JP2008186072A - Read/write device for semiconductor memory card - Google Patents

Read/write device for semiconductor memory card Download PDF

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JP2008186072A
JP2008186072A JP2007016665A JP2007016665A JP2008186072A JP 2008186072 A JP2008186072 A JP 2008186072A JP 2007016665 A JP2007016665 A JP 2007016665A JP 2007016665 A JP2007016665 A JP 2007016665A JP 2008186072 A JP2008186072 A JP 2008186072A
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semiconductor memory
memory card
write device
read
housing
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Masaaki Kiyomiya
雅明 清宮
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YE Data Inc
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YE Data Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a read/write device for a semiconductor memory card for preventing static electricity from being discharged to a semiconductor memory card at a mounting position of the semiconductor memory card. <P>SOLUTION: In the read/write device for a semiconductor memory card provided with a semiconductor memory card connector 6, a metal chassis 4 provided with an insertion opening for inserting a semiconductor memory card 1 into the connector 6, and a peripheral circuit for reading/writing data from/to the semiconductor memory card 1, a front molded panel 2 made of synthetic resin provided with a semiconductor memory card insertion opening 2a on the front of the chassis 4 and protrusions 2c, 2c protruding from a rear end of the semiconductor memory card 1 at the mounting position toward a user over and under the insertion opening 2a is mounted, slits 2b, 2b are provided at the top parts of the protrusions 2c, 2c, and an electrostatic induction plate 3 made of a metallic plate provided with protrusion pieces 3b, 3b whose points are inserted into the slits 2b, 2b is provided between the metal chassis 4 and the front molded panel 2. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、実装した半導体メモリーカードの静電気による破壊から保護するための半導体メモリーカード読み書き装置に関するものである。   The present invention relates to a semiconductor memory card read / write device for protecting a mounted semiconductor memory card from static damage.

半導体メモリーカード読み書き装置においては、装置を操作する人体等からの静電気の放電による、半導体メモリーカード及び半導体メモリーカード読み書き装置の破壊・誤動作の問題がある。   The semiconductor memory card read / write device has a problem of destruction and malfunction of the semiconductor memory card and the semiconductor memory card read / write device due to electrostatic discharge from a human body or the like who operates the device.

従来、この問題を解決する方法として、例えばカード挿入口の内側に、挿入口に倣った切欠けを設けた静電気誘導板をコネクタ端子の前方に配置する方法や、カードを装置の挿入口に挿入する際、カード挿入側に設けられた接地電位の除電用部材に接触させる方法等の方策が講じられてきた。   Conventionally, as a method for solving this problem, for example, an electrostatic induction plate provided with a notch following the insertion slot inside the card insertion slot is disposed in front of the connector terminal, or a card is inserted into the insertion slot of the apparatus. In doing so, measures such as a method of contacting a static elimination member having a ground potential provided on the card insertion side have been taken.

しかし、これらの方法は静電気の放電に対してカード読み書き装置を保護することは出来るが、カードの実装位置において、カードそのものへ放電されることを阻止することができず、カードの破壊・誤動作の懸念は解決することができず、十分ではなかった。
特開２００３−２２９２１３号公報 特開平５−１９７８５０号公報 However, these methods can protect the card read / write device against electrostatic discharge, but cannot prevent the card from being discharged to the card itself at the mounting position of the card. Concerns could not be resolved and were not sufficient.
JP 2003-229213 A JP-A-5-197850

そこで本発明は、半導体メモリーカードの実装位置において、半導体メモリーカードへの静電気の放電を阻止する半導体メモリーカード読み書き装置を提供することを課題とするものである。   Therefore, an object of the present invention is to provide a semiconductor memory card read / write device that prevents electrostatic discharge to the semiconductor memory card at the mounting position of the semiconductor memory card.

本発明は上記の課題を解決するためになされたもので、請求項１に記載の発明は、半導体メモリーカードコネクターと、該コネクターに半導体メモリーカードを挿入するための挿入口を備えた筐体と、前記半導体メモリーカードへのデータ読み書きを行う周辺回路とを備え且つ前記筐体に前面パネルを設けた半導体メモリーカード読み書き装置において、前記前面パネルの挿入口の周辺に、実装位置の半導体メモリーカードの後端よりもユーザー側に向けて突出する突出部を設け、少なくとも前記突出部に前記筐体に導通する静電気誘導手段を設けたことを特徴とする半導体メモリーカード読み書き装置である。   The present invention has been made to solve the above-mentioned problems, and the invention according to claim 1 includes a semiconductor memory card connector, and a housing having an insertion slot for inserting the semiconductor memory card into the connector. A semiconductor memory card read / write device comprising a peripheral circuit for reading / writing data from / to the semiconductor memory card and having a front panel provided on the housing. A semiconductor memory card read / write device characterized in that a protruding portion protruding toward the user side from the rear end is provided, and at least the protruding portion is provided with a static electricity induction means conducting to the housing.

請求項２に記載の発明は、前記前面パネルを表面に金属膜を備えたモールドパネルとしたことを特徴とする半導体メモリーカード読み書き装置である。   According to a second aspect of the present invention, there is provided a semiconductor memory card read / write device, wherein the front panel is a molded panel having a metal film on the surface.

請求項３に記載の発明は、前記前面パネルを金属板をプレス成型したものとしたことを特徴とする半導体メモリーカード読み書き装置である。   According to a third aspect of the present invention, there is provided a semiconductor memory card read / write device in which the front panel is formed by press-molding a metal plate.

請求項４に記載の発明は、前記前面パネルを鋳物で構成したことを特徴とする半導体メモリーカード読み書き装置である。   According to a fourth aspect of the present invention, there is provided a semiconductor memory card read / write device in which the front panel is made of a casting.

請求項５に記載の発明は、半導体メモリーカードコネクターと該コネクターに半導体メモリーカードを挿入するための挿入口を備えた筐体と、前記半導体メモリーカードへのデータ読み書きを行う周辺回路とを備え且つ前記筐体に前面モールドパネルを設けた半導体メモリーカード読み書き装置において、前記前面モールドパネルの前面に半導体メモリーカードの挿入口の周辺に、実装位置の半導体メモリーカードの後端よりユーザー側に向けた突出する突出部を設け、且つ前記突出部にスリットを設けると共に、該スリットに先端を挿入させた突出片を設けた金属板製静電気誘電版を、前記筐体と前面パネル間に設けたことを特徴とする半導体メモリーカード読み書き装置である。   The invention described in claim 5 includes a semiconductor memory card connector, a housing having an insertion slot for inserting the semiconductor memory card into the connector, and a peripheral circuit for reading and writing data from and to the semiconductor memory card. In the semiconductor memory card read / write device provided with a front mold panel on the housing, the front of the front mold panel is protruded from the rear end of the semiconductor memory card at the mounting position toward the user side in the vicinity of the insertion slot of the semiconductor memory card. And a metal plate electrostatic dielectric plate provided with a protruding piece having a slit inserted in the slit and a protruding piece inserted into the slit between the casing and the front panel. The semiconductor memory card read / write device.

請求項６に記載の発明は、請求項１ないし４のいずれかに記載の半導体メモリーカード読み書き装置において、前記突出部に半導体メモリーカード挿入口に向かうガイド用スロープを設けたことを特徴とする請求項１ないし４のいずれかに記載の半導体メモリーカード読み書き装置である。   According to a sixth aspect of the present invention, in the semiconductor memory card read / write device according to any one of the first to fourth aspects, a guide slope toward the semiconductor memory card insertion slot is provided in the projecting portion. Item 5. A semiconductor memory card read / write device according to any one of Items 1 to 4.

請求項１に記載の発明によると、帯電した人体等が半導体メモリーカードの挿入口近辺に接近した際、実装位置にある半導体メモリーカードより先に、静電気誘導手段に接近するため、帯電電荷を静電気誘導手段を介して放電させることができ、半導体メモリーカードを静電気から保護することができる。   According to the first aspect of the present invention, when a charged human body or the like approaches the vicinity of the insertion slot of the semiconductor memory card, it approaches the static electricity induction means prior to the semiconductor memory card at the mounting position. It can be discharged via the guiding means, and the semiconductor memory card can be protected from static electricity.

請求項２に記載の発明によると、同じくモールドパネルの表面に設けた金属膜を介して帯電した人体等の帯電電荷を放電させることができ、半導体メモリーカードを静電気から保護することができる。   According to the second aspect of the present invention, it is possible to discharge a charged charge of a human body or the like charged through the metal film provided on the surface of the mold panel, and to protect the semiconductor memory card from static electricity.

請求項３及び請求項４に記載の発明によると、前面パネルは金属製であるため、同じく帯電した人体等の帯電電荷を放電させることができ、半導体メモリーカードを静電気から保護することができる。   According to the third and fourth aspects of the present invention, since the front panel is made of metal, it is possible to discharge a charged charge of a human body or the like that is similarly charged, and to protect the semiconductor memory card from static electricity.

請求項５に記載の発明によると、帯電した人体等が装置の挿入口近辺に接近した際、実装位置にある半導体メモリーカードより先に、静電誘導版の先端に接近するため、帯電電荷を静電誘導版に放電させることができ、半導体メモリーカードを静電気から保護することが出来る。   According to the fifth aspect of the present invention, when a charged human body or the like approaches the vicinity of the insertion slot of the apparatus, the charged electric charge is reduced because it approaches the tip of the electrostatic induction plate before the semiconductor memory card at the mounting position. The electrostatic induction plate can be discharged, and the semiconductor memory card can be protected from static electricity.

請求項６に記載の発明によると、半導体メモリーカードの挿入時に、半導体メモリーカードの先端が挿入口と正対しない場合でも、挿入を円滑且つ容易に行うことが出来る。   According to the sixth aspect of the present invention, even when the semiconductor memory card is inserted, even when the front end of the semiconductor memory card does not face the insertion slot, the insertion can be performed smoothly and easily.

以下、本発明の実施の形態について図を参照して説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１は、本発明の実施例１の主要部の構成を示す斜視図、図２はその分解斜視図で、１は半導体メモリーカード、２は合成樹脂製の前面モールドパネル、３は金属板製の静電誘導版、４は金属シャーシ(筐体)、５は回路基板、６は半導体メモリーカードコネクター、７はホストコンピュータ接続コネクターである。   FIG. 1 is a perspective view showing the configuration of the main part of Embodiment 1 of the present invention, FIG. 2 is an exploded perspective view thereof, 1 is a semiconductor memory card, 2 is a front mold panel made of synthetic resin, and 3 is a metal plate 4 is a metal chassis (housing), 5 is a circuit board, 6 is a semiconductor memory card connector, and 7 is a host computer connector.

前記前面モールドパネル２は半導体メモリーカード挿入口２ａを備え、その上下にスリット２ｂを設けた突出部２ｃ，２ｃが形成され、両側に設けた係合片２ｄ，２ｄによって金属シャーシ４(筐体)に固定されるように構成されている。そして、半導体メモリーカード挿入口２ａと突出部２ｃ，２ｃ間には、図３に示すようにそれぞれガイド用スロープ２ｅ，２ｅが形成されている。   The front mold panel 2 is provided with a semiconductor memory card insertion slot 2a, projecting portions 2c and 2c provided with slits 2b on the upper and lower sides thereof, and a metal chassis 4 (housing) by engagement pieces 2d and 2d provided on both sides. It is comprised so that it may be fixed to. As shown in FIG. 3, guide slopes 2e and 2e are formed between the semiconductor memory card insertion slot 2a and the protruding portions 2c and 2c, respectively.

前記静電誘導版３は、金属板をプレス加工により構成したもので、半導体メモリーカード挿入口３ａと、そのユーザー側の上下に設けた突出片３ｂ，３ｂと、両側に設けた接触片３ｃ，３ｃとから構成され、前面モールドパネル２と金属シャーシ４間に装着され、前面モールドパネル２を金属シャーシ４に装着した時、図３に示すように、突出片３ｂ、３ｂの先端は前面モールドパネル２のスリット２ｂ、２ｂに挿入されて位置決めされ、接触片３ｃ、３ｃは金属シャーシ４に密接し、グランドに導通される。   The electrostatic induction plate 3 is formed by pressing a metal plate, and includes a semiconductor memory card insertion slot 3a, protruding pieces 3b and 3b provided on the upper and lower sides of the user side, and contact pieces 3c provided on both sides. 3c, and is mounted between the front mold panel 2 and the metal chassis 4, and when the front mold panel 2 is mounted on the metal chassis 4, as shown in FIG. 3, the tips of the protruding pieces 3b and 3b are front mold panels. The contact pieces 3c and 3c are in close contact with the metal chassis 4 and conducted to the ground.

即ち、静電誘導版３は、前面モールドパネル２に設けられた半導体メモリーカード１の挿抜方向と同一方向に穿口したスリット２ｂ，２ｂを貫通する突出片３ｂ，３ｂと、金属シャーシ４と導通状態にて接合する接触片３ｃ，３ｃとを備えており，静電誘導版３の突出片３ｂ，３ｂは、半導体メモリーカード１の実装位置よりも前方(ユーザー側)に位置する構成となっている。   That is, the electrostatic induction plate 3 is electrically connected to the metal chassis 4 and the projecting pieces 3b, 3b penetrating through the slits 2b, 2b bored in the same direction as the insertion / extraction direction of the semiconductor memory card 1 provided on the front mold panel 2. Contact pieces 3c, 3c to be joined in a state, and the protruding pieces 3b, 3b of the electrostatic induction plate 3 are positioned forward (user side) from the mounting position of the semiconductor memory card 1. Yes.

以上のように構成されているので、図４に示すように、人体等の帯電物１０が半導体メモリーカード１に接近した際、該半導体メモリーカード１の金属カバー１ａ，１ｂより先に、静電誘導版３の突出片３ｂ，３ｂが、帯電物１０からの放電可能圏１１内に入るため、帯電物１０からの電荷を、静電誘導版３を介して前記金属シャーシ４に逃がすことで、該半導体メモリーカード１への直接放電を回避し、該半導体メモリーカード１の破壊・誤動作から保護することが出来る。   Since it is configured as described above, as shown in FIG. 4, when a charged object 10 such as a human body approaches the semiconductor memory card 1, the electrostatic covers are placed before the metal covers 1 a and 1 b of the semiconductor memory card 1. Since the protruding pieces 3b and 3b of the induction plate 3 enter the dischargeable zone 11 from the charged object 10, the charge from the charged object 10 is released to the metal chassis 4 through the electrostatic induction plate 3, Direct discharge to the semiconductor memory card 1 can be avoided, and the semiconductor memory card 1 can be protected from destruction or malfunction.

そして、突出片３ｂ，３ｂは先端をスリット２ｂ，２ｂに挿入する構成となっているので、静電誘導版３の位置決めと組込みが容易になると共に、静電誘導版３を金属板で構成しても、突出片３ｂ，３ｂはスリット２ｂ，２ｂで保持され、補強されることになるため、除電効果を損なうことがない。また、前面モールドパネル２には，ガイドスロープ２ｅ，２ｅが設けられているので、半導体メモリーカード１の挿入を容易に行うことが出来る効果がある。   Since the protruding pieces 3b and 3b are configured to be inserted into the slits 2b and 2b, the electrostatic induction plate 3 can be easily positioned and assembled, and the electrostatic induction plate 3 is made of a metal plate. However, since the protruding pieces 3b and 3b are held and reinforced by the slits 2b and 2b, the static elimination effect is not impaired. Further, since the front mold panel 2 is provided with guide slopes 2e and 2e, there is an effect that the semiconductor memory card 1 can be easily inserted.

前記実施例１は，デザインの多様性を意図して前面パネルを合成樹脂製モールドパネルとしたが、除電効果のみを意図する場合には、ここでは図示しないが、突出部２ｃ，２ｃを備えた前面パネルを金属板をプレス加工したものとするか、鋳物で構成し、この前面パネルを静電誘電体とすることにより、実装時の半導体メモリーカードの破壊・誤動作から保護することが出来る。即ち、帯電物１０からの電荷を前面パネルの突出部及び係合片２ｄを介して金属シャーシ４に逃がし、半導体メモリーカード１の破壊・誤動作を未然に防止する。   In the first embodiment, the front panel is made of a synthetic resin mold panel for the purpose of design diversity. However, in the case where only the neutralization effect is intended, although not shown here, the projections 2c and 2c are provided. If the front panel is formed by pressing a metal plate or is made of a casting, and the front panel is made of an electrostatic dielectric, it can be protected from destruction or malfunction of the semiconductor memory card during mounting. That is, the charge from the charged object 10 is released to the metal chassis 4 through the protruding portion of the front panel and the engaging piece 2d, thereby preventing the semiconductor memory card 1 from being destroyed or malfunctioning.

前記実施例１は、合成樹脂製の前面モールドパネル２に突出部２ｃ，２ｃを設け、その突出部２ｃ，２ｃにそれぞれスリット２ｂ，２ｂを設け、そのスリット２ｂ，２ｂに前面モールドパネル２と金属シャーシ４間に設けた静電誘導版３の突出片３ｂ，３ｂを挿入して突出部２Ｃ，２ｃの頂上部の一部に静電気誘導手段を設けたものであるが、本発明はこの構造に限定されるものではない。以下他の実施例について図面に基づき説明する。   In the first embodiment, the front mold panel 2 made of synthetic resin is provided with protrusions 2c and 2c, the protrusions 2c and 2c are provided with slits 2b and 2b, respectively, and the front mold panel 2 and the metal are provided in the slits 2b and 2b. The projecting pieces 3b and 3b of the electrostatic induction plate 3 provided between the chassis 4 are inserted and the electrostatic induction means is provided at a part of the top of the projecting portions 2C and 2c. The present invention has this structure. It is not limited. Other embodiments will be described below with reference to the drawings.

図５は本発明の実施例２の拡大縦断面図で、メッキ、金属蒸着などの方法により前面モールドパネル２の表面に金属膜８を施し、この前面モールドパネル２を係合片２ｄ，２ｄ（図示せず）を介して金属シャーシ４に装着したとき、この係合片２ｄ，２ｄを介して金属シャーシ４に放電するようにしたものである。尚、突出部の設け方は実施例１と同様である。     FIG. 5 is an enlarged longitudinal sectional view of Embodiment 2 of the present invention. A metal film 8 is applied to the surface of the front mold panel 2 by a method such as plating or metal vapor deposition, and the front mold panel 2 is engaged with the engagement pieces 2d, 2d ( When attached to the metal chassis 4 via a not-shown), the metal chassis 4 is discharged via the engagement pieces 2d and 2d. The method of providing the protruding portion is the same as that in the first embodiment.

図６は本発明の実施例３の拡大縦断面図で、前面パネル２’を金属板プレス加工したものと、それ自体を静電気誘導手段としたものである。この場合も突出部の設け方は実施例１と同様である。   FIG. 6 is an enlarged longitudinal sectional view of Embodiment 3 of the present invention, in which the front panel 2 'is pressed with a metal plate and itself is used as a static electricity induction means. In this case as well, the method of providing the protruding portion is the same as in the first embodiment.

図７は本発明の実施例４の拡大縦断面図で、前面モールドパネル２”を鋳物で構成したもので、この場合も突出部の設け方は実施例１と同様である。   FIG. 7 is an enlarged longitudinal sectional view of the fourth embodiment of the present invention, in which the front mold panel 2 ″ is made of a casting. In this case as well, the method of providing the protruding portion is the same as in the first embodiment.

以上図示した実施例２〜４は、いずれも帯電した人体などが半導体メモリーカードの挿入口近辺に接近した際、実装位置にある半導体メモリーカードより先に、突出部先端の静電気誘導手段に接近するため、帯電電荷をその静電気誘導手段と係合片２ｄ，２ｄを介して金属シャーシ４に放電させ、半導体メモリーカード１の破壊・誤動作を未然に防止する。   In Examples 2 to 4 shown above, when a charged human body or the like approaches the vicinity of the insertion slot of the semiconductor memory card, the electrostatic induction means at the tip of the protruding portion approaches before the semiconductor memory card at the mounting position. Therefore, the charged charge is discharged to the metal chassis 4 via the static electricity induction means and the engagement pieces 2d and 2d, thereby preventing the semiconductor memory card 1 from being destroyed or malfunctioning.

本発明の実施例１の要部構成を示す斜視図。The perspective view which shows the principal part structure of Example 1 of this invention. 本発明の実施例１の分解斜視図。The disassembled perspective view of Example 1 of this invention. 本発明の実施例１の拡大縦断面図。1 is an enlarged vertical sectional view of Example 1 of the present invention. 本発明の実施例１の電気的効果の説明図。Explanatory drawing of the electrical effect of Example 1 of this invention. 本発明の実施例２の拡大縦断面図。The expanded longitudinal cross-sectional view of Example 2 of this invention. 本発明の実施例３の拡大縦断面図。The expanded longitudinal cross-sectional view of Example 3 of this invention. 本発明の実施例４の拡大縦断面図。The expanded longitudinal cross-sectional view of Example 4 of this invention.

符号の説明Explanation of symbols

１ 半導体メモリーカード
１ａ 半導体メモリーカード上カバー
１ｂ 半導体メモリーカード下カバー
２ 前面モールドパネル
２ａ 半導体メモリーカード挿入口
２ｂ スリット
２ｃ 突出部
２ｄ 係合片
３ 静電誘導版
３ａ 半導体メモリーカード挿入口
３ｂ 突出片
３ｃ 接触片
４ 金属シャーシ
５ 回路基板
６ 半導体メモリーカードコネクター
７ ホストコンピュータ接続コネクター DESCRIPTION OF SYMBOLS 1 Semiconductor memory card 1a Semiconductor memory card upper cover 1b Semiconductor memory card lower cover 2 Front mold panel 2a Semiconductor memory card insertion slot 2b Slit 2c Projection part 2d Engagement piece 3 Static induction plate 3a Semiconductor memory card insertion slot 3b Projection piece 3c Contact piece 4 Metal chassis 5 Circuit board 6 Semiconductor memory card connector 7 Host computer connector

Claims (6)

半導体メモリーカードコネクターと、該コネクターに半導体メモリーカードを挿入するための挿入口を備えた筐体と、前記半導体メモリーカードへのデータ読み書きを行う周辺回路とを備え且つ前記筐体に前面パネルを設けた半導体メモリーカード読み書き装置において、前記前面パネルの挿入口の周辺に、実装位置の半導体メモリーカードの後端よりもユーザー側に向けて突出する突出部を設け、少なくとも前記突出部に前記筐体に導通する静電気誘導手段を設けたことを特徴とする半導体メモリーカード読み書き装置。 A semiconductor memory card connector; a housing having an insertion slot for inserting a semiconductor memory card into the connector; and a peripheral circuit for reading and writing data to the semiconductor memory card; and a front panel is provided on the housing In the semiconductor memory card read / write device, a protrusion that protrudes toward the user side from the rear end of the semiconductor memory card at the mounting position is provided around the insertion opening of the front panel, and at least the protrusion is attached to the housing. A semiconductor memory card read / write device, characterized in that a static electricity induction means is provided. 前記前面パネルを表面に金属膜を備えたモールドパネルとしたことを特徴とする請求項１記載の半導体メモリーカード読み書き装置。 2. The semiconductor memory card read / write device according to claim 1, wherein the front panel is a molded panel having a metal film on the surface. 前記前面パネルを金属板をプレス成型したものとしたことを特徴とする請求項１記載の半導体メモリーカード読み書き装置。 2. The semiconductor memory card read / write device according to claim 1, wherein the front panel is formed by press-molding a metal plate. 前記前面パネルを鋳物で構成したことを特徴とする請求項１記載の半導体メモリーカード読み書き装置。 2. The semiconductor memory card read / write device according to claim 1, wherein the front panel is made of a casting. 半導体メモリーカードコネクターと該コネクターに半導体メモリーカードを挿入するための挿入口を備えた筐体と、前記半導体メモリーカードへのデータ読み書きを行う周辺回路とを備え且つ前記筐体に前面モールドパネルを設けた半導体メモリーカード読み書き装置において、前記前面モールドパネルの前面に半導体メモリーカードの挿入口の周辺に、実装位置の半導体メモリーカードの後端よりユーザー側に向けた突出する突出部を設け、且つ前記突出部にスリットを設けると共に、該スリットに先端を挿入させた突出片を設けた金属板製静電気誘電版を、前記筐体と前面パネル間に設けたことを特徴とする半導体メモリーカード読み書き装置。 A semiconductor memory card connector, a housing having an insertion slot for inserting a semiconductor memory card into the connector, a peripheral circuit for reading and writing data to the semiconductor memory card, and a front mold panel provided on the housing In the semiconductor memory card read / write device, a protrusion projecting from the rear end of the semiconductor memory card at the mounting position toward the user side is provided on the front surface of the front mold panel around the insertion slot of the semiconductor memory card, and the protrusion A semiconductor memory card read / write device, wherein a slit is formed in a portion, and an electrostatic dielectric plate made of a metal plate provided with a protruding piece having a tip inserted into the slit is provided between the housing and the front panel. 前記突出部に半導体メモリーカード挿入口に向かうガイド用スロープを設けたことを特徴とする請求項１ないし４のいずれかに記載の半導体メモリーカード読み書き装置。 5. The semiconductor memory card read / write device according to claim 1, wherein a guide slope toward the semiconductor memory card insertion slot is provided in the projecting portion.
JP2007016665A 2007-01-26 2007-01-26 Read/write device for semiconductor memory card Pending JP2008186072A (en)

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EP2146256A2 (en) 2008-07-17 2010-01-20 Brother Kogyo Kabushiki Kaisha Image forming apparatus
WO2012172609A1 (en) * 2011-06-16 2012-12-20 三菱電機株式会社 Electronic apparatus
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CN110290632A (en) * 2019-06-21 2019-09-27 苏州佳世达光电有限公司 A kind of electronic device of electrostatic discharge protective

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JPH03105587A (en) * 1989-09-20 1991-05-02 Fuji Electric Co Ltd Ic card reading and writing device
JPH04333191A (en) * 1990-10-08 1992-11-20 Alcatel Cit Smart card reader
JP2000153050A (en) * 1998-11-20 2000-06-06 Bussan Creative:Kk Housing case for conductive game machine control
JP2002150335A (en) * 2000-11-06 2002-05-24 Denso Corp On-vehicle equipment for automatic fare collection system
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2146256A2 (en) 2008-07-17 2010-01-20 Brother Kogyo Kabushiki Kaisha Image forming apparatus
WO2012172609A1 (en) * 2011-06-16 2012-12-20 三菱電機株式会社 Electronic apparatus
JP5377801B2 (en) * 2011-06-16 2013-12-25 三菱電機株式会社 Electronics
WO2018003794A1 (en) * 2016-06-27 2018-01-04 日本電産サンキョー株式会社 Card reader
CN110290632A (en) * 2019-06-21 2019-09-27 苏州佳世达光电有限公司 A kind of electronic device of electrostatic discharge protective
CN110290632B (en) * 2019-06-21 2021-12-14 苏州佳世达光电有限公司 Electronic device for electrostatic discharge protection

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