JP4738727B2 - Semiconductor chip testing equipment - Google Patents

Description

The present invention relates to a semiconductor chip test apparatus, and more particularly, to a semiconductor chip test apparatus for testing electrical performance by connecting a semiconductor chip conveyed by a measuring hand of a handler to a socket.

  Conventionally, a test apparatus for measuring the electrical characteristics of a semiconductor chip (IC) has been put into practical use. This test apparatus is usually integrated with an automatic transfer device called a handler in order to improve productivity.

FIG. 3 shows a schematic cross-sectional view of a conventional test apparatus. As shown in the figure, the test unit 1 is attached to the handler base 4 with the screws 7 and 10 via the contact unit 5a and the like. Here, the contact unit 5a of the conventional test apparatus is formed of a metal material for reasons such as workability and durability.

For example, Patent Document 1 discloses a technique relating to noise countermeasures in a semiconductor chip test apparatus. This patent document 1 discloses that a guide rail, a clamp plate, and a guide rail are formed of a resin material having good electrical insulation so that voltage noise generated from a driving component is not transmitted to a test unit. Yes .

No. 7-40226

In an environment where a test apparatus is installed, there are various noise sources such as a power source for a handler, a power source for an LSI tester, and a power source for an adjacent machine. In particular, since the contact unit 5a of the conventional test apparatus described with reference to FIG. 3 is made of metal, voltage noise is transmitted through the handler base 4, the screw 10 and the contact unit 5a, and electromagnetic wave noise is covered by the antenna effect. There is a problem in that it is transmitted in a non-contact manner to the terminals and wirings of the semiconductor chip or IC socket to be tested, and adversely affects the electrical characteristics test.

An object of the present invention is to provide a test apparatus capable of solving such problems, preventing voltage noise and electromagnetic wave noise from being applied to a semiconductor chip to be tested, etc., and stably measuring electrical characteristics.

A semiconductor chip test apparatus according to the present invention is a semiconductor chip test apparatus for performing an electrical performance test by connecting a semiconductor chip transported by a measurement hand of a handler to a socket, the handler base of the handler, and a test connecting the head and the test board, all parts of the contact unit surrounding the semiconductor chip connection state to the socket is obtained by construction of an insulating material. According to this structure, since all parts of the contact unit surrounding the semiconductor chip and made of an insulating material, it is possible to prevent the voltage noise and electromagnetic noise are applied to the semiconductor chip or the like of the non-test object.

The contact unit is preferably provided with a metal screw hole part into which a screw for connection with the handler base or the test head is screwed. With such a configuration, the contact unit and the handler base , or the contact unit and the test head can be easily fixed with screws. In particular, in the present invention, since the contact unit is made of an insulating material, if the screw is screwed in as it is, the screwed portion is likely to be broken. Can be prevented.

Furthermore, a test board for executing a test of the semiconductor chip may be provided between the contact unit and the test head, and a reinforcing plate for reinforcing the test board may be provided. The contact unit made of an insulating material has to be weaker than that made of a metal material, but a test board that is created when a semiconductor chip is inserted into a socket by attaching a reinforcing plate It is possible to protect the test board from stress on the surface.
The reinforcing plate is provided below the test board via an insulating sheet, the reinforcing plate is a metallic plate, the test board and the insulating sheet are provided in contact with each other, and the insulating sheet is provided. And the reinforcing plate may be provided in contact with each other.

  The insulating material of the contact unit in a preferred embodiment is a glass epoxy resin or a polyetherimide resin.

Moreover, it is preferable that the contact unit is inscribed in the side surface of the socket. Thereby, electromagnetic wave noise can be prevented from entering the test head through the gap between the socket and the contact unit.

According to the present invention, it is possible to provide a test apparatus that can prevent voltage noise and electromagnetic wave noise from being applied to a semiconductor chip to be tested and can stably measure electrical characteristics.

  FIG. 1 is a schematic cross-sectional view of a test apparatus according to the present invention. FIG. 1A shows a state before mounting a semiconductor chip, and FIG. 1B shows an electrical state after mounting the semiconductor chip. The test apparatus of the characteristic measurement state is shown. FIG. 2 is a schematic top view of the test apparatus according to the present invention. The cross-sectional view of FIG. 1 shows the AA ′ cross-section of FIG.

The semiconductor chip 2 on which an electrical characteristic test or the like is executed by the test apparatus according to the present invention is a packaged chip. In particular, an analog IC that is easily affected by voltage noise and electromagnetic wave noise is suitable. More specifically, it is an analog IC that realizes a highly accurate A / D converter.

  In this test apparatus, a test board 3 is mounted on a test head 1 of an LSI tester. The test head 1 stores various circuits for measuring and testing electrical characteristics. For example, the main surface of the test head 1 has a square of 1 m square. The test board 3 is appropriately replaced according to the semiconductor chip 2 to be tested, and is composed of, for example, a 30 cm square printed wiring board. On the upper surface of the test board 3, an IC socket 6 to which the terminal of the semiconductor chip 2 is inserted and connected is provided.

  A thick cylindrical contact unit 5 is provided around the outside of the IC socket 6 as well shown in the top view of FIG. The shape of the inner periphery of the contact unit 5 is configured to be inscribed in the side surface of the IC socket 6. In this example, since the IC socket 6 has a quadrangular prism shape, the inner periphery of the contact unit 5 has a shape that is hollowed out of the quadrangular column. Further, the inner periphery of the contact unit 5 is formed wider than the outer periphery of the measurement hand 12 in order to prevent contact with the measurement hand 12.

  The contact unit 5 is made of an insulating resin having a high workability. Preferably, the contact unit 5 is made of glass epoxy resin or PEI (polyetherimide) resin, but may be made of an insulating material, and may be made of ceramics or the like in addition to the resin.

The contact unit 5 has a function of fixing the test head 1 and the test board 3 to the handler base 4 . That is, the contact unit 5 regulates the relative positions of the test head 1, the test board 3, and the handler base 4 .

  First, the contact unit 5, the test head 1, and the test board 3 are fixed by the test board-contact unit fixing screw 7. Therefore, through holes for passing the screws 7 are provided at four positions on the upper surface of the housing of the contact unit 5, the test board 3, and the test head 1. An insulating sheet 8 is provided between the test board 3 and the contact unit 5. A reinforcing plate 9 is provided below the test board 3 via an insulating sheet 8.

  The reinforcing plate 9 is a metallic plate, and protects the test board 3 from the stress applied to the test board 3 when the semiconductor chip 2 is inserted into the IC socket 6 by the measuring hand 12 from above. Is provided. Therefore, the reinforcing plate 9 reinforces the test board 3 within a range wider than at least the main surface of the IC socket 6. The reinforcing plate 9 is also provided with four through holes for allowing the screws 7 to pass therethrough. In particular, in the embodiment of the present invention, since the contact unit 5 is made of an insulating material that is generally weaker than metal, the reinforcing plate 9 is effective in complementing the strength. In addition, although the reinforcement plate 9 in this example is comprised separately from the insulation sheet 8, it is not restricted to this, You may give insulation plating to the reinforcement plate 9. FIG.

  Screws passed through the contact unit 5, the test board 3, the upper surface of the casing of the test head 1, the insulating sheet 8, and the reinforcing plate 9 are tightened with nuts inside the test head 1. Thereby, each member is fixed integrally.

The contact unit 5 and the handler base 4 are fixed by four handler base -contact unit fixing screws 10. For this reason, in the contact unit 5 made of resin, an embedded screw hole part 11 is provided at a position where the screw is screwed. The screw hole component 11 is screwed with the screw 10 to realize the fixing of the screw 10 and the contact unit 5 and is made of, for example, metal. In the contact unit 5, a member similar to the screw hole member 11 may be provided in a portion corresponding to the screw 7. At this time, as shown in FIGS. 1 and 2, the screw hole member 11 corresponding to the screw 10 and the screw hole member 11 corresponding to the screw 7 are arranged in a shifted portion so as not to be continuous.

  The handler base 4 is a component that is a base of a casing of an automatic transfer device called a handler that transfers the semiconductor chip 2, and is a plate-like member made of, for example, an iron alloy. The handler is provided to improve productivity. Basically, the place where the semiconductor chip 2 before the test is placed, the place where the test is performed (that is, the position where the semiconductor chip 2 is fixed to the IC socket 6), the semiconductor chip after the test 2 is a transfer device that carries the semiconductor chip 2 between places where the 2 is placed. This handler is fixed to the ground by a fixing member (not shown) and is separately grounded.

  The measuring hand 12 is a member of the handler, and is a holding unit that holds the semiconductor chip 2 during transport. The measurement hand 12 moves downward while holding the semiconductor chip 2, and fixes the semiconductor chip 2 to the IC socket 6. The measuring hand 12 is made of an insulating material. Note that the measurement hand 12 may hold not only one semiconductor chip 2 but also a plurality of semiconductor chips 2.

As described above, in the present invention, since the contact unit 5 is made of an insulating material , the antenna effect is reduced, and electromagnetic wave noise propagating in the space, for example , electromagnetic wave noise (commercial frequency sine wave such as a handler or LSI tester) Etc. ) can be enhanced. In particular, the analog characteristic measurement in which the signal-to-noise ratio is deteriorated due to electromagnetic noise can be improved.
Further, since the contact unit 5 is made of an insulating material, voltage noise can be prevented from being transmitted to the semiconductor chip 2 to be tested through the handler base 4 and the contact unit 5.

1 is a schematic cross-sectional view of a test apparatus according to the present invention. It is a model top view of the testing apparatus concerning this invention. It is a schematic cross section of the conventional test apparatus.

1 Test head 2 IC to be measured
3 Test board 4 Handler base 5 Contact unit 6 IC socket 8 Insulation sheet 9 Reinforcement plate 12 Measuring hand

Claims (6)

A semiconductor chip testing apparatus for testing electrical performance by connecting a semiconductor chip transported by a measurement hand of a handler to a socket,
And handlers base of the handler, connects the test head and the test board, a semiconductor chip test apparatus constructed of an insulating material all parts of the contact unit surrounding the semiconductor chip connection state to the socket. 2. The semiconductor chip testing apparatus according to claim 1, wherein the contact unit is provided with a metal screw hole part into which a screw for connection with the handler base or the test head is screwed. A test board for executing a test of the semiconductor chip is provided between the contact unit and the test head,
2. The semiconductor chip testing apparatus according to claim 1, further comprising a reinforcing plate for reinforcing the test board. The reinforcing plate is provided below the test board via an insulating sheet,
The reinforcing plate is a metallic plate,
4. The semiconductor chip testing apparatus according to claim 3, wherein the test board and the insulating sheet are provided in contact with each other, and the insulating sheet and the reinforcing plate are provided in contact with each other.   2. The semiconductor chip testing apparatus according to claim 1, wherein the insulating material of the contact unit is a glass epoxy resin or a polyetherimide resin.   2. The semiconductor chip testing apparatus according to claim 1, wherein the contact unit is inscribed in a side surface of the socket.

Images