JP4696505B2 - Electronics - Google Patents

Description

  The present invention relates to a panel part constituting a housing for housing a circuit board, a conductive part provided on the outer surface of the panel part, and the conductive part for preventing charging of the conductive part The present invention relates to an electronic device including a conductive member extending from or to the ground portion on the circuit board.

  In general, in an electronic device, in order to prevent adverse effects on electronic components on a circuit board due to static electricity generated in a resin panel or the like constituting a housing, by connecting the panel or the like to the ground of the circuit board, Static electricity to be accumulated in a panel or the like is forcibly attenuated (see, for example, Patent Documents 1 to 3).

  FIG. 5 is a cross-sectional view showing an example of countermeasures against static electricity in such a conventional electronic device. In this electronic device, a lead plate 53 is used in order to release static electricity that is to be accumulated in the plated part 52 provided on the panel 51. One end of the lead plate 53 is fixed to a metal portion 54 connected to the ground of the circuit board, and the other end is in contact with the back surface of the plated part 52 by elastic force.

  According to this configuration, since the static electricity on the plated part 52 flows to the ground side through the lead plate 53 and the metal part 54, the plated part 52 is not charged. Thereby, static electricity accumulates in the plated part 52, and this static electricity can be prevented from adversely affecting the electronic component.

  FIG. 6 is a sectional view showing a conventional example of countermeasures against static electricity in a memory card case. As shown in the figure, in this memory card case, an exterior plate 61 that houses a printed circuit board and a bottom plate 62 are connected by a spring 63. The exterior plate 61 and the bottom plate 62 are subjected to conductive plating. The bottom plate 62 is connected to a common earth line with the printed circuit board.

  According to this, since the conductive exterior plate 61 and the bottom plate 62 are connected to the ground line, the inside and outside of the housing can be held at an equal potential. Therefore, accumulation of static electricity is suppressed, and it is possible to prevent the IC chip or the like on the printed circuit board from being destroyed by static electricity discharge.

Japanese Patent Laid-Open No. 5-114792 JP 2001-291988 A JP 2002-368436 A

  However, if a sheet metal member such as a lead plate is used to release static electricity as in the prior art of FIG. 5 described above, a metal mold used for the sheet metal is required and the number of parts increases. To rise. In addition, if an electronic component exists around the lead plate, static electricity may fly from the lead plate to the electronic component.

  On the other hand, since the countermeasure against static electricity as shown in FIG. 6 is applicable when the housing is thin like a memory card case, it is difficult to directly apply it to an electronic device having a certain thickness. is there.

  An object of the present invention is to make it possible to take countermeasures against static electricity with a simpler configuration in an electronic device in view of the problems of the prior art.

  In order to achieve this object, an electronic device according to the present invention includes a panel portion that constitutes a housing that houses a circuit board, a conductive component provided on the outer surface of the panel portion, and a conductive component. An electronic device provided with a conductive member reaching the ground part on the circuit board or the vicinity thereof, and the inner side is a through hole extending from the outer surface of the panel part to the ground part on the circuit board or the vicinity thereof. The non-conductive columnar part is provided, and the conductive member reaches the ground part or its vicinity through the through hole.

  Here, examples of the electronic device include a car audio system and a mobile phone. As the circuit board, for example, a printed board having an electronic component such as an IC is applicable. As the conductive part, for example, a plated decorative panel is applicable. As a panel part, the thing made from resin integrally molded with the said columnar part corresponds, for example. However, the columnar part may not be integrally molded with the panel part, and may be attached to the panel part by adhesion or fitting. Examples of the columnar portion include a cylindrical one and a prismatic one.

  In this configuration, the charge to be accumulated in the conductive component is guided to the ground side of the circuit board through the conductive member. At this time, since the conductive member passes through the through-hole inside the non-conductive columnar portion, there is no fear that the electric charge will fly to the surrounding electronic component and adversely affect the electronic component. Further, the columnar member and the conductive member can be easily configured by integral molding with the panel portion and the conductive component. Therefore, an adverse effect on the electronic component due to charging of the conductive component can be prevented with no trouble with a simple configuration.

  An electronic device according to a second invention is characterized in that, in the first invention, the conductive component is a plated component formed by plating a resin member.

  According to a third aspect of the present invention, there is provided the electronic device according to the second aspect, wherein the plated component is provided with a rod-shaped portion that is molded integrally with the plated component and plated, and the conductive member is formed by the rod-shaped portion. It is configured.

  According to a fourth aspect of the present invention, in the electronic device according to the first or second aspect, the conductive member uses a spring having one end in contact with the ground portion of the circuit board and the other end in contact with the conductive component. It is configured.

  The electronic device according to a fifth aspect of the present invention is characterized in that, in the fourth aspect, the conductive component has a convex portion fitted in the through hole of the columnar member.

  According to the present invention, it is possible to prevent the conductive parts from being charged with no trouble by a simple configuration.

  FIG. 1 shows an essential part of an electronic apparatus according to an embodiment of the present invention in the form of an assembly drawing. FIG. 2 is a sectional view of the main part. As shown in these drawings, the electronic apparatus includes a panel 1 that constitutes a part of a housing that houses a circuit board 21, and a plated component 2 that is provided on the outer surface of the panel 1. In the figure, reference numeral 21 a denotes a ground portion for applying a ground potential in the circuit board 21.

  The panel 1 has a cylindrical portion 1a extending from the back surface of the panel 1 to the vicinity of the ground portion 21a. A through hole 1b extending from the outer surface of the panel 1 to the vicinity of the ground portion 21a is provided along the axial direction inside the cylindrical portion 1a. The panel 1 is made of resin and is integrally molded with the cylindrical portion 1a.

  The plated component 2 has a rod-shaped portion 2 a that is molded integrally with the plated component 2. The rod-like part 2a passes through the through hole 1b and extends to the ground part 21a. The plated part 2 is plated on the entire surface including the rod-like portion 2a, and is imparted with conductivity. The end of the rod-like portion 2a on the circuit board 21 side is close to the ground portion 21a or close enough to prevent charging of the plated component 2 without hindrance.

  The plated part 2 is attached to the panel 1 by inserting the rod-like part 2a from the outer surface side of the panel 1 into the through hole 1b of the cylindrical part 1a and bonding the main body of the plated part 2 to the panel 1 with double-sided tape or the like. It can be carried out.

  In this configuration, excess electric charges that are generated due to friction or the like and are to be accumulated in the plated component 2 are guided to the ground portion 21a through the rod-shaped portion 2a and removed, so that excessive static electricity is accumulated in the plated component 2. Never happen. During this time, since the rod-like portion 2b is surrounded by the non-conductive cylindrical portion 1a, the charges moving through the rod-like portion 2a do not fly to nearby electronic components.

  According to this embodiment, the cylindrical portion 1a and the rod-shaped portion 2a are formed by integral molding with the panel 1 and the plated component 2, respectively, and the rod-shaped portion 2a can be plated simultaneously with the plated component 2. In addition, since a sheet metal part such as the lead plate 53 in FIG. 5 is unnecessary, it is possible to take countermeasures against static electricity with a very easy and simple configuration.

  FIG. 3 shows an essential part of an electronic apparatus according to another embodiment of the present invention in the form of an assembly drawing. In the figure, 31 is a panel constituting the casing of the electronic device, and 32 is a cylindrical portion fixed to the panel 31. The cylindrical portion 32 is provided with a through hole 32a penetrating in the axial direction. The panel 31 is provided with a fitting hole 31 a for fitting one end of the cylindrical portion 32 and fixing the cylindrical portion 32 to the panel 31. In the form of FIG. 1, the tubular part 1 a is formed by integral molding with the panel 1 body, but in this embodiment, the tubular part 32 is configured as a separate part from the panel 31.

  When the cylindrical portion 32 is fitted into the fitting hole 31a and fixed, the panel 31 and the cylindrical portion 32 form the same shape as the panel 1 of FIG. On the other hand, the plated component 2 can be attached in the same manner as in FIG.

  Thus, even when the cylindrical portion 32 is configured as a component different from the panel 31, it is possible to take countermeasures against static electricity with a simple configuration. Other configurations and operational effects are the same as those of the embodiment of FIGS. 1 and 2.

  FIG. 4A shows an essential part of an electronic apparatus according to still another embodiment of the present invention in the form of an assembly drawing. In the figure, reference numeral 41 denotes a spring inserted into the cylindrical portion 1a, and reference numeral 42 denotes a plated component fixed to the panel 1. The plated component 42 has a convex portion 42 a that fits into the through hole 1 b of the tubular portion 1 a when being fixed to the panel 1.

  The plated part 42 can be attached by fitting the convex part 42a from the outer surface side of the panel 1 to the through hole 1b of the cylindrical part 1a and fixing it to the panel 1 by adhesion or the like. The spring 41 is inserted into the through-hole 1b from the back side of the panel 1, and is attached so that one end contacts the convex portion 42a and the other end contacts the ground portion 21a (FIG. 2) of the circuit board 21.

  According to the present embodiment, even when it is difficult to form a long conductive member such as the rod-like portion 2a in the case of the embodiment of FIG. You can take measures against static electricity by supplementing the length of. Other configurations and operational effects are the same as those of the embodiment of FIGS.

  The present invention is not limited to the above-described embodiments, and can be implemented with appropriate modifications. For example, in the above-described embodiment shown in FIG. 4A, the protruding part 42a is provided on the plated part 42, and this is fitted into the through hole 1b to position the plated part 42. Instead, a plated part 43 having no projection as shown in FIG. In this case, one end of the spring 41 is in direct contact with the back surface of the plated component 43.

  In each of the above-described embodiments, the cylindrical portion 1a and the cylindrical portion 32 are used as the nonconductive member surrounding the conductive member. Instead, a polygonal columnar shape having a through hole in the axial direction, or the like. These columnar members may be used.

It is a figure which shows the principal part of the electronic device which concerns on one Embodiment of this invention in the format of an assembly drawing. It is sectional drawing of the principal part of FIG. It is a figure which shows the principal part of the electronic device which concerns on other embodiment of this invention in the format of an assembly drawing. It is a figure which shows the principal part of the electronic device which concerns on another embodiment of this invention in the form of an assembly drawing, and the figure which shows another example of a plating component. It is sectional drawing which shows an example of the countermeasure against static electricity in the conventional electronic device. It is sectional drawing which shows the prior art example of the countermeasure against static electricity in a memory card case. It is sectional drawing which shows such a part.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 31, 51: Panel, 1a, 32: Cylindrical part, 1b, 32a: Through-hole, 2, 42, 43: Plated part, 2a: Rod-like part, 21: Circuit board, 21a: Ground part, 31a: Fitting Joint hole, 41, 63: spring, 42a: convex part, 52: plated part, 53: lead plate, 54: metal part, 61: exterior plate, 62: bottom plate.

Claims (2)

A panel portion constituting a housing for storing a circuit board;
Conductive parts provided on the outer surface of the panel portion,
The aforementioned conductive parts protrudes from a surface in contact with the outer surface of the panel portion, contacts the tip to the surface of the ground portion on the circuit board, or the rod-shaped portion faces close to that formed by integrally molding And
The panel portion is formed with a non-conductive cylindrical portion inserted from the inner surface of the panel portion into which the rod-shaped portion is inserted and extending to the vicinity of the ground portion on the circuit board. Electronics.   The electronic device according to claim 1, wherein the conductive part is a plated part formed by plating a resin member.

Images