JP4700469B2 - Liquid crystal display - Google Patents

Description

  The present invention relates to a liquid crystal display device.

  In a liquid crystal display device, a white light source combining a blue semiconductor light emitting diode element and a yellow phosphor is used as a backlight, particularly in a small liquid crystal panel for a mobile phone. On the other hand, medium- and large-sized liquid crystal display devices have so far used a cold cathode tube as a backlight light source, but in recent years, a module using a semiconductor light-emitting diode (LED) element as a backlight light source has been developed for a liquid crystal television. Has been. In order to improve the color display performance with high image quality and high-speed response by controlling the three primary colors independently, it is necessary to provide an LED backlight module that can be mounted and controlled with red, green, and blue primary LED elements, and LED Since the input power to the backlight light source increases, it is necessary to improve the heat dissipation characteristics.

  In order to improve the heat dissipation characteristics so far, heat dissipation and cooling devices for semiconductor elements, electronic components, and electronic equipment can be efficiently obtained over a wide area using carbon graphite sheets, making them thinner and smaller. Attempts have been made to increase flexibility. Regarding these, as known examples, Patent Documents 1, 2 and 3 describe heat dissipating means configured in specific elements and devices.

  Patent Document 4 describes an example in which a graphite sheet is applied as a heat spreader for plasma display, and further describes that it is effective for a display device to which a light emitting diode is applied.

Kondo Shigeru et al., Japanese Unexamined Patent Publication No. 2000-223629 Yoshida Akira et al., Japanese Patent Application Laid-Open No. 2001-111279. Abe Munemitsu et al., JP 2002-344180 A Timothy Krobesco et al., JP-A-2005-122181

  The present invention relates to a liquid crystal display device, and an object thereof is to improve the heat dissipation characteristics of a backlight module and to improve the optical characteristics of a backlight using an LED element as a backlight light source and the backlight module.

  Since the LED element is a point light source, from a thermal viewpoint, it becomes a heat spot as a heat source, and heat from a narrow area is generated and diffused. It is necessary to quickly diffuse the heat generated from the heat source to make the heat spread uniform in a wide area backlight or backlight module to improve the uniformity of temperature distribution. For this reason, a board | substrate and a sheet | seat with high heat conductivity are required. However, if the heat radiation is not sufficiently performed, the heat spread does not become uniform in the substrate or sheet, and it becomes difficult to keep the temperature distribution uniform. Moreover, if the exhaust heat is not sufficient, even if the heat spread and the uniformity of the temperature distribution are sufficient, the temperature rises with time and the temperature distribution cannot be maintained uniformly.

  In the present invention, in consideration of measures against heat dissipation and exhaust heat, the heat dissipation characteristics of the backlight light source and the backlight module using the LED elements are improved, and also sufficient measures against exhaust heat are taken. It was set so that heat transfer from high substrates and sheets could be applied smoothly. In addition, the luminous efficiency of LED elements can be controlled by maintaining the spread of heat and the uniformity of the temperature distribution in a steady manner without causing temperature increases over time or changes in temperature distribution over time. The purpose was to improve without lowering.

  In the present invention, means for improving the heat radiation characteristics of the backlight light source and the backlight module of the liquid crystal display device will be described, and a configuration for improving the efficiency of the LED element and reducing the power consumption will be described below.

  In the present invention, when an LED element is applied to a backlight light source of a liquid crystal display device, if it is operated at high output and high luminance, the problem of heat generation is greatly highlighted due to high power consumption. Further, since the LED element is a point light source, it becomes a heat point as a heat generation source, and the heat generation area is limited to a minimum area, and the heat tends to be trapped.

In this content, the countermeasures against the above-mentioned heat generation problem were taken as follows. In the package of the LED element serving as the light source, the heat dissipation substrate, or the housing of the display backlight module, the generated heat is diffused to a sufficiently wide area to dissipate heat. Conventionally, it is known to use a carbon graphite sheet having a high thermal conductivity of 200 W / mK or more and applicable to a wide area for heat dissipation. However, since the carbon graphite sheet is mainly composed of black carbon graphite, there is a problem that it is close to black body radiation and has a high electromagnetic wave absorption rate and a low thermal radiation rate. Carbon graphite sheets have high thermal conductivity in the transverse direction parallel to the sheet and excellent thermal diffusion, but the thermal conductivity is an order of magnitude lower in the longitudinal direction of the sheet thickness, and heat conduction and heat transport are limited. Will be. For this reason, it is effective for heat conduction and thermal diffusion to proceed in the lateral direction and soaking, but there is a limit to further heat dissipation and exhaust heat after the heat spreads throughout the carbon graphite sheet. . Therefore, a configuration that further dissipates heat from the carbon graphite sheet and exhausts heat is necessary. In this content, it was decided to take measures against the problem by utilizing a ceramic filler sheet with ceramic particles having a small electromagnetic wave absorption rate and a thermal radiation rate of 0.9 or more as a filler. In other words, one side of the carbon graphite sheet was covered with a ceramic filler sheet. The heat spread by the carbon graphite sheet is emitted as infrared electromagnetic waves by the ceramic filler sheet, so that heat can be sufficiently radiated into the atmosphere to release heat and exhaust heat. Separately, in the carbon graphite sheet, conductive carbon graphite particles may be scattered from the side wall or the like, which may cause electrical short-circuiting or leakage. In order to solve this problem, it is necessary to perform an insulation treatment so that the carbon graphite particles are not scattered. Again, insulation treatment is possible by covering with a ceramic filler sheet, and withstand voltage is at least 1
There is a feature that can be set to kV or more. For this reason, it becomes an advantage which can fully ensure the withstand voltage required for a display use.

  In this description, the basic structure is a heat dissipation and exhaust heat configuration in which a carbon graphite sheet is provided for a package, a substrate, and a housing of an LED element, and a ceramic filler sheet is further provided. When a ceramic substrate is used as the LED element mounting substrate, the ceramic substrate has a high dielectric strength and heat radiation, so a two-layer structure is provided in which a carbon graphite sheet is provided on the back side of the ceramic substrate and then a ceramic filler sheet is provided. This configuration is sufficient. In this case, it can be effectively seen as a three-layer structure in which the carbon graphite sheet is sandwiched between a ceramic substrate which is a ceramic layer and a ceramic filler sheet. Further, it is possible to adopt a basic structure of a three-layer structure in which both sides of a carbon graphite sheet are sandwiched between ceramic filler sheets. When a metal substrate is used as the mounting substrate for the LED element, a structure for improving heat dissipation can be dealt with by adhering to the back side of the metal substrate as a three-layer structure in which a carbon graphite sheet is sandwiched between ceramic filler sheets. Accordingly, it is possible to cope with a substrate configuration that sufficiently secures the characteristics of the withstand voltage and the heat radiation and exhaust heat without causing an electrical problem such as a short circuit or a leak.

  If the heat dissipation characteristics of the mounting substrate are improved, the temperature rise of the mounting substrate can be suppressed by at least 20-25 degrees, and also in the backlight module housing of a large-sized liquid crystal television using LED elements as light sources, the temperature rise is at least 40. It is possible to suppress -50 degrees. In this content, there is a feature that surpasses the function of a heat pipe that is superior in heat uniformity. In other words, heat can be diffused over a wide area that exceeds the area of the heat pipe, the temperature distribution can be made uniform, and a thin sheet of about 1 mm can be used, so that it can be made into a thin substrate structure, which is sufficiently effective for display applications. It will be shown. Furthermore, in order to efficiently dissipate heat, a fin structure provided in the backlight module housing and a fan for forced exhaust that exhausts heat sufficiently have been introduced. Therefore, there is no need to provide a forced exhaust fan for exhaust heat, and there is an advantage that a target power consumption can be achieved. As a result, a simplified housing structure can be realized, and the backlight module can be configured to be thin at low cost.

As described above, the luminous efficiency of the LED element is at least 20− under the operating condition at high current.
There is an effect that the power consumption can be reduced by at least 20-30% by 30% improvement. This leads to improving the reliability of the LED element and the sealing resin. In addition, by adopting a three-layer structure in which a carbon graphite sheet is sandwiched between ceramic layers, it is possible to secure a dielectric breakdown voltage of at least 1 kV or higher for a mounting substrate or a backlight module, and insulation required for display applications. A breakdown voltage can be realized.

  Based on the above, the technology of this content can realize the package of LED element package and substrate and backlight module with improved heat dissipation characteristics, so it is possible to improve the luminous efficiency of LED element during high current operation It is. This is effective for reducing power consumption as a whole. Further, it is possible to configure a backlight module that sufficiently secures a withstand voltage and reliability for display applications.

  The present invention has an effect of improving the light emission efficiency of the LED element as a light source for the liquid crystal display device and reducing the power consumption of the backlight module. In this content, a metal substrate or a ceramic substrate is applied to the substrate of the LED element, and a combination of a high thermal conductivity carbon graphite sheet and a high thermal radiation ceramic filler sheet is basically provided on these substrates. As a structure for improving the heat dissipation characteristics, a two-layer structure of a carbon graphite sheet and a ceramic filler sheet or a three-layer structure in which the carbon graphite sheet is sandwiched between ceramic layers is applied. In this content, a carbon graphite sheet with a thermal conductivity of at least 200 W / mK, which is as high as that of a metal substrate, quickly diffuses the heat from the heat source of the LED element, which is a point light source, and serves as a heat spreader. This is effective in achieving a uniform temperature distribution. In addition, the ceramic filler sheet having a high thermal emissivity of 0.9 or more works sufficiently to exhaust the heat transported from the substrate to the atmosphere.

  In this description, the heat dissipation substrate is configured as follows based on a configuration in which at least a carbon graphite sheet and a ceramic filler sheet have a two-layer structure. When a ceramic substrate is applied to the LED element mounting substrate, a two-layer structure is adopted in which a carbon graphite sheet is provided on the back side of the ceramic substrate, and then a ceramic filler sheet is adhered. Further, when a metal substrate is used as a mounting substrate for the LED element, a structure for improving the heat radiation characteristic is dealt with by adhering to the back side of the metal substrate as a three-layer structure in which a carbon graphite sheet is sandwiched between ceramic filler sheets. Thus, by improving the heat dissipation characteristics of the mounting board of the LED element, it is possible to suppress the temperature rise of the mounting board by at least 20-25 degrees, and in addition, in the backlight module housing of the large-sized liquid crystal television using the LED element as a light source, It is possible to suppress the temperature rise by at least 40-50 degrees. Since heat can be diffused over a wide area and the temperature distribution can be made uniform, it has more functionality than a heat pipe, which is superior to conventional heat equalization, and can be finished in a thin configuration, so it can be used for display applications. It is shown to be effective enough. Furthermore, in this content, there is no need to provide a fin structure for heat dissipation or a forced exhaust fan for exhaust heat, and there is an advantage that the target power consumption can be achieved. As a result, a simplified housing structure can be realized, and the backlight module can be configured to be thin at low cost.

As described above, the luminous efficiency of the LED element is at least 20− under the operating condition at high current.
There is an effect that the power consumption can be reduced by at least 20-30% by 30% improvement. This leads to improving the reliability of the mounting element.

  Further, according to the present contents, it is possible to secure a dielectric breakdown voltage of at least 1 kV or higher with respect to the mounting substrate and the backlight module, and it is possible to realize a dielectric breakdown voltage required for display applications.

  From the above, it is clear that the light emitting efficiency of the LED element can be improved and the power consumption can be reduced, and that the backlight module can sufficiently ensure the withstand voltage and the reliability for the display application.

  Below, the form for implementing this invention is shown.

  An embodiment of the present invention will be described below with reference to FIGS.

  In the liquid crystal display device configured in this embodiment, a light source composed of light-emitting diode elements constituting a backlight module will be described first. In FIG. 1, a package configuration in which a light emitting diode element constituting a backlight light source is mounted will be described. First, a metal substrate with an insulating layer, a ceramic substrate, or a glass epoxy substrate 1 is used as a substrate, and a wiring substrate having wirings 2 formed thereon is prepared. Thereafter, for example, the blue light emitting diode element 3, the green light emitting diode element 4, the green light emitting diode element 5, and the red light emitting diode element 6 are die-bonded to one side of the wiring 2 using a eutectic alloy or a silver paste material. Next, the light emitting diode elements 3, 4, 5, 6 are each wire-bonded to the other wiring 2 using a gold wire 7. A mold resin to be the light reflection plate 8 is bonded and fixed to these light emitting diode elements. Thereafter, the transparent resin 9 shown in the cross-sectional view of FIG. 2 is formed while defoaming, and is sealed with respect to the light emitting diode elements 3, 4, 5, and 6. Next, a carbon graphite sheet 10 having a higher thermal conductivity in the horizontal direction than that in the vertical direction and a high anisotropy is set as shown in FIG. 2, and a ceramic filler-containing sheet 11 is provided on the carbon graphite sheet 10 so as to cover it. .

  Next, in addition to the package structure in which the light emitting diode elements as described in FIGS. 1 and 2 are mounted, for example, as shown in the top view of FIG. Even when the unit structure 12 is configured and provided on one substrate 1, a backlight module can be configured in the same manner. As shown in the cross-sectional view of FIG. 4, the carbon graphite sheet 10 is set as shown in FIG. 4 on the lower side of the substrate 1 as described above, and the ceramic filler-containing sheet 11 is provided so as to cover the carbon graphite sheet 10. .

  Further, in FIG. 5, the package structure shown in FIGS. 1 and 2 is mounted on the backlight housing 13 of the liquid crystal display device, or the unit structure shown in FIGS. 3 and 4 is mounted, respectively. A backlight light source is formed by the structure shown in FIG. Thereafter, as shown in FIG. 6, similarly to the above, the carbon graphite sheet 10 is set as shown in FIG. 4 on the lower side of the backlight housing 13, and the ceramic filler-containing sheet 11 is overlaid thereon. Provide.

  As shown in FIG. 7, a liquid crystal display device is configured using a light emitting diode element package structure or unit structure aggregate provided in the backlight housing 13 as a backlight light source. The liquid crystal panel of the liquid crystal display device is irradiated with the light beam 15 from the backlight light source. The optical system of the liquid crystal display device includes at least a diffusion plate 16, a regular prism sheet 17, and a diffusion film 18. A sheet having a high regular reflectance may be introduced between the regular prism sheet 17 and the diffusion film 18. By providing a liquid crystal panel configuration including a polarizing plate 19, a liquid crystal panel 20 having a thin film transistor circuit, and a polarizing plate 21 on the diffusion film 18, the liquid crystal display device shown in the cross-sectional view of FIG. 7 is formed.

  According to this embodiment, the temperature rise of the substrate is relatively small compared to the case of a single carbon graphite sheet having a very high lateral thermal conductivity and high anisotropy, and a heat spot such as a light emitting diode element. The thermal uniformity in the lateral direction with respect to the heat source to be further improved, and the temperature distribution of the substrate can be flattened. The ceramic filler-containing sheet absorbs heat from the heat bath whose temperature has increased by spreading over the carbon graphite sheet, and since the thermal emissivity is as high as 0.9 or more, it can efficiently dissipate heat into the atmosphere. For this reason, it can be set as the structure which improves heat dissipation only by setting it as the two-layer structure which provided the ceramic filler containing sheet | seat on the carbon graphite sheet shown to this content. Specifically, in the case of the unit structure shown in FIGS. 3 and 4, the temperature rise of the substrate can be suppressed from several degrees to 10 degrees, and the temperature difference can be flattened within several degrees. In the case of the backlight module housing shown in FIG. 6, the temperature rise of the housing can be suppressed by 10 degrees or more, and the temperature difference can be flattened within 10 degrees. These are very effective for the low power consumption of the liquid crystal display device, and are useful for reducing the power consumption by 15 to 20%. Further, as shown in FIGS. 2, 4, 6, and 7, when providing the ceramic filler-containing sheet on the carbon graphite sheet, by providing the ceramic filler-containing sheet so as to cover the side wall of the carbon graphite sheet, It is possible to sufficiently ensure the insulation of the conductive carbon graphite sheet and to ensure a dielectric breakdown voltage of at least 1 kV.

  In this embodiment, the two-layer structure in which the ceramic filler-containing sheet is provided on the carbon graphite sheet is described. However, the temperature rises further by repeating the two-layer structure in which the ceramic filler-containing sheet is provided on the carbon graphite sheet. Can be suppressed and the temperature distribution can be flattened. Needless to say, this is effective for low power consumption of the liquid crystal display device.

  The contents of this embodiment can be applied to a backlight module of a liquid crystal panel for a small TV to a large TV.

  Another embodiment of the present invention will be described below with reference to FIGS.

In the present embodiment, the package structure of the light-emitting diode element and the backlight module housing are configured as in the first embodiment. However, as shown in FIGS. 8 to 11, the package substrate, the unit substrate, and the backlight module housing substrate are configured. The difference is that the ceramic filler-containing sheet 11 is first provided on the lower side, and then the carbon graphite sheet 10 and the ceramic filler-containing sheet 11 are provided. Other than that, the backlight module of FIG. 10 and the liquid crystal display device of FIG. 11 are formed in exactly the same manner as in the first embodiment.

According to this example, the temperature rise of the substrate is relatively smaller than in the case of the two-layer structure of the carbon graphite sheet and the ceramic filler-containing sheet, which is the configuration of Example 1, and the light emitting diode element The thermal uniformity in the transverse direction with respect to the heat source that becomes the heat spot is further improved, and the temperature distribution of the substrate can be flattened. The first ceramic filler-containing sheet first absorbs the amount of heat of the substrate, dissipates heat from the high heat radiation rate to the carbon graphite sheet, and first flattens the heat distribution. Thereafter, the third layer ceramic filler-containing sheet absorbs the heat quantity of the carbon graphite sheet whose temperature has risen, and can efficiently dissipate heat to the atmosphere by high heat radiation. For this reason, it can be set as the structure which further improves heat dissipation by setting it as the 3 layer structure which provided the ceramic filler containing sheet | seat on the carbon graphite sheet shown to this content. Specifically, in the case of the unit structure of FIG. 9, the temperature rise of the substrate can be suppressed by 10 degrees or more, which corresponds to the fact that the temperature difference can be flattened within several degrees, and the backlight module housing shown in FIG. In this case, the temperature rise of the housing can be suppressed by 15 degrees or more, and the temperature difference can be flattened within 10 degrees. These are very effective for the low power consumption of the liquid crystal display device, and are useful for reducing the power consumption by 20 to 30%.

  Further, as shown in FIGS. 8 to 11, when the ceramic filler-containing sheet is provided on the carbon graphite sheet, by providing the ceramic filler-containing sheet so as to cover the side wall of the carbon graphite sheet, the conductive carbon graphite is provided. It is possible to sufficiently ensure the insulation of the sheet and to secure a dielectric breakdown voltage of at least 1 kV.

  In this embodiment, the three-layer structure in which the ceramic filler-containing sheet is provided on the carbon graphite sheet has been described. However, the temperature is further increased by repeating the three-layer structure in which the ceramic filler-containing sheet is provided on the carbon graphite sheet. The temperature distribution can be flattened by suppressing the two-layer structure in Example 1 after the ceramic filler-containing sheet first.

  The contents of this embodiment can be applied to a backlight module of a liquid crystal panel for a small TV to a large TV.

  Another embodiment of the present invention will be described below with reference to FIGS.

The light emitting diode device package structure and the backlight module housing are configured in the same manner as in the second embodiment, but the wiring 2 is formed on the package substrate as shown in FIGS. In a light emitting diode element with high luminous efficiency and a package structure capable of expanding the light distribution, as shown in FIG. 14, the package structure 22 is alternately provided for each line in the backlight module housing and arranged in a staggered pattern. Can do. In other respects, like the second embodiment, the backlight module shown in FIGS. 14 and 15 and the liquid crystal display device shown in FIG. 16 are formed.

  According to the present embodiment, the distance between the package structures on which the light emitting diode elements are mounted becomes relatively large, and the heat source becomes a more isolated heat spot, but the ceramic filler-containing sheets are provided before and after the carbon graphite sheet. By adopting a three-layer structure, the heat dissipation is improved, so that it can sufficiently serve as a heat spreader. A heat dissipation characteristic substantially equivalent to that of Example 2 is obtained, and an effect equivalent to heat dissipation can be achieved. For this reason, the heat dissipation characteristics do not affect the display characteristics of the liquid crystal display device.

  The contents of this embodiment can be applied to a backlight module of a liquid crystal panel for a small TV to a large TV.

  Another embodiment of the present invention will be described below with reference to FIGS.

In this embodiment, a backlight module for a mobile phone and a liquid crystal display device are formed. First, in FIG. 17, a package element on which a blue light emitting diode element is mounted is formed. As shown in FIGS. 18 and 19, a resin 24 containing a yellow phosphor is provided in order to emit white light using a blue light emitting diode element. Thus, a package 26 of white light emitting diode elements is formed. Others have the package structure shown in the first and second embodiments. In FIG. 18, the heat dissipation structure is a two-layer structure in which a carbon graphite sheet and a ceramic filler-containing sheet are provided on the substrate 1, and in FIG. 19, the ceramic filler-containing sheet is provided on the substrate 1 before and after the carbon graphite sheet as the heat dissipation structure. It has a three-layer structure. FIG. 20 shows a top view of a configuration in which a package 26 of white light-emitting diode elements is mounted on an insulating film sheet 25 with wiring, and FIGS. 21 and 22 show cross-sectional views thereof. In FIG. 21, the heat dissipation structure is a two-layer structure in which a carbon graphite sheet and a ceramic filler-containing sheet are provided on the insulating film sheet with wiring 25. In FIG. It has a three-layer structure in which a ceramic filler-containing sheet is provided before and after the graphite sheet. FIG. 23 shows a top view of a liquid crystal display device that mounts the backlight module formed in FIG. 21 or 22 and expands the backlight beam through the light guide plate 27 and irradiates the liquid crystal panel as a cellular phone application. . In FIG. 24, a package 26 of white light emitting diode elements is mounted on an insulating film sheet 25 with wiring, and the backlight beam 15 that has passed through the light guide plate 27 is enlarged on the upper surface of the light guide plate. After that, the light is guided to the reverse prism sheet 28, and the light is emitted through the diffusion film 29 to irradiate the polarizing plate 30, the liquid crystal panel 31 with a thin film transistor circuit, and the polarizing plate 32. As shown in FIG. 25, the liquid crystal display device for a mobile phone is formed to include a backlight module 33, a liquid crystal panel pixel 34, a wiring 35 on the insulating layer sheet, and a drive circuit 36.

  According to this example, even when a small light emitting diode element with high output and high brightness with a smaller number of packages is used as a light source, it is possible to improve heat dissipation by providing a combination of a carbon graphite sheet and a ceramic filler-containing sheet. It is. That is, since the heat dissipation is improved, it serves as a heat spreader, and it is possible to suppress the temperature rise and to prevent the heat interference between the packages of the light emitting diode elements. For this reason, it is possible to reduce the power consumption of the circuit that drives the backlight light source without the heat dissipation characteristics affecting the display characteristics of the liquid crystal display device.

  The contents of this embodiment have an effect that is effective as a backlight in a liquid crystal display device for a small television. For this reason, it can be applied not only to backlight modules and liquid crystal display devices for mobile phones, but also to backlight modules and liquid crystal display devices such as car navigation systems, personal computers and TV personal computers. Applicable to backlight module.

  The present invention can be applied as a backlight module or backlight source for a high-output, high-brightness white light source with high heat dissipation, a small-sized liquid crystal display device such as a liquid crystal display device for a large liquid crystal television, a mobile phone or a personal computer. .

The top view which shows the package structure which mounts the light emitting diode element of one Example of this invention. Sectional drawing which shows the package structure which mounts the light emitting diode element of one Example of this invention. The top view which shows the backlight unit structure which mounts the light emitting diode element of one Example of this invention. Sectional drawing which shows the backlight unit structure which mounts the light emitting diode element of one Example of this invention. The top view which shows the backlight module structure which mounts the light emitting diode element of one Example of this invention. BRIEF DESCRIPTION OF THE DRAWINGS Sectional drawing which shows the backlight module structure which mounts the light emitting diode element of one Example of this invention. BRIEF DESCRIPTION OF THE DRAWINGS Sectional drawing of the liquid crystal panel display apparatus for television which arranges the mounting unit element of one Example of this invention. Sectional drawing which shows the package structure which mounts the light emitting diode element of this invention other Example. Sectional drawing which shows the backlight unit structure which mounts the light emitting diode element of this invention other Example. Sectional drawing which shows the backlight module structure which mounts the light emitting diode element of this invention other Example. Sectional drawing of the liquid crystal panel display apparatus for television which arranges the mounting unit element of this invention other Example. The top view which shows the package structure which mounts the light emitting diode element of this invention other Example. Sectional drawing which shows the package structure which mounts the light emitting diode element of this invention other Example. The top view which shows the backlight module structure which mounts the light emitting diode element of this invention other Example. Sectional drawing which shows the backlight module structure which mounts the light emitting diode element of this invention other Example. Sectional drawing of the liquid crystal panel display apparatus for television which arranges the mounting unit element of this invention other Example. The top view which shows the package structure which mounts the light emitting diode element of this invention other Example. Sectional drawing which shows the package structure which mounts the light emitting diode element of this invention other Example. Sectional drawing which shows the package structure which mounts the light emitting diode element of this invention other Example. The top view which shows the unit structure which mounts the light emitting diode element of this invention other Example. Sectional drawing which shows the unit structure which mounts the light emitting diode element of this invention other Example. Sectional drawing which shows the unit structure which mounts the light emitting diode element of this invention other Example. The top view of the liquid crystal panel display apparatus for mobile phones using the light emitting diode element mounting package of this invention. Sectional drawing of the liquid crystal panel display apparatus for mobile phones using the light emitting diode element mounting package of this invention. The top view of the liquid crystal panel display apparatus for mobile phones using the light emitting diode element mounting package of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Metal substrate with an insulating layer or ceramic substrate or glass epoxy substrate, 2, 35 ... Wiring, 3 ... Blue light emitting diode element, 4, 5 ... Green light emitting diode element, 6 ... Red light emitting diode element, 7 ... Gold wire, 8 ... Light reflecting plate, 9 ... transparent resin, 10 ... carbon graphite sheet, 11 ... ceramic filler-containing sheet, 12 ... unit structure, 13 ... backlight housing, 14 ... light emitting diode element mounting unit assembly, 15 ... backlight beam, 16 DESCRIPTION OF SYMBOLS ... Diffusion plate, 17 ... Regular prism sheet, 18 ... Diffusion film, 19, 21, 30, 32 ... Polarizing plate, 20 ... Thin film transistor and liquid crystal panel for television, 22 ... Package structure, 23 ... Wiring on insulating layer, 24 ... Yellow System phosphor-containing resin, 25 ... insulating film sheet, 26 ... package, 27 ... light guide plate, 28 ... reverse prism sheet , 29 ... diffusing film, 31 ... TFT circuit LCD panel, 33 ... backlight module, 34 ... liquid crystal panel pixels, 36 ... driving circuit.

Claims (11)

  In a liquid crystal display device comprising a liquid crystal panel, an optical system, and a backlight module, a carbon graphite sheet and a sheet containing a ceramic layer as a filler are laminated on a substrate on which a light emitting diode element used as a backlight light source is mounted. The heat dissipation sheet has a layer structure having at least a two-layer structure, and the heat dissipation sheet, which is a two-layer structure of a carbon graphite sheet and a ceramic filler-containing sheet, is disposed on the heat dissipation substrate and the heat dissipation housing of the light-emitting diode element. A liquid crystal display device comprising a backlight module by being provided.   The liquid crystal display device according to claim 1, wherein in the liquid crystal display device including a liquid crystal panel, an optical system, and a backlight module, at least carbon with respect to a substrate on which a light emitting diode element used as a backlight light source is mounted. A layer structure based on a two-layer structure of a graphite sheet and a ceramic filler-containing sheet is provided, and the carbon graphite sheet and the ceramic filler-containing sheet are adhered to each other on the back surface or the surface of the substrate, or the ceramic filler is attached to the back surface. A liquid crystal display characterized in that a backlight module is formed by providing a heat-radiating substrate and a heat-dissipating housing of a light-emitting diode element having at least a structure in which a carbon graphite sheet sprayed on is closely adhered to each other. apparatus.   In a liquid crystal display device including a liquid crystal panel, an optical system, and a backlight module, a ceramic layer is included as a filler on the back surface or the front surface of the substrate with respect to a substrate on which a light emitting diode element used as a backlight light source is mounted. The sheet has at least a three-layer structure comprising a sheet, a carbon graphite sheet, and a ceramic layer as a filler, and the heat dissipation sheet has a basic structure, and the carbon graphite sheet is sandwiched between ceramic filler-containing sheets. A liquid crystal display device, wherein a backlight module is configured by providing the heat radiating sheet having a structure also on a heat radiating substrate and a heat radiating housing of a light emitting diode element.   4. The liquid crystal display device according to claim 3, wherein the substrate on which the light emitting diode element used as the backlight light source is mounted contains ceramic layers as fillers on both sides of the carbon graphite sheet on the back surface or the surface of the substrate. A layer structure based on a three-layer structure sandwiched between sheets is provided, and a three-layer structure sheet in which a ceramic filler-containing sheet is bonded to both sides of a carbon graphite sheet is formed on the substrate, or carbon. A backlight module provided with a heat-radiating substrate and a heat-dissipating housing of a light-emitting diode element is configured by forming a three-layer structure sheet sprayed with ceramic filler on both sides of the graphite sheet on the substrate. A liquid crystal display device.   5. The liquid crystal display device according to claim 1, wherein a substrate on which a light emitting diode element used as a backlight light source is mounted is a ceramic substrate or a metal substrate, and a carbon graphite sheet and a ceramic are formed on the back surface of the substrate. By providing the filler-containing sheet, it has a three-layer structure in which both sides of the carbon graphite sheet are sandwiched between the ceramic filler-containing sheets, and the ceramic filler-containing sheets are bonded and provided on both sides of the carbon graphite sheet, or The substrate is configured by providing a ceramic layer sprayed with a ceramic filler on both sides of the carbon graphite sheet, so that a backlight module having a heat dissipation substrate and a heat dissipation housing for a light emitting diode element is configured. LCD table featuring Apparatus.   5. The liquid crystal display device according to claim 1, wherein a substrate on which a light emitting diode element used as a backlight light source is mounted is a ceramic substrate, and wiring is provided on the surface of the ceramic substrate. The light emitting diode element is mounted, and the back surface of the ceramic substrate has a three-layer structure of a ceramic substrate, a carbon graphite sheet, and a ceramic filler-containing sheet by providing a carbon graphite sheet and a ceramic filler-containing sheet, A ceramic filler-containing sheet is adhered to the back of the carbon graphite sheet, or a ceramic layer sprayed with a ceramic filler is provided on the back of the carbon graphite sheet to form the ceramic substrate. Die The liquid crystal display device, characterized in that have configured backlight module is provided with a heat radiation substrate and the heat radiating housing of over de device.   5. The liquid crystal display device according to claim 1 and 4, wherein a substrate on which a light emitting diode element used as a backlight light source is mounted is a metal substrate, and wiring is provided on the surface of the metal substrate via an insulating layer. The light-emitting diode element is mounted on the wiring, and the back surface of the metal substrate has a three-layer structure of a ceramic filler-containing sheet, a carbon graphite sheet, and a ceramic filler-containing sheet. The ceramic substrate containing sheet is formed by bonding the ceramic filler-containing sheet, or the metal substrate is formed by providing the ceramic layer sprayed with the ceramic filler on both sides of the carbon graphite sheet, thereby forming the heat dissipation substrate of the light emitting diode element. And a backlight module with a heat dissipation housing. The liquid crystal display device, characterized in that there.   In the liquid crystal display device according to any one of claims 1 to 7, the layer structure of at least a carbon graphite sheet and a ceramic layer is provided for the entire housing on which the light emitting diode element used as a backlight light source is mounted. A light emitting diode having at least a structure in which a carbon graphite sheet and a ceramic filler-containing sheet are adhered and bonded to the back surface or the surface of the casing, or a carbon graphite sheet sprayed with a ceramic filler is adhered and bonded to the back surface. A liquid crystal display device comprising a backlight module by providing a heat dissipation housing for the element.   9. The liquid crystal display device according to any one of claims 1 to 8, wherein an adhesive adhesive layer made of a resin is formed on a carbon graphite sheet provided on a substrate on which a light emitting diode element used as a backlight light source is mounted. By forming a sheet in which insulation is sufficiently ensured and at least a dielectric breakdown voltage of 1 kV or more can be achieved, a backlight module provided with a heat dissipation substrate and a heat dissipation housing for a light emitting diode element is configured. There is a liquid crystal display device.   10. The liquid crystal display device according to any one of claims 1 to 9, wherein an adhesive adhesive layer made of a resin having a high withstand voltage is provided on a side wall of a carbon graphite sheet provided on a substrate on which a light emitting diode element used as a backlight light source is mounted. The side wall of the carbon graphite sheet is covered with an insulating layer by forming a ceramic filler containing sheet on the side wall of the carbon graphite sheet or by spraying the ceramic filler on the side wall of the carbon graphite sheet. A liquid crystal display device having at least a dielectric breakdown voltage of 1 kV or more. 11. The liquid crystal display device according to any one of claims 1 to 10, wherein a sheet on which a carbon graphite sheet and a ceramic layer are introduced is provided on a substrate on which a light emitting diode element is mounted, and the substrate or casing on which the light emitting diode element is mounted is backlit. A liquid crystal display device for a cellular phone, a personal computer, or a television, characterized by being configured as a module.

Images