG. 11 is a sectional view showing still another embodiment of the nonreciprocal circuit device according to the present invention, and FIG. 12 is an exploded perspective view showing the nonreciprocal circuit device shown in FIG. 11 and 12, the same reference numerals are assigned to the parts corresponding to the constituent parts appearing in FIGS. 1 to 10.

  11 and 12 is an embodiment in which the configuration of the non-reciprocal circuit device described with reference to FIGS. 1 to 5 is further developed, and the magnet 5 is provided on the other surface of the base portion 40. It is characterized in that it is dropped into the concave portion 47 provided in the.

  According to the structure shown in FIGS. 11 and 12, it is possible to obtain the same operational effects as those of the above-described embodiments, and to stabilize the arrangement posture of the magnet 5, thereby improving the nonreciprocal circuit characteristics. it can. In addition, the process of mounting the magnet 5 on the center electrode substrate 4 can be performed quickly and reliably.

  FIG. 13 is a cross-sectional view showing still another embodiment of the non-reciprocal circuit device according to the present invention. In FIG. 13, parts corresponding to the constituent parts appearing in FIG. 1 to FIG.

  The nonreciprocal circuit device of FIG. 13 is a combination of the characteristic configurations of FIGS. 11 and 12 with respect to the embodiment of FIG. 7, and the magnet 5 is a concave shape provided on the other surface of the base portion 40. The part 47 is characterized by being dropped.

  According to the structure shown in FIG. 13, it is possible to obtain the same operational effects as those of the above-described embodiments, and the mounting process of the magnet 5 to the center electrode substrate 4 is facilitated, and the magnet 5 after mounting is provided. The arrangement posture is stabilized, thereby improving the nonreciprocal circuit characteristics.

  Although the contents of the present invention have been specifically described above with reference to the preferred embodiments, it is obvious that those skilled in the art can take various modifications based on the basic technical idea and teachings of the present invention. It is.

1 is a perspective view of a non-reciprocal circuit device according to an embodiment of the present invention. It is sectional drawing which shows typically the internal structure of the nonreciprocal circuit device shown in FIG. It is a perspective view which decomposes | disassembles and shows the internal structure of the nonreciprocal circuit device shown in FIG.1 and FIG.2. It is a perspective view which shows the structure of the other surface side of the center electrode board | substrate shown in FIG. It is a perspective view which shows the structure of the other surface side of the terminal board shown in FIG. It is a block diagram of the communication apparatus using the nonreciprocal circuit device based on this invention. It is sectional drawing which shows another embodiment of the nonreciprocal circuit device based on this invention. It is a perspective view which shows the center electrode board | substrate used for the nonreciprocal circuit device shown in FIG. It is a perspective view which shows the terminal board used for the nonreciprocal circuit device shown in FIG. It is sectional drawing which shows another embodiment of the nonreciprocal circuit device based on this invention. It is sectional drawing which shows another embodiment of the nonreciprocal circuit device based on this invention. It is a perspective view which decomposes | disassembles and shows the nonreciprocal circuit device shown in FIG. It is sectional drawing which shows another embodiment of the nonreciprocal circuit device based on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Terminal board | substrate 11-13 Terminal electrode film | membrane 16 Recessed part 2 Magnetic board | substrate 3 Ferrite board | substrate 4 Center electrode board | substrate 41 Center electrode film | membrane 46 Recessed part 5 Magnet 6 Conductive bonding agent 7 Reception circuit part 8 Transmission circuit part 83, 84 Nonreciprocal circuit Element 9 Transmission / reception antenna

Claims (5)

A non-reciprocal circuit device including a terminal substrate, a center electrode substrate, and a ferrite substrate,
The terminal substrate has a plurality of terminal electrode films on one surface,
The central electrode substrate has a central electrode film and a concave portion on one surface, and the central electrode film is combined with the terminal substrate so as to face the terminal electrode film, and the central electrode film Is bonded to the terminal electrode film with a conductive bonding agent,
The ferrite substrate is disposed in a relationship facing the center electrode film between the opposing surfaces of the terminal substrate and the center electrode substrate, and is stored in the concave portion.
Non-reciprocal circuit element. A non-reciprocal circuit device including a terminal substrate, a center electrode substrate, and a ferrite substrate,
The terminal substrate has a plurality of terminal electrode films, concave portions, and a conductive film on one surface,
The conductive film is electrically connected to a ground electrode film provided on the other surface of the terminal substrate in the concave portion,
The central electrode substrate has a central electrode film on one surface, the central electrode film is combined with the terminal substrate in a relationship facing the terminal electrode film, and an end of the central electrode film is It is bonded to the terminal electrode film by a conductive bonding agent,
The ferrite substrate is disposed in a relationship facing the center electrode film between the opposing surfaces of the terminal substrate and the center electrode substrate, and is stored in the concave portion.
Non-reciprocal circuit element. The nonreciprocal circuit device according to claim 1, further comprising a magnet and a magnetic plate,
The magnet is mounted on the surface of the center electrode substrate opposite to the surface on which the center electrode film is formed,
The magnetic plate is disposed between opposing surfaces of the terminal substrate and the central electrode substrate.
Non-reciprocal circuit element. A non-reciprocal circuit device according to any one of claims 1 to 3,
The central electrode substrate has a lower dielectric constant than the ferrite substrate;
Non-reciprocal circuit element. A communication device including a transmission circuit unit and a nonreciprocal circuit element,
The nonreciprocal circuit element is described in any one of claims 1 to 4 and provided in the transmission circuit unit.
Communication equipment.

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