JP4776940B2 - 集積回路、半導体装置及び無線チップ - Google Patents

集積回路、半導体装置及び無線チップ Download PDF

Info

Publication number
JP4776940B2
JP4776940B2 JP2005039662A JP2005039662A JP4776940B2 JP 4776940 B2 JP4776940 B2 JP 4776940B2 JP 2005039662 A JP2005039662 A JP 2005039662A JP 2005039662 A JP2005039662 A JP 2005039662A JP 4776940 B2 JP4776940 B2 JP 4776940B2
Authority
JP
Japan
Prior art keywords
power supply
circuit
generating
central processing
supply potential
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005039662A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005268768A (ja
JP2005268768A5 (enExample
Inventor
清 加藤
潤 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2005039662A priority Critical patent/JP4776940B2/ja
Publication of JP2005268768A publication Critical patent/JP2005268768A/ja
Publication of JP2005268768A5 publication Critical patent/JP2005268768A5/ja
Application granted granted Critical
Publication of JP4776940B2 publication Critical patent/JP4776940B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
  • Microcomputers (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2005039662A 2004-02-20 2005-02-16 集積回路、半導体装置及び無線チップ Expired - Fee Related JP4776940B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005039662A JP4776940B2 (ja) 2004-02-20 2005-02-16 集積回路、半導体装置及び無線チップ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004043903 2004-02-20
JP2004043903 2004-02-20
JP2005039662A JP4776940B2 (ja) 2004-02-20 2005-02-16 集積回路、半導体装置及び無線チップ

Publications (3)

Publication Number Publication Date
JP2005268768A JP2005268768A (ja) 2005-09-29
JP2005268768A5 JP2005268768A5 (enExample) 2008-03-27
JP4776940B2 true JP4776940B2 (ja) 2011-09-21

Family

ID=35092935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005039662A Expired - Fee Related JP4776940B2 (ja) 2004-02-20 2005-02-16 集積回路、半導体装置及び無線チップ

Country Status (1)

Country Link
JP (1) JP4776940B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100812994B1 (ko) 2005-12-09 2008-03-13 한국전자통신연구원 웨이크­업 기능을 가지는 전지 지원형 rfid 태그 장치및 그 방법
JP2007199895A (ja) * 2006-01-25 2007-08-09 Sony Corp 近接通信用データ処理装置
JP4945224B2 (ja) * 2006-11-30 2012-06-06 株式会社東芝 コントローラ、情報処理装置、および供給電圧制御方法
KR100853189B1 (ko) 2006-12-08 2008-08-20 한국전자통신연구원 태그 수명 연장을 위한 저전력 무선 인식 태그 및 그 방법
KR100853190B1 (ko) 2006-12-08 2008-08-20 한국전자통신연구원 패시브 태그의 전력관리장치 및 방법
JP2011197870A (ja) * 2010-03-18 2011-10-06 Mitsubishi Electric Corp プログラマブルデバイス搭載装置
KR101685389B1 (ko) 2010-10-08 2016-12-20 삼성전자주식회사 스마트 카드
KR102710975B1 (ko) * 2022-11-10 2024-09-27 쓰리에이로직스(주) 스탠바이 모드에서 rf 능동 장치로부터 전송된 rf 신호를 검출할 수 있는 rf 리더기

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5945920A (en) * 1997-12-10 1999-08-31 Atmel Corporation Minimum voltage radio frequency indentification
JP3889158B2 (ja) * 1998-06-29 2007-03-07 株式会社エヌ・ティ・ティ・データ Ic搭載カード及びカードシステム
JP3878431B2 (ja) * 2000-06-16 2007-02-07 株式会社ルネサステクノロジ 半導体集積回路装置
JP3877518B2 (ja) * 2000-12-13 2007-02-07 松下電器産業株式会社 プロセッサの電力制御装置
JP3929761B2 (ja) * 2001-11-27 2007-06-13 シャープ株式会社 半導体装置の動作制御方法、半導体装置動作制御プログラム、半導体装置動作制御プログラムを記録した記録媒体、半導体装置、およびicカード

Also Published As

Publication number Publication date
JP2005268768A (ja) 2005-09-29

Similar Documents

Publication Publication Date Title
KR101105296B1 (ko) 집적회로, 반도체 장치 및 id칩
US7857229B2 (en) Securities, chip mounting product, and manufacturing method thereof
US8136735B2 (en) ID label, ID card, and ID tag
US8685835B2 (en) Method for manufacturing thin film integrated circuit, and element substrate
CN1655186B (zh) 半导体器件
JP4652087B2 (ja) 半導体装置
JP4776941B2 (ja) 半導体装置の製造方法、icカード、icタグ、rfid、トランスポンダ、紙幣、有価証券、パスポート、電子機器、バッグ及び衣類
JP4718850B2 (ja) 半導体装置、icカード、icタグ、rfid、トランスポンダ、紙幣、有価証券、パスポート、電子機器、バッグ及び衣類
JP4776940B2 (ja) 集積回路、半導体装置及び無線チップ
KR20070058598A (ko) 반도체 장치
JP4836466B2 (ja) 半導体装置
JP5121119B2 (ja) チップ搭載物
JP4836523B2 (ja) 半導体装置、icカード、icタグ、rfid、トランスポンダ、紙幣、有価証券類、パスポート、電子機器、バッグ及び衣類

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080206

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20080206

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110315

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110328

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110621

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110629

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140708

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140708

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees