JP4731232B2 - Surface mount base for electronic devices - Google Patents

Surface mount base for electronic devices Download PDF

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JP4731232B2
JP4731232B2 JP2005213185A JP2005213185A JP4731232B2 JP 4731232 B2 JP4731232 B2 JP 4731232B2 JP 2005213185 A JP2005213185 A JP 2005213185A JP 2005213185 A JP2005213185 A JP 2005213185A JP 4731232 B2 JP4731232 B2 JP 4731232B2
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lead
support frame
hole
terminal
mount base
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JP2007035723A (en
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敬一 上村
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16152Cap comprising a cavity for hosting the device, e.g. U-shaped cap

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Description

本発明は、LEDや水晶振動子等の電子素子を支持し、セット基板への表面実装を容易にするための電子素子用の表面実装ベース、特に製造が容易な表面実装ベースに関する。   The present invention relates to a surface mount base for an electronic element for supporting an electronic element such as an LED or a crystal resonator and facilitating surface mounting on a set substrate, and more particularly to a surface mount base easy to manufacture.

水晶振動子を表面実装ベースに搭載して表面実装型としたパッケージは、小型・軽量であることから、特に携帯型の電子機器に内蔵するのに多用されている。通常、そのタイプのパッケージは、表面実装ベースに水晶振動子を搭載して封止される。例えば特許文献1には、水晶振動子が実装されるセット基板との適合性を考慮した表面実装ベースが記載されている。   A surface mount type package in which a crystal resonator is mounted on a surface mount base is small and light in weight, and is therefore widely used especially in portable electronic devices. Usually, this type of package is sealed by mounting a crystal resonator on a surface mount base. For example, Patent Literature 1 describes a surface mount base that considers compatibility with a set substrate on which a crystal resonator is mounted.

図2は、特許文献1に記載された表面実装ベースを用いた水晶振動子のパッケージの断面を示す。図示しないが、平面形状は長方形であり、図2にはその長手方向の断面が示される。21は表面実装ベースであり、絶縁性の支持部材22、一対の金属製のリード端子23、および封着ガラス24からなる。表面実装ベース21の上面に水晶振動子25が搭載され、その上部がカバー26により覆われている。   FIG. 2 shows a cross section of a crystal resonator package using the surface mount base described in Patent Document 1. Although not shown, the planar shape is a rectangle, and FIG. 2 shows a longitudinal section thereof. Reference numeral 21 denotes a surface mount base, which includes an insulating support member 22, a pair of metal lead terminals 23, and a sealing glass 24. A crystal resonator 25 is mounted on the upper surface of the surface mount base 21, and an upper portion thereof is covered with a cover 26.

支持部材22は、例えばセラミックからなり、両端部に一対の貫通孔27を有する。リード端子23は、素子接続端子23a、リード部23bおよび実装端子23cを有し、リード部23bを貫通孔27に貫通させて支持部材22に装着されている。貫通孔27には封着ガラス24が充填され、リード端子23を貫通孔27内に封着し、それにより表面実装ベース21の気密性が確保されている。リード端子23の素子接続端子23aは支持部材22の上面側に面して位置し、水晶振動子25の電極と導電性接着剤等により接続されている。実装端子23cは支持部材22の底面側に面するように配置され、セット基板に実装される際の端子として使用される。素子接続端子23aと実装端子23cは、垂直方向のリード部23bに対して、水平方向に互いに逆向きに折曲されている。   The support member 22 is made of ceramic, for example, and has a pair of through holes 27 at both ends. The lead terminal 23 includes an element connection terminal 23 a, a lead portion 23 b, and a mounting terminal 23 c, and is attached to the support member 22 with the lead portion 23 b penetrating the through hole 27. The through hole 27 is filled with a sealing glass 24, and the lead terminal 23 is sealed in the through hole 27, thereby ensuring the airtightness of the surface mount base 21. The element connection terminal 23a of the lead terminal 23 is located facing the upper surface side of the support member 22, and is connected to the electrode of the crystal unit 25 by a conductive adhesive or the like. The mounting terminal 23c is disposed so as to face the bottom surface side of the support member 22, and is used as a terminal when mounted on the set substrate. The element connection terminal 23a and the mounting terminal 23c are bent in opposite directions in the horizontal direction with respect to the vertical lead portion 23b.

封着ガラス24として、固形状ガラスを貫通孔27内に充填し、支持部材22及びリード端子23とともに一体的に焼成する。これにより、固形状ガラスが溶融して、支持部材22及びリード端子23とともに一体化して表面実装ベース21を形成する。   As the sealing glass 24, solid glass is filled into the through-hole 27 and fired integrally with the support member 22 and the lead terminal 23. As a result, the solid glass is melted and integrated with the support member 22 and the lead terminal 23 to form the surface mount base 21.

カバー26は、セラミック等の絶縁材からなり、例えばガラス封止によって表面実装ベース21の外周に接合される。   The cover 26 is made of an insulating material such as ceramic, and is joined to the outer periphery of the surface mount base 21 by, for example, glass sealing.

このようなパッケージは、リード端子23の実装端子23cがセット基板の回路端子部(図示せず)に、例えば高熱炉を搬送させて半田によって接合される。その際、金属製の実装端子23cは弾性があるので、セラミック製の支持部材22とセット基板(ガラスエポキシ基板等)との膨張係数差を吸収する。したがって、ヒートサイクル等によって両者間の接合部に加わる外部衝撃を緩和し、例えば半田に生ずるひびや欠けの発生を防止する。
特開2003−297453号公報
In such a package, the mounting terminals 23c of the lead terminals 23 are joined to a circuit terminal portion (not shown) of the set substrate by soldering, for example, by transporting a high-temperature furnace. At that time, since the metal mounting terminal 23c has elasticity, it absorbs a difference in expansion coefficient between the ceramic support member 22 and the set substrate (glass epoxy substrate or the like). Therefore, the external impact applied to the joint between the two due to heat cycle or the like is alleviated, and for example, cracks and chips generated in the solder are prevented.
JP 2003-297453 A

上記構成の表面実装ベース21を作製する工程において、リード端子23を支持部材22に装着する際には、リード端子23を貫通孔27内に挿通し治具等を用いて固定した状態で、固形状のガラスを充填する。しかし、リード端子23の挿通を容易にするために、貫通孔27を十分な大きさにせざるを得ないので、リード端子23のリード部23bは、貫通孔27内でガタツキ、位置決めが不安定になるので、製造工程での取り扱いが困難であった。   In the step of manufacturing the surface mount base 21 having the above-described configuration, when the lead terminal 23 is attached to the support member 22, the lead terminal 23 is inserted into the through hole 27 and fixed using a jig or the like. Fill the shape glass. However, in order to facilitate the insertion of the lead terminal 23, the through-hole 27 must be made sufficiently large, so that the lead portion 23b of the lead terminal 23 is unstable in the through-hole 27 and unstable in positioning. Therefore, handling in the manufacturing process was difficult.

さらに、同じセット基板(ガラスエポキシ基板等)に実装されるコンデンサおよびダイオードならびにICなどの電子素子の小型化に伴い、電子素子用の表面実装ベースも小型化される傾向が強い。そのため、金属製の実装端子23cを形成する領域に寸法的な制限が生じ弾性が低くなり、リード端子23に作用する外部衝撃を緩和する作用が低下して、表面実装ベースと実装基板の接合部に加わる外部応力により、接合部が破壊される惧れが増大した。   Furthermore, along with the miniaturization of electronic devices such as capacitors and diodes and ICs mounted on the same set substrate (glass epoxy substrate or the like), the surface mount base for electronic devices tends to be miniaturized. For this reason, the region where the metal mounting terminal 23c is formed is dimensionally restricted, the elasticity is lowered, the action of mitigating the external impact acting on the lead terminal 23 is lowered, and the surface mounting base and the mounting substrate are joined. The risk of the joints being destroyed due to external stress applied to the surface increased.

本発明は、組み立てに際し、支持部材に対するリード端子の離脱やガタツキが抑制された状態に位置決めがされ、製造が容易であるとともに、リード端子の装着位置精度を高めることが可能な構造を有し、しかも、リード端子2の弾性が高く確保されて外部衝撃を十分に緩和できる表面実装ベースを提供することを目的とする。   The present invention has a structure that is positioned in a state in which detachment and backlash of the lead terminal with respect to the support member are suppressed during assembly, is easy to manufacture, and can improve the mounting position accuracy of the lead terminal, Moreover, it is an object of the present invention to provide a surface mount base in which the elasticity of the lead terminal 2 is ensured and the external impact can be sufficiently mitigated.

本発明の電子素子用の表面実装ベースは、貫通孔を有する絶縁性の支持部材と、前記貫通孔の内部領域に配置された素子接続部、前記支持部材の外部に配置された実装部、および前記素子接続部と前記実装部との間を連結し前記貫通孔に挿入されたリード部を有するリード端子と、前記支持部材の貫通孔に充填されて前記リード部を前記貫通孔内に封着した封着ガラスとを備える。前記リード部は、前記支持部材を挟持するとともに、前記貫通孔内の前記封着ガラスから前記実装部側に突出した非封着領域を前記貫通孔内に備えている。 The surface mount base for an electronic device according to the present invention includes an insulating support member having a through hole, an element connection portion disposed in an inner region of the through hole, a mount portion disposed outside the support member, and A lead terminal having a lead portion connected between the element connection portion and the mounting portion and inserted into the through-hole, and filled in the through-hole of the support member and sealing the lead portion in the through-hole Sealing glass. The lead portion sandwiches the support member and includes a non-sealing region protruding from the sealing glass in the through hole toward the mounting portion in the through hole .

本発明の表面実装ベースの構成によれば、リード端子は、支持枠に当接し押圧することにより、支持枠に確実に保持される。それにより、組み立てに際し、支持枠に対するリード端子の離脱やガタツキが抑制された状態に位置決めがされ、その状態で封着ガラスを充填し、焼成することができ、製造が容易であるとともに、リード端子の装着位置精度を高めることが可能である。   According to the configuration of the surface mount base of the present invention, the lead terminal is securely held by the support frame by abutting against and pressing the support frame. As a result, during assembly, positioning is performed in a state where detachment and backlash of the lead terminal with respect to the support frame are suppressed, and in that state, the sealing glass can be filled and baked, and the lead terminal is easy to manufacture. It is possible to improve the mounting position accuracy.

さらに、Fe−Ni−Co合金などの金属板で形成されるリード端子は、リード部に設けた非封着領域の弾性により、電子素子の組立工程やガラエポ系基板への実装工程や基板実装後の冷熱サイクルなどによる外部からリード端子に作用する衝撃を緩和する構造になっている。従って、外部応力に対する強度が向上し、長期間の信頼性を維持することができる。   Furthermore, the lead terminal formed of a metal plate such as an Fe-Ni-Co alloy has an electronic element assembly process, a mounting process on a glass-epoxy-based board, and a board mounting process due to the elasticity of the non-sealing region provided in the lead part The structure is designed to mitigate impacts acting on the lead terminals from the outside due to the cooling and heating cycle. Therefore, the strength against external stress is improved and long-term reliability can be maintained.

本発明の表面実装ベースにおいて、前記貫通孔の貫通方向における前記非封着領域の長さが0.1mm〜0.5mmであることが好ましい。   In the surface mount base of the present invention, it is preferable that the length of the non-sealing region in the through direction of the through hole is 0.1 mm to 0.5 mm.

また、前記リード部表面と前記支持部材の内表面との間に0.05mm〜0.3mmの間隙を有することが好ましい。   Moreover, it is preferable to have a gap of 0.05 mm to 0.3 mm between the surface of the lead portion and the inner surface of the support member.

以下、本発明の実施の形態における表面実装ベースについて、図1を参照して具体的に説明する。図1(a)は表面実装ベースの平面図、(b)は側面図、(c)は(a)におけるA−A断面図、(d)は裏面図、(e)は(a)におけるB−B断面図である。この表面実装ベースは、絶縁性の支持枠1、一対の金属製のリード端子2、および封着ガラス3からなる。     Hereinafter, the surface mount base in the embodiment of the present invention will be specifically described with reference to FIG. 1A is a plan view of a surface mount base, FIG. 1B is a side view, FIG. 1C is a cross-sectional view taken along line AA in FIG. 1A, FIG. 1D is a rear view, and FIG. It is -B sectional drawing. The surface mount base is composed of an insulating support frame 1, a pair of metal lead terminals 2, and a sealing glass 3.

支持枠1は、例えばセラミックからなり、概略長方形の枠状の形状を有し、内周面1aにより内腔を形成している。リード端子2は、Fe−Ni−Co合金などの金属板で形成され、素子接続端子2a、リード部2b、および実装端子2cを有し、リード部2bが支持枠1の内腔に挿通され支持枠1に装着されている。支持枠1の内腔には封着ガラス3が充填されて、リード端子2を支持枠1内に封着し、それにより、表面実装ベースの表裏面間での気密性が保持されている。   The support frame 1 is made of, for example, ceramic, has a substantially rectangular frame shape, and forms a lumen by the inner peripheral surface 1a. The lead terminal 2 is formed of a metal plate such as an Fe-Ni-Co alloy and has an element connection terminal 2a, a lead part 2b, and a mounting terminal 2c. The lead part 2b is inserted into the inner cavity of the support frame 1 and supported. Mounted on the frame 1. The inner cavity of the support frame 1 is filled with a sealing glass 3, and the lead terminals 2 are sealed in the support frame 1, whereby the airtightness between the front and back surfaces of the surface mounting base is maintained.

リード端子2の素子接続端子2aは、支持枠1の上面側に面して位置し、電子素子を搭載する際にその電極と導電性接着剤等により接続される。実装端子2cは、支持枠1の底面側に面するように配置され、セット基板に実装される際の端子として使用される。   The element connection terminal 2a of the lead terminal 2 is located facing the upper surface side of the support frame 1, and is connected to the electrode by a conductive adhesive or the like when the electronic element is mounted. The mounting terminal 2c is disposed so as to face the bottom surface side of the support frame 1, and is used as a terminal when mounted on the set substrate.

リード端子2のリード部2bは、ガラス封着3に封着されていない非封着部2b’を、0.1〜1.0mmの長さで有する。リード部2bに設けられた突起4の作用により、非封着部2b’と支持枠1とは離間しており、0.05mm〜1.5mmの間隙を有する。非封着部2b’と実装端子2cとの間に位置する屈曲部は0.01mm〜1.0mmの曲率半径Rを有しており、外部衝撃を緩和する弾性を強くすることが可能である。   The lead portion 2b of the lead terminal 2 has an unsealed portion 2b 'that is not sealed to the glass seal 3 with a length of 0.1 to 1.0 mm. Due to the action of the protrusion 4 provided on the lead portion 2b, the non-sealing portion 2b 'and the support frame 1 are separated from each other and have a gap of 0.05 mm to 1.5 mm. The bent portion located between the non-sealing portion 2b ′ and the mounting terminal 2c has a radius of curvature R of 0.01 mm to 1.0 mm, and can increase the elasticity to mitigate external impact. .

非封着部2b’の長さは0.5mm、非封着部2b’と支持枠1との間隙は0.15mm、非封着部2b’と実装端子2cとの間に位置する屈曲部の曲率半径Rは0.1mmが好適である。   The length of the non-sealed portion 2b ′ is 0.5 mm, the gap between the non-sealed portion 2b ′ and the support frame 1 is 0.15 mm, and the bent portion is located between the non-sealed portion 2b ′ and the mounting terminal 2c. The radius of curvature R is preferably 0.1 mm.

また、非封着部2b’に屈曲部や段差部を設けることで、更に外部衝撃を緩和する弾性を強くすることが出来る。   Further, by providing a bent portion or a stepped portion in the non-sealing portion 2b ', it is possible to further increase the elasticity for reducing the external impact.

リード端子2の実装端子2cは、支持枠1の底面を経て外周面1bに沿って延在し、外面対向部2dを形成している。リード端子2のリード部2bは、支持枠1の内周面1aに対向するように配置されている。外面対向部2dとリード部2bは、その間に支持枠1が挟持されるように構成されている。すなわち、外面対向部2dとリード部2bの間の間隔は、支持枠1の内周面1aと外周面1bの間の厚みよりも若干小さく形成されている。したがって、外面対向部2dとリード部2bの間に支持枠1を挿入すれば、リード端子2に撓みを生じて支持枠1を挟持する押圧力が発生し、リード端子2が支持枠1に係合する。より正確に言えば、外面対向部2dとリード部2bの間の間隔とは、支持枠1の外周面1bに対向する外面対向部2dの内面と、リード部2bに形成された支持枠1の内周面1aに向かって突出する突起4との間隔である。その外面対向部2dの内面とリード部2bの突起4の間隔が、支持枠1の厚みよりも小さく形成されている。   The mounting terminal 2c of the lead terminal 2 extends along the outer peripheral surface 1b through the bottom surface of the support frame 1 and forms an outer surface facing portion 2d. The lead portion 2 b of the lead terminal 2 is disposed so as to face the inner peripheral surface 1 a of the support frame 1. The outer surface facing portion 2d and the lead portion 2b are configured such that the support frame 1 is sandwiched therebetween. That is, the interval between the outer surface facing portion 2d and the lead portion 2b is formed slightly smaller than the thickness between the inner peripheral surface 1a and the outer peripheral surface 1b of the support frame 1. Therefore, if the support frame 1 is inserted between the outer surface facing portion 2d and the lead portion 2b, the lead terminal 2 is bent to generate a pressing force for clamping the support frame 1, and the lead terminal 2 is engaged with the support frame 1. Match. More precisely, the interval between the outer surface facing portion 2d and the lead portion 2b is the distance between the inner surface of the outer surface facing portion 2d facing the outer peripheral surface 1b of the support frame 1 and the support frame 1 formed on the lead portion 2b. The distance from the protrusion 4 protruding toward the inner peripheral surface 1a. The distance between the inner surface of the outer surface facing portion 2 d and the protrusion 4 of the lead portion 2 b is formed smaller than the thickness of the support frame 1.

上述の挟持作用により、各リード端子2を支持枠1に弾性的に保持させた後、封着ガラス3として固形状ガラスを支持枠1の内腔に充填し、焼成する。それにより、支持枠1に対して、リード端子2が封着ガラス3により一体化され、気密構造が形成される。   After the lead terminals 2 are elastically held on the support frame 1 by the above-described clamping action, the solid glass as the sealing glass 3 is filled in the lumen of the support frame 1 and baked. Thereby, the lead terminal 2 is integrated with the support frame 1 by the sealing glass 3, and an airtight structure is formed.

以上のように、本実施の形態の構造によれば、支持枠1に各リード端子2が確実に保持された状態で封着工程を行うことができるので、治具を要することなく、リード端子2の離脱やガタツキを抑制することができる。したがって、製造が容易であるとともに、リード端子の装着位置精度を高めることが可能である。   As described above, according to the structure of the present embodiment, since the sealing process can be performed in a state where each lead terminal 2 is securely held on the support frame 1, the lead terminal can be performed without requiring a jig. 2 and backlash can be suppressed. Therefore, it is easy to manufacture and it is possible to improve the accuracy of the mounting position of the lead terminals.

なお、リード部2bに突起4を設けることは必須ではないが、それにより次のような効果が得られる。すなわち、突起4を設けることにより、支持枠1の内周面1aとリード部2bの間に間隙が生じる。その間隙により、内周面1aとリード部2bの間に溶融ガラスが侵入し易くなり、当該箇所における気密性を確保することが容易になる。さらに、本実施の形態においては、内周面1aとリード部2bの間に溶融ガラスが侵入し易くするために、リード端子2のリード部2bは、図1(e)等に表われているように、素子接続端子2aよりも幅が狭く形成されている。   Although it is not essential to provide the protrusion 4 on the lead portion 2b, the following effects can be obtained. That is, by providing the protrusion 4, a gap is generated between the inner peripheral surface 1 a of the support frame 1 and the lead portion 2 b. The gap makes it easy for molten glass to enter between the inner peripheral surface 1a and the lead portion 2b, and it becomes easy to ensure airtightness at the location. Furthermore, in the present embodiment, the lead portion 2b of the lead terminal 2 appears in FIG. 1 (e) or the like in order to make it easier for molten glass to enter between the inner peripheral surface 1a and the lead portion 2b. Thus, the width is narrower than the element connection terminal 2a.

また、外面対向部2dに、支持枠1の外周面1bに向かって凸となるように屈曲形状を付与することもできる。その場合、外面対向部2dとリード部2bの間の間隔は、外面対向部2dの内面の屈曲形状の頂点と、リード部2bに形成された突起4との間隔である。外面対向部2dの形状は、要するに支持枠1に対するリード端子2の装着が容易であること、および装着後に弾性変形による押圧力が発生する条件を満足すれば、どのような形状にしてもよい。例えば、突起状、屈曲部に局面を形成するU字状等でもよい。   Further, the outer surface facing portion 2d can be given a bent shape so as to be convex toward the outer peripheral surface 1b of the support frame 1. In this case, the distance between the outer surface facing portion 2d and the lead portion 2b is the distance between the apex of the bent shape on the inner surface of the outer surface facing portion 2d and the protrusion 4 formed on the lead portion 2b. The shape of the outer surface facing portion 2d may be any shape as long as the mounting of the lead terminal 2 to the support frame 1 is easy and the conditions for generating a pressing force due to elastic deformation after mounting are satisfied. For example, it may be a protrusion or a U-shape that forms a bend in a bent portion.

本実施の形態においては、素子接続端子2aおよび封着ガラス3の上面は、支持枠1の上端面から窪んで位置し、支持枠1の上部にキャビティ5が形成されている。キャビティ5が形成されていると、素子接続端子2aが支持枠1の内部に収容されて外部に突出しないので、素子搭載前における損傷等を回避する効果が得られる。また、電子素子をキャビティ5内に搭載するように構成することも可能である。   In the present embodiment, the upper surfaces of the element connection terminals 2 a and the sealing glass 3 are recessed from the upper end surface of the support frame 1, and a cavity 5 is formed in the upper part of the support frame 1. When the cavity 5 is formed, the element connection terminal 2a is accommodated inside the support frame 1 and does not protrude outside, so that an effect of avoiding damage or the like before the element is mounted can be obtained. It is also possible to configure so that the electronic element is mounted in the cavity 5.

このようなキャビティ5が、本実施の形態においては、単純な直線形状の支持枠1により形成されている。すなわち、支持枠1の内周面1aには、段差が形成されておらず、支持枠1の上下方向において直線状である。したがって、支持枠1の製造が容易であり、また表面実装ベースを組み立てる際に、支持枠1の表裏の識別が不要で、製造工程が簡素である。   Such a cavity 5 is formed by a simple linear support frame 1 in the present embodiment. That is, no step is formed on the inner peripheral surface 1 a of the support frame 1, and the support frame 1 is linear in the vertical direction. Therefore, manufacture of the support frame 1 is easy, and when the surface mounting base is assembled, the front and back of the support frame 1 need not be identified, and the manufacturing process is simple.

さらに、支持枠1の外周面1bには、外面溝6が形成されている。外面溝6には、リード端子2の外面対向部2dが係合している。すなわち、外面溝6により形成された段差により、外面対向部2dが支持枠1の外周面1bを横方向に移動することが規制される。それにより、支持枠1に対してリード端子2を位置決めする効果が得られる。   Further, an outer surface groove 6 is formed on the outer peripheral surface 1 b of the support frame 1. The outer surface facing portion 2 d of the lead terminal 2 is engaged with the outer surface groove 6. That is, the step formed by the outer surface groove 6 restricts the outer surface facing portion 2d from moving on the outer peripheral surface 1b of the support frame 1 in the lateral direction. Thereby, the effect of positioning the lead terminal 2 with respect to the support frame 1 is obtained.

なお、以上の実施の形態において、支持枠1は平板状としたが、例えば凹部を形成する形状とすることもできる。   In the above embodiment, the support frame 1 has a flat plate shape. However, the support frame 1 may have a shape that forms a recess, for example.

本発明の電子素子用の表面実装ベースによれば、組み立てに際して、支持枠に対するリード端子の離脱やガタツキが抑制され、製造が容易であるとともに、リード端子の装着位置精度を高めることが可能である。従って、LEDや水晶振動子等の電子素子を搭載した表面実装用のパッケージに用いるのに好適である。   According to the surface mount base for an electronic device of the present invention, when assembling, the lead terminal can be prevented from being detached or rattled from the support frame, and can be easily manufactured, and the lead terminal mounting position accuracy can be increased. . Therefore, it is suitable for use in a surface mounting package on which an electronic element such as an LED or a crystal resonator is mounted.

本発明の一実施形態による電子素子用の表面実装ベースを示す図であり、(a)は平面図、(b)は側面図、(c)は(a)におけるA−A断面図、(d)は裏面図、(e)は(a)におけるB−B断面図It is a figure which shows the surface mounting base for electronic devices by one Embodiment of this invention, (a) is a top view, (b) is a side view, (c) is AA sectional drawing in (a), (d ) Is a back view, and (e) is a cross-sectional view along BB in (a). 従来例の電子素子用の表面実装ベースの断面図Sectional view of a surface mount base for a conventional electronic device

符号の説明Explanation of symbols

1 支持枠
1a 内周面
1b 外周面
2 リード端子
2a 素子接続端子
2b リード部
2b’ 非封着部
2c 実装端子
2d 外面対向部
3 封着ガラス
4 突起
5 キャビティ
6 外面溝
21 表面実装ベース
22 支持部材
23a 素子接続端子
23b リード部
23c 実装端子
24 封着ガラス
25 水晶振動子
26 カバー
DESCRIPTION OF SYMBOLS 1 Support frame 1a Inner peripheral surface 1b Outer peripheral surface 2 Lead terminal 2a Element connection terminal 2b Lead part 2b 'Non-sealing part 2c Mounting terminal 2d Outer surface opposing part 3 Sealing glass 4 Protrusion 5 Cavity 6 Outer surface groove 21 Surface mounting base 22 Support Member 23a Element connection terminal 23b Lead part 23c Mounting terminal 24 Sealing glass 25 Crystal resonator 26 Cover

Claims (3)

貫通孔を有する絶縁性の支持部材と、
前記貫通孔の内部領域に配置された素子接続部、前記支持部材の外部に配置された実装部、および前記素子接続部と前記実装部との間を連結し前記貫通孔に挿入されたリード部を有するリード端子と、
前記支持部材の貫通孔に充填されて前記リード部を前記貫通孔内に封着した封着ガラスとを備え、
前記リード部は、前記支持部材を挟持するとともに、前記貫通孔内の前記封着ガラスから前記実装部側に突出した非封着領域を前記貫通孔内に備えていることを特徴とする電子素子用の表面実装ベース。
An insulating support member having a through hole;
An element connection portion disposed in an inner region of the through hole, a mounting portion disposed outside the support member, and a lead portion connected between the element connection portion and the mounting portion and inserted into the through hole A lead terminal having
A sealing glass filled in the through hole of the support member and sealing the lead portion in the through hole;
The lead part sandwiches the support member , and includes an unsealed region protruding from the sealing glass in the through hole toward the mounting part in the through hole. Surface mount base for.
前記貫通孔の貫通方向における前記非封着領域の長さが0.1mm〜0.5mmである請求項1記載の電子素子用の表面実装ベース。   The surface mount base for an electronic device according to claim 1, wherein a length of the non-sealing region in a through direction of the through hole is 0.1 mm to 0.5 mm. 前記リード部表面と前記支持部材の内表面との間に0.05mm〜0.3mmの間隙を有する請求項1または2記載の電子素子用の表面実装ベース。   The surface mount base for an electronic device according to claim 1 or 2, wherein a gap of 0.05 mm to 0.3 mm is provided between the surface of the lead portion and the inner surface of the support member.
JP2005213185A 2005-07-22 2005-07-22 Surface mount base for electronic devices Expired - Fee Related JP4731232B2 (en)

Priority Applications (1)

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JP2005213185A JP4731232B2 (en) 2005-07-22 2005-07-22 Surface mount base for electronic devices

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Application Number Priority Date Filing Date Title
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JP2007035723A JP2007035723A (en) 2007-02-08
JP4731232B2 true JP4731232B2 (en) 2011-07-20

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Country Link
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62158348A (en) * 1986-01-04 1987-07-14 Fujitsu Ltd Leadless package
JPS6370449A (en) * 1986-09-11 1988-03-30 Fujitsu Ltd Leadless package
JPH09283648A (en) * 1996-04-11 1997-10-31 Matsushita Electric Ind Co Ltd Surface mounting type hermetic package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62158348A (en) * 1986-01-04 1987-07-14 Fujitsu Ltd Leadless package
JPS6370449A (en) * 1986-09-11 1988-03-30 Fujitsu Ltd Leadless package
JPH09283648A (en) * 1996-04-11 1997-10-31 Matsushita Electric Ind Co Ltd Surface mounting type hermetic package

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