JP4702370B2 - Circuit module manufacturing method - Google Patents

Circuit module manufacturing method Download PDF

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JP4702370B2
JP4702370B2 JP2007542274A JP2007542274A JP4702370B2 JP 4702370 B2 JP4702370 B2 JP 4702370B2 JP 2007542274 A JP2007542274 A JP 2007542274A JP 2007542274 A JP2007542274 A JP 2007542274A JP 4702370 B2 JP4702370 B2 JP 4702370B2
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resin material
resin
wiring board
board
terminal board
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JPWO2007049417A1 (en
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伸明 小川
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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  • Engineering & Computer Science (AREA)
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Description

本発明は、平板状の配線基板と枠状の端子板とを接合した回路モジュールの製造方法およびその製造方法により製造された回路モジュールに関するものである。   The present invention relates to a circuit module manufacturing method in which a flat wiring board and a frame-shaped terminal plate are joined, and a circuit module manufactured by the manufacturing method.

従来、実装密度を高めて小型化できる回路モジュールとして、特許文献１〜４に記載のものがある。この回路モジュールは、平板状の配線基板の表面に複数の接続電極を形成するとともに、枠状の端子板の表面に前記複数の接続電極に対応する複数の接続電極を形成し、配線基板の表面に端子板の表面を対向させて、配線基板の接続電極と端子板の接続電極とをはんだなどの接合材を用いて接合したものである。端子板の内側の配線基板の表面には、半導体素子のような回路部品が搭載され、この回路部品を覆うように、端子板の内側面と配線基板の表面とで構成されるキャビティに樹脂が充填される。   Conventionally, there are those described in Patent Documents 1 to 4 as circuit modules that can be downsized by increasing the mounting density. In this circuit module, a plurality of connection electrodes are formed on the surface of the flat wiring board, and a plurality of connection electrodes corresponding to the plurality of connection electrodes are formed on the surface of the frame-shaped terminal board. The connection electrode of the wiring board and the connection electrode of the terminal board are joined using a joining material such as solder, with the surface of the terminal board facing each other. A circuit component such as a semiconductor element is mounted on the surface of the wiring board inside the terminal board, and resin is placed in a cavity formed by the inner surface of the terminal board and the surface of the wiring board so as to cover the circuit component. Filled.

キャビティに樹脂を充填するのは、配線基板上に搭載された回路部品の保護（回路部品がワイヤボンディングで配線基板に接続される場合には、ワイヤーよれによる短絡防止、ベアチップやフリップチップの場合には微細端子間への異物混入による短絡等の防止）と機械的強度向上とを目的としている。そのため、樹脂に求められる特性は、ワイヤや微細端子間の隙間に入り込む流動性や、基板との良好な密着性などが不可欠である。よって、樹脂は塗布時の粘度が低く、基板にぬれ広がり易いことが好ましい。   Fill the cavity with resin to protect the circuit components mounted on the wiring board (when the circuit components are connected to the wiring board by wire bonding, to prevent short circuit due to wire twisting, in the case of bare chip or flip chip The purpose of this is to prevent short circuiting or the like due to foreign matter mixing between fine terminals) and to improve mechanical strength. For this reason, the properties required for the resin are indispensable for the fluidity to enter the gaps between the wires and the fine terminals and the good adhesion to the substrate. Therefore, it is preferable that the resin has a low viscosity at the time of application and easily wets and spreads on the substrate.

ところが、前記のように配線基板の接続電極と端子板の接続電極とをはんだなどの導電性接合材を用いて接合した場合、隣合う接合材間には必ず隙間が発生するので、粘度の低い樹脂はこの隙間を通り抜けてしまう。隙間を通り抜けた樹脂は、以下のような問題を引き起こす。すなわち、配線基板が子基板状態のときに樹脂を塗布する場合には、樹脂が基板の外周からはみ出し、そのはみ出しによる寸法不良や外観不良、外形寸法バラツキの増大による品質低下を引き起こす。さらに、基板の裏面側へ樹脂が回り込むことで、表面実装用の端子電極を覆ってしまい、配線基板を別の実装基板に実装する際に接続不良を引き起こす可能性がある。また、配線基板が集合基板状態のときに樹脂を塗布する場合には、集合基板を子基板に分割（ブレイク）するためのブレイク溝を、外周へはみ出た樹脂が埋めてしまうことがある。そのため、ブレイク強度が上がってしまい、ブレイク不良による生産性の低下を引き起こす。
特開平６−２１６３１４号公報 特開平７−５０３５７号公報 特開２０００−１０１３４８号公報 特開２００１−３３９１３７号公報 However, when the connection electrode of the wiring board and the connection electrode of the terminal board are bonded using a conductive bonding material such as solder as described above, a gap is always generated between the adjacent bonding materials, so the viscosity is low. The resin passes through this gap. Resin passing through the gap causes the following problems. That is, when the resin is applied when the wiring board is in the sub-board state, the resin protrudes from the outer periphery of the substrate, causing a dimensional defect or an appearance defect due to the protrusion, and a deterioration in quality due to an increase in external dimension variation. Further, the resin wraps around the back side of the substrate, thereby covering the surface mounting terminal electrodes, which may cause a connection failure when the wiring substrate is mounted on another mounting substrate. Further, when the resin is applied when the wiring board is in the collective board state, the resin that protrudes to the outer periphery may be buried in the break groove for dividing (breaking) the collective board into the sub-boards. Therefore, the break strength is increased, and the productivity is lowered due to the break failure.
JP-A-6-216314 Japanese Patent Laid-Open No. 7-50357 JP 2000-101348 A JP 2001-339137 A

そこで、本発明の好ましい実施形態の目的は、配線基板と端子板とで構成されるキャビティに樹脂を充填する場合に、樹脂が外部へ流れ出すのを防止できる回路モジュールの製造方法を提供することにある。   Accordingly, an object of a preferred embodiment of the present invention is to provide a circuit module manufacturing method capable of preventing the resin from flowing out when the resin formed in the cavity constituted by the wiring board and the terminal plate is filled. is there.

前記目的を達成するため、本発明の好ましい実施形態に係る回路モジュールの製造方法は、表面に配置された複数の接続電極を有する平板状の配線基板と、前記複数の接続電極に対応する複数の接続電極を有する枠状の端子板とを準備する工程と、前記配線基板の複数の接続電極と前記端子板の複数の接続電極とをそれぞれ個別に導電性接合材を介して接合する工程と、前記端子板の内側面と前記配線基板の表面とで構成されるキャビティ内に、回路部品を搭載する工程と、前記端子板の内側面と前記配線基板の表面との間に、両者の隙間を埋める第１の樹脂材料を塗布する工程と、前記第１の樹脂材料を塗布した後、前記回路部品を覆うように、第２の樹脂材料を前記キャビティに充填する工程と、を有し、前記第１の樹脂材料は、前記第２の樹脂材料に比べて、硬化前における同一温度・同一雰囲気下での粘度が高く、かつ前記導電性接合材間の隙間を通って外部へ流れ出すのを防止できる程度の粘度を有し、前記第１の樹脂材料を、前記導電性接合材間の隙間を満たし、かつ前記導電性接合材の周面の一部が外部に開放された位置で終端となるように塗布することを特徴とするものである。 In order to achieve the above object, a method of manufacturing a circuit module according to a preferred embodiment of the present invention includes a flat wiring board having a plurality of connection electrodes arranged on a surface, and a plurality of connection electrodes corresponding to the plurality of connection electrodes. A step of preparing a frame-shaped terminal plate having a connection electrode, a step of individually bonding a plurality of connection electrodes of the wiring board and a plurality of connection electrodes of the terminal plate via a conductive bonding material, A step of mounting circuit components in a cavity constituted by the inner surface of the terminal board and the surface of the wiring board, and a gap between the inner surface of the terminal board and the surface of the wiring board, A step of applying a first resin material to be filled; and a step of filling the cavity with a second resin material so as to cover the circuit component after the first resin material is applied , The first resin material is the first resin material. Compared to the resin material, the viscosity at the same temperature and in the same atmosphere before curing is high, and the viscosity is such that it can be prevented from flowing out through the gap between the conductive bonding materials. A resin material is applied so that a gap between the conductive bonding materials is filled and a part of a peripheral surface of the conductive bonding material is terminated at a position opened to the outside. It is.

本発明では、まず平板状の配線基板と枠状の端子板とを準備する。配線基板の表面には複数の接続電極が設けられ、端子板には配線基板の接続電極に対応する複数の接続電極が形成されている。これら対応する接続電極同士を半田や導電性接着剤などの導電性接合材で接合する。接合によって、隣合う導電性接合材間には隙間が形成される。次に、端子板より内側の配線基板の表面に、回路部品を搭載する。なお、回路部品の搭載は、配線基板に端子板を接合する前、後、さらには同時でもよい。回路部品は、配線基板に対して半田などを用いて表面実装してもよいし、フェースアップで搭載した後、ワイヤーボンディングしてもよく、あるいはバンプを用いてフェースダウン実装してもよい。次に、端子板の内側面と配線基板の表面とで構成されるキャビティに封止用樹脂（第２の樹脂材料）を充填するのであるが、封止用樹脂の充填の前に、端子板の内側面と配線基板の表面との間に、両者の隙間を埋める第１の樹脂材料を環状に塗布する。第１の樹脂材料は、封止用樹脂を充填した時、封止用樹脂がその流動性によって接合材間の隙間を通って外部へ流れ出るのを防止するためのシーリング材としての役割を持つものである。第１の樹脂材料は少なくとも端子板と配線基板との隙間を埋めるものであればよく、必ずしも接合材間の隙間に入り込む必要はない。なお、第１の樹脂材料の塗布は、回路部品を搭載する後であることが好ましいが、回路部品を搭載する前でもよい。第１の樹脂材料によって端子板と配線基板との隙間を埋めた後、キャビティに封止用樹脂である第２の樹脂材料を充填する。第２の樹脂材料はレベリング性のよい任意の材料を用いることができるので、充填後の樹脂表面を平坦にすることができ、回路部品の周囲にも容易に回り込むことができ、しかも充填時間を短縮できる。端子板と配線基板との隙間が第１の樹脂材料によって埋められているので、第２の樹脂材料が接合材間の隙間を通って外部へ流れ出すのを確実に防止できる。   In the present invention, first, a flat wiring board and a frame-shaped terminal board are prepared. A plurality of connection electrodes are provided on the surface of the wiring board, and a plurality of connection electrodes corresponding to the connection electrodes of the wiring board are formed on the terminal board. These corresponding connection electrodes are joined together with a conductive bonding material such as solder or a conductive adhesive. By the bonding, a gap is formed between the adjacent conductive bonding materials. Next, circuit components are mounted on the surface of the wiring board inside the terminal board. The circuit components may be mounted before, after, and at the same time before joining the terminal board to the wiring board. The circuit component may be mounted on the surface of the wiring board using solder or the like, or may be wire-bonded after being mounted face-up, or may be mounted face-down using bumps. Next, the sealing resin (second resin material) is filled into the cavity formed by the inner surface of the terminal board and the surface of the wiring board. Before filling the sealing resin, the terminal board A first resin material that fills the gap between the inner side surface and the surface of the wiring board is annularly applied. The first resin material has a role as a sealing material for preventing the sealing resin from flowing out through the gap between the bonding materials due to its fluidity when the sealing resin is filled. It is. The first resin material only needs to fill at least the gap between the terminal board and the wiring board, and does not necessarily enter the gap between the bonding materials. The application of the first resin material is preferably after the circuit component is mounted, but may be performed before the circuit component is mounted. After filling the gap between the terminal board and the wiring board with the first resin material, the cavity is filled with a second resin material that is a sealing resin. As the second resin material, any material having a good leveling property can be used, so that the resin surface after filling can be flattened, can easily go around the circuit component, and the filling time can be reduced. Can be shortened. Since the gap between the terminal board and the wiring board is filled with the first resin material, it is possible to reliably prevent the second resin material from flowing out through the gap between the bonding materials.

第１の樹脂材料と第２の樹脂材料とは異なる成分組成を有するものであることが望ましいが、異なる成分組成とは、異なる樹脂で構成される場合のほか、母材となる樹脂は同じで、添加物の量や種類が異なる場合も含む。配線基板の接続電極および端子板の接続電極は、枠状（４辺）に配置されたもののほか、２辺に配置されたものでもよく、さらには３辺に配置されたものでもよい。接続電極が４辺に配置されている場合には、第１の樹脂材料が接合材間の隙間を通って外部へ流出しないような粘度以上に設定すればよいが、２辺または３辺に接続電極が配置されている場合には、少なくとも１辺は接合材（接続電極）が設けられていないため、端子板と配線基板との間で流動が停止するように第１の樹脂材料の粘度を設定する必要がある。   Although it is desirable that the first resin material and the second resin material have different component compositions, the different component compositions are the same as the base material resin, in addition to the case where they are composed of different resins. This includes cases where the amount and type of additives are different. The connection electrode of the wiring board and the connection electrode of the terminal board may be arranged on two sides, in addition to those arranged in a frame shape (four sides), and may be arranged on three sides. When the connection electrodes are arranged on four sides, the first resin material may be set to have a viscosity or higher so as not to flow outside through the gap between the bonding materials, but connected to two or three sides. When the electrode is arranged, since at least one side is not provided with a bonding material (connection electrode), the viscosity of the first resin material is set so that the flow stops between the terminal board and the wiring board. Must be set.

第１の樹脂材料は、第２の樹脂材料に比べて、硬化前における同一温度・同一雰囲気下での粘度が高く、かつ導電性接合材間の隙間を通って外部へ流れ出すのを防止できる程度の粘度を有するのがよい。第１の樹脂材料の粘度が高いので、何らの追加的処理を行うことなく外部への流れ出しを防止できる。第１の樹脂材料の粘度が高いといっても、ある程度の流動性を有するため、端子板と配線基板との隙間を通り、導電性接合部材間の隙間に入り込む可能性があるが、第１の樹脂材料の表面張力により接合部材の間で流動を止めることができる程度がよい。ここで、高い粘度とは、配線基板と端子板の隙間に若干入りこむ程度であってもよいし、導電性接合材間の隙間に入り込む程度であってもよく、１００Ｐａ・ｓ以上、好ましくは２００Ｐａ・ｓ以上（２５℃、５ｒｐｍ）がよい。なお、硬化前の粘度が高い樹脂材料とは、常温時（塗布時）だけでなく、流動性のよくなる高温域においても、同様に粘度が高いことが必要である。   The first resin material has a higher viscosity at the same temperature and the same atmosphere before curing than the second resin material, and can prevent the first resin material from flowing out through the gap between the conductive bonding materials. It is good to have a viscosity of Since the first resin material has a high viscosity, it can be prevented from flowing out to the outside without any additional treatment. Even if the viscosity of the first resin material is high, the first resin material has a certain degree of fluidity, and thus may pass through the gap between the terminal board and the wiring board and enter the gap between the conductive bonding members. It is preferable that the flow can be stopped between the joining members by the surface tension of the resin material. Here, the high viscosity may be a level that slightly enters the gap between the wiring board and the terminal board, or may be a level that enters the gap between the conductive bonding materials, and is 100 Pa · s or more, preferably 200 Pa. -S or more (25 degreeC, 5 rpm) is good. The resin material having a high viscosity before curing needs to have a high viscosity not only at room temperature (at the time of application) but also in a high temperature range where fluidity is improved.

第２の樹脂材料として粘度の高い樹脂を使用すると、レベリング性が悪くなり、キャビティに充填した際に表面が塗布時の波うった形状を維持してしまい、平坦にならないことがある。また、粘度の高い樹脂は塗布時間が長くかかるという工法上の問題のほか、基板との密着性が悪く、安定した封止性が得られないこともある。したがって、第２の樹脂材料としては、粘度が低い（レベリング性のよい）樹脂材料を用いるのがよく、好ましくは１００Ｐａ・ｓ以下（２５℃、５ｒｐｍ）がよい。   When a resin having a high viscosity is used as the second resin material, the leveling property is deteriorated, and when the cavities are filled, the surface maintains a wavy shape at the time of application and may not be flat. Moreover, in addition to the problem in the construction method that a resin having a high viscosity takes a long coating time, the adhesiveness with the substrate is poor, and a stable sealing property may not be obtained. Therefore, as the second resin material, it is preferable to use a resin material having a low viscosity (good leveling property), and preferably 100 Pa · s or less (25 ° C., 5 rpm).

第１の樹脂材料を第２の樹脂材料より高い粘度とした場合に、第１の樹脂材料と第２の樹脂材料を共に熱硬化型樹脂材料とし、第１の樹脂材料と第２の樹脂材料とを同時に熱硬化させる工程をさらに有するのがよい。この場合には、第１の樹脂材料を塗布し、第２の樹脂材料を充填した後で、第１，第２の樹脂材料を同時に熱硬化させることができる。つまり、硬化処理は１回で済むので、処理工数を減らすことができ、回路部品などへの熱影響を少なくすることができる。   When the viscosity of the first resin material is higher than that of the second resin material, the first resin material and the second resin material are both thermosetting resin materials, and the first resin material and the second resin material are used. It is preferable to further include a step of thermally curing these. In this case, after the first resin material is applied and the second resin material is filled, the first and second resin materials can be thermally cured simultaneously. In other words, since the curing process only needs to be performed once, the number of processing steps can be reduced, and the thermal influence on the circuit components and the like can be reduced.

第１の樹脂材料と第２の樹脂材料を熱硬化型樹脂と無機フィラーとの混合樹脂組成物とし、第１の樹脂材料に含まれる無機フィラーの含有率を第２の樹脂材料に含まれる無機フィラーの含有率より高くしてもよい。この場合には、無機フィラーの含有率によって粘度を自由に調整することができる。なお、第１と第２の樹脂材料の母材となる熱硬化性樹脂を同系統とした場合には、同一温度で熱硬化させることができるとともに、硬化状態での両者の接合性がよく、剥離等の発生を防止できる。   The first resin material and the second resin material are mixed resin compositions of a thermosetting resin and an inorganic filler, and the content of the inorganic filler contained in the first resin material is inorganic contained in the second resin material. You may make it higher than the content rate of a filler. In this case, the viscosity can be freely adjusted by the content of the inorganic filler. In addition, when the thermosetting resin used as the base material of the first and second resin materials is the same system, the thermosetting resin can be thermoset at the same temperature, and the bonding property of both in the cured state is good. Generation | occurrence | production of peeling etc. can be prevented.

第１の樹脂材料として放射線硬化型または放射線硬化・熱硬化両用型樹脂材料を使用し、第２の樹脂材料として熱硬化型樹脂材料を使用し、第１の樹脂材料を塗布する工程と第２の樹脂材料を充填する工程との間に、第１の樹脂材料に放射線を照射して硬化させる工程を設けてもよい。第１の樹脂材料として放射線硬化型または放射線硬化・熱硬化両用型樹脂材料を使用した場合には、粘性の低い樹脂を使用しても、その流動を放射線を照射することで停止させることができるため、第１の樹脂材料が接合材間の隙間を通って外部へ流れ出てしまうのを防止できる。この場合には、塗布作業の時間を短縮でき、かつ基板との密着性もよい。放射線としては、紫外線、電子線、可視光線、赤外線、遠赤外線などあらゆる放射線を含む。特に、紫外線、電子線、可視光線は、短時間で樹脂の外表面を硬化させることができる点で望ましい。なお、第１の樹脂材料として放射線硬化型または放射線硬化・熱硬化両用型樹脂材料のいずれを使用してもよいが、第２の樹脂材料が熱硬化型の場合には、放射線硬化・熱硬化両用型樹脂材料が望ましい。   A step of applying a first resin material using a radiation curable resin or a radiation curable / thermosetting resin material as the first resin material, and using a thermosetting resin material as the second resin material; A step of irradiating the first resin material with radiation and curing it may be provided between the step of filling the resin material. When a radiation-curing type or radiation-curing / thermosetting resin material is used as the first resin material, the flow can be stopped by irradiating the radiation even if a low-viscosity resin is used. Therefore, it is possible to prevent the first resin material from flowing out through the gap between the bonding materials. In this case, the time for the coating operation can be shortened and the adhesion to the substrate is good. Examples of radiation include all types of radiation such as ultraviolet rays, electron beams, visible rays, infrared rays, and far infrared rays. In particular, ultraviolet rays, electron beams, and visible rays are desirable in that the outer surface of the resin can be cured in a short time. Either a radiation curable type or a radiation curable / thermosetting resin material may be used as the first resin material, but when the second resin material is a thermosetting type, radiation curable / thermosetting is used. A dual-use resin material is desirable.

第１の樹脂材料を、導電性接合材間の隙間を満たし、かつ導電性接合材の周面の少なくとも一部が外部に開放された位置で終端となるように塗布するのがよい。第１の樹脂材料を導電性接合材に到達する前で終端となるように塗布してもよいし、導電性接合材の周囲全周を取り巻く位置で終端となるように塗布してもよいが、後者の場合には、第１の樹脂材料が導電性接合材の周囲全周を取り巻いているため、前者に比べて接合材を補強する効果が高く、かつ接合材間の絶縁性を高めることができる。但し、接合材が半田の場合、半田がマザーボード等への実装時の熱で溶融・膨張すると、半田フラッシュ現象が発生する可能性がある。つまり、樹脂により完全に覆われた半田は、溶融・膨張により樹脂と基板との界面を引き剥がし、その僅かな隙間に溶融した半田が流れ込み、ショート不良を発生させる可能性がある。これに対し、第１の樹脂材料を、導電性接合材間の隙間を満たし、かつ導電性接合材の周面の一部が外部に開放された位置で終端となるように塗布した場合には、接合材の補強効果と絶縁性の向上効果の他に、溶融により膨張した半田を開放部から逃がすことができるので、半田フラッシュ現象を防止できる。   It is preferable to apply the first resin material so that the gap between the conductive bonding materials is filled, and at least a part of the peripheral surface of the conductive bonding material is terminated at a position open to the outside. The first resin material may be applied so as to be terminated before reaching the conductive bonding material, or may be applied so as to be terminated at a position surrounding the entire circumference of the conductive bonding material. In the latter case, since the first resin material surrounds the entire circumference of the conductive bonding material, the effect of reinforcing the bonding material is higher than that of the former, and the insulation between the bonding materials is improved. Can do. However, when the bonding material is solder, a solder flash phenomenon may occur if the solder melts and expands due to heat during mounting on a motherboard or the like. That is, the solder completely covered with the resin may peel off the interface between the resin and the substrate due to melting / expansion, and the molten solder may flow into a slight gap between them, which may cause a short circuit failure. On the other hand, when the first resin material is applied so that the gap between the conductive bonding materials is filled and a part of the peripheral surface of the conductive bonding material is terminated to the outside In addition to the effect of reinforcing the bonding material and the effect of improving the insulation, the solder expanded by melting can be released from the open portion, so that the solder flash phenomenon can be prevented.

第１の樹脂材料は、塗布後に流動しないようなチキソ性を有するものを使用してもよい。第１の樹脂材料がチキソ性を有する場合には、塗布後の形状を硬化するまで保持できるので、塗布管理が容易であり、第１の樹脂材料が接合材間の隙間を通って外部へ流れ出てしまうのを確実に防止できる。   The first resin material may have a thixotropy that does not flow after application. When the first resin material has thixotropy, the shape after application can be maintained until it is cured, so that application management is easy and the first resin material flows out through the gap between the bonding materials. Can be reliably prevented.

端子板の裏面に、端子板の厚み方向に延びる導電体を介して接続電極と電気的に接続された端子電極を形成してもよい。この場合には、端子板の端子電極を回路モジュールをマザーボードなどに実装する際の端子電極として用いることができる。端子板の厚み方向に延びる導電体としては、端子板の内部を貫通するビアホール導体であってもよいし、スルーホールでもよく、さらに端子板の外側面または内側面に形成されたパターン電極であってもよい。   You may form the terminal electrode electrically connected with the connection electrode through the conductor extended in the thickness direction of a terminal board on the back surface of a terminal board. In this case, the terminal electrode of the terminal plate can be used as a terminal electrode when the circuit module is mounted on a mother board or the like. The conductor extending in the thickness direction of the terminal plate may be a via-hole conductor penetrating the inside of the terminal plate or a through-hole, and may be a pattern electrode formed on the outer or inner surface of the terminal plate. May be.

配線基板の裏面に、配線基板の表面に搭載した回路部品とは別の回路部品を実装してもよい。このようにすれば、配線基板の両面に電子部品を搭載することができ、実装密度を高めることができる。   A circuit component different from the circuit component mounted on the front surface of the wiring board may be mounted on the back surface of the wiring board. If it does in this way, an electronic component can be mounted on both surfaces of a wiring board, and a mounting density can be raised.

配線基板は複数のセラミック層を積層してなるセラミック多層基板であり、端子板は樹脂基板であってもよい。配線基板としてセラミック多層基板を用いた場合、配線基板の内部に複雑な回路を構成できるので、回路密度を高めることができる。また、端子板として樹脂基板を用いると、この回路モジュールをマザーボードなどに実装したとき、マザーボードと配線基板との熱膨張差を樹脂基板が吸収できるため、望ましい。   The wiring board may be a ceramic multilayer board formed by laminating a plurality of ceramic layers, and the terminal board may be a resin board. When a ceramic multilayer substrate is used as the wiring substrate, a complicated circuit can be formed inside the wiring substrate, so that the circuit density can be increased. In addition, it is desirable to use a resin substrate as the terminal board because the resin substrate can absorb the thermal expansion difference between the motherboard and the wiring substrate when the circuit module is mounted on a motherboard or the like.

発明の好ましい実施形態の効果Effects of preferred embodiments of the invention

以上のように、本発明によれば、第１の樹脂材料によって端子板と配線基板との隙間を埋めた後、キャビティに第２の樹脂材料を充填するようにしたので、第２の樹脂材料としてレベリング性のよいものを使用でき、充填後の第２の樹脂材料の表面を平坦にすることができ、回路部品の周囲にも容易に回り込ませることができる。また、第２の樹脂材料が接合材間の隙間を通って外部へ流れ出すのを、第１の樹脂材料によって確実に阻止できるため、外観不良や外部との接続不良、ブレイク不良などの発生を防止できる。   As described above, according to the present invention, after filling the gap between the terminal board and the wiring board with the first resin material, the cavity is filled with the second resin material. A material having good leveling property can be used, and the surface of the second resin material after filling can be flattened and can be easily wrapped around the circuit component. In addition, the first resin material can reliably prevent the second resin material from flowing out through the gap between the bonding materials, thereby preventing the occurrence of poor appearance, poor external connection, breakage, etc. it can.

本発明にかかる回路モジュールの第１実施形態の断面図である。It is sectional drawing of 1st Embodiment of the circuit module concerning this invention. 図１に示す回路モジュールの底面図である。It is a bottom view of the circuit module shown in FIG. 図１のIII −III 線断面図である。It is the III-III sectional view taken on the line of FIG. 図１に示す回路モジュールの分解斜視図である。It is a disassembled perspective view of the circuit module shown in FIG. 図１に示す回路モジュールの製造方法の前半を示す工程図である。It is process drawing which shows the first half of the manufacturing method of the circuit module shown in FIG. 図１に示す回路モジュールの製造方法の後半を示す工程図である。FIG. 4 is a process diagram illustrating the second half of the method for manufacturing the circuit module illustrated in FIG. 1. 第１の樹脂材料の塗布方法の他の実施形態を示す図である。It is a figure which shows other embodiment of the coating method of the 1st resin material. 第１の樹脂材料の塗布方法のさらに他の実施形態を示す図である。It is a figure which shows other embodiment of the application | coating method of a 1st resin material. 端子板の変形例を示す斜視図である。It is a perspective view which shows the modification of a terminal board.

（第１実施形態）
図１〜図４は本発明にかかる回路モジュールの第１実施形態を示す。この回路モジュールＡは、平板状の配線基板１に枠状の端子板１０を接合した構造となっている。(First embodiment)
1 to 4 show a first embodiment of a circuit module according to the present invention. This circuit module A has a structure in which a frame-shaped terminal board 10 is joined to a flat wiring board 1.

配線基板１は、例えばＬＴＣＣ（Low-Temperature Co-firable Ceramic：低温焼結セラミック）などの複数のセラミック層を積層してなるセラミック多層基板であり、一主面には複数のランド電極２が形成され、その上に複数の回路部品３が接続されている。また、配線基板１の表層や内層には銀や銅を主とする電極パターンが設けられており、キャパシタやインダクタのような受動素子パターンや回路部品３と受動素子とを接続するための配線パターンを形成している。この例では、回路部品３はランド電極２にはんだ付けされた例えば積層型セラミックコンデンサ等の表面実装部品と、ランド電極２にバンプを介してフェースダウン実装された例えば半導体デバイス等の表面実装部品との組み合わせであるが、これに限るものではない。ランド電極２は、配線基板１の内部に設けられたビアホール導体４および内部配線５を介して他主面に形成された複数の接続電極６または複数のパッド電極７と接続されている。接続電極６は、図４に示すように配線基板１の外周部近傍に枠状に配置されている。パッド電極７は枠状に配置された接続電極６より内側の領域に形成されており、配線基板１の他主面に搭載された集積回路素子などの回路部品８とボンディングワイヤ９を介して接続されている。この例では、配線基板１の他主面に集積回路素子８を搭載したが、積層型セラミックコンデンサ等の表面実装部品や半導体デバイス等のフェースダウン実装部品などを搭載してもよい。なお、配線基板１は樹脂基板であってもよい。   The wiring board 1 is a ceramic multilayer board formed by laminating a plurality of ceramic layers such as LTCC (Low-Temperature Co-firable Ceramic), and a plurality of land electrodes 2 are formed on one main surface. A plurality of circuit components 3 are connected thereto. In addition, an electrode pattern mainly composed of silver or copper is provided on the surface layer or the inner layer of the wiring board 1, and a passive element pattern such as a capacitor or an inductor, or a wiring pattern for connecting the circuit component 3 and the passive element. Is forming. In this example, the circuit component 3 includes a surface mount component such as a multilayer ceramic capacitor that is soldered to the land electrode 2, and a surface mount component such as a semiconductor device that is mounted face down on the land electrode 2 via bumps. However, the present invention is not limited to this. The land electrode 2 is connected to a plurality of connection electrodes 6 or a plurality of pad electrodes 7 formed on the other main surface via via-hole conductors 4 and internal wirings 5 provided inside the wiring substrate 1. As shown in FIG. 4, the connection electrode 6 is arranged in a frame shape near the outer periphery of the wiring substrate 1. The pad electrode 7 is formed in a region inside the connection electrode 6 arranged in a frame shape, and is connected to a circuit component 8 such as an integrated circuit element mounted on the other main surface of the wiring substrate 1 via a bonding wire 9. Has been. In this example, the integrated circuit element 8 is mounted on the other main surface of the wiring board 1, but a surface-mounted component such as a multilayer ceramic capacitor, a face-down mounted component such as a semiconductor device, or the like may be mounted. The wiring board 1 may be a resin board.

端子板１０は枠状の樹脂基板よりなり、その外形寸法は配線基板１と同一あるいはやや小さく、端子板１０を配線基板１の他主面に導電性接合材２０を介して接合することによって、キャビティ１１が形成される。接合材２０を含む端子板１０の厚みは、配線基板１の他主面に搭載されたボンディングワイヤ９を含む回路部品８の高さより厚く設定されている。配線基板１の他主面と対向する端子板１０の一主面には、配線基板１の接続電極６と対向する複数の接続電極１２が枠状に配置されている。また、端子板１０の他主面には、接続電極１２と対応する複数の端子電極１３（図４参照）が形成されており、接続電極１２と端子電極１３とは、端子板１０を厚み方向に貫通するビアホール導体１４を介して相互に接続されている。端子電極１３は、この回路モジュールＡをマザーボード等の実装基板に実装する際、実装基板の電極と接続される。なお、端子板１０は枠状のセラミック板であってもよい。なお、層間接続導体が金属薄板を折り曲げ加工した薄板状導体であり、端子板１０がこの薄板状導体を樹脂でモールド成型してなるモールド樹脂性の端子板であることが特に好ましい。層間接続導体が金属薄板を折り曲げ加工したものであれば、端子板１０に応力が加わったとしても、層間接続導体が断線することなく、接続信頼性を確保できる。   The terminal board 10 is made of a frame-shaped resin substrate, and its outer dimensions are the same as or slightly smaller than the wiring board 1. By joining the terminal board 10 to the other main surface of the wiring board 1 via the conductive bonding material 20, A cavity 11 is formed. The thickness of the terminal board 10 including the bonding material 20 is set to be thicker than the height of the circuit component 8 including the bonding wires 9 mounted on the other main surface of the wiring board 1. On one main surface of the terminal board 10 facing the other main surface of the wiring substrate 1, a plurality of connection electrodes 12 facing the connection electrodes 6 of the wiring substrate 1 are arranged in a frame shape. Further, a plurality of terminal electrodes 13 (see FIG. 4) corresponding to the connection electrodes 12 are formed on the other main surface of the terminal plate 10, and the connection electrodes 12 and the terminal electrodes 13 are arranged in the thickness direction. Are connected to each other through via-hole conductors 14 penetrating them. The terminal electrode 13 is connected to the electrode of the mounting board when the circuit module A is mounted on a mounting board such as a mother board. The terminal board 10 may be a frame-shaped ceramic board. It is particularly preferable that the interlayer connection conductor is a thin plate conductor obtained by bending a thin metal plate, and the terminal plate 10 is a molded resin terminal plate obtained by molding the thin plate conductor with resin. If the interlayer connection conductor is formed by bending a thin metal plate, connection reliability can be secured without disconnection of the interlayer connection conductor even if stress is applied to the terminal plate 10.

配線基板１の接続電極６と、端子板１０の接続電極１２とは、それぞれ半田や導電性接着剤などの導電性接合材２０を介して電気的に接続され、かつ機械的に接合されている。この例では、接合材２０として半田を用いた。   The connection electrode 6 of the wiring board 1 and the connection electrode 12 of the terminal board 10 are electrically connected and mechanically bonded via a conductive bonding material 20 such as solder or conductive adhesive, respectively. . In this example, solder is used as the bonding material 20.

端子板１０と配線基板１とで形成されるキャビティ１１のうち、端子板１０の内周面には環状に第１の樹脂材料２１が塗布・硬化されており、端子板１０と配線基板１との隙間が第１の樹脂材料２１によって埋められている。キャビティ１１の残りの領域には第２の樹脂材料２２が充填・硬化されており、ボンディングワイヤ９を含む回路部品８の全体が第２の樹脂材料２２の中に埋設されている。接合材２０を含む端子板１０の厚みは、ボンディングワイヤ９を含む回路部品８の高さより厚いので、樹脂材料２２が端子板１０より突出することはない。   Of the cavities 11 formed by the terminal board 10 and the wiring board 1, the first resin material 21 is applied and cured in an annular shape on the inner peripheral surface of the terminal board 10. Are filled with the first resin material 21. The remaining region of the cavity 11 is filled and cured with the second resin material 22, and the entire circuit component 8 including the bonding wires 9 is embedded in the second resin material 22. Since the thickness of the terminal board 10 including the bonding material 20 is thicker than the height of the circuit component 8 including the bonding wires 9, the resin material 22 does not protrude from the terminal board 10.

第１の樹脂材料２１と第２の樹脂材料２２は同系統または同質の熱硬化型樹脂と無機フィラーとの混合樹脂組成物で構成されている。特に、第１の樹脂材料２１に含まれる無機フィラーの含有率は第２の樹脂材料２２に含まれる無機フィラーの含有率より高く、そのために第１の樹脂材料２１の塗布時の粘度は第２の樹脂材料２２の充填時の粘度より高く設定されている。特に、第１の樹脂材料２１は、第２の樹脂材料２２に比べて、硬化前における同一温度・同一雰囲気下での粘度が高く、かつ接合材２０間の隙間を通って外部へ流れ出すのを防止できる程度の粘度を有するのがよい。一方、第２の樹脂材料２２は、レベリング性がよく、ボンディングワイヤ９の隙間や回路部品８の周囲に容易に回り込むことができる流動性を持つものがよい。なお、図１では、第２樹脂材料２２の表面がキャビティ１１内の中央部付近で凸状になるように設けられているが、中央部付近で凹状になっていてもよい。   The 1st resin material 21 and the 2nd resin material 22 are comprised with the mixed resin composition of the thermosetting type resin of the same system or the same quality, and an inorganic filler. In particular, the content of the inorganic filler contained in the first resin material 21 is higher than the content of the inorganic filler contained in the second resin material 22, so that the viscosity at the time of application of the first resin material 21 is the second. It is set higher than the viscosity at the time of filling the resin material 22. In particular, the first resin material 21 has a higher viscosity at the same temperature and in the same atmosphere before curing than the second resin material 22 and flows out to the outside through the gap between the bonding materials 20. It should have a viscosity that can be prevented. On the other hand, the second resin material 22 has good leveling properties, and it is preferable that the second resin material 22 has fluidity that can easily go around the gaps of the bonding wires 9 and the circuit components 8. In FIG. 1, the surface of the second resin material 22 is provided so as to be convex near the central portion in the cavity 11, but may be concave near the central portion.

第１，第２の樹脂材料２１，２２の母材となる熱硬化性樹脂としては、例えば耐熱性、耐湿性に優れたエポキシ樹脂、フェノール樹脂、シアネート樹脂などを用いることができ、無機フィラーとしては、例えばアルミナ、シリカ、チタニアなどを用いることができる。なお、第１，第２の樹脂材料２１，２２と端子板１０を構成する樹脂とが同系統または同質であれば、樹脂材料２１，２２と端子板１０との接合性も良好となる。   As the thermosetting resin that becomes the base material of the first and second resin materials 21 and 22, for example, an epoxy resin, a phenol resin, a cyanate resin, etc. excellent in heat resistance and moisture resistance can be used. For example, alumina, silica, titania or the like can be used. In addition, if the 1st, 2nd resin materials 21 and 22 and the resin which comprises the terminal board 10 are the same systems or the same quality, the joining property of the resin materials 21 and 22 and the terminal board 10 will also become favorable.

ここで、回路モジュールＡの製造方法を、図５，図６を参照して説明する。図５の（ａ）は、配線基板１を準備した状態を示す。ここでは、接続電極６とパッド電極７とが配線基板１の上側を向くように配置されている。図５の（ｂ）は、配線基板１の接続電極６に対して、端子板１０の接続電極１２を接合材２０を介して接続した状態を示す。接合材２０として半田を使用した場合には、リフロー半田付けを行うことで、量産性を高めることができる。配線基板１と端子板１０との間に配置された各接合材２０間には、隙間δ（図３参照）が形成される。図５の（ｃ）は、端子板１０で囲まれた配線基板１の上面に回路部品８を搭載するとともに、ボンディングワイヤ９によって回路部品８とパッド電極７とを接続した状態を示す。   Here, a method of manufacturing the circuit module A will be described with reference to FIGS. FIG. 5A shows a state in which the wiring board 1 is prepared. Here, the connection electrode 6 and the pad electrode 7 are arranged so as to face the upper side of the wiring substrate 1. FIG. 5B shows a state in which the connection electrode 12 of the terminal plate 10 is connected to the connection electrode 6 of the wiring board 1 via the bonding material 20. When solder is used as the bonding material 20, mass productivity can be improved by performing reflow soldering. A gap δ (see FIG. 3) is formed between each bonding material 20 disposed between the wiring board 1 and the terminal board 10. FIG. 5C shows a state in which the circuit component 8 is mounted on the upper surface of the wiring board 1 surrounded by the terminal board 10 and the circuit component 8 and the pad electrode 7 are connected by the bonding wire 9.

図６の（ａ）は、端子板１０と配線基板１とで構成されたキャビティ１１内であって、端子板１０の内周面に沿って第１の樹脂材料２１を塗布した状態を示す。塗布には、ディスペンサなどの自動塗布装置を用いることができる。第１の樹脂材料２１は、その塗布時における粘度が高く（例えば１００Ｐａ・ｓ以上、好ましくは２００Ｐａ・ｓ以上（２５℃、５ｒｐｍ））、そのため樹脂材料２１は配線基板１と端子板１０との隙間を埋め、接合材２０間の隙間δを通って外部へ流れ出すことがない。この例では樹脂材料２１が接合材２０間の隙間δを満たし、接合材２０の周面の一部が外部に開放された位置で終端となるように塗布されている（図３参照）。そのため、樹脂材料２１が接合材２０を補強して接合強度を高めることができ、かつ樹脂材料２１が接合材２０間の絶縁性を高めることができる。さらに、接合材２０の周面の一部が外部へ露出しているので、回路モジュールＡをマザーボード等へ実装する際の熱で接合材（半田）２０が溶融・膨張しても、膨張した圧力を開放部から逃がすことができので、半田フラッシュ現象を防止できる。なお、この段階で第１の樹脂材料２１を加熱硬化させてもよいが、この例では硬化させない。なお、第１の樹脂材料２１は回路部品８およびボンディングワイヤ９に付着しないように塗布するのがよい。   FIG. 6A shows a state in which the first resin material 21 is applied along the inner peripheral surface of the terminal board 10 in the cavity 11 constituted by the terminal board 10 and the wiring board 1. An automatic application device such as a dispenser can be used for application. The first resin material 21 has a high viscosity at the time of application (for example, 100 Pa · s or more, preferably 200 Pa · s or more (25 ° C., 5 rpm)). Therefore, the resin material 21 is formed between the wiring board 1 and the terminal board 10. The gap is filled and does not flow out through the gap δ between the bonding materials 20. In this example, the resin material 21 is applied so as to fill the gap δ between the bonding materials 20 and terminate at a position where a part of the peripheral surface of the bonding material 20 is opened to the outside (see FIG. 3). Therefore, the resin material 21 can reinforce the bonding material 20 to increase the bonding strength, and the resin material 21 can increase the insulation between the bonding materials 20. Further, since a part of the peripheral surface of the bonding material 20 is exposed to the outside, the expanded pressure is generated even when the bonding material (solder) 20 is melted / expanded by heat when the circuit module A is mounted on a mother board or the like. Can be released from the open portion, so that the solder flash phenomenon can be prevented. The first resin material 21 may be cured by heating at this stage, but is not cured in this example. The first resin material 21 is preferably applied so as not to adhere to the circuit component 8 and the bonding wire 9.

図６の（ｂ）は、第１の樹脂材料２１が塗布されたキャビティ１１内に第２の樹脂材料２２を充填した状態を示す。第２の樹脂材料２２は第１の樹脂材料２１に比べて粘度が低い樹脂（１００Ｐａ・ｓ以下（２５℃、５ｒｐｍ）がよい）であるため、流動性がよく、ワイヤ９の隙間や回路部品８の周囲へ容易に流れ込むことができる。端子板１０と配線基板１との隙間は第１の樹脂材料２１で既に埋められているので、流動性のよい第２の樹脂材料２２であっても、端子板１０と配線基板１との隙間を通って外部へ漏れ出ることがない。   FIG. 6B shows a state in which the second resin material 22 is filled in the cavity 11 to which the first resin material 21 is applied. Since the second resin material 22 is a resin having a lower viscosity than the first resin material 21 (100 Pa · s or less (25 ° C., 5 rpm) is preferable), the fluidity is good, and the gaps between the wires 9 and circuit components 8 can easily flow around. Since the gap between the terminal board 10 and the wiring board 1 is already filled with the first resin material 21, the gap between the terminal board 10 and the wiring board 1 even if the second resin material 22 has good fluidity. There is no leakage outside.

その後、第１の樹脂材料２１と第２の樹脂材料２２を同時に熱硬化させる。両方の樹脂材料２１，２２が同系統（または同質）の熱硬化型樹脂よりなる場合には、同一温度で硬化するので、熱処理工程が簡易になるとともに、複数回の熱サイクルを回路部品８に与えずに済む。樹脂材料２１，２２を硬化させることにより、回路部品８を保護する保護層が形成されるが、その保護層は端子板１０の端子電極１３より外部へ突出することがない。最後に、図６の（ｃ）のように、配線基板１の裏面側にあるランド電極２に回路部品３を接続することによって、回路モジュールＡが完成する。   Thereafter, the first resin material 21 and the second resin material 22 are thermally cured simultaneously. When both resin materials 21 and 22 are made of the same type (or the same type) of thermosetting resin, they are cured at the same temperature, so that the heat treatment process is simplified and a plurality of thermal cycles are applied to the circuit component 8. You don't have to give it. By hardening the resin materials 21 and 22, a protective layer for protecting the circuit component 8 is formed, but the protective layer does not protrude from the terminal electrode 13 of the terminal plate 10 to the outside. Finally, as shown in FIG. 6C, the circuit component A is completed by connecting the circuit component 3 to the land electrode 2 on the back surface side of the wiring board 1.

（第２実施形態）
前記実施形態では、図３，図６の（ａ）に示すように、第１の樹脂材料２１が接合材２０間の隙間δを満たした位置で終端となるように塗布した例を示したが、図７の（ａ）に示すように、第１の樹脂材料２１が接合材２０に到達することなく、端子板１０と配線基板１との間で終端となるように塗布してもよい。第１の樹脂材料２１としてさらに高粘度の材料あるいはチキソ性を有する材料を使用した場合、樹脂材料２１が塗布時の形態を保持するため、上述のように接合材２０に到達することなく端子板１０と配線基板１との間で終端とさせることができる。また、図７の（ｂ）は、第１の樹脂材料２１が接合材２０を完全に取り巻くように塗布した例である。これは、第１の樹脂材料２１として比較的粘度の低い材料を用いた場合であり、第１の樹脂材料２１が必要以上に広がらないように、熱風や熱線を用いて第１の樹脂材料（熱硬化性樹脂の場合）２１の流動を止めてもよい。(Second Embodiment)
In the said embodiment, as shown to (a) of FIG. 3, FIG. 6, although the 1st resin material 21 showed the example applied so that it might become the termination | terminus in the position which satisfy | filled the clearance gap δ between the joining materials 20. As shown in FIG. 7A, the first resin material 21 may be applied so as to end between the terminal board 10 and the wiring board 1 without reaching the bonding material 20. When a higher viscosity material or a thixotropic material is used as the first resin material 21, the resin material 21 retains its form at the time of application, so that the terminal board does not reach the bonding material 20 as described above. 10 and the wiring board 1 can be terminated. FIG. 7B shows an example in which the first resin material 21 is applied so as to completely surround the bonding material 20. This is a case where a material having a relatively low viscosity is used as the first resin material 21, and the first resin material (using hot air or hot wire) is used so that the first resin material 21 does not spread more than necessary. The flow of 21 may be stopped in the case of a thermosetting resin.

（第３実施形態）
図８は、第１の樹脂材料２１の塗布方法の他の例を示す。この実施形態では、第１の樹脂材料２１として、放射線硬化型または放射線硬化・熱硬化両用型樹脂材料を使用したものである。例えば、紫外線照射型樹脂または紫外線・熱硬化両用型樹脂を使用すればよい。なお、第２の樹脂材料は上述と同様に熱硬化型樹脂材料を使用している。(Third embodiment)
FIG. 8 shows another example of a method for applying the first resin material 21. In this embodiment, the first resin material 21 is a radiation curable type or a radiation curable / heat curable resin material. For example, an ultraviolet irradiation resin or an ultraviolet / thermosetting resin may be used. The second resin material is a thermosetting resin material as described above.

この場合には、第１の樹脂材料２１をディスペンサなどで塗布した後、第１の樹脂材料２１が接合材２０間の隙間を満たした段階で、紫外線などの放射線ＵＶを照射する。図８では、放射線の照射箇所を端子板１０の外側としたが、内側であってもよい。外側の場合には、接合材２０間の隙間を満たした樹脂材料２１が硬化するため、それ以上の流出を防止できる。内側の場合には、樹脂材料２１が接合材２０間の隙間を満たした段階で、放射線の照射によってキャビティ側に面する樹脂材料２１が硬化するので、樹脂材料２１がそれ以上流れ出るのを防止できる。放射線の照射は、樹脂材料２１の流動を止める程度でよいので、１〜数秒程度の短時間で済み、硬化に時間を要しない。   In this case, after applying the first resin material 21 with a dispenser or the like, radiation UV such as ultraviolet rays is irradiated when the first resin material 21 fills the gap between the bonding materials 20. In FIG. 8, the radiation irradiation site is the outside of the terminal board 10, but it may be inside. In the case of the outer side, since the resin material 21 that fills the gap between the bonding materials 20 is cured, further outflow can be prevented. In the case of the inner side, when the resin material 21 fills the gap between the bonding materials 20, the resin material 21 facing the cavity side is cured by irradiation of radiation, so that the resin material 21 can be prevented from further flowing out. . Since the irradiation of the radiation is sufficient to stop the flow of the resin material 21, it takes a short time of about 1 to several seconds and does not require time for curing.

第１の樹脂材料２１として、放射線硬化・熱硬化両用型樹脂材料を使用した場合には、上述のように放射線の照射によって樹脂材料２１を仮硬化させた状態で、第２の樹脂材料２２を充填し、その後で熱処理することで両方の樹脂材料２１，２２を同時に本硬化させることができる。放射線硬化型または放射線硬化・熱硬化両用型樹脂材料は、塗布時の粘度が比較的低いので、塗布時間を短縮できる。   When a radiation-curing / thermosetting resin material is used as the first resin material 21, the second resin material 22 is used in a state where the resin material 21 is temporarily cured by irradiation with radiation as described above. By filling and then heat-treating, both resin materials 21 and 22 can be fully cured at the same time. Since the radiation-curing type or radiation-curing / thermosetting resin material has a relatively low viscosity at the time of coating, the coating time can be shortened.

（第４実施形態）
図９は、枠状の端子板として種々の変形例を示したものである。図９の（ａ）は、端子板１０Ａの表面の接続電極１２と裏面の端子電極（図示せず）とを側面に形成した接続用パターン電極１５によって接続した例である。接続用パターン電極１５は、端子板１０Ａの外側面または内側面のいずれに形成してもよい。図９の（ｂ）は、端子板１０Ｂの表面の接続電極１２と裏面の端子電極１３とをスルーホール１６によって接続した例である。スルーホール１６は、端子板１０Ｂを厚み方向に貫通する穴の内面に電極を形成したものである。図９の（ｃ）は、端子板１０Ｃの表面の接続電極１２と裏面の端子電極（図示せず）とを側面に形成した接続用パターン電極１７によって接続した例であるが、接続用パターン電極１７が凹溝の内面に形成されたものである。図９の（ｄ）は、端子板１０Ｄの表面の接続電極１２と裏面の端子電極（図示せず）とを、ビアホール導体（図示せず）と、側面に形成した凹溝構造の接続用パターン電極１８とで接続した例である。特に、グランド電極などのはんだ量の多い電極（ランドの大きい電極）１２ａに接続用パターン電極１８を適用した例である。グランド電極などの広い面積の電極は、はんだ溶融による熱膨張の影響を最も受けやすいからである。(Fourth embodiment)
FIG. 9 shows various modified examples of the frame-shaped terminal board. FIG. 9A shows an example in which the connection electrode 12 on the front surface of the terminal plate 10A and the terminal electrode (not shown) on the back surface are connected by the connection pattern electrode 15 formed on the side surface. The connection pattern electrode 15 may be formed on either the outer surface or the inner surface of the terminal board 10A. FIG. 9B shows an example in which the connection electrode 12 on the front surface of the terminal board 10 </ b> B and the terminal electrode 13 on the back surface are connected by the through hole 16. The through hole 16 is formed by forming an electrode on the inner surface of a hole that penetrates the terminal board 10B in the thickness direction. FIG. 9C shows an example in which the connection electrode 12 on the front surface of the terminal board 10C and the terminal electrode (not shown) on the back surface are connected by the connection pattern electrode 17 formed on the side surface. 17 is formed on the inner surface of the groove. FIG. 9D shows a connection pattern having a concave groove structure in which the connection electrode 12 on the front surface of the terminal plate 10D and the terminal electrode (not shown) on the back surface are formed on the via hole conductor (not shown) and the side surface. This is an example of connection with the electrode 18. In particular, this is an example in which the connection pattern electrode 18 is applied to an electrode 12a having a large amount of solder (an electrode having a large land) such as a ground electrode. This is because an electrode having a large area such as a ground electrode is most susceptible to thermal expansion due to solder melting.

前記各実施形態では、子基板状態の配線基板１を準備し、この配線基板１に端子板１０を接合する例について説明したが、集合基板状態の配線基板１を準備し、その配線基板１に複数の端子板１０を接合し、回路部品８の搭載、樹脂材料２１，２２の塗布・充填後、子基板に分割する方法を用いてもよい。集合基板を子基板にチョコレートブレイクで分割する場合、樹脂材料２１，２２が分割線（ブレイク溝）まではみ出ないので、ブレイク不良を防止できる。本発明の配線基板は平板状であるが、平板状とはその表面が完全に平面である場合だけでなく、浅い凹凸部が形成されたものでもよい。例えば、特許文献１に示されるように配線基板に浅い凹部を形成し、その中に回路部品を搭載するようにしてもよい。前記各実施形態では、配線基板の接続電極および端子板の接続電極を、共に枠状すなわち４辺すべてに配置したが、２辺あるいは３辺に接続電極を配置してもよい。この場合も、第１の樹脂材料２１によって配線基板１と端子板１０との隙間を埋めることができるので、第２の樹脂材料２２が外部へ流れ出すのを防止できる。   In each of the above embodiments, the example in which the wiring board 1 in the sub-board state is prepared and the terminal board 10 is joined to the wiring board 1 has been described. However, the wiring board 1 in the collective board state is prepared, and A method may be used in which a plurality of terminal boards 10 are joined and divided into sub-boards after mounting the circuit component 8 and applying and filling the resin materials 21 and 22. When the collective substrate is divided into the sub-substrates by chocolate break, the resin materials 21 and 22 do not protrude to the dividing line (break groove), so that break failure can be prevented. The wiring board of the present invention has a flat plate shape. However, the flat plate shape may be not only when the surface is completely flat, but also with a shallow uneven portion formed. For example, as shown in Patent Document 1, a shallow recess may be formed in a wiring board, and a circuit component may be mounted therein. In each of the above embodiments, the connection electrodes of the wiring board and the connection electrodes of the terminal plate are both arranged in a frame shape, that is, on all four sides, but the connection electrodes may be arranged on two sides or three sides. Also in this case, since the gap between the wiring board 1 and the terminal board 10 can be filled with the first resin material 21, it is possible to prevent the second resin material 22 from flowing out.

Claims (7)

表面に配置された複数の接続電極を有する平板状の配線基板と、前記複数の接続電極に対応する複数の接続電極を有する枠状の端子板とを準備する工程と、
前記配線基板の複数の接続電極と前記端子板の複数の接続電極とをそれぞれ個別に導電性接合材を介して接合する工程と、
前記端子板の内側面と前記配線基板の表面とで構成されるキャビティ内に、回路部品を搭載する工程と、
前記端子板の内側面と前記配線基板の表面との間に、両者の隙間を埋める第１の樹脂材料を塗布する工程と、
前記第１の樹脂材料を塗布した後、前記回路部品を覆うように、第２の樹脂材料を前記キャビティに充填する工程と、を有し、
前記第１の樹脂材料は、前記第２の樹脂材料に比べて、硬化前における同一温度・同一雰囲気下での粘度が高く、かつ前記導電性接合材間の隙間を通って外部へ流れ出すのを防止できる程度の粘度を有し、
前記第１の樹脂材料を、前記導電性接合材間の隙間を満たし、かつ前記導電性接合材の周面の一部が外部に開放された位置で終端となるように塗布することを特徴とする回路モジュールの製造方法。Preparing a flat wiring board having a plurality of connection electrodes arranged on the surface, and a frame-shaped terminal board having a plurality of connection electrodes corresponding to the plurality of connection electrodes;
A step of individually connecting a plurality of connection electrodes of the wiring board and a plurality of connection electrodes of the terminal board via a conductive bonding material;
Mounting circuit components in a cavity formed by the inner surface of the terminal board and the surface of the wiring board;
Applying a first resin material that fills the gap between the inner surface of the terminal board and the surface of the wiring board;
Filling the cavity with a second resin material so as to cover the circuit component after applying the first resin material ;
The first resin material has a higher viscosity at the same temperature and the same atmosphere before curing than the second resin material, and flows out to the outside through the gap between the conductive bonding materials. Has a viscosity that can be prevented,
The first resin material is applied so as to fill a gap between the conductive bonding materials and terminate at a position where a part of a peripheral surface of the conductive bonding material is open to the outside. method of manufacturing a circuit module. 前記第１の樹脂材料と前記第２の樹脂材料は共に熱硬化型樹脂材料よりなり、前記第１の樹脂材料と前記第２の樹脂材料とを同時に熱硬化させる工程をさらに有することを特徴とする請求項１に記載の回路モジュールの製造方法。The first resin material and the second resin material are both made of a thermosetting resin material, and the method further comprises a step of thermosetting the first resin material and the second resin material simultaneously. The circuit module manufacturing method according to claim 1 . 前記第１の樹脂材料と前記第２の樹脂材料は、熱硬化型樹脂と無機フィラーとの混合樹脂組成物であり、前記第１の樹脂材料に含まれる無機フィラーの含有率は前記第２の樹脂材料に含まれる無機フィラーの含有率より高いことを特徴とする請求項１又は２に記載の回路モジュールの製造方法。The first resin material and the second resin material are a mixed resin composition of a thermosetting resin and an inorganic filler, and the content of the inorganic filler contained in the first resin material is the second resin material. method of manufacturing a circuit module according to claim 1 or 2, wherein the higher content of the inorganic filler contained in the resin material. 前記第１の樹脂材料は、塗布後に流動しないようなチキソ性を有することを特徴とする請求項１ないし３のいずれか１項に記載の回路モジュールの製造方法。It said first resin material, method of manufacturing a circuit module according to any one of claims 1 to 3, characterized in that it has a thixotropic property so as not to flow after coating. 前記端子板の裏面には、前記端子板の厚み方向に延びる導電体を介して前記接続電極と電気的に接続された端子電極が形成されていることを特徴とする請求項１ないし４のいずれか１項に記載の回路モジュールの製造方法。The terminal electrode electrically connected with the said connection electrode through the conductor extended in the thickness direction of the said terminal board is formed in the back surface of the said terminal board, The Claim 1 thru | or 4 characterized by the above-mentioned. A method for manufacturing the circuit module according to claim 1. 前記配線基板の裏面には、別の回路部品が実装されていることを特徴とする請求項１ないし５のいずれか１項に記載の回路モジュールの製造方法。The back surface of the wiring board, method of manufacturing a circuit module according to any one of claims 1 to 5, characterized in that the separate circuit components are mounted. 前記配線基板は複数のセラミック層を積層してなるセラミック多層基板であり、前記端子板は樹脂基板であることを特徴とする請求項１ないし６のいずれか１項に記載の回路モジュールの製造方法。The wiring board is a ceramic multilayer substrate formed by laminating a plurality of ceramic layers, method of manufacturing a circuit module according to any one of claims 1 to 6, wherein the terminal plate is a resin substrate .
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