JP4771106B2 - RFID antenna and manufacturing method thereof - Google Patents

Description

  The present invention relates to an RFID antenna (RFID) formed on a single-sided printed board such as a single-sided flexible printed board or a single-sided hard printed board, and a method for manufacturing the same.

  In recent years, wireless communication systems using RFID technology have attracted attention. This communication system is generally composed of a data carrier capable of storing various data and a reader / writer that reads and writes (reads / writes) information without contact with the data carrier. A data carrier is called an RFID tag (wireless IC tag) or a non-contact IC card according to its shape, size, etc. (hereinafter collectively referred to as a “non-contact IC card”), and recently a cellular phone. More and more cases are built in. Radio frequency bands used for this non-contact IC card include a band of 135 kHz or less, a 13.56 MHz band, a 2.45 GHz band, and the like. This non-contact IC card has been used for various entry / exit management such as an automatic ticket gate for transportation recently because it is easy for users to handle. In addition, applications to electronic money and article management are also being studied.

These non-contact IC cards and reader / writers generally have a built-in loop antenna (antenna coil), and supply electric power to the non-contact IC cards by electromagnetic induction via a magnetic field generated by the reader / writer antenna. Read / write data to / from the card. Here, in order to adjust the resonance frequency of the antennas of the non-contact IC card and the reader / writer, a capacitor is conventionally provided in parallel with the antenna coil (see, for example, Patent Document 1 or 2 below).
JP 2003-224415 A JP 2005-259153 A

When a surface mount type chip capacitor is provided in parallel with the antenna coil for resonance frequency adjustment, the inner and outer substrate regions are electrically connected across the loop pattern forming the antenna coil for the convenience of wiring. There is a need to. For this reason, in Patent Document 1, as shown in FIG. 10, by forming a wiring pattern on the back surface of the substrate, the inner substrate region and the outer substrate region are electrically connected across the loop pattern. Yes. Alternatively, as in Patent Document 3 below, a jumper is separately provided to electrically connect the inner substrate region and the outer substrate region across the loop pattern.
JP 2002-358491 A

  It should be noted that electrically connecting the inner substrate region and the outer substrate region across the loop pattern is not limited to the case where a surface mount type chip capacitor is provided for adjusting the resonance frequency, and the loop pattern is formed. This is necessary when both the two contacts must be provided inside or outside the loop pattern for convenience of wiring, such as when the board is inserted into a connector, for example.

  When the wiring pattern is formed on the back surface of the substrate as in Patent Document 1 or 2 in order to electrically connect the inner substrate region and the outer substrate region across the loop pattern, it is necessary to use a double-sided substrate. There is a high cost. Further, when a jumper is separately provided as in Patent Document 3, the number of parts increases and the cost increases.

  The present invention has been made in view of such a situation, and the purpose of the present invention is to cover the inner and outer substrate regions across the loop pattern even for single-sided printed boards such as single-sided flexible printed boards and single-sided rigid printed boards. An object of the present invention is to provide an RFID antenna and a method for manufacturing the same that can reduce the cost by making it possible to electrically connect the substrate region without providing a jumper.

The first aspect of the present invention is an RFID antenna. This RFID antenna is
A loop pattern, first and second connection terminal portions located on either the inner side or the outer side of the loop pattern, and first to fourth bonding pads are formed, and the third and fourth pads are formed. Including a single-sided printed circuit board in which a part including the position of the bonding pad is cut out to be a cut piece;
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. Connected to the terminal portion, the third bonding pad and the fourth bonding pad are connected in the cut piece,
The cut piece is positioned such that the first bonding pad and the third bonding pad are in contact with each other, and the second bonding pad and the fourth bonding pad are in contact with each other; The first and third bonding pads are electrically bonded to each other, and the second and fourth bonding pads are electrically bonded to each other ;
The cut pieces, that exists in a position that does not return to the previous position, which is also cut by rotating the folding direction axis along any portion of its edge.

The second aspect of the present invention is also an RFID antenna. This RFID antenna is
A single-sided printed circuit board on which a loop pattern, first and second connection terminal portions located on either the inner side or the outer side of the loop pattern, and first to fourth bonding pads are formed;
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. A cut piece is formed which is connected to the terminal portion and is provided with a cut or opening of a predetermined shape so as to leave a connecting portion on the single-sided printed circuit board, and the third and fourth bonding pads are formed as described above. Located on the cut piece and connected to each other ,
The cut piece is present at a position where the third and fourth bonding pads do not come into contact with the first and second bonding pads even when bent at the connecting portion without being cut, the first and connecting pad and the third bonding pads and the abutting and wherein the second bonding pads fourth bonding pads of Ru arrangement can der abut.

In the RFID antenna according to the second aspect, the distance between the first and second bonding pads and the distance between the third and fourth bonding pads may be substantially equal.

In the RFID antenna according to the first or second aspect, a capacitor for adjusting a resonance frequency may be provided between the first and second connection terminal portions.

A third aspect of the present invention is a method for manufacturing an RFID antenna. This method
Using a single-sided printed circuit board on which a loop pattern, first and second connection terminal portions located on either the inside or the outside of the loop pattern, and first to fourth bonding pads are formed, A method of manufacturing an RFID antenna,
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. A cut piece is formed which is connected to the terminal portion and is provided with a cut or opening of a predetermined shape so as to leave a connecting portion on the single-sided printed circuit board, and the third and fourth bonding pads are formed as described above. The third and fourth bonding pads are connected to the first and second bonding pads even if the cut pieces are bent at the connecting portion without being cut. Exists in a position where it does not contact,
This method
Cutting the cut piece from the single-sided printed circuit board;
The cut piece is disposed so that the first bonding pad and the third bonding pad are in contact with each other, and the second bonding pad and the fourth bonding pad are in contact with each other. And electrically bonding the first and third bonding pads to each other and electrically bonding the second and fourth bonding pads to each other.

  It should be noted that any combination of the above-described constituent elements, and those obtained by converting the expression of the present invention between methods and systems are also effective as aspects of the present invention.

According to the first aspect of the present invention, a part of the single-sided printed circuit board is cut into a cut piece, and the third bonding pad and the fourth bonding pad are connected to each other in the cut piece. The cut piece is positioned so that the second bonding pad and the fourth bonding pad are in contact with each other, and the first bonding pad and the third bonding pad are in contact with each other. 3 bonding pads are electrically bonded to each other, and the second and fourth bonding pads are electrically bonded to each other. The substrate region and the outer substrate region can be electrically connected without providing a separate jumper, and the cost can be reduced.

According to the second aspect of the present invention, the single-sided printed board is provided with a cut or opening having a predetermined shape so as to be freely cut, and the third and fourth bonding pads are the cut pieces. Since the cut pieces are cut out and passed between the first and second bonding pads, the board area inside the loop pattern is straddled even if it is a single-sided printed board. Can be electrically connected to the outer substrate region without providing a separate jumper, and the cost can be reduced.

According to the third aspect of the present invention, the third and fourth bonding pads are connected to each other in the cut piece provided with a predetermined shape of cut or opening in the single-sided printed board. Therefore, the step of cutting the cut piece from the single-sided printed board, the first bonding pad and the third bonding pad abut, and the second bonding pad and the fourth bonding pad, Arranging the cut pieces so as to contact each other, electrically joining the first and third joining pads to each other, and electrically joining the second and fourth joining pads to each other. Thus, even on a single-sided printed board, it is possible to electrically connect the inner board area and the outer board area across the loop pattern without providing a separate jumper, thereby reducing costs. That.

It is an exemplary schematic perspective view showing the configuration of the RFID antenna according to the first reference example of the present invention, where (A) is an unfinished state before bending, and (B) is a completed state after bending. It is an exemplary schematic perspective view which shows the structure of the RFID antenna which concerns on the 2nd reference example of this invention, (A) is the unfinished state before bending, (B) is the completion state after bending. It is an exemplary schematic perspective view which shows the structure of the RFID antenna which concerns on the 3rd reference example of this invention, (A) is the unfinished state before bending, (B) is the completion state after bending. It is an exemplary schematic perspective view which shows the structure of the RFID antenna which concerns on the 4th reference example of this invention, (A) is the unfinished state before bending, (B) is the completion state after bending. It is an exemplary schematic perspective view which shows the structure of the RFID antenna which concerns on the 5th reference example of this invention, (A) is the unfinished state before bending, (B) is the completion state after bending. It is an exemplary schematic perspective view which shows the structure of the RFID antenna which concerns on the 6th reference example of this invention, (A) is the incomplete state before bending, (B) is the completion state after bending. It is the exemplary schematic perspective view which shows the structure of the RFID antenna which concerns on the 7th reference example of this invention, (A) is the unfinished state before bending, (B) is the completion state after bending. It is an exemplary schematic perspective view showing the configuration of the RFID antenna according to the embodiment of the present invention, where (A) is an incomplete state before cutting, and (B) is a completed state after cutting. The schematic perspective view which shows another example of the formation position of a cut piece regarding the embodiment. The schematic perspective view which shows the structure of the conventional RFID antenna.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same or equivalent component, member, etc. which are shown by each drawing, and the overlapping description is abbreviate | omitted suitably. In addition, the embodiments do not limit the invention but are exemplifications, and all features and combinations thereof described in the embodiments are not necessarily essential to the invention.

( First reference example )
FIGS. 1A and 1B are exemplary schematic perspective views showing the configuration of an RFID antenna 100 according to a first reference example of the present invention. 1A shows an incomplete state before bending, and FIG. 1B shows a completed state after bending.

  The RFID antenna 100 includes a loop pattern 12 forming an antenna main body portion, a first connection terminal portion 14, a second connection terminal portion 16, a first bonding pad 18, and a second bonding terminal. A single-sided FPC 10 (single-sided flexible printed circuit; FPC: Flexible Printed Circuit) on which pads 19 are formed is provided, and a chip capacitor 13 is mounted on the single-sided FPC 10.

  The loop pattern 12 is a conductor pattern made of, for example, copper, a pad (not shown) for mounting the chip capacitor 13 inside the loop pattern 12, first and second connection terminal portions 14 and 16, A second bonding pad 19 (before bending) is formed, and a first bonding pad 18 is formed outside the loop pattern 12. The surface of the single-sided FPC 10 is entirely covered and insulated with a cover film such as polyimide, and the first and second connection terminal portions 14 and 16 and the first and second bonding pads 18 and 19 are formed. Only a portion of the conductor (eg, copper foil) is exposed.

  A plurality of (for example, three) chip capacitors 13 are provided in parallel between the first and second connection terminal portions 14 and 16 in order to adjust the resonance frequency of the RFID antenna 100 to, for example, around 13.56 MHz. . If necessary, the resonance frequency can be adjusted afterwards by cutting the wiring patterns at both ends of the predetermined number of chip capacitors 13. One end (inner end portion) of the loop pattern 12 is connected to the first connecting terminal portion 14, and the other end (outer end portion) of the loop pattern 12 is connected to the first bonding pad 18. The bonding pad 19 is connected to the second connection terminal portion 16.

  The single-sided FPC 10 is provided with an opening 21 having a predetermined shape to form a bent piece 23, and the second bonding pad 19 is preferably located at the tip of the bent piece 23. The opening 21 preferably surrounds the second bonding pad 19 in a U shape or a U shape. The bent piece 23 is bent so that the first bonding pad 18 and the second bonding pad 19 come into contact with each other. In this state, the first and second bonding pads 18 and 19 are electrically bonded to each other by, for example, soldering, thermocompression bonding (welding by spot heating), or a conductive adhesive. As a result, the inner substrate region and the outer substrate region are electrically connected across the loop pattern 12.

Thus, according to this reference example , in order to electrically connect the inner substrate region and the outer substrate region across the loop pattern 12, a wiring pattern is formed on the back surface of the substrate as in Patent Document 1 or 2. There is no need to form it, and there is no need to provide a separate jumper as in Patent Document 3. That is, even in the case of single-sided FPC, it is possible to electrically connect the inner substrate region and the outer substrate region across the loop pattern without separately providing a jumper, thereby reducing the cost.

( Second reference example )
2A and 2B are exemplary schematic perspective views showing the configuration of an RFID antenna 200 according to a second reference example of the present invention. 2A shows an incomplete state before bending, and FIG. 2B shows a completed state after bending. Compared with the RFID antenna 100 of the first reference example, the RFID antenna 200 of the present reference example is provided with a cut 22 in the single-sided FPC 10 instead of the opening 21 in order to form the bent piece 23. Is different, and is otherwise the same. This reference example also has the same effect as the first reference example .

( Third reference example )
3A and 3B are exemplary schematic perspective views showing the configuration of an RFID antenna 300 according to a third reference example of the present invention. 3A shows an unfinished state before bending, and FIG. 3B shows a completed state after bending. In the RFID antenna 300 of the present reference example , in addition to the configuration of the RFID antenna 100 of the first reference example , the first preliminary bonding pad 38 and the second preliminary bonding pad 39 are folded from the bent piece 23. It is formed inside the loop pattern 12 (on the pattern connecting the second connection terminal portion 16 and the second bonding pad 19) so as to be divided on both sides of the bending position, and the first and second The preliminary bonding pads 38 and 39 are electrically bonded to each other. As a result, the first and second bonding pads 18 and 19 and the inner side of the loop pattern 12 (second connection terminal portion 16) are connected via the first and second preliminary bonding pads 38 and 39. (That is, a path connecting both sides of the folding position without passing through the folding position is formed). The second preliminary bonding pad 39 is preferably located at the base of the bent piece 23.

Although the conductor pattern may be broken at the bent position of the bent piece 23, according to the present reference example , the first and second bonding pads 18 and 19 and the substrate region inside the loop pattern 12 (first 2 is connected via the first and second preliminary bonding pads 38 and 39, even if the conductor pattern is disconnected at the bending position of the single-sided FPC 10, the first In addition, electrical connection between the second bonding pads 18 and 19 and the substrate region (second connection terminal portion 16) inside the loop pattern 12 is ensured. Therefore, according to this reference example , in addition to the effect of the first reference example , it is possible to expect a reduction in the defective product occurrence rate. In the second reference example described above, the same effect can be further achieved by forming the first and second preliminary bonding pads 38 and 39 as in the case of this reference example .

( Fourth reference example )
4A and 4B are exemplary schematic perspective views showing the configuration of an RFID antenna 400 according to a fourth reference example of the present invention. 4A shows an unfinished state before bending, and FIG. 4B shows a completed state after bending. Compared to the RFID antenna 100 of the first reference example, the RFID antenna 400 of this reference example has a single-sided FPC 10 partially extended (protruded) from the outer periphery with a predetermined width instead of the bent piece 23. The extension piece 41 has an extension piece 41 so that the first bonding pad 18 is preferably located at the distal end of the extension piece 41 and the first bonding pad 18 and the second bonding pad 19 are in contact with each other. 41 is different in that it is bent, and is the same in other points. This reference example also has the same effect as the first reference example . In the case of this reference example , compared with the first reference example , although it is disadvantageous in terms of cost by the length of the extension piece 41, it is possible to increase the area of the loop pattern 12, which is advantageous in terms of performance. It becomes.

( Fifth reference example )
5A and 5B are exemplary schematic perspective views showing a configuration of an RFID antenna 500 according to a fifth reference example of the present invention. 5A shows an incomplete state before bending, and FIG. 5B shows a completed state after bending. In the RFID antenna 500 of this reference example , in addition to the configuration of the RFID antenna 400 of the fourth reference example, a first preliminary bonding pad 58 and a second preliminary bonding pad 59 are formed by bending the extension piece 41. The first and second preliminary bonding pads 58 and 59 are formed on the outer side of the loop pattern 12 so as to be divided and positioned on both sides of the position, and are electrically connected to each other. As a result, the first and second bonding pads 18 and 19 are connected to the substrate region outside the loop pattern 12 via the first and second preliminary bonding pads 58 and 59 (that is, the bending position). A path that connects both sides of the folding position without passing through is formed). The first preliminary bonding pad 58 is preferably located at the base of the extension piece 41.

According to this reference example , the same effects as those of the fourth reference example can be obtained, and the first and second bonding pads 18 and 19 and the substrate region outside the loop pattern 12 can be obtained as in the third reference example. Are connected via the first and second preliminary bonding pads 58 and 59, so that even if the conductor pattern is disconnected at the bending position of the single-sided FPC 10, the first and second bonding pads 18, Electrical connection between the circuit board 19 and the substrate area outside the loop pattern 12 is ensured, and a reduction in the defective product generation rate can be expected.

( Sixth reference example )
6A and 6B are exemplary schematic perspective views showing the configuration of an RFID antenna 600 according to a sixth reference example of the present invention. 6A shows an unfinished state before folding, and FIG. 6B shows a completed state after bending. In addition to the configuration of the RFID antenna 200 of the second reference example, the RFID antenna 600 of the reference example has a first positional relationship with each of the first and second bonding pads 18 and 19. And second positioning holes 61 and 62 (through holes) are provided in the vicinity of the first and second bonding pads 18 and 19, respectively, so that the positions of the first and second positioning holes 61 and 62 coincide with each other. The bent piece 23 is bent.

According to this reference example , in addition to the effects of the second reference example , the first and second positioning holes 61 and 62 are provided, so that the bent piece 23 is bent to be used for the first and second joining. Positioning when the pads 18 and 19 are joined can be surely and easily performed, for example, by inserting a pin or visually, and the reliability can be easily improved. In the first reference example described above, the same effect can be further achieved by forming the first and second positioning holes 61 and 62 as in the case of this reference example .

( Seventh reference example )
7A and 7B are exemplary schematic perspective views showing the configuration of an RFID antenna 700 according to a seventh reference example of the present invention. 7A shows an incomplete state before folding, and FIG. 7B shows a completed state after bending. In addition to the configuration of the RFID antenna 400 of the fourth reference example, the RFID antenna 700 of this reference example has a first positional relationship with each of the first and second bonding pads 18 and 19. And second positioning holes 71 and 72 (through holes) are provided in the vicinity of the first and second bonding pads 18 and 19, respectively, so that the positions of the first and second positioning holes 71 and 72 coincide with each other. The extension piece 41 is bent.

According to the present reference example , in addition to the effect of the fourth reference example , the first and second positioning holes 71 and 72 are provided to fold the extension piece 41 in the same manner as the sixth reference example. Positioning when the first and second bonding pads 18 and 19 are bonded can be surely and easily performed, for example, by inserting a pin or visually, and it is easy to improve reliability.

( Embodiment )
8A and 8B are exemplary schematic perspective views showing the configuration of the RFID antenna 800 according to the embodiment of the present invention. 8A shows an incomplete state before cutting, and FIG. 8B shows a completed state after cutting.

Compared with the RFID antenna 100 of the first reference example , the RFID antenna 800 of the present embodiment is provided with an opening 85 having a predetermined shape as shown in FIG. The point where the cut piece 81 is formed, the point where the third and fourth bonding pads 83 and 84 are formed on the cut piece 81 (on the one-sided FPC 10) and are connected to each other, and FIG. The first and second bonding pads 18 and 19 are connected to each other by the cut piece 81 cut out as shown in FIG. The distance between the first and second bonding pads 18 and 19 and the distance between the third and fourth bonding pads 83 and 84 are preferably substantially equal.

As shown in FIG. 8A, the opening 85 has a shape surrounding the third and fourth bonding pads 83 and 84 except for the thin connecting portion 87. Instead of the opening 85, a narrow cut may be provided. Moreover, the formation position of the cut piece 81 is arbitrary, and for example, it may be formed as shown in FIG. By cutting the connecting portion 87, the cut piece 81 can be easily cut with a cutter, for example. As shown in FIG. 5B, the cut piece 81 cut out is in contact with the first bonding pad 18 and the third bonding pad 83, and the second bonding pad 19 and the fourth bonding pad. It arrange | positions so that the pad 84 may contact | abut. In this state, the first and third bonding pads 18 and 83 are electrically bonded to each other, and the second and fourth bonding pads 19 and 84 are electrically bonded to each other. This embodiment also has the same effect as the first reference example .

  In the present embodiment, a single-sided hard printed board may be used instead of the single-sided FPC 10. As the single-sided rigid printed board, for example, a glass epoxy board (material: FR4 or the like) is suitable. A single-sided hard printed board cannot be bent like a single-sided FPC, but in this embodiment, the board does not need to be bent, and thus a single-sided hard printed board can be used. That is, the technique of the present embodiment can be widely applied when a single-sided printed board such as a single-sided FPC or a single-sided hard printed board is used.

  The present invention has been described above by taking the embodiment as an example. However, it will be understood by those skilled in the art that various modifications can be made to each component of the embodiment within the scope of the claims. Hereinafter, modifications will be described.

  In any embodiment, the chip capacitor 13, the first and second connection terminal portions 14 and 16, and the second bonding pad 19 are provided inside the loop pattern 12, and the outside of the loop pattern 12. In the modification, the chip capacitor 13, the first and second connection terminal portions 14, 16, and the first connection pads 18 are formed outside the loop pattern 12. Two bonding pads 19 may be provided, and the first bonding pad 18 may be formed inside the loop pattern 12.

  In any of the embodiments, the case where the chip capacitor 13 is provided for adjusting the resonance frequency has been described. However, it is not necessary to provide the chip capacitor 13 if the adjustment of the resonance frequency is unnecessary. Even in this case, the present embodiment is effective as long as it is necessary to electrically connect the inner substrate region and the outer substrate region across the loop pattern 12.

In the first reference example , the opening 21 is provided so as to surround the second bonding pad 19 in a U shape or a U shape, and the bent piece 23 is formed. However, in the modified example, the first bonding pad 18 is formed. Alternatively, a bent piece may be formed by providing an opening so as to surround a U-shape. That is, whether the bent piece is configured to be bent from the inner side to the outer side of the loop pattern 12 or to be bent from the outer side to the inner side is appropriately determined depending on design convenience or the like. The same can be said for the second, third, and sixth reference examples .

In the configuration in which the first and second positioning holes 61 and 62 are provided as in the sixth reference example , the first and second preliminary bonding pads 38 and 39 are further provided as in the third reference example. Is also possible. Similarly, the technique of the fifth reference example can be applied to the seventh reference example . Furthermore, the technique of providing the positioning holes 61 and 62 as in the sixth reference example can be applied to the embodiment .

10 single-sided FPC
12 Loop Pattern 13 Chip Capacitor 14 First Connection Terminal Portion 16 Second Connection Terminal Portion 18 First Bonding Pad 19 Second Bonding Pad 21 Opening 22 Cut 23 Bending Piece 41 Extension Piece 81 Cut Piece 83 Third bonding pad 84 Fourth bonding pad 85 Opening 87 Connecting portion 100, 200,..., 800 RFID antenna

Claims (5)

A loop pattern, first and second connection terminal portions located on either the inner side or the outer side of the loop pattern, and first to fourth bonding pads are formed, and the third and fourth pads are formed. Including a single-sided printed circuit board in which a part including the position of the bonding pad is cut out to be a cut piece;
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. Connected to the terminal portion, the third bonding pad and the fourth bonding pad are connected in the cut piece,
The cut piece is positioned such that the first bonding pad and the third bonding pad are in contact with each other, and the second bonding pad and the fourth bonding pad are in contact with each other; The first and third bonding pads are electrically bonded to each other, and the second and fourth bonding pads are electrically bonded to each other ;
The cut pieces, that exists in a position that does not return to the previous position cut be rotated in the folding direction axis along any part of its own rim, RFID antenna. A single-sided printed circuit board on which a loop pattern, first and second connection terminal portions located on either the inner side or the outer side of the loop pattern, and first to fourth bonding pads are formed;
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. A cut piece is formed which is connected to the terminal portion and is provided with a cut or opening of a predetermined shape so as to leave a connecting portion on the single-sided printed circuit board, and the third and fourth bonding pads are formed as described above. Located on the cut piece and connected to each other ,
The cut piece is present at a position where the third and fourth bonding pads do not come into contact with the first and second bonding pads even when bent at the connecting portion without being cut, the first and connecting pad and the third bonding pads and the abutting and wherein the second bonding pads fourth bonding pads of Ru arrangement can der abut, RFID antenna. 3. The RFID antenna according to claim 2 , wherein a distance between the first and second bonding pads is substantially equal to a distance between the third and fourth bonding pads. In the RFID antenna according to any one of claims 1 to 3, a capacitor for adjusting the resonance frequency is provided between the first and second connection terminal portions, the RFID antenna. Using a single-sided printed circuit board on which a loop pattern, first and second connection terminal portions located on either the inside or the outside of the loop pattern, and first to fourth bonding pads are formed, A method of manufacturing an RFID antenna,
One end of the loop pattern is connected to the first connection terminal portion, the other end of the loop pattern is connected to the first bonding pad, and the second bonding pad is used for the second connection. A cut piece is formed which is connected to the terminal portion and is provided with a cut or opening of a predetermined shape so as to leave a connecting portion on the single-sided printed circuit board, and the third and fourth bonding pads are formed as described above. The third and fourth bonding pads are connected to the first and second bonding pads even if the cut pieces are bent at the connecting portion without being cut. Exists in a position where it does not contact,
This method
Cutting the cut piece from the single-sided printed circuit board;
The cut piece is disposed so that the first bonding pad and the third bonding pad are in contact with each other, and the second bonding pad and the fourth bonding pad are in contact with each other. And a step of electrically bonding the first and third bonding pads to each other and electrically bonding the second and fourth bonding pads to each other. .

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