JP4742728B2 - Barrel plating method - Google Patents

Description

  The present invention relates to a barrel plating method in which a plating object is plated while stirring in a plating solution in the barrel.

  As a plating apparatus (method) that can efficiently process a large number of small parts, an anode is made to flow through an anode electrode and a cathode electrode while stirring an object to be plated together with a dummy medium in a plating solution in a barrel. 2. Description of the Related Art Conventionally, barrel plating apparatuses (methods) for plating a metal for plating on the pole side on an object to be plated are generally known.

In this type of barrel plating equipment (method), as the dummy media for conducting the object to be plated to the cathode electrode, the surface of iron alloy balls or ceramic balls plated with nickel (Ni) or the like is usually used. (For example, refer to Patent Document 1). As the cathode electrode, a cathode bar made of stainless steel is generally used.
JP2003-328195A (paragraph number 0004)

  By the way, in the conventional general barrel plating apparatus (method) using a cathode bar made of a dummy medium or stainless steel material plated with nickel (Ni) or the like on the surface, the plating on the anode electrode side is performed each time the plating process is repeated. Since the metal for the metal deposits on the surface of the dummy media and the cathode bar, the outer dimensions of the dummy media and the cathode bar gradually increase.

  And the enlarged dummy media and cathode bars are generally discarded because their original function of efficiently and uniformly plating a large number of plating objects is reduced.

  Accordingly, an object of the present invention is to provide a barrel plating method capable of reducing waste by making it possible to reuse dummy media and cathode bars that are generally enlarged to be disposed of.

  In the barrel plating method according to the present invention, the plating object on the anode electrode side is plated by passing a current between the anode electrode and the cathode electrode while stirring the object to be plated together with the dummy medium in the plating solution in the barrel. A barrel plating method of plating on a metal plate, using a dummy medium made of a metal for plating as a dummy medium, and using the dummy medium on which the plating metal is deposited and enlarged as a result of using the dummy medium It is characterized by being reused.

  In this barrel plating method, since the dummy media composed of the plating metal is used, the dummy media in which the plating metal is deposited and enlarged by use can be reused as the plating metal on the anode side. As a result, the number of discarded dummy media is reduced.

  Further, the barrel plating method according to the present invention is such that a current is passed between the anode electrode and the cathode electrode while stirring the object to be plated in the plating solution in the barrel, and the metal for plating on the anode electrode side is used as the object to be plated. This is a barrel plating method for plating, in which a cathode bar made of a metal for plating is used as a cathode electrode, and a cathode bar which has been deposited and enlarged by use as a metal for plating on the anode electrode side. It is characterized by reuse.

  In this barrel plating method, a cathode bar made of a metal for plating is used, so that the cathode bar that is deposited and enlarged by use can be reused as a metal for plating on the anode side. As a result, the number of discarded cathode bars is reduced.

  Further, in the barrel plating method according to the present invention, the plating object on the anode electrode side is plated by flowing a current between the anode electrode and the cathode electrode while stirring the object to be plated together with the dummy medium in the plating solution in the barrel. A barrel plating method for plating on an object, in which a dummy medium in which the surface of a core material that is non-eluting to the plating solution is composed of a plating metal is used as a dummy medium. The dummy media deposited and enlarged on the substrate is reused as a metal for plating on the anode side.

  In this barrel plating method, a dummy medium in which the surface of the core material that is non-eluting to the plating solution is composed of a plating metal is used. It can be reused as the electrode-side plating metal, and as a result, the number of discarded dummy media is reduced.

  According to the barrel plating method of the present invention using a dummy medium composed of a plating metal, the dummy medium in which the plating metal is deposited and enlarged by use can be reused as a plating metal on the anode side. As a result, the number of discarded dummy media can be reduced.

  Further, according to the barrel plating method of the present invention using the cathode bar composed of the metal for plating, the cathode bar on which the metal for plating is deposited and enlarged by use is reused as the metal for plating on the anode side. As a result, the cathode bar to be discarded can be reduced.

  Furthermore, according to the barrel plating method of the present invention using the dummy media in which the surface of the core material exhibiting non-eluting properties with respect to the plating solution is composed of the plating metal, the plating metal is precipitated and enlarged by use. The dummy media can be reused as the anode-side plating metal, and as a result, the number of discarded dummy media can be reduced.

  Hereinafter, an embodiment of a barrel plating method according to the present invention will be described with reference to the drawings. In the drawings to be referred to, FIG. 1 is a cross-sectional view showing a schematic structure of a barrel plating apparatus used in a barrel plating method according to an embodiment of the present invention.

  First, a barrel plating apparatus 1 used in the barrel plating method of one embodiment will be described with reference to FIG. 1. This barrel plating apparatus 1 includes a barrel 3 and an anode electrode 4 in a plating bath 2 in which a plating solution L is stored. It has an arranged structure.

  The barrel 3 is formed, for example, in a substantially hexagonal cylindrical shape having a rotation support shaft 3 </ b> A at the center, and is disposed sideways in the plating bath 2. A rotating support shaft 3A of the barrel 3 is rotatably supported through the plating bath 2. The rotating support shaft 3A is rotationally driven by a motor (not shown) so as to be disposed sideways in the plating bath 2. The barrel 3 is configured to rotate in the plating solution L.

  In such a barrel 3, a cathode bar 5 (for example, a bar made of stainless steel (SUS) or copper (Cu)) that constitutes a cathode electrode is inserted, and a plurality of small parts that are objects to be plated. 6 is accommodated together with a large number of dummy media 7.

  Here, when nickel (Ni) is plated on the small component 6, for example, a nickel sphere made of the same material as the plating metal is used as the dummy medium 7. As the anode 4, the same nickel sphere as the dummy medium 7 is accommodated in a mesh-like metal basket, for example, a titanium (Ti) basket 4A.

  In the barrel plating method of the embodiment using such a barrel plating apparatus 1, when the barrel 3 is rotated around the rotation support shaft 3 </ b> A, a plurality of small parts 6 accommodated in the barrel 3 are a large number of dummy media 7. At the same time, the plating solution L is stirred. When a current is passed between the anode electrode 4 and the cathode bar 5 of the cathode electrode, a plurality of small parts 6 are conducted to the cathode bar 5 of the cathode electrode through a large number of dummy media 7.

  As a result, the nickel ions dissolved in the plating solution L from the nickel spheres accommodated in the basket 4A of the anode electrode 4 are subjected to a reducing action on the surface of each small component 6 and are uniform on the surface of each small component 6. A thick nickel (Ni) film is formed, and thus the surface of each small component 6 is uniformly plated with nickel (Ni).

  The nickel (Ni) plating process for the plurality of small parts 6 using the barrel plating apparatus 1 is repeated by replacing the small parts 6 in the barrel 3. In this repeated operation, nickel (Ni), which is a metal for plating, is deposited on the surface of a large number of dummy media 7 in the barrel 3, and the large number of dummy media 7 are gradually deposited by the deposition of nickel (Ni). It will be enlarged.

  Here, in the barrel plating method of this embodiment, instead of discarding a large number of dummy media 7 that have been enlarged due to the deposition of nickel (Ni) on the surface by repetitive operations, they are reused as the plating metal for the anode electrode 4. . That is, it is reused as a plating metal by being accommodated in the basket 4A of the anode electrode 4.

  The dummy media 7 that is reused as the plating metal for the anode electrode 4 is composed of nickel spheres made of the same material as the plating metal, so that it can be reused very effectively without contaminating the plating solution L. Is done.

  The barrel plating method according to the present invention is not limited to the above-described embodiment. For example, the dummy media 7 may be changed to a ceramic sphere exhibiting non-eluting properties with respect to the plating solution L as a core and nickel (Ni) plating on the surface thereof. In this case, the dummy media 7 in which nickel (Ni) is deposited and enlarged on the nickel (Ni) plating layer on the surface is accommodated in the basket 4A of the anode electrode 4 so that the plating solution L is not contaminated. Effectively reused.

  The cathode bar 5 may be changed to a nickel (Ni) bar made of the same material as the plating metal. In this case, in the repetitive operation of the nickel (Ni) plating treatment, nickel (Ni) as a plating metal is deposited on the surface of the nickel (Ni) cathode bar and gradually enlarges, but the enlarged nickel ( The cathode bar 5 made of Ni) is accommodated in the basket 4A of the anode electrode 4 so that it can be reused very effectively without contaminating the plating solution L as a metal for plating.

  Furthermore, the metal for plating on the anode electrode 4 side is not limited to nickel (Ni) but can be appropriately changed such as gold (Au), silver (Ag), copper (Cu), and the like. In this case, the material of the dummy media 7 and the cathode bar 5 is the same material as gold (Au), silver (Ag), copper (Cu), or the like, which is a metal for plating.

  The barrel plating apparatus used in the barrel plating method of the present invention is not limited to the one shown in FIG. 1, but the type in which the barrel rotates around the vertical axis or the type in which the barrel rotates around the tilt axis. It may be a thing.

It is sectional drawing which shows schematic structure of the barrel plating apparatus used for the barrel plating method which concerns on one Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Barrel plating apparatus 2 Plating bath 3 Barrel 4 Anode pole 5 Cathode bar 6 Small parts 7 Dummy media L Plating solution

Claims (1)

A barrel plating method in which a plating object on the anode electrode side is plated on a plating object by flowing a current between the anode electrode and the cathode electrode while stirring the object to be plated together with a dummy medium in a plating solution in the barrel. ,
As the dummy medium, using a dummy medium composed only of the core material that exhibits non-elution with respect to the plating solution and the metal for plating covering the surface of the core material,
A barrel plating method, wherein a dummy medium in which the plating metal is deposited and enlarged by use is reused as a plating metal on the anode electrode side.

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