JP4697780B2 - Tape peeling device - Google Patents

Description

  The present invention relates to a tape peeling device, and more particularly to a tape peeling device that peels off a tape attached to mask a part of the surface of a material to be applied.

  Conventionally, various substrate coating apparatuses that apply a coating solution to a substrate or the like have been developed. For example, in an apparatus for manufacturing an organic EL (Electro Luminescence) display device, a substrate on which a hole transport material or an organic EL material is applied in a predetermined pattern shape on the main surface of a substrate such as a glass substrate placed on a stage. A coating device is used. In this substrate coating apparatus, a coating liquid (organic EL material or hole transport material) is discharged from a nozzle at a predetermined pressure. Here, the organic EL material and the hole transport material are roughly classified into a low molecular weight material and a high molecular weight material, and a high molecular weight material is generally used in a substrate coating apparatus that performs nozzle coating.

  The substrate coating apparatus applies the coating liquid to the substrate by scanning the nozzle on the substrate while increasing the coating liquid to a predetermined pressure with a pump and discharging it from the nozzle. The method of applying with a nozzle has an advantage that the application liquid can be applied at a higher speed than the method of applying the application liquid with an ink jet. However, in the method of applying the coating liquid with the nozzle, the responsiveness of the coating liquid discharge control is not high, so it is difficult to control the discharge of the coating liquid on and off. Accordingly, since it is difficult to turn on and off the discharge of the coating liquid while the nozzle is scanned on the substrate, it is not possible to select and apply the coating liquid only in a region that needs to be coated during scanning. Therefore, when performing nozzle application, after applying a coating liquid also to the area | region which does not need application | coating in a board | substrate, you have to remove the coating liquid applied to the area | region which does not require application | coating.

  For example, the four end portions of the substrate become application unnecessary regions. Further, when a plurality of organic EL display devices are produced from a single substrate, it is necessary to form application-unnecessary regions in a lattice pattern on the substrate. In other words, it is necessary to form an application-free region at a portion other than the edge of the substrate. In the case of performing nozzle coating, as a method for removing the coating liquid from the lattice-shaped application unnecessary region of the substrate, there is a method in which a masking tape is attached to the application unnecessary region for masking.

  Here, when a masking tape is affixed and the application | coating unnecessary area | region is formed, you have to peel off the masking tape affixed after the application | coating process from the board | substrate. In order to facilitate this operation, a masking tape may be attached to the substrate in advance so that one end of the masking tape can be easily held. For example, one end of the masking tape sticks out from the substrate. And when peeling a masking tape from a board | substrate, it peels by pulling up the masking tape affixed on the board | substrate while pinching the said protruding one end. Thereby, the masking tape can be easily peeled from the substrate. In the masking tape peeling process, there are human work performed by an operator himself and mechanical work performed by a peeling device having a mechanism for holding the masking tape.

Another method of peeling the masking tape from the substrate is to apply the resin solution to the substrate to which the masking tape has been applied, cure the resin solution, and then peel the masking tape from the substrate together with the resin solution. It is considered (for example, refer to Patent Document 1).
JP 2000-42921 A

  However, the coating liquid adheres to the masking tape attached to the substrate after the coating process. In addition, the coating liquid on the masking tape is also cured by the treatment for promoting the curing of the coating liquid applied to the substrate. Therefore, in the conventional peeling method, when the masking tape is peeled off, the applied material or the like attached on the masking tape may be finely broken and released and scattered on the substrate. For example, when nipping one end of the masking tape and pulling it off from the substrate for peeling, the masking tape is deformed or the upper surface of the masking tape to which the applied material is attached faces downward. As a result, the coating or the like released from the upper surface of the masking tape drops and adheres as particles on the substrate, which causes a reduction in the quality of the substrate.

  The method of Patent Document 1 is effective when a masking tape is used as sandblast resistance. However, when a masking tape is used as an anti-coating liquid, the resin solution adheres to the coated surface of the substrate, and the applied material on the substrate is peeled off or destroyed. The method of Patent Document 1 cannot be applied.

  Therefore, an object of the present invention is to provide a tape that peels off the tape from the material to be adhered while preventing a coating or the like attached on the tape adhered to the material to be adhered from falling on the material to be adhered. It is to provide a peeling apparatus.

In order to achieve the above object, the present invention has the following features.
1st invention is a masking tape peeling apparatus which peels the masking tape which affixed on the upper surface of a board | substrate, and apply | coated the coating liquid to the said board | substrate, and the coating liquid adhered to the upper surface .
The masking tape peeling apparatus includes a masking tape peeling mechanism and a first suction mechanism. The masking tape peeling mechanism to peel the masking tape from the top surface of the substrate. The first suction mechanism is when the masking tape peeling mechanism to peel the masking tape, the masking is stuck to the upper surface portion and the substrate of the masking tape was peeled from the substrate by the masking tape peeling mechanism A gas that is in the vicinity of the separation boundary with the portion of the tape and that contains particles of the coating material that is broken and released is sucked.

In a second aspect based on the first invention, the first suction mechanism, suction port toward the vicinity of the peeling boundary from the adhesive side of the masking tape is peeled from the substrate by the masking tape peeling mechanism Including.

In a third aspect based on the first invention, the first suction mechanism, suction port toward the separation boundary near the counter-adhesive face side of the masking tape is peeled from the substrate by the masking tape peeling mechanism including.

In a fourth aspect based on the first aspect, the masking tape peeling apparatus further includes a housing and a second suction mechanism. The housing, positioning the masking tape separating mechanism and the first suction mechanism therein. The second suction mechanism is when the masking tape peeling mechanism to peel the masking tape, sucks the gas in the housing unit.

In a fifth aspect based on the first invention, the masking tape peeling device, a control unit for controlling the sucking operation of the first suction mechanism further comprises. The control section stops the suction operation of the first suction mechanism after a predetermined time has elapsed after the operation of peeling the masking tape attached to the upper surface of the substrate by the masking tape peeling mechanism is completed.

According to the first invention will be liberated as particles adhered onto the masking tape at the time of peeling the masking tape, for sucking the particles generated during the peeling process by the first suction mechanism, the particles It can prevent falling and adhering on the substrate .

According to the second aspect, the first suction mechanism, it is possible to directly suck the particles generated on the adhesive surface side of the masking tape at the time of peeling the masking tape, suction of the pressure-sensitive adhesive surface side Efficiency is improved.

According to the third aspect, the first suction mechanism, it is possible to directly suck the particles of coating material or the like to be destroyed finely on anti adhesive surface of the masking tape at the time of peeling the masking tape The suction efficiency on the anti-adhesive surface side is improved.

According to the fourth aspect of the invention, it is possible to prevent particles generated inside the casing including the masking tape peeling mechanism from falling on the substrate .

According to the fifth aspect, after the masking tape peeling operation is completed, since the suction by the first suction mechanism is continued for a predetermined time, it is possible to keep the masking tape peeling device itself clean, results In particular, it is possible to prevent particles from adhering to the substrate that is put into the masking tape peeling apparatus.

  Hereinafter, a tape peeling apparatus according to an embodiment of the present invention will be described with reference to the drawings. 1A to 1C are diagrams showing the tape peeling apparatus. 1A is a top view of the tape peeling device, FIG. 1B is a side view of the tape peeling device, and FIG. 1C is a front view of the tape peeling device. Note that the tape peeling apparatus shown in FIGS. 1A to 1C also has a pasting function for sticking the masking tape to the upper surface of the substrate before the coating liquid is applied, and peels the masking tape from the upper surface of the substrate to which the coating liquid has been applied. Is.

  1A to 1C, the tape peeling device includes a table 1, a table moving mechanism 2, a first rail 3, a pasting unit 4, a peeling unit 5, a unit moving mechanism 6, a second rail 7, a support member 8, and a negative pressure pump. 91, a negative pressure source 92, and a pipe 93. The tape peeling apparatus includes a control unit (not shown) that controls the operation of each component. The control unit also controls the start and stop of a suction operation described later. A substrate, which is a material to be bonded to which the masking tape is applied and peeled off, is placed on the upper surface (mounting surface) of the table 1. The mounting surface of the table 1 is parallel to the illustrated XY plane. The lower surface of the table 1 is fixed to the upper part of the table moving mechanism 2. The table moving mechanism 2 is installed on a first rail 3 that extends in the X-axis direction, and can slide along the first rail 3. Thereby, the table moving mechanism 2 can translate the table 1 in the X-axis direction. The table moving mechanism 2 can be rotated around the Z axis shown in the figure, which is the center of the table 1, and the table 1 can be rotated around the Z axis.

  On the other hand, the support member 8 supports the two second rails 7 above the movable space of the table 1. Each second rail 7 extends in the Y-axis direction. Two sets of the support member 8 and the two second rails 7 are provided. The unit moving mechanism 6 is installed between the two sets of second rails 7 so as to be slidable along the second rails 7. As a result, the unit moving mechanism 6 can move in parallel in the Y-axis direction. The pasting unit 4 and the peeling unit 5 are fixed to the unit moving mechanism 6. 1A to 1C, the sticking unit 4 is fixed to the unit moving mechanism 6 on the Y axis negative direction side, and the peeling unit 5 is fixed to the unit moving mechanism 6 on the Y axis positive direction side. The sticking unit 4 and the peeling unit 5 are arranged at a position where the lower surface thereof is higher than the upper surface of the table 1 (position in the positive direction with respect to the Z axis). Accordingly, the unit moving mechanism 6 can move the sticking unit 4 and the peeling unit 5 in the Y-axis direction above the movable space of the table 1.

  The negative pressure pump 91 is fixed between the sticking unit 4 and the peeling unit 5. The negative pressure pump 91 supplies negative pressure to suction units 94 and 95 described later. A filter (not shown) for collecting particles contained in the gas to be sucked is provided between the negative pressure pump 91 and the suction parts 94 and 95, respectively. The negative pressure source 92 supplies negative pressure to the inside of the pasting unit 4 and the peeling unit 5 through the pipe 93. For example, the negative pressure source 92 is a negative pressure source supplied from a device other than the negative pressure pump or tape peeling device provided in the tape peeling device (factory exhaust supplied from the installation site or a separate negative pressure pump). Etc.). The pipe 93 is disposed so as to connect the negative pressure source 92 and the upper portions of the casings of the pasting unit 4 and the peeling unit 5. Note that the pipe 93 is configured to be stretchable in accordance with the movement of the attaching unit 4 and the peeling unit 5 in the Y-axis direction. Further, a filter (not shown) for collecting particles contained in the gas to be sucked is provided between the negative pressure source 92 and the pipe 93. The negative pressure pump 91 is not limited to a pump as long as it generates a negative pressure.

  Next, the structure of the pasting unit 4 will be described with reference to FIG. 2 is a diagram schematically showing the internal configuration of the sticking unit 4, and is a view as viewed in the Y-axis positive direction in FIG. 1A.

  2, the pasting unit 4 includes a housing 10, a supply reel 11, a recovery reel 12, guide rollers 13 to 15, a movable roller 16, an adjustment roller 17, a tape separating member 18, an air cylinder 19, a movable member 20, and a cutting unit. 21 and a suction part 94. The affixing unit 4 is for affixing the masking tape Ta on the upper surface of the substrate placed on the table 1.

  The casing 10 is provided with a pipe 93 on its upper surface. Then, the gas inside the housing 10 is sucked into the negative pressure source 92 through the pipe 93. Inside the housing 10 are a supply reel 11, a recovery reel 12, guide rollers 13 to 15, a movable roller 16, an adjustment roller 17, a tape separation member 18, an air cylinder 19, a movable member 20, a cutting portion 21, and a suction portion. 94 is installed.

  The supply reel 11, the recovery reel 12, the guide rollers 13 to 15, and the adjustment roller 17 are supported by the casing 10 and the like with their rotation shafts fixed. The masking tape Ta is wound around the supply reel 11 and stored. In the present embodiment, the supply reel 11 forms one tape Ta + Tb by adhering the adhesive surface of the masking tape Ta to one main surface of the base tape Tb, and winds and stores the tape Ta + Tb. ing. That is, the tape Ta + Tb wound around the supply reel 11 has a structure composed of two layers of the masking tape Ta and the base tape Tb. The tape Ta + Tb is pulled out from the supply reel 11 and guided through the outer peripheral surfaces of the guide rollers 13 to 15 so that the other main surface of the base tape Tb constituting the tape Ta + Tb contacts the tape separating member 18.

  The tape separating member 18 is fixed so that the tip end portion thereof is exposed to the opening 10 </ b> W formed on the lower surface of the housing 10. The cutting part 21 has a cutting blade 22 for cutting the masking tape Ta. The cutting unit 21 cuts only the masking tape Ta with respect to the tape Ta + Tb before being guided to the tip of the tape separating member 18 in accordance with an instruction from a control unit (not shown). Then, the tape Ta + Tb that comes into contact with the tape separating member 18 is detoured in a V shape at the tip, and is guided to the collection reel 12 via the adjustment roller 17. The adjusting roller 17 is composed of a pair of nipping rollers for nipping the tape Ta + Tb, one of which is a driving roller that rotates under the control of the control unit, and the other is a driven roller that follows the driving roller.

  When the cutting part 21 cuts only the masking tape Ta of the tape Ta + Tb, the masking tape Ta is peeled off from the base tape Tb from the cutting part at the tip part of the tape separating member 18. The peeled masking tape Ta protrudes from the opening 10W with the adhesive surface down. On the other hand, the base tape Tb peeled off from the masking tape Ta detours in a V shape at the tip of the tape separating member 18 and is guided to the recovery reel 12 via the adjustment roller 17. In this case, only the base tape Tb is wound around the collection reel 12 and collected.

  The movable roller 16 is disposed in the vicinity of the tip of the tape separating member 18. The movable member 20 supports the rotating shaft of the movable roller 16 at one end thereof. The other end of the movable member 20 is connected to an air cylinder 19 that expands and contracts according to the control of the control unit. The movable member 20 is supported so as to be rotatable around a fulcrum 23 fixed to the housing 10 or the like. The air cylinder 19 and the movable member 20 move the movable roller 16 in the vertical direction according to the expansion / contraction operation of the air cylinder 19 (see the double-headed arrow shown in FIG. 2. More precisely, the direction is an arc direction centered on the fulcrum 23. ). Note that the movable roller 16 can move to a position protruding from the opening 10 </ b> W below the lower surface of the housing 10.

  The suction part 94 is fixed with its suction port facing the space where the movable roller 16 and the tip of the tape separating member 18 are disposed. The suction unit 94 sucks the gas near the space where the suction port is directed to the negative pressure pump 91.

  Next, the structure of the peeling unit 5 will be described with reference to FIG. 3 is a diagram schematically showing the internal configuration of the peeling unit 5, and is a view in the Y-axis positive direction in FIG.

  In FIG. 3, the peeling unit 5 includes a housing 30, a supply reel 31, a collection reel 32, guide rollers 33 to 35, an adjustment roller 36, a movable roller 37, an air cylinder 38, a movable member 39, and a suction unit 95. The peeling unit 5 is for peeling the masking tape Ta from the substrate by sticking the peeling tape Tc to the masking tape Ta attached to the upper surface of the substrate. The tape peeling mechanism of the present invention corresponds to the supply reel 31, the recovery reel 32, the guide rollers 33 to 35, the adjustment roller 36, the movable roller 37, the air cylinder 38, and the movable member 39.

  The casing 30 is provided with a pipe 93 on its upper surface. Then, the gas inside the housing 30 is sucked into the negative pressure source 92 through the pipe 93. Inside the housing 30, a supply reel 31, a recovery reel 32, guide rollers 33 to 35, an adjustment roller 36, a movable roller 37, an air cylinder 38, a movable member 39, and a suction unit 95 are installed. Note that the second suction mechanism of the present invention corresponds to the negative pressure source 92 and the pipe 93.

  The supply reel 31, the recovery reel 32, the guide rollers 33 to 35, and the adjustment roller 36 are supported by their housings 30 and the like with their rotational axes fixed. The release tape Tc is wound around the supply reel 31 and stored. Unlike the masking tape Ta which is wound around the supply reel 11 and stored, the peeling tape Tc has a single-layer structure that is not bonded to another tape. The peeling tape Tc is pulled out from the supply reel 31 and guided through the outer peripheral surfaces of the guide rollers 33 and 34 so that the anti-adhesive surface comes into contact with the outer peripheral surface of the movable roller 37.

  The movable roller 37 is disposed in the vicinity of the opening 30 </ b> W formed on the lower surface of the housing 30. The movable member 39 supports the rotating shaft of the movable roller 37 at one end thereof. The other end of the movable member 39 is connected to an air cylinder 38 that expands and contracts according to the control of the control unit. The movable member 39 is supported so as to be rotatable around a fulcrum 40 fixed to the housing 30 or the like. With these air cylinder 38 and movable member 39, the movable roller 37 is moved in the vertical direction according to the expansion and contraction of the air cylinder 38 (see the double-headed arrow shown in FIG. 3. More precisely, the direction is an arc direction centered on the fulcrum 40. ). The movable roller 37 can move to a position protruding from the opening 30 </ b> W below the lower surface of the housing 30.

  The peeling tape Tc that comes into contact with the outer peripheral surface of the movable roller 37 detours along the outer peripheral surface of the movable roller 37 and is guided to the recovery reel 32 via the outer peripheral surface of the guide roller 35 and the adjustment roller 36. The adjustment roller 36 includes a pair of sandwiching rollers that sandwich the peeling tape Tc, one of which is a driving roller that rotates under the control of the control unit, and the other is a driven roller that follows the driving roller.

  When the adhesive surface of the peeling tape Tc that comes into contact with the outer peripheral surface of the movable roller 37 and the anti-adhesive surface of the masking tape Ta attached to the upper surface of the substrate come into contact with each other by the operation of the tape peeling device described later, the masking tape Ta Adheres to the adhesive surface of the release tape Tc. The bonded masking tape Ta is peeled off from the upper surface of the substrate and guided to the guide roller 35 together with the peeling tape Tb (indicated as tape Ta + Tc in FIG. 3). In this case, the masking tape Ta peeled off from the substrate together with the peeling tape Tb is also wound around the collecting reel 32 and collected.

  The suction part 95 is a suction port near the boundary (near the separation boundary) between the part peeled off from the upper surface of the substrate P and the part attached to the upper surface of the substrate P with respect to the masking tape Ta to be peeled off. To be fixed. Specifically, the suction unit 95 is fixed with its suction port facing the space where the movable roller 37 is disposed. The suction unit 95 sucks the gas near the space where the suction port is directed to the negative pressure pump 91. The first suction mechanism of the present invention corresponds to the negative pressure pump 91 and the suction unit 95.

  Next, the operation of the tape peeling device will be described by taking as an example the case where the tape peeling device described above is used in the manufacturing process of an organic EL display device. When manufacturing an organic EL display device, a coating liquid such as a hole transport material or an organic EL material is applied to a substrate (glass substrate). In order to prevent the coating liquid from being applied to the application unnecessary region on the upper surface of the substrate, the tape peeling device applies the masking tape Ta to the upper surface of the substrate. Further, the tape peeling device peels the masking tape Ta from the upper surface of the substrate after the application of the coating liquid is completed. That is, the tape peeling apparatus is used in a step of attaching the masking tape Ta to the substrate (sticking step) and a step of peeling the masking tape Ta from the upper surface of the substrate after application (peeling step).

  First, the outline of the manufacturing process of the organic EL display device will be described with reference to FIGS. FIG. 4 is a diagram showing the substrate P on which the masking tape Ta is attached. FIG. 5 is a diagram showing a state in which the coating liquid is applied to the upper surface of the substrate P on which the masking tape Ta is attached. FIG. 6 is a diagram showing the substrate P peeled off from the upper surface of the substrate P after the masking tape Ta is applied.

  In FIG. 4, two masking tapes Ta are attached to one main surface of the substrate P in the attaching step. One masking tape Ta is affixed in parallel to the one side (left and right direction in FIG. 4) at a position that is a predetermined length away from one side of the substrate P having a substantially rectangular main surface. The other masking tape Ta is affixed in parallel to the facing side at a position away from the side facing the one side by a predetermined length.

  In FIG. 5, a region A on the substrate P is a region where the coating liquid is applied. As shown in FIG. 5, in the coating step, the coating liquid is applied to the upper surface of the substrate P on which the masking tape Ta is attached. As a coating method, for example, using a nozzle that discharges the coating liquid toward the upper surface of the substrate P while reciprocating in a predetermined direction, the substrate P is moved horizontally at a predetermined pitch in a direction perpendicular to the reciprocating direction. A method is conceivable. In FIG. 5, it is assumed that the coating liquid is applied in stripes in a direction perpendicular to the direction in which the masking tape Ta on the upper surface of the substrate P is applied (the vertical direction in FIG. 5). Note that the substrate P on which the coating liquid is applied may be processed so that the coating liquid is cured in a desired state by being preheated.

  In FIG. 6, when the masking tape Ta is peeled from the substrate P on which the coating liquid is applied to the region A shown in FIG. 5, three regions A1 to A3 divided by the region E are formed. In the peeling step, the masking tape Ta is peeled off from the upper surface of the substrate P after the coating liquid is applied by a tape peeling device. As shown in FIG. 6, since the upper surface area E of the substrate P between the area A1 and the area A2 is an area where the masking tape Ta has been adhered, the coating liquid is not attached. In the region E between the region A2 and the region A3, the coating liquid is not attached as in the upper surface region E of the substrate P between the region A1 and the region A2. In the present embodiment, the use of the masking tape Ta as described above prevents the coating liquid from adhering to the upper surface region of the substrate P that does not require coating. Note that an area E indicated by a one-dot chain line in FIG. 6 is an area used as one organic EL display device, and an area outside the area E is cut and discarded.

  Here, when manufacturing the organic EL display device, a coating liquid such as a hole transport material or red, green, and blue organic EL materials is applied to the substrate P. As shown in FIG. 7, the specific order of the manufacturing process is that, after a bank (wall) is formed on the upper surface of the substrate P, a sticking process and a peeling process are performed for each coating liquid coating process using a tape peeling device. Is called. For example, when a red organic EL material is applied to the substrate P, the masking tape Ta is applied before the coating process, the substrate P is preheated after the coating process, the masking tape Ta is peeled off, and the baking process is performed. Is called. And new masking tape Ta is affixed on the board | substrate P again before apply | coating another coating liquid.

  Next, with reference to FIG. 1A to FIG. 1C and FIG. 8A to FIG. 8C, a detailed operation in which the tape peeling device described above applies the masking tape Ta to the upper surface of the substrate P will be described. 8A to 8C are schematic views showing the state of the vicinity of the opening 10W of the housing 10, and show the operation of the tape peeling device for attaching the masking tape Ta to the upper surface of the substrate P step by step. 8A to 8C, the casing 10, the air cylinder 19, and the movable member 20 are not shown for the purpose of making the drawings easy to see.

  First, the substrate P is placed on the upper surface of the table 1 before the operation of the tape peeling device is started. In this initial state, the table 1 is disposed outside the two support members 8, for example, at the position shown in FIG. 1A, and the direction in which the masking tape Ta is applied to the substrate P by the rotation of the table moving mechanism 2. Is adjusted. In addition, when the table 1 is positioned between the two support members 8, the pasting unit 4 in the initial state is a space directly above the table 1 and affixes the masking tape Ta to the substrate P placed on the table 1. It moves in the Y-axis direction so that it becomes a position. Then, the negative pressure pump 91 and the negative pressure source 92 are driven, and suction is started from the suction portion 94 and the pipe 93.

  From such an initial state, horizontal movement of the table 1 in the X-axis direction is started. The table 1 moves in a direction approaching the sticking unit 4 (X-axis direction in FIG. 1A). Further, the supply reel 11, the recovery reel 12, and the adjustment roller 17 of the sticking unit 4 start to rotate in the direction in which the tape Ta + Tb is guided (see FIG. 2). As a result, the tape Ta + Tb supplied from the supply reel 11 is guided to the tip end portion of the tape separating member 18, and the tape Ta + Tb is wound around the collection reel 12 and collected. The feed speed of the tape Ta + Tb by the supply reel 11, the recovery reel 12, and the adjustment roller 17 is set to be equal to the horizontal movement speed of the table 1 in the X-axis direction.

  In FIG. 8A, when the substrate P placed on the table 1 reaches a predetermined position just below the sticking unit 4, the cutting unit 21 cuts the masking tape Ta. Specifically, the cutting unit 21 cuts only the masking tape Ta by causing the cutting blade 22 to protrude toward the anti-adhesive surface of the masking tape Ta bonded to the base tape Tb and to bite only into the masking tape Ta. . Here, the tape Ta + Tb guided from the guide roller 15 to the tape separating member 18 is composed of two layers of a masking tape Ta and a base tape Tb. The cutting blade 22 is adjusted to bite to a depth at which only the masking tape Ta is cut with respect to the guided tape Ta + Tb. Therefore, the masking tape Ta is cut by the cutting part 21, but the base tape Tb is not cut.

  When the tape Ta + Tb is further fed after the masking tape Ta is cut by the cutting portion 21, the cutting position of the masking tape Ta reaches the tip of the tape separating member 18. Since the base tape Tb detours in a V shape at the tip of the tape separating member 18, the masking tape Ta is peeled off from the base tape Tb from the cutting position (starting end). As a result, the masking tape Ta is peeled off from the tip of the tape separating member 18 and protrudes downward in the attaching unit 4.

  The movable roller 16 moves downward (Y-axis negative direction) by the expansion / contraction operation of the air cylinder 19 at the timing when the start end of the masking tape Ta protrudes downward from the tip end portion of the tape separating member 18 (state of FIG. 8B). By this operation, the outer peripheral surface of the movable roller 16 comes into contact with the anti-adhesive surface of the masking tape Ta, and the masking tape Ta is further pushed down. Then, the movable roller 16 moves to the vicinity of the upper surface of the substrate P located directly below the anti-adhesive surface of the masking tape Ta in contact with the outer peripheral surface thereof, so that the adhesive surface of the masking tape Ta becomes the upper surface of the substrate P. Abut. As a result, the vicinity of the starting end of the masking tape Ta is attached to the substrate P. When the vicinity of the starting end of the masking tape Ta is attached to the substrate P, the movable roller 16 moves upward and returns to the original position.

  Further, while the movable roller 16 moves in the vertical direction, the horizontal movement operation of the table 1 and the feeding operation of the tape Ta + Tb are continued. Therefore, when the masking tape Ta is affixed to the upper surface of the substrate P, the masking tape Ta to be subsequently supplied is sequentially affixed to the upper surface of the substrate P (state of FIG. 8C). On the other hand, when the tape Ta + Tb having a predetermined length is sent after cutting the masking tape Ta, the cutting unit 21 cuts only the masking tape Ta again. The predetermined length is the length of the masking tape Ta to be attached to the substrate P. After the cutting by the cutting unit 21 is performed again, the masking tape Ta is attached to the substrate P up to the cutting position (terminal) where the tape Ta + Tb is further fed to be cut again. Note that the vicinity of the end of the masking tape Ta may be forcibly brought into contact with the substrate P by moving the movable roller 16 up and down again. Further, the movable roller 16 may be kept pressed against the substrate P through the masking tape Ta during the masking tape Ta attaching operation. With the above operation, the process of attaching one masking tape Ta to the upper surface of the substrate P is completed. Then, after the pasting process is completed and the tape Ta + Tb feed drive is stopped and a predetermined time has elapsed, suction from the suction portion 94 and the pipe 93 is stopped.

  As described above, the tape peeling apparatus can apply the masking tape Ta to the upper surface of the substrate P along the X-axis direction using the mounted tape application mechanism. The position in the X-axis direction where the starting end of the masking tape Ta is attached can be set to an arbitrary position by adjusting the timing for cutting the masking tape Ta. On the other hand, the position in the Y-axis direction where the masking tape Ta is applied can be set to an arbitrary position by moving the application unit 4 in the Y-axis direction in advance by the unit moving mechanism 6. Here, when the tape Ta + Tb is sent inside the casing 10 of the sticking unit 4 or the masking tape Ta is peeled off from the base tape Tb, particles may be generated inside the casing 10. However, when the masking tape Ta is applied, the gas in the space in the vicinity of the opening 10W where the distal ends of the movable roller 16 and the tape separating member 18 are disposed is sucked by the suction portion 94. Further, the gas inside the housing 10 is sucked through the pipe 93. Therefore, it is possible to prevent the particles from falling on the substrate P in the operation of attaching the masking tape Ta to the substrate P.

  Next, with reference to FIGS. 1A to 1C and FIGS. 9A to 9D, a detailed operation in which the tape peeling apparatus described above peels the masking tape Ta from the upper surface of the substrate P will be described. 9A to 9D are schematic views showing the state of the vicinity of the opening 30W of the housing 30, and show the operation of the tape peeling device for peeling the masking tape Ta from the upper surface of the substrate P step by step. 9A to 9D, the housing 30, the air cylinder 38, and the movable member 39 are not shown for the purpose of making the drawings easy to see.

  First, the substrate P on which the coating liquid is applied is placed on the upper surface of the table 1 before the operation of the tape peeling device is started. The initial position of the table 1 in the peeling step is arranged outside the two support members 8 as in the pasting step, and the masking tape Ta to be peeled is directed in the X-axis direction by the rotation operation of the table moving mechanism 2. To be adjusted. The peeling unit 5 in the initial state has a space immediately above the table 1 when the table 1 is positioned between the two support members 8 and the movable roller 37 is positioned on the extended line of the masking tape Ta to be peeled off. To move in the Y-axis direction. In other words, the peeling unit 5 is arranged so that the position of the masking tape Ta to be peeled from the substrate P and the position of the movable roller 37 are the same in the Y-axis direction. Then, the negative pressure pump 91 and the negative pressure source 92 are driven, and suction is started from the suction unit 95 and the pipe 93.

  From such an initial state, horizontal movement of the table 1 in the X-axis direction is started. The table 1 moves in a direction approaching the peeling unit 5 (X-axis direction in FIG. 1A). Furthermore, the supply reel 31, the recovery reel 32, and the adjustment roller 36 of the peeling unit 5 start to rotate in the direction in which the peeling tape Tc is guided (see FIG. 3). As a result, the peeling tape Tb supplied from the supply reel 31 is guided to a position where the outer peripheral portion of the movable roller 37 and its anti-adhesive surface abut, and the peeling tape Tc is wound around the collecting reel 32 and collected. . Note that the feeding speed of the peeling tape Tc by the supply reel 31, the recovery reel 32, and the adjustment roller 36 is set to be equal to the horizontal movement speed of the table 1 in the X-axis direction.

  In FIG. 9A, when the table 1 moves horizontally from the initial state, when the leading end of the masking tape Ta attached to the substrate P reaches a position directly below the movable roller 37, the movable roller 37 is expanded and contracted by the air cylinder 38. Move down. Here, the anti-adhesive surface of the peeling tape Tc is in contact with the outer peripheral surface of the movable roller 37, and the peeling tape Tc is detoured upward along the outer peripheral surface of the movable roller 37, so that the expansion and contraction operation is performed. Accordingly, the peeling tape Tc also moves downward. Eventually, when the movable roller 37 moves to the vicinity of the upper surface of the substrate P, the adhesive surface of the peeling tape Tc comes into contact with the anti-adhesive surface near the starting end of the masking tape Ta (state of FIG. 9B).

  When the peeling tape Tc comes into contact with the masking tape Ta, the movable roller 37 moves upward and returns to the original position. At this time, since the vicinity of the starting end of the masking tape Ta is adhered to the adhesive surface of the peeling tape Tc, the starting end of the masking tape Ta is pulled up from the upper surface of the substrate P and peeled off (state shown in FIG. 9C). Then, the masking tape Ta adhered to the peeling tape Tc is peeled off from the upper surface of the substrate P and guided to the guide roller 35 together with the peeling tape Tb.

  Further, while the movable roller 37 is moving in the vertical direction, the horizontal movement operation of the table 1 and the feeding operation of the peeling tape Tc are continued. Therefore, when the vicinity of the start end of the masking tape Ta is affixed to the peeling tape Tc, the masking tape Ta is sequentially affixed to the subsequently supplied peeling tape Tc (state of FIG. 9D). Thereafter, since the horizontal movement operation of the table 1 and the feeding operation of the peeling tape Tc are continued, the masking tape Ta is attached to the peeling tape Tc to the end and peeled off from the upper surface of the substrate P. The masking tape Ta affixed to the adhesive surface of the peeling tape Tc is collected in the housing 30 by the feeding operation of the peeling tape Tc, and is collected on the collection reel 32 via the guide roller 35 and the adjustment roller 36. . With the above operation, the process of peeling one masking tape Ta to be peeled from the upper surface of the substrate P is completed.

  Further, while the peeling unit 5 performs the process of peeling the masking tape Ta from the substrate P, the suction unit 95 continues to suck the vicinity of the movable roller 37. In the example shown in FIG. 3 and FIGS. 9A to 9D, the suction port of the suction part 95 is arranged facing the adhesive surface side of the masking tape Ta immediately after being peeled. Therefore, the suction unit 95 can suck particles such as an applied material that are destroyed and released during the peeling process. And after the process which peels is completed and the feed drive of the peeling tape Tc is stopped and predetermined time passes, the suction from the suction part 95 and the piping 93 is stopped.

  As described above, the tape peeling apparatus can peel the masking tape Ta attached along the X-axis direction of the upper surface of the substrate P. The X-axis direction position of the starting end of the masking tape Ta to be peeled can be set to an arbitrary position by adjusting the timing for lowering the movable roller 37. On the other hand, the Y-axis direction position of the masking tape Ta to be peeled can be set to an arbitrary position by moving the peeling unit 5 in the Y-axis direction in advance by the unit moving mechanism 6.

  Here, the coating liquid adheres to the masking tape Ta attached to the upper surface of the substrate P after the coating process. In addition, the curing of the coating solution applied to the substrate P may have progressed to some extent. Therefore, when the masking tape Ta is peeled off, the applied material or the like attached on the masking tape Ta is finely broken and released as particles. However, by attracting particles generated during the peeling process from the suction unit 95, it is possible to prevent the particles from falling on and attaching to the substrate P. Further, when the peeling tape Tc or the used masking tape Ta attached together with the peeling tape Tc is sent inside the casing 30 of the peeling unit 5, particles may be generated inside the casing 30. However, when the masking tape Ta is peeled off, the gas inside the housing 30 is sucked through the pipe 93. Therefore, it is possible to prevent particles generated inside the housing 30 from falling on the substrate P in the operation of peeling the masking tape Ta on the substrate P.

  In the above description, the suction port of the suction part 95 is disposed toward the adhesive surface side of the masking tape Ta immediately after being peeled off, but the place where the suction part 95 is disposed is not limited to this position. For example, as shown in FIG. 10, the suction port of the suction portion 95 may be disposed toward the anti-adhesive surface side of the masking tape Ta immediately after being peeled off. In this case, since the suction part 95 can directly suck particles such as a coating material that is finely broken on the anti-adhesive surface of the masking tape Ta when peeling, the suction efficiency is improved. In addition, the masking tape Ta to be peeled may be placed with the suction port facing near the peeling boundary between the part peeled off from the upper surface of the substrate P and the part stuck on the upper surface of the substrate P. For example, the suction part 95 may be fixed at another position. If the suction port of the suction unit 95 is arranged near the masking tape Ta immediately after being peeled, particles generated near the position where the suction is removed from the substrate P can be removed. Furthermore, a plurality of suction portions 95 may be fixed and disposed so as to face the masking tape Ta immediately after each suction port is peeled off.

  In the above description, the sticking and peeling processing of the masking tape Ta is performed while moving the table 1 on which the substrate P is placed in the X-axis direction. However, the sticking unit 4 and the peeling unit 5 are fixed with the substrate P fixed. It may be moved in the negative X-axis direction opposite to the above. It goes without saying that the same effect can be obtained if at least one of the pasting unit 4 and the peeling unit 5 and the substrate P relatively move in the X-axis direction.

  In the above-described embodiment, the organic EL display device manufacturing apparatus has been described as an example. However, the present invention uses another coating liquid as long as the apparatus uses a masking tape when the coating liquid is applied to the substrate. It can also be applied to manufacturing equipment. For example, the present invention can be applied to an apparatus for peeling a masking tape from a substrate masked with a masking tape when a fluorescent material for plasma display, a resist solution, an SOG (Spin On Glass) solution, or the like is applied.

  The tape peeling apparatus according to the present invention peels off the tape from the material to be adhered while preventing a coating or the like attached on the tape adhered to the material to be adhered from falling on the material to be adhered. It is useful as an apparatus for peeling the masking tape from the substrate masked with a masking tape or the like when applying the coating liquid.

The top view of the tape peeling apparatus which concerns on one Embodiment of this invention. The side view of the tape peeling apparatus which concerns on one Embodiment of this invention The front view of the tape peeling apparatus which concerns on one Embodiment of this invention The figure which shows typically the internal structure of the sticking unit 4 of FIG. 1A-FIG. 1C. The figure which shows typically the internal structure of the peeling unit 5 of FIG. 1A-FIG. 1C. The figure which shows the board | substrate P in which the masking tape Ta was affixed The figure which shows the state which apply | coated the coating liquid on the upper surface of the board | substrate P with which masking tape Ta was affixed. The figure which shows the board | substrate P which the masking tape Ta peeled from the board | substrate P upper surface after application | coating The figure which shows the order of the manufacturing process which manufactures an organic electroluminescence display. The schematic diagram which shows the mode of the opening part 10W vicinity of the housing | casing 10 in the operation | movement of the 1st step in which the tape peeling apparatus affixes the masking tape Ta on the upper surface of the board | substrate P. The schematic diagram which shows the mode of the opening part 10W vicinity of the housing | casing 10 in the operation | movement of the 2nd step in which a tape peeling apparatus affixes the masking tape Ta on the upper surface of the board | substrate P. FIG. The schematic diagram which shows the mode of the opening part 10W vicinity of the housing | casing 10 in the operation | movement of the 3rd step in which a tape peeling apparatus affixes the masking tape Ta on the upper surface of the board | substrate P. FIG. The schematic diagram which shows the mode of the opening part 30W vicinity of the housing | casing 30 in the operation | movement of the 1st step in which the tape peeling apparatus peels the masking tape Ta from the upper surface of the board | substrate P. The schematic diagram which shows the mode of the opening part 30W vicinity of the housing | casing 30 in the operation | movement of the 2nd step in which the tape peeling apparatus peels the masking tape Ta from the upper surface of the board | substrate P. The schematic diagram which shows the mode of the opening part 30W vicinity of the housing | casing 30 in the operation | movement of the 3rd step in which the tape peeling apparatus peels the masking tape Ta from the upper surface of the board | substrate P. The schematic diagram which shows the mode of the opening part 30W vicinity of the housing | casing 30 in the operation | movement of the 4th step in which the tape peeling apparatus peels the masking tape Ta from the upper surface of the board | substrate P. The figure which shows the example arrange | positioned toward the anti-adhesion surface side of the masking tape Ta just after peeling the suction opening of the suction part 95

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Table 2 ... Table moving mechanism 3 ... 1st rail 4 ... Pasting unit 5 ... Separation unit 6 ... Unit moving mechanism 7 ... 2nd rail 8 ... Support member 10,30 ... Housing | casing 11,31 ... Supply reel 12,32 ... Recovery reels 13-15, 33-35 ... Guide rollers 16, 37 ... Moving rollers 17, 36 ... Adjusting rollers 18 ... Tape separating members 19, 38 ... Air cylinders 20, 39 ... Moving members 21 ... Cutting portions 22 ... Cutting blades 23, 40 ... fulcrum 91 ... negative pressure pump 92 ... negative pressure source 93 ... piping 94, 95 ... suction part

Claims (5)

Affixed to the upper surface of the substrate, a masking tape peeling device for peeling the masking tape coating liquid adheres to the upper surface when applying the coating solution to the substrate,
And masking tape peeling mechanism for peeling the masking tape from the top surface of the substrate,
When the masking tape peeling mechanism to peel the masking tape, peeling the vicinity of the boundary between portions of the masking tape by the masking tape peeling mechanism is stuck on the upper surface of the site and the substrate of the masking tape was peeled from the substrate And a first suction mechanism for sucking a gas containing particles of an applied material that is broken and released when the masking tape is peeled off. The first suction mechanism, the masking tape by the peeling mechanism comprises an inlet towards the release near the boundary from the adhesive side of the masking tape is peeled from the substrate, masking tape peeling device according to claim 1 . The first suction mechanism, comprising said masking tape peeling inlet toward the peeling boundary near the counter-adhesive face side of the masking tape is peeled from the substrate by a mechanism, the masking tape peeling according to claim 1 apparatus. The masking tape peeling device is
A housing in which the masking tape peeling mechanism and the first suction mechanism are disposed;
The masking when the tape peeling mechanism to peel the masking tape, said second suction mechanism for sucking the housing portion of the gas, further comprising a masking tape separating device according to claim 1. The masking tape peeling apparatus further includes a control unit that controls a suction operation of the first suction mechanism,
The control unit stops the suction operation of the first suction mechanism after a predetermined time has elapsed after the operation of peeling the masking tape attached to the upper surface of the substrate by the masking tape peeling mechanism is completed. The masking tape peeling apparatus according to claim 1.

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