JP4705256B2 - LAMINATE MANUFACTURING METHOD AND CHIP CAPACITOR - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a laminate comprising at least one dielectric layer and at least two metal thin layer (or metal thin film) patterns located on both sides thereof, and an apparatus for the same. Such a laminate can be suitably used for manufacturing electronic components such as capacitors.
[0002]
[Prior art]
Today's electronic components are becoming increasingly demanding for miniaturization and high performance, and capacitors are no exception. If the dielectric constant of the dielectric layer is the same, the capacitance of the capacitor is proportional to the area of the opposing electrodes located on both sides of the dielectric, and inversely proportional to the thickness of the dielectric layer. Therefore, in order to maintain or increase the capacitance while reducing the size of the capacitor, it is effective to reduce the thickness of the dielectric layer and increase the effective area of the electrode in the capacitance generating portion.
[0003]
As a laminate composed of a dielectric layer and a thin metal layer pattern used for manufacturing an electronic component such as a capacitor, for example, a laminate for a film capacitor is known. This is a metallized film in which a thin metal layer pattern of aluminum or the like is laminated on a resin film such as polyester (PEN, PET, etc.), polyolefin (PP, etc.), polyphenylene sulfide (PPS), etc. by vacuum deposition, sputtering, Laminated or wound.
[0004]
Regarding the thickness of the resin film, there is a limit to the thinning of the film because of restrictions on the handling process and workability of the film during or after the manufacturing process. The film thickness for film capacitors currently in use is up to about 1.2 μm. Therefore, in order to further increase the capacity of the capacitor, it is necessary to increase the effective area of the thin metal layer that functions as an electrode and constitute the thin metal layer pattern, that is, to increase the number of layers or turns. However, this is contrary to the demand for miniaturization of capacitors. That is, at present, film capacitors have reached the limit of achieving both high size and high capacity.
[0005]
On the other hand, regarding the manufacture of a laminate comprising a dielectric layer and a thin metal layer pattern, a capacitor laminate having a dielectric layer thickness of about 1 μm obtained by a method completely different from the above-described film capacitor manufacturing method is provided. Has been proposed (see US Pat. No. 5,125,138). In this method, the dielectric layer is formed as a resin layer by polymerizing the applied monomer, and in the same way as a conventional laminated film capacitor laminate, a laminated structure in which a dielectric layer and a thin metal layer pattern are sequentially laminated. While taking these, about 1000 layers or more are laminated, and the thickness is about several mm.
[0006]
[Problems to be solved by the invention]
According to the study by the present inventors, it has been found that, as the chip size of the capacitor is reduced, the occurrence of a defect due to the variation in the capacitance becomes a problem. In more detail, since the area of the opposing electrodes on both sides of the dielectric layer, which is a factor that determines the capacitance of the capacitor, is small, the variation in the accuracy of electrode formation in the capacitor manufacturing process has a large variation in capacitance. It turns out that it can be one of the causes.
[0007]
The problem regarding the accuracy of electrode formation is that in the case of a capacitor manufactured by sequentially laminating a dielectric layer and a thin metal layer pattern composed of a thin metal layer that functions as an electrode, miniaturization and high capacity are required. To achieve it, you can't avoid it. A film capacitor in which a thin metal layer pattern composed of a thin metal layer functioning as an electrode is formed on a film and wound and laminated can be adjusted by controlling the winding position, but this method is not always satisfactory. It is not possible. Further, when the dielectric layer and the metal thin layer pattern are laminated by the method described in the above-mentioned US patent specification, such control by the winding position cannot be applied. In this method, the thin metal layer pattern is generally composed of a plurality of thin metal layers in the form of strips, and these are present at predetermined positions on one dielectric layer at predetermined intervals. To be arranged. These thin metal layers may or may not be interconnected by thin or small thin metal layer portions. A particular problem is whether or not the metal thin layer formed on the dielectric layer is formed at a predetermined position in a predetermined metal thin layer pattern. In particular, it is a problem whether or not the above-described interval (generally referred to as “margin width”) is in a predetermined manner in the formed thin metal layer pattern.
[0008]
Accordingly, an object of the present invention is to provide a new method for manufacturing a laminate and a method for manufacturing the same, in which, when used for manufacturing a capacitor, there is little variation in electric capacity, and a reduction in size and increase in capacity can be realized stably. To provide an apparatus. Still another object of the present invention is to provide a capacitor manufactured from such a laminate. Therefore, it can be said that the object of the present invention is to further improve the accuracy of the margin width when the thin metal layer pattern is formed on the dielectric layer so as to define the margin width.
[0009]
[Means for Solving the Problems]
The present invention provides a laminate by laminating a dielectric layer and a thin metal layer pattern including a step of forming a dielectric layer and a step of forming a thin metal layer pattern on the formed dielectric layer in a vacuum atmosphere. In a method of manufacturing a body, Optically observe the formed metal thin layer pattern and dielectric layer, measure the margin width or the shape of the formed metal thin layer pattern, and check the metal thin layer pattern and dielectric layer defects previously examined Using the optical characteristics peculiar to the part, judge the properties of the formed metal thin layer pattern and dielectric layer, and judge the suitability of the layer formation. Provided is a method for producing a laminate. The step of forming the dielectric layer may include treating the surface of the formed dielectric layer. In addition, the step of forming the metal thin layer pattern includes previously setting a metal thin layer pattern to be formed on the dielectric layer.
[0010]
Furthermore, the present invention is an apparatus for manufacturing a laminate in which a dielectric layer and a metal thin layer pattern are laminated, including a dielectric layer forming means and a metal thin layer pattern forming means in a vacuum chamber, Provided is a laminate manufacturing apparatus further comprising means for optically observing a pattern formation state. In the vacuum chamber, the dielectric layer forming means may include dielectric layer surface treatment means for treating the surface of the formed dielectric layer, and the metal thin layer pattern forming means forms a metal thin layer pattern. Before, it includes means for setting the thin metal layer pattern to be formed.
[0011]
In the present invention, a laminate is a laminate in which at least one dielectric layer and at least one metal thin film pattern are alternately laminated, and the outermost layer is a metal thin film pattern even if it is a dielectric layer. Also good. The state in which the metal thin layer pattern is laminated on the dielectric layer is not particularly limited. Depending on the purpose of the laminate, the metal thin film pattern may exist over the entire dielectric layer. Or not, and usually there is a thin metal layer pattern on a portion, preferably most, of the dielectric layer. Thus, for example, the thin metal layer pattern formed on the surface of the dielectric layer is a pattern in which thin metal layers in the form of a plurality of strips or rectangles existing at intervals, referred to as the margin width, are arranged. Or a single rectangular shape set back to the required width from the edge of the dielectric layer (considering having a margin width from the edge of the dielectric layer). it can). In general, the portion of the surface of the dielectric layer where the metal thin layer pattern does not exist is very small, and therefore the margin width is also very small. Therefore, the portion of the surface of the dielectric layer where the metal thin layer pattern does not exist is in a state where the surface of the dielectric layer is exposed. When forming the next dielectric layer after forming the metal thin layer pattern, the next dielectric layer is laminated on the metal thin layer pattern and the exposed dielectric layer.
[0012]
In the present invention, the formation state of the thin metal layer pattern is optically observed, but this observation is performed in a non-contact state. Such optical observation is performed by irradiating light on the surface of a laminated body in a manufacturing process (including a laminated state, that is, an intermediate part) to optically observe the surface of the laminated body, It is preferable to measure by measuring the reflected light from the surface. Specifically, the observation is performed by measuring a difference in optical reflectance on the surface of the laminate or a color difference due to optical interference. For example, the surface of the laminate is observed using a camera capable of recognizing a difference in optical reflectance or a color difference due to optical interference, and data obtained by the observation is processed to obtain a difference in optical reflectance or It is possible to obtain a surface image of the laminate reflecting the color difference due to optical interference and determine whether the margin width is formed as prescribed.
[0013]
Thus, by optically observing the formation state of the metal thin layer pattern, it is confirmed whether or not the metal thin layer pattern is formed in a predetermined manner, and when the formation state is not within an allowable range, for example, The formation condition of the next thin metal layer pattern is changed and adjusted so that the next thin metal layer pattern is formed in a predetermined manner. In some cases, the production of the laminate is stopped. In other cases, if the current manufacturing conditions are left as they are based on observation of the formation state of the metal thin layer pattern, such tendency disappears when it is recognized that there is a tendency to deviate from the allowable range. Thus, the formation conditions of the next metal thin layer pattern may be changed. Of course, if it is determined that the formation is smooth, the production is continued as it is.
[0014]
Furthermore, the present invention provides a capacitor, particularly a chip capacitor, produced using the laminate produced by the method for producing a laminate as described above. The present invention provides a capacitor, particularly a chip capacitor, manufactured using the laminate manufactured using the laminate manufacturing apparatus as described above. Moreover, this invention provides the capacitor | condenser manufactured especially using the laminated body manufacturing apparatus as mentioned above using the laminated body manufacturing method as mentioned above, especially a chip capacitor.
[0015]
In the method or apparatus for manufacturing a laminate according to the present invention, the other features except the means for optically observing or observing the formation state of the metal thin layer pattern are as follows. And a substantially known method and apparatus for producing a laminate by laminating a dielectric layer and a thin metal layer pattern, wherein the dielectric layer is formed by polymerizing monomers. May be the same. In addition to the above-mentioned U.S. patent specifications, such a method and apparatus are disclosed in, for example, the Journal of Precision Engineering (Vol. 66, No. 8, 2000, pages 1181-1184), JP 2000-124061 A and JP 2000 2000. No. -195752 and the like, and this specification includes these disclosures as a part of the specification.
[0016]
In a particularly preferred embodiment of the method for producing a laminate of the present invention, a dielectric layer and a thin metal layer pattern are laminated around a rotary drum having a circular or polygonal section as a substrate. In this method, a dielectric layer is formed during one rotation of a rotating drum (for example, a can roller), the surface of the dielectric layer is treated as necessary, and a predetermined thin metal layer pattern (accordingly, therefore) A thin metal layer pattern is not formed on a portion of the dielectric layer. During the next rotation of the rotating drum, a new dielectric layer is formed on the thin metal layer pattern and the dielectric layer on which the thin metal layer pattern is not formed (ie, exposed), Thereafter, a predetermined thin metal layer pattern is formed on the new dielectric layer. In this manner, a laminate in which dielectric layers and metal thin layer patterns are alternately formed and a predetermined number of dielectric layers and metal thin layer patterns are overlaid is manufactured.
[0017]
In the manufacturing apparatus for a laminate according to a particularly preferred aspect of the present invention, a dielectric layer forming means having a rotary drum having a circular or polygonal cross section in a vacuum chamber and having a dielectric layer surface treatment means around the rotary drum. The thin metal layer pattern forming means having the thin metal layer pattern setting means is arranged, and the manufacturing apparatus of the present invention can optically observe the formation state of the thin metal layer pattern (also referred to as “optical observation means”). Further).
[0018]
In a particularly preferred embodiment, the optical observation means is disposed between the metal thin layer pattern forming means and the dielectric layer forming means. Using such an apparatus, a dielectric layer is formed by the dielectric layer forming means during one rotation of the rotating drum, and then the surface of the dielectric layer is treated by the dielectric layer surface treating means to obtain a metal. A predetermined thin metal layer pattern is formed on the surface-treated dielectric layer by using the thin layer pattern setting means and the thin metal layer pattern forming means (therefore, the thin metal layer is formed on a part of the dielectric layer. Not formed). In the same manner during the next rotation of the rotating drum, the dielectric layer and then the predetermined thin metal layer pattern are formed. In this way, the dielectric layers and the thin metal layer patterns are alternately formed, and a laminated body is manufactured by stacking a predetermined number of dielectric layers and thin metal layer patterns.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Below, the manufacturing method and manufacturing apparatus of the laminated body of this invention are demonstrated concretely taking the case of a multilayer film capacitor as an example.
FIG. 1 is a schematic view schematically showing one specific embodiment of a production apparatus for producing a laminate according to the present invention. The method of the present invention can be suitably carried out using this manufacturing apparatus.
[0020]
In the aspect illustrated in FIG. 1, the manufacturing apparatus 20 includes a can roller 1 that is disposed in a vacuum chamber 5 and functions as a rotating drum having a circular cross section. The can roller 1 rotates around the central axis O in a direction indicated by an arrow in the drawing at a constant angular velocity or circumferential velocity. By alternately forming dielectric layers and metal thin layer patterns on the surface of such a can roller, a laminate in which these layers are laminated is formed.
[0021]
A metal vapor deposition source 4 that functions as a metal thin layer pattern forming means is disposed below the can roller 1, and the metal is evaporated from the metal vapor deposition source 4, so that the can roller 1 (or a dielectric layer of a laminated body being formed thereon) A process of forming a thin metal layer pattern by forming a thin metal layer pattern composed of a plurality of thin metal layers each of which functions as a metal electrode by vapor deposition on the surface is performed. When forming the metal thin layer pattern, the metal thin layer pattern is vapor-deposited only on a predetermined portion of the can roller 1 or the dielectric layer formed thereon, that is, the metal thin layer pattern is vapor-deposited with the predetermined metal thin layer pattern. Before vapor-depositing, patterning material is applied to portions other than the surface portion to be vapor-deposited, thereby setting a metal thin layer pattern. The metal thin layer forming means has means for setting a predetermined metal thin layer pattern by applying the patterning material in this way, and the metal thin layer patterning device 3 serves as a means for setting such a metal thin layer pattern. It is arranged upstream of the metal evaporation source 4 in the rotation direction of the roller 1.
[0022]
Further, the resin monomer evaporation source 2 and the monomer polymerization apparatus 8 are arranged in this order on the downstream side in the rotation direction of the can roller 1, and these function as dielectric layer forming means, thereby forming a metal thin film formed by vapor deposition. A resin layer functioning as the next dielectric layer is formed on the layer pattern (and on the exposed portion of the already formed dielectric layer where the thin metal layer pattern is not formed). A forming step is performed. In the laminated body manufacturing apparatus, it is preferable that the dielectric forming unit 9 includes a dielectric processing unit 9 as a dielectric layer surface processing unit downstream of the monomer polymerization unit 8 in the rotation direction of the can roller 1 (formed). Depending on the dielectric layer and the metal thin layer pattern formed thereon, and this is used to treat the surface of the dielectric layer. Thereby, the surface state of the formed dielectric layer can be made suitable for metal deposition.
[0023]
Then, observation of the formation state of the thin metal layer pattern is performed between the step of forming the thin metal layer pattern and the step of forming the next dielectric layer. Specifically, the metal thin layer pattern is formed between the metal thin layer pattern forming unit and the dielectric layer forming unit downstream thereof, more specifically, between the metal evaporation source 4 and the resin monomer evaporation source 2. An apparatus (optical observation means) 7 for optically observing the formation state of the metal thin layer pattern is optically observed by this. Optically observing the formation state of the thin metal layer pattern is the above-described sequence in the method for manufacturing a laminate (that is, a sequence in which the step of forming the thin metal layer pattern and the step of forming the dielectric layer are repeated). Although it may be carried out at any point, it is particularly preferred to carry out between the formation of the thin metal layer pattern and the formation of the dielectric layer.
[0024]
The various devices (2, 3, 4, 7, 8, and 9) described above are arranged so as to face the can roller 1 in the vacuum chamber 5, and are formed on the surface of the laminate that is being formed on the can roller 1. On the other hand, a predetermined treatment can be performed. In FIG. 1, the vacuum chamber 5 can be operated with a predetermined vacuum degree by a vacuum pump 6.
[0025]
The outer peripheral surface of the can roller 1 is finished in a smooth, preferably mirror-like shape, and is preferably cooled to -20 to 40 ° C, particularly preferably -10 to 10 ° C. The rotation speed of the can roller 1 can be freely set according to its diameter, but is usually about 15 to 70 rpm.
[0026]
The metal vapor deposition source 4 evaporates metal toward the surface of the can roller 1 (or a dielectric layer that has already been formed) and enables metal vapor deposition thereon. For example, a laminated body used for a capacitor is manufactured. When it does, the metal thin layer pattern comprised by the metal thin layer which functions as a metal electrode is formed. As the metal to be deposited, for example, at least one selected from Al, Cu, Zn, Sn, Au, Ag, and Pt is used. In the case of manufacturing a capacitor, it is particularly preferable to use Al. Instead of vapor deposition, the metal thin layer pattern may be formed by other means such as sputtering.
[0027]
The resin monomer evaporation source 2 evaporates the monomer toward the surface of the can roller 1 (or the exposed portion of the metal thin layer pattern and dielectric layer formed immediately before), and the monomer is liquefied thereon. And then polymerizing the monomer to form a dielectric layer. The resin monomer to be used is not particularly limited as long as the deposited monomer can be polymerized (or crosslinked or cured) to form a resin that can function as a dielectric layer. For example, acrylic resin and methacrylic acid resin are It can function as a dielectric layer. When manufacturing a capacitor, acrylic resin is particularly preferred.
[0028]
The deposited resin monomer is polymerized (or crosslinked or cured) by the monomer polymerization apparatus 8, reaches a desired polymerization degree (or crosslinking degree or curing degree), and forms a resin thin film, which functions as a dielectric layer. As the monomer polymerization apparatus, for example, an electron beam irradiation apparatus or an ultraviolet irradiation apparatus can be used according to the resin monomer to be used.
[0029]
In the illustrated embodiment, the formed resin thin film is subjected to surface treatment by the resin surface treatment apparatus 9, thereby improving the adhesion with a thin metal layer to be formed later. For example, oxygen plasma treatment, argon plasma treatment, or the like can be performed.
[0030]
The patterning material applying device 3 is for presetting a thin metal layer pattern to be formed by attaching (or applying) the patterning material to the surface of the dielectric layer in, for example, a combination of various strip-like forms. In the subsequent metal deposition, the metal thin layer pattern is not formed in the portion where the patterning material is adhered, and conversely, the metal thin layer pattern is formed in the portion where the patterning material is not adhered. A predetermined thin metal layer pattern is set. Thus, the portion where the thin metal layer pattern is not formed becomes an electrically insulating portion of the laminate, and in the case of a capacitor, a specific portion of such an electrically insulating portion becomes a margin width portion.
[0031]
As the patterning material, for example, oil (specifically, fluorine-based oil such as fomblin oil) can be used. The patterning material applying means is preferably a system in which the vaporized patterning material is sprayed from the nozzle toward the can roller 1 to be liquefied on the surface of the dielectric layer. When this method is used, the setting condition of the metal thin layer pattern can be adjusted by appropriately changing the temperature of the oil sprayed from the nozzle and / or the distance between the nozzle and the surface of the laminated body as necessary.
[0032]
The optical observation means 7 functioning as means for optically observing the formation state of the metal thin layer pattern is preferably provided with a metal thin layer pattern from the metal vapor deposition source 4 to the surface of the can roller 1 after the patterning material is applied. The formation state of the surface of the laminate immediately after the formation is optically observed without contact. That is, measurement is performed using an optical system that irradiates light on the surface of the laminate being manufactured and measures reflected light from the surface of the laminate. Such optical observation means is, for example, a metal electrode pattern state measuring device (a metal electrode pattern state measuring device in an example described later) in the case of manufacturing a capacitor laminate.
[0033]
The observation of the formation state means, for example, observing and recognizing whether or not the formed thin metal layer pattern is formed in a predetermined position at a predetermined position. More specifically, the appearance of the formed thin metal layer pattern (or the thin metal layer constituting it) (for example, whether the edge of the thin metal layer is not straight or there is no missing portion) and The position of the formed thin metal layer pattern (or the thin metal layer constituting it) (whether it is formed on a predetermined outer peripheral portion of the can roller or at a predetermined position in the axial direction of the can roller) Etc.), and thus the shape of the thin metal layer pattern (or the thin metal layer constituting it) is measured.
[0034]
In the present invention, since the shape of the metal thin layer pattern (or the metal thin layer constituting the metal thin layer pattern) is measured, an interval between adjacent metal thin layers, for example, a margin width can be measured. Regarding the formation position of the metal thin layer pattern (or the metal thin layer constituting the metal thin layer pattern), for example, the absolute formation position can be grasped by synchronizing the rotation of the can roller and the photographing timing of the camera.
[0035]
The present invention is based on the fact that the optical properties of the thin metal layer and the dielectric layer are different from each other, and in carrying out the present invention, it is confirmed in advance how these have specific optical properties. deep. Then, when observing the surface of the laminate that is being manufactured with respect to such optical properties, the metal thin layer pattern (or the metal thin layer pattern) The optical properties peculiar to the metal thin layer are observed, and conversely, the metal thin layer pattern (or the metal thin layer constituting the metal thin layer) is actually formed. If not formed, optical characteristics different from those of the thin metal layer are observed, that is, optical characteristics peculiar to the dielectric layer are observed. Therefore, by observing the optical properties of the surface, it can be determined whether a thin metal layer or a dielectric layer is present. As such optical properties, the light reflectance of the layer surface, the light interference property of the layer (for example, the hue of the layer), and the like can be suitably used.
[0036]
The unique optical properties as described above can be used not only for the difference between a thin metal layer and a dielectric layer, but also for determining the so-called properties of whether each layer is properly formed. For example, when there is a defect (for example, a non-existing portion) in a part of the thin metal layer pattern, or when a part of the dielectric layer contains impurities such as bubbles, it is necessary to investigate in advance how the optical characteristics are unique. If such characteristics are observed, the suitability of the layer formation can be determined. Therefore, in the present invention, a layer (dielectric material) formed during the manufacturing process of the laminate is formed by optically observing the formation state of the metal thin film pattern or by means for optically observing the formation state of the metal thin film pattern. The properties of the layer and / or the metal thin layer) can be observed in addition to or instead of the formation state of the metal thin film pattern.
[0037]
Since it is necessary to form the metal thin layer pattern with very high accuracy, the optical system to be used is generally observed at a magnification of at least about 5 times, for example, 10 times or more in terms of accuracy. In general, for example, an objective lens of 2 to 10 times is used. Since the can roller 1 is always rotating and the field of view is narrow, the image easily flows at high speed. Therefore, in order to accurately observe the patterning shape and / or the properties of each layer, it is preferable to use a high-speed camera that can be observed (that is, capable of imaging) at a shutter speed of 1 / 10,000 to 1,000,000 seconds. Further, the light source for irradiating light is preferably a color rendering property, and a light source having high illuminance, for example, a metal halide lamp is preferable.
[0038]
The positional relationship between the light source and the camera functioning as a sensor is set so that light can be emitted from the light source to the laminated body and reflected light from the laminated body can be received. In order to increase the amount of received light as much as possible, light is irradiated substantially perpendicularly to the laminate (ie, at an incident angle of 0 °, and thus in the normal direction of the can roller 1), It is preferable to capture light that is returning substantially perpendicular to it (and hence from the center of the can roller 1). In another aspect, the stack is illuminated obliquely (ie, at an incident angle greater than 0 ° (eg, 60 ° -80 °)) and obliquely from the stack, preferably with a similarly large reflection angle. A configuration that captures the returning light is also possible.
[0039]
When the dielectric layer is a transparent body, the optical system causes light to enter the surface of the laminate formed on the can roller 1 in the normal direction using a half mirror from a light source (that is, using the half mirror). It is preferable that the reflected light or interference light on the surface be captured by a camera arranged in the normal direction. Note that it is also possible to directly irradiate the surface of the laminated body and capture reflected light or interference light via a half mirror. When the dielectric layer is transparent or translucent, a part of the irradiated light is reflected on the surface of the outermost dielectric layer, and the light transmitted through the dielectric layer is directly below the dielectric layer. If a thin metal layer pattern is located, or if there is a dielectric layer formed during the previous rotation by the surface of the thin metal layer pattern or directly below the outermost dielectric layer, the outermost dielectric layer and Reflected at the interface with the underlying dielectric layer, these reflected lights interfere with each other. Therefore, when the surface of the laminate is observed, an interference color is recognized in the dielectric layer portion, and when the thin metal layer pattern is exposed, all the irradiated light is reflected, so that the interference color is recognized. That is, the interference characteristics are different.
[0040]
Therefore, when the outermost surface of the laminate is irradiated with light and the interference light from the outermost surface is observed, an interference color is observed in the exposed portion of the dielectric layer on the outermost surface of the laminate, and the metal The interference color is not observed in the portion where the thin layer pattern is exposed. That is, interference occurs in the portion where the dielectric layer is exposed, and interference does not occur in the portion where the thin metal layer pattern is exposed (or in the portion where the dielectric layer is exposed, the hue of the thin metal layer pattern is exposed due to interference). Therefore, when the outermost surface of the laminate is observed with a camera, the color contrast can be recognized as an image with high sensitivity by the presence or absence of interference colors, so the thin metal layer pattern (or dielectric layer) on the outermost surface of the laminate ) And its position can be detected.
[0041]
Moreover, when the light reflectance is measured by irradiating light on the outermost surface of the laminate and measuring the amount of light reflected from the outermost surface, the dielectric layer is exposed on the outermost surface of the laminate. The reflectance is small in the portion where the metal thin layer pattern is exposed, and the reflectance is large in the portion where the metal thin layer pattern is exposed. That is, when the reflectance is measured by observing the outermost surface of the laminate with a camera, the presence and position of the metal thin layer pattern (or dielectric layer) on the outermost surface of the laminate are detected according to the magnitude of the reflectance. it can.
[0042]
When the dielectric is an opaque body, the optical system is configured so that light is incident on the surface of the can roller 1 from the light source at a large incident angle and the reflected light scattered from the surface of the laminate is captured by the camera. Is preferred. The surface reflectance is high at the portion where the thin metal layer pattern is exposed on the outermost surface of the laminate, and the surface reflectance is low at the other portion (ie, the portion where the dielectric layer is exposed). Since the characteristics are different, the portion where the metal thin layer pattern is formed can be recognized as an image with high sensitivity.
[0043]
In any of the above-described aspects, the optical characteristics such as the interference color and reflectance of the surface of the laminate being manufactured are measured by a camera capable of high-speed imaging, and the results are image-processed to obtain metal. It is possible to efficiently confirm whether or not the shape of the thin layer pattern and / or the properties of each layer are predetermined, and the formation of the next metal thin layer pattern can be adjusted according to the result. As a result, for example, when manufacturing a capacitor, the margin width between metal electrodes can be measured with high accuracy and adjusted as necessary.
[0044]
Therefore, the dielectric layer and the metal thin layer pattern (however, the metal thin layer pattern is not necessarily formed over the entire circumference of the can roller on the outer peripheral surface of the can roller 1. Alternating with a plurality of thin metal layers in a generally strip or rectangular form (and thus extending along a portion of the circumference of the can roller) that extends at least partially along the axial direction of A laminated body in which a predetermined number of thin metal layer patterns are sandwiched between a predetermined number of dielectric layers (however, the outermost layer may be a dielectric layer depending on the purpose, even if a thin metal layer pattern May be formed).
[0045]
The number of layers of the laminated body can be appropriately selected according to the purpose, but is generally about 1 to 10,000 layers (the number of dielectric layers). When used for manufacturing a chip capacitor, 1000 to 10,000 layers (dielectrics) Number of body layers), particularly about 2000 to 5000 layers (number of dielectric layers). This laminated body is cylindrical as a whole. This is divided in the radial direction (for example, divided into 8 portions every 45 °), removed from the can roller, and heated and pressed, respectively, to obtain a flat plate-like laminated body element such as a capacitor mother element. Then, the laminated body manufactured from the laminated body of this invention is obtained by cut | disconnecting this mother element to a predetermined dimension. This multilayer element can be used as a chip capacitor, for example.
[0046]
FIG. 2 is a schematic view schematically showing another aspect of the laminate manufacturing apparatus of the present invention described with reference to FIG. 2 differs from FIG. 1 in that a metal thin layer pattern state measuring device 7 functioning as a means for optically observing the formation state of the metal thin layer pattern is connected to the measurement data processing device 10 and patterning is performed. The material application device 3 is connected to a control device 11 for adjusting the pattern setting conditions. The measurement data processing device 10 takes in observation data of the formation state of the metal thin layer pattern from the metal thin layer pattern state measurement device 7, obtains, for example, a tendency to change with time, and the like, and according to the processing result The patterning material application condition of the patterning material application apparatus 3, and therefore the pattern setting condition can be automatically changed. That is, a system for feeding back the data of the measurement data processing apparatus 10 to the control means 11 of the patterning material applying apparatus 3 is configured. This control means controls the temperature of the oil of the patterning material application device 3 and / or the distance between the nozzle and its injection target, thereby adjusting the setting conditions of the thin metal layer pattern to be formed.
[0047]
For example, when oil is used as a patterning imparting material, oil vapor is sprayed from the nozzle onto the surface of the dielectric layer, but depending on the distance from the dielectric layer surface to the nozzle or the amount of oil sprayed according to the spray strength distribution of the oil By changing the oil temperature, the patterning width (and hence the margin width) can be controlled. As a result, if the metal deposition source changes over time in the same production lot, or changes occur in the equipment state before and after maintenance between different production lots, the thin metal layer pattern that forms the thin metal layer pattern in-process It is possible to control the application condition of the patterning material by evaluating the interval, for example, the margin width.
[0048]
According to the above-described apparatus and method of the present invention, when a predetermined metal thin layer pattern is formed on a dielectric layer, the accuracy is improved. Therefore, when an element such as a capacitor is manufactured using the laminate of the present invention, there is little variation in electric capacity, and a downsized / high capacity capacitor can be manufactured more efficiently.
[0049]
【Example】
(Example 1)
Based on the production method of the present invention, a laminate was produced using the apparatus shown in FIG. The inside of the vacuum chamber 5 is 2 × 10 ^-2 The pressure was set to Pa or less, and the outer surface of the can roller 1 was maintained at 5 ° C. Dicyclopentadiene dimethanol diacrylate was used as a resin monomer for forming the dielectric layer, which was vaporized and deposited on the outer peripheral surface of the can roller 1 from the monomer evaporation source 2. In addition, an electron beam curing device was used as the monomer polymerization device 8, and the deposited resin monomer material was polymerized and cured to form a dielectric layer. The thickness of the formed dielectric layer was 0.3 to 0.4 μm.
[0050]
Thereafter, the surface of the dielectric layer surface treatment apparatus 9 was subjected to oxygen plasma treatment. Next, the patterning material was applied to the dielectric layer portion constituting the portion corresponding to the electrical insulator by the patterning material applying device 3. A fluorine-based oil was used as a patterning material, which was vaporized and ejected from a nozzle (diameter 75 μm), and was deposited on the dielectric layer in a band shape with a width of 100 to 350 μm.
[0051]
Next, aluminum was vapor-deposited from the metal evaporation source 4. The deposition thickness was 25 nm, and the target film resistance was 7Ω / □. After vapor deposition, the metal electrode pattern state measuring device 7 (objective lens x 5 times, shutter speed 1 / 100,000 second, light source 250W metal halide lamp) recognizes the color difference due to light interference, thereby making the margin between the electrodes. The width is measured with an accuracy of ± 10 μm or less, the margin width is measured by the metal electrode pattern state measuring device 7 so that the margin width falls within the standard value of 150 to 300 μm, and the margin width deviates from the standard value based on the result. In the case where it is predicted, the patterning material applying apparatus was adjusted so as not to deviate, and it was manufactured manually and managed empirically so as to prevent the deviation.
[0052]
The above operation was repeated about 4000 times with the rotation of the can roller 1 to form a laminate of about 1.3 mm.
Next, the obtained cylindrical laminate was divided into 20 parts in the radial direction, removed, and pressed by heating to obtain a flat laminate mother element. This was cut and a chip capacitor was obtained by passing through a process performed by a conventional film capacitor.
[0053]
Regarding the obtained chip capacitor, in the case of a chip capacitor having a margin width between electrodes of 150 μm or less, the insulation resistance value between the metal electrodes was lowered, and defects in the electric inspection process were likely to occur. Since the opposing electrode area becomes large, it is easy to generate an electric capacity that exceeds the standard value of the capacity. In the case of a chip capacitor having a margin width of 300 μm or more, the opposing electrode area is conversely reduced. Therefore, it is easy to generate an electric capacity that is less than the standard value of the capacity, and moreover, it becomes easy to cut the margin part other than the metal electrode part in the cutting process of the multilayer base element, and thus it is easy to cause a defect when forming the terminal electrode. It was.
[0054]
Next, the chip capacitor manufactured by measuring the margin width between the electrodes with the metal electrode pattern state measurement device 7 and managing it in the same manner as described above so as to fall within the standard value of 150 to 300 μm has a thickness of about 1. It was 4 mm, depth 1.6 mm, width (direction between both external electrodes) 3.2 mm, and the capacity was 0.47 μF despite being small. The capacity variation could be reduced by about half compared to when the margin width measuring device was not used (that is, when the manufacturing conditions were set in advance and the manufacturing was terminated under the same conditions). The withstand voltage was 50V. Furthermore, when the laminate was disassembled and the electrical resistance of the deposited film was measured by the 4-terminal method, it was 7 ± 3Ω / □, and when the insulation resistance was measured, 1 × 10 ¹¹ It was over Ω and sufficient electrical insulation as a capacitor was obtained.
[0055]
(Example 2)
A laminate was manufactured in the same manner as in Example 1. However, by using the manufacturing apparatus shown in FIG. 2 to recognize the color difference due to the light interference, the margin width between the electrodes is measured with an accuracy of ± 10 μm or less by image recognition, and within the same production lot. Gather data on the degree of change in margin width due to adjustment of oil temperature and nozzle position (including whether or not it is outside the allowable range), and the degree of change in margin width due to disturbance other than oil concentration and nozzle position between lots, This is subjected to arithmetic processing by the measurement data processing device 10 to obtain information in advance. Based on the information thus obtained in advance, the color difference due to light interference observed in the subsequent manufacturing process of the laminated body is evaluated by the image observation data in the control device 10 of the patterning material application device ( That is, it is determined whether the pattern shape state is within the allowable range or if it is left out of the allowable range), and the result is fed back to the patterning material applying device 3 via the control device 11, The application condition of the patterning material was automatically changed.
[0056]
At this time, the distance from the dielectric layer surface to the nozzle tip is 150 ± 100 μm, the temperature of the oil part is changed in the range of 155 to 170 ° C., and the patterning width is controlled, the margin width between the thin metal layers is stabilized. 180 to 270 μm. Further, even when the metal vapor deposition source 4 fluctuates and the thickness of the vapor deposition film fluctuates, a margin width of 180 to 270 μm can be formed similarly.
[0057]
The above operation was repeated about 4000 times by rotating the can roller 1 to form a laminate of about 1.3 mm.
Next, the obtained cylindrical laminate was divided into 20 parts in the radial direction, removed, and pressed by heating to obtain a flat laminate mother element. This was cut and a chip capacitor was obtained by passing through a process performed by a conventional film capacitor.
[0058]
The obtained chip capacitor had a thickness in the stacking direction of about 1.4 mm, a depth of 1.6 mm, a width (direction between both external electrodes) of 3.2 mm, and a small capacitance of 0.47 μF. Capacitance variation was able to produce a capacitor that stably fell within the standard variation range even when the element shape was small, or when maintenance or lot-to-lot variation factors occurred. The withstand voltage was 50V. Furthermore, when the laminate was disassembled and the electrical resistance of the deposited film was measured by the 4-terminal method, it was 7 ± 3Ω / □, and when the insulation resistance was measured, 1 × 10 ¹¹ It was over Ω and sufficient electrical insulation as a capacitor was obtained.
[Brief description of the drawings]
FIG. 1 is a schematic view of a manufacturing apparatus according to a first embodiment of the present invention.
FIG. 2 is a schematic view of a manufacturing apparatus according to a second embodiment of the present invention.
[Explanation of symbols]
1 can roller, 2 resin monomer evaporation source, 3 patterning material applying device,
4 Metal deposition source, 5 Vacuum container, 6 Vacuum pump,
7 Metal thin layer pattern state measuring device, 8 Resin monomer polymerization device,
9 Dielectric layer surface treatment device, 10 Measurement data processing device,
11 Control device for patterning material application device, 20 Laminate manufacturing device.

Claims (8)

In a vacuum atmosphere, a laminated body is manufactured by laminating a dielectric layer and a thin metal layer pattern including a step of forming a dielectric layer and a step of forming a thin metal layer pattern on the formed dielectric layer. In the method
Optically observe the formed metal thin layer pattern and dielectric layer, measure the margin width or the shape of the formed metal thin layer pattern, and check the metal thin layer pattern and dielectric layer defects previously examined A method for producing a laminate , characterized by determining properties of the formed thin metal layer pattern and the dielectric layer using optical characteristics peculiar to the part, and determining whether or not the layer is formed .   2. The laminate according to claim 1, wherein the formation state of the thin metal layer pattern is observed by measuring a color due to optical reflectance or optical interference on a surface of the laminate in the manufacturing process. Manufacturing method.   3. The laminate according to claim 1, wherein the observation of the formation state of the thin metal layer pattern is performed between the step of forming the thin metal layer pattern and the step of forming the next dielectric layer. Manufacturing method.   The step of forming the metal thin layer pattern includes spraying and applying oil from a nozzle toward a portion of the dielectric layer where the metal thin layer pattern is not formed, before forming the metal thin layer pattern. The manufacturing method of the laminated body in any one of Claims 1-3 to do.   The measurement result of the margin width of the thin metal layer pattern obtained by observing the formation state of the thin metal layer pattern is fed back to the process of forming the thin metal layer pattern, and the formation conditions of the thin metal layer pattern are adjusted. The manufacturing method of the laminated body of Claim 1.   5. The method for producing a laminate according to claim 4, wherein the formation conditions of the metal thin layer pattern are adjusted by controlling the temperature and / or nozzle position of oil ejected from the nozzle.   The method for manufacturing a multilayer body according to claim 1, wherein the multilayer body is a capacitor mother element of a chip capacitor, and the thin metal layer pattern is an electrode of the chip capacitor.   A chip capacitor manufactured by dividing the capacitor mother element according to claim 7.

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