JP4695991B2 - Electronic component mounting method - Google Patents

Description

  The present invention includes a plurality of suction nozzles on a mounting head that can be moved from a component picking position to a component mounting position, and picks up an electronic component sucked and held by the suction nozzle with a component recognition camera and recognizes it with a recognition processing device. The present invention relates to an electronic component mounting method in which the amount of deviation in the angular direction is corrected by rotating the mounting head based on the processing result and mounted on a printed circuit board.

  This type of electronic component mounting method is disclosed in Patent Document 1. Generally, when correcting the displacement in the angular direction by rotating the mounting head based on the recognition processing result obtained by imaging and recognizing the electronic component sucked and held by the suction nozzle by the component recognition camera, If there is a deviation from the design value at the center of rotation, the mounting accuracy of the electronic component on the printed circuit board cannot be increased.

For this reason, it is necessary to obtain the center of rotation of the mounting head to grasp the amount of deviation, and to use this data during the correction. In this case, conventionally, the scope axis (for example, two axes of X and Y) of the component recognition camera is operated so that the suction nozzle is positioned at the center of the imaging range of the component recognition camera when the mounting head is rotated once. Then, the suction nozzle was imaged a plurality of times to find the rotation center of the mounting head.
JP 2001-53492 A

  However, a two-axis drive source for moving the component recognition camera is necessary, and the cost is high, and there is an error for scope alignment by these drive sources, so it was necessary to correct with an offset value. .

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component mounting apparatus that can determine the rotation center of a mounting head at a low cost and extremely easily.

For this reason, the invention of claim 1 is provided with a plurality of suction nozzles on a mounting head movable from a component picking position to a component mounting position, and picks up an electronic component sucked and held by the suction nozzle with a component recognition camera. In the electronic component mounting method for correcting the amount of deviation in the angular direction by rotating the mounting head based on the result of the recognition processing by the recognition processing device and mounting the printed circuit board on the printed circuit board,
By rotating the head rotation drive motor of the mounting head to a predetermined angle within a range that can be imaged by the component recognition camera, imaging the suction nozzle multiple times is repeated multiple times by moving the mounting head. ,
Translate each position of the suction nozzle imaged at each stop position of the mounting head and recognized by the recognition processing device so that the coordinates of the origin position of the suction nozzle of the mounting head overlap,
Each position of the suction nozzle at each stop position of the mounting head is averaged in a state weighted for each stop position to obtain each coordinate of the suction nozzle for each rotation of the mounting head,
The center coordinates of a circle passing through the respective coordinates of the suction nozzle thus obtained or in the vicinity of the coordinates are obtained and used as the rotation center of the mounting head.

According to a second aspect of the present invention, a recognition head is provided with a plurality of suction nozzles in a mounting head that can move from a component pick-up position to a component mounting position, and an electronic component picked and held by the suction nozzle is imaged by a component recognition camera In the electronic component mounting method in which the amount of deviation in the angular direction is corrected by rotating the mounting head based on the result of recognition processing in (1) and mounted on the printed circuit board.
By rotating the head rotation drive motor of the mounting head to a predetermined angle within a range that can be imaged by the component recognition camera, imaging the suction nozzle multiple times is repeated multiple times by moving the mounting head. ,
Translate each position of the suction nozzle imaged at each stop position of the mounting head and recognized by the recognition processing device so that the coordinates of the origin position of the suction nozzle of the mounting head overlap,
Each position of the suction nozzle at each stop position of the mounting head is averaged to determine each coordinate of the suction nozzle for each rotation of the mounting head,
A center coordinate of a circle passing through the obtained coordinates of the suction nozzle is obtained and used as the rotation center of the mounting head.

According to a third aspect of the present invention, there is provided a recognition processing device comprising a plurality of suction nozzles in a mounting head movable from a component pick-up position to a component mounting position, and imaging an electronic component sucked and held by the suction nozzle with a component recognition camera. In the electronic component mounting method in which the amount of deviation in the angular direction is corrected by rotating the mounting head based on the result of recognition processing in (1) and mounted on the printed circuit board.
By rotating the head rotation drive motor of the mounting head to a predetermined angle within a range that can be imaged by the component recognition camera, imaging the suction nozzle multiple times is repeated multiple times by moving the mounting head. ,
Translate each position of the suction nozzle imaged at each stop position of the mounting head and recognized by the recognition processing device so that the coordinates of the origin position of the suction nozzle of the mounting head overlap,
For each stop position of the mounting head, obtain the center coordinates of a circle that passes through each position of the suction nozzle recognized by the recognition processing device,
The center coordinates for each stop position of the mounting head are averaged in a weighted state for each stop position to obtain the rotation center of the mounting head.

According to a fourth aspect of the present invention, there is provided a recognition processing apparatus comprising a plurality of suction nozzles in a mounting head movable from a component pick-up position to a component mounting position, and imaging an electronic component sucked and held by the suction nozzle with a component recognition camera. In the electronic component mounting method in which the amount of deviation in the angular direction is corrected by rotating the mounting head based on the result of recognition processing in (1) and mounted on the printed circuit board.
By rotating the head rotation drive motor of the mounting head to a predetermined angle within a range that can be imaged by the component recognition camera, imaging the suction nozzle multiple times is repeated multiple times by moving the mounting head. ,
For each stop position of the mounting head, obtain the center coordinates of a circle that passes through each position of the suction nozzle recognized by the recognition processing device,
Translate the center coordinates for each stop position of the mounting head so that the coordinates of the origin position of the suction nozzle of the mounting head overlap,
The center coordinates for each stop position of the mounting head are averaged in a weighted state for each stop position to obtain the rotation center of the mounting head.

According to a fifth aspect of the present invention, a recognition head is provided with a plurality of suction nozzles in a mounting head that can be moved from a component picking position to a component mounting position, and an electronic component sucked and held by the suction nozzle is imaged by a component recognition camera. In the electronic component mounting method in which the amount of deviation in the angular direction is corrected by rotating the mounting head based on the result of recognition processing in (1) and mounted on the printed circuit board.
By rotating the head rotation drive motor of the mounting head to a predetermined angle within a range that can be imaged by the component recognition camera, imaging the suction nozzle multiple times is repeated multiple times by moving the mounting head. ,
Translate each position of the suction nozzle imaged at each stop position of the mounting head and recognized by the recognition processing device so that the coordinates of the origin position of the suction nozzle of the mounting head overlap,
For each stop position of the mounting head, obtain the center coordinates of a circle that passes through each position of the suction nozzle recognized by the recognition processing device,
The center coordinates for each stop position of the mounting head are averaged to be the center of rotation of the mounting head.

  According to the present invention, since there is no need to move the recognition camera, it is possible to provide an electronic component mounting apparatus that can determine the rotation center of the mounting head at a low cost and extremely easily.

  Hereinafter, an electronic component mounting apparatus including a mounting head according to an embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1. The electronic component mounting apparatus 1 includes a supply system 3 for supplying electronic components in parallel with each other with an apparatus main body 2 interposed therebetween, and the electronic components on a printed circuit board P. A mounting system 4 to be mounted is arranged. The apparatus main body 2 is provided with an index unit which is a main body of the drive system, a rotary table 12 connected to the index unit, and a plurality (for example, twelve) of mounting heads 10 mounted on the outer periphery of the rotary table 12. The rotary table 12 is intermittently rotated by the index unit at an intermittent pitch corresponding to the number of mounting heads 10. When the rotary table 12 rotates intermittently, a predetermined suction nozzle 11 among the plurality of suction nozzles 11 mounted on each mounting head 10 appropriately faces the supply system 3 and the mounting system 4, and the electrons supplied from the supply system 3. After the component is adsorbed, it is mounted on the printed circuit board P that is rotated and conveyed to the mounting system 4 and introduced into the mounting system 4.

  The supply system 3 has a number of component supply units 5 corresponding to the type of electronic components to be mounted on the printed circuit board P. The component supply unit 5 is provided on a supply table 7 slidably guided by a pair of guide rails 6. It is attached sideways and detachably. A ball screw 8 is screwed onto the supply base 7 in the sliding direction, and the supply base 7 is moved forward and backward by a forward and reverse rotation of a feed motor 9 connected to one end of the ball screw 8. A desired component supply unit 5 is selectively allowed to face the suction position. A carrier tape loaded with electronic components at a predetermined pitch is mounted on each component supply unit 5 in a state of being unwound on a tape reel, and the electronic component is sucked from the carrier tape unwound from the tape reel at any time. It is adsorbed by the nozzle 11.

  The mounting system 4 includes an XY table 15 for moving the placed printed board P in the X direction and the Y direction by an X axis drive motor 15X and a Y axis drive motor 15Y, and a carry-in conveyor 16 disposed before and after the XY table 15. The printed board P on the carry-in conveyor 16 is transferred to the XY table 15 and the printed board P on the XY table 15 is transferred to the carry-out conveyor 17 at the same time.

  Then, the printed circuit board P sent to the downstream end of the carry-in conveyor 16 is transferred onto the XY table 15 by the substrate transfer device 18, and at the same time, the printed circuit board P on the XY table 15 on which the mounting of the electronic components is completed is The substrate is transferred to the carry-out conveyor 17 by the substrate transfer device 18. The printed circuit board P introduced onto the XY table 15 is appropriately moved in the plane direction by the XY table 15, and the component mounting portion is mounted at the mounting position corresponding to the electronic components sequentially sent by the mounting heads 10. The electronic component is mounted from each suction nozzle 11.

  The apparatus main body 2 has an index unit which is a main body of a drive system on a support base, and the index unit intermittently rotates the rotary table 12 and synchronizes (interlocks) with the intermittent period of the rotary table 12. Various devices of the main body 2 are operated.

  The rotary table 12 is fixed to a shaft cylinder (not shown) rotated by an index unit, and intermittently rotates clockwise in plan view. Then, twelve mounting heads 10 provided at equal intervals in the circumferential direction along the respective linear blocks are attached to the outer peripheral portion of the rotary table 12 so as to be movable up and down via linear rails. Then, both cam followers rotate while being pressed against the upper and lower surfaces of the cam formed over the entire periphery of the lower end peripheral portion of the cylindrical cam member for guiding the hollow cylindrical rotary table so as to surround the upper portion of the shaft cylinder. Then, according to the shape of the cam, each mounting head 10 rotates with the rotary table 12 while moving up and down along each linear block as described above.

  In this case, the intermittent rotation of the rotary table 12 is 12 intermittent cycles per rotation in accordance with the number of mounting heads 10, and each mounting head 10 revolving by this intermittent rotation is at 12 stop positions, respectively. Stop. At the 12 stop positions, in addition to the suction position for picking up and mounting the electronic component, the position at which the picked-up electronic component is imaged and corrected by the component recognition camera 13, and nozzle switching in the mounting head 10 The position where (exchange) is performed is included.

  Each mounting head 10 can be rotated by each head rotation drive motor 14, and each mounting head 10 supports, for example, five suction nozzles 11 arranged at equal intervals in the circumferential direction so as to be able to appear and retract. Accordingly, the head rotation driving motor 14 drives the mounting head 10 to rotate, and the plurality of suction nozzles 11 revolve around the mounting head 10 axis.

  Then, the component recognition camera 13 images the electronic component taken out by the suction nozzle 11 of the mounting head 10 from the component supply unit 5 and is held by suction, and the overall control is performed based on the recognition processing result recognized by the recognition processing device 24. In order for the CPU 20 as a device to correct the displacement of the electronic component with respect to the suction nozzle 11, each head rotation drive motor 14 that rotates the mounting head 10 in the angular direction (θ), and the XY table 15 in the X and Y directions. The X-axis drive motor 15X and the Y-axis drive motor 15Y are controlled to move in the X and Y directions.

  Next, when controlling each head rotation drive motor 14 that rotates the mounting head 10 with respect to this angular direction (θ), if there is a deviation from the design value with respect to the rotation center of the mounting head 10, printing of the electronic component is performed. Since the mounting accuracy on the substrate P cannot be increased, the rotation center of the mounting head 10 is obtained, the amount of deviation from the design value of the rotation center is grasped, and this is stored in the RAM 21 as an offset value. This is used when correcting.

  Next, a description will be given based on the control block diagram of FIG. Reference numeral 20 denotes a CPU as a control unit that performs overall control of the operation related to the mounting of the mounting apparatus. Reference numeral 21 denotes positional information on the X direction, Y direction, and angle in the printed circuit board P for each mounting order (step number) of electronic components. And mounting data comprising arrangement number information of each component supply unit 3 and nozzle position information indicating the position of the suction nozzle to be used in the mounting head, and the type of each electronic component corresponding to the arrangement number of each component supply unit 3 ( (Component ID) and component placement data indicating what suction nozzle (nozzle ID) is used, component library data indicating the characteristics of the electronic component for each electronic component, RAM (random access Reference numeral 22 denotes a ROM (Read Only Memory) for storing a program.

  The CPU 20 controls the operation related to the component mounting operation of the electronic component mounting apparatus according to the program stored in the ROM 21 based on the data stored in the RAM 21. That is, the CPU 20 controls the drive of the X-axis drive motor 15X, the Y-axis drive motor 15Y, the head rotation drive motor 14, and the vertical axis drive motor 19 that raises and lowers the suction nozzle 11 via the drive circuit 23.

  A recognition processing device 24 is connected to the CPU 20 via the interface 25. The recognition processing device 24 performs recognition processing of an image captured by the component recognition camera 13, and the CPU 20 sends a processing result. Is sent out. That is, the CPU 20 outputs an instruction to the recognition processing device 24 so as to perform recognition processing (calculation of misalignment amount) on the image captured by the component recognition camera 18 and receives the recognition processing result from the recognition processing device 24. Is.

  That is, when the amount of displacement of the electronic component is grasped by the recognition processing of the recognition processing device 24, the result is sent to the CPU 20, and the CPU 20 should correct the displacement of the electronic component sucked and held by the suction nozzle 11. The XY table 15 is rotated in the XY direction by driving the X-axis drive motor 15X and the Y-axis drive motor 15, and the mounting head 10 is rotated by θ by the drive of the head rotation drive motor 14 to move around the X, Y direction and the vertical axis. The rotation angle position is corrected.

  The image picked up by the component recognition camera 13 is displayed on a monitor 26 as a display device. The monitor 26 is provided with various touch panel switches 27, and various settings can be performed by an operator operating the touch panel switch 27.

  Next, a first embodiment of a method for obtaining the rotation center of the mounting head 10 will be described below with reference to FIGS. First, as shown in FIG. 3, when the operator presses the touch panel switch 27 related to the offset teaching of the rotation center of the mounting head 10 displayed on the monitor 26, the CPU 20 turns the rotary table 12 clockwise in plan view using the index unit. When the mounting head 10 to be measured reaches the position a, the rotary table 12 is stopped, and the head of the mounting head 10 is within the range SH that can be imaged by the component recognition camera 13. For example, the rotation drive motor 14 is rotated at a predetermined angle to be stopped, and the suction nozzle 11 is imaged five times at the rotation stop position. However, an image may be taken at every predetermined angle without stopping the rotation of the mounting head 10.

  Next, as described above, the rotation table 12 is rotated clockwise, and when the mounting head 10 reaches the position b, the rotation table 12 is stopped, and the range SH that can be imaged by the component recognition camera 13 is shown. In this, imaging of the suction nozzle 11 is performed, for example, five times by rotating the head rotation drive motor 14 of the mounting head 10 at the predetermined angle, for example. Similarly, the rotary table 12 is stopped when the mounting head 10 reaches the position c, and the head rotation drive motor 14 of the mounting head 10 is set within a range SH that can be imaged by the component recognition camera 13. For example, if the suction nozzle 11 is imaged five times, the suction nozzle 11 is imaged, for example, by rotating at every predetermined angle. Preferably, the positions of a, b, and c are preferably set at substantially equal intervals, and the origin position of the suction nozzle 11 when the mounting head 10 is at the position b is preferably an imaging range SH that is a screen. It is better to be the center of

  Note that an image obtained by picking up the suction nozzle 11 by the component recognition camera 13 is subjected to recognition processing by the recognition processing device 24 and stored as position data of the suction nozzle 11 in the RAM 21 by the CPU 20. Stored in

  Then, the origin position of the suction nozzle 11, that is, the position of the suction nozzle 11 imaged for the third time by rotating the mounting head 10 (in other words, the position of the suction nozzle 11 at the rotation origin position of the mounting head 10). So that the position of the suction nozzle 11 at each stop position a, b, c of the mounting head 10 is translated so that the coordinates of the mounting head 10 overlap, that is, the positions a3 and c3 are translated so as to overlap b3, By using the coordinates of the same rotation angle of the nozzle 11, the appearance of appearance due to the position of the screen is reduced. As shown in FIG. 4, the coordinates (Xs1, Ys1), (Xs2, Ys2), (Xs3, Ys3), (Xs4, Ys4), (Xs5, Ys5) of the suction nozzles 11 corrected in this way (5-point sample) Example) Find the center coordinates of the circle passing through and set it as the center of rotation.

  That is, when each point of each stop position a, b, c is (Xan, Yan), (Xbn, Ybn), (Xcn, Ycn) (n = 1, 2, 3, 4, 5), the stop position The movement distance of each point of a is (Xbc-Xac) in the X direction, (Ybc-Yac) in the Y direction, and the movement distance of each point of the stop position c is (Xbc-Xcc) in the X direction, The Y direction is (Ybc-Ycc). Therefore, each coordinate (Xsn, Ysn) (n is 1, 2, 3, 4, 5) of each corrected suction nozzle 11 is Xsn = (α (Xan + (Xbc−Xac)) + βXbn + α (Xcn + (Xbc− Xcc))) / (2α + β), and each coordinate of each suction nozzle 11 corrected from Ysn = (α (Yan + (Ybc−Yac)) + βYbn + α (Ycn + (Ybc−Ycc))) / (2α + β) is obtained. However, in the state where each position of the suction nozzle 11 at each stop position a, b, c is weighted for each stop position, that is, the values of α and β are determined by weighting, and the suction nozzle is averaged. 11 coordinates are obtained. Note that β = 0 when not used as data for calculating each point of the stop position b. The method of obtaining the center coordinates of the circle passing through the five points or the circle passing through the vicinity of the five points from the coordinates of the five points of the suction nozzle 11 thus corrected is based on a known least square method as shown below. Use circular approximation.

That is, for example, as a method for obtaining the center coordinates of a circle passing through a plurality of points (X1, Y1) to (Xn, Yn), circle approximation by the least square method is used. The equation of the circle is (X−xr) ² + (Y−yr) ² = R ² , where the center coordinates are (xr, yr) and the radius is R, and this equation is X ² −2aX + Y ² −2bY−c. = 0 (equation (1)), a and b can be used so that equation (1) passes through the closest position to each point of (X1, Y1) to (Xn, Yn) using this equation. , C is obtained. Since a = xr and b = yr, (a, b) at this time is set as the center coordinate. Here, when (Xi, Yi) (i = 1 to n) is substituted into the equation (1), 2aXi + 2bi + c = Xi ² + Yi ² and (2xi) a + (2Yi) b + c = (xi ² + Yi ² ) are obtained.

Although n equations can be formed, these n equations are called measurement equations. (A, b) is obtained from the above equation, but since the measurement points 1 to n are not necessarily on the circle, the most reliable value (a0, b0) is approximately obtained. become. If ai = 2Xi, bi = 2yi, (ci = 1), (Xi ² + Yi ² ) = Mi, then (Xi ² + Yi ² ) − (2Xi) a0 + (2Yi) b0 + c0 = vi for (a0, b0). Is obtained. This vi is a residual because a0 and b0 are approximate values. With respect to a0 and b0 that minimize the sum of squares Σ (vi ² ) of the residual vi, according to the theory of least squares,
ΣXi ² · a0 + Σ (bi · ai) · b0 + Σ (1 · ai) · c0 = Σ (ai · Mi)
Σ (ai · bi) · a0 + Σ (bi ² ) · b0 + Σ (1 · bi) · c0 = Σ (bi · Mi)
Σ (ai · ci) · a0 + Σ (bi · ci) · b0 + Σ (1 ² ) · c0 = Σ (ci · Mi),
The standard equation is obtained. Let (a0.b0) obtained by solving this equation be the value of the center of the circle.

  Next, a second embodiment of a method for obtaining the rotation center of the mounting head 10 shown in FIG. 5 will be described. As in the first embodiment, at each stop position a, b, c, the rotary table 12 is rotated clockwise by a predetermined angle to stop and within the range SH that can be imaged by the component recognition camera 13. When the head rotation driving motor 14 of the mounting head 10 is rotated at every predetermined angle, the suction nozzle 11 is imaged five times.

  Then, by using the coordinates of the rotation angle of the same suction nozzle 11, the appearance of appearance due to the position of the screen is reduced. The coordinates of the stop positions a, b, and c of the rotary table 12 are used as they are. The center of the circle passing through the coordinates (Xs1, Ys1), (Xs2, Ys2), (Xs3, Ys3), (Xs4, Ys4), (Xs5, Ys5) (example of five-point sample) of each suction nozzle 11 thus corrected Find the coordinates and use them as the center of rotation.

  That is, when each point of the stop positions a, b, c is (Xan, Yan), (Xbn, Ybn), (Xcn, Ycn), n = 1, 2, 3, 4, 5), Xsn = (αXan + βXbn + αXcn) ) / (2α + β), and Ysn = (αYan + βYbn + αYcn) / (2α + β). However, in the state where each position of the suction nozzle 11 at each stop position a, b, c is weighted for each stop position, that is, the values of α and β are determined by weighting, and the suction nozzle is averaged. 11 coordinates are obtained. Note that β = 0 when not used as data for calculating each point of the stop position b. The method of obtaining the center coordinates of the circle passing through the five points of the suction nozzle 11 thus corrected uses a circle approximation by a known least square method as described above.

  Next, a third embodiment of a method for obtaining the rotation center of the mounting head 10 shown in FIG. 6 will be described. As in the first embodiment, at each stop position a, b, c, the rotary table 12 is rotated clockwise by a predetermined angle to stop and within the range SH that can be imaged by the component recognition camera 13. When the head rotation driving motor 14 of the mounting head 10 is rotated at every predetermined angle, the suction nozzle 11 is imaged five times.

  Then, the center coordinates (Xra, Yra), (Xrb, Yrb), (Xrc, Yrc) obtained by the least square circle approximation for the respective arcs of the stop positions a, b, c are used as the origin position of the suction nozzle 11. The center of rotation (Xr, Yr) is obtained by moving the coordinates so as to overlap each other.

  That is, the movement distance of the origin position of the stop position a is (Xbc−Xac) in the X direction and (Ybc−Yac) in the Y direction, and the movement distance of the origin position of the stop position c is (Xbc) in the X direction. -Xcc), the Y direction becomes (Ybc-Ycc), and Xr = (α (Xra + (Xbc−Xac)) + βXrb + α (Xrc + (Xbc−Xcc)) / (2α + β) and Yr = (α (Yra + (Ybc− Yac)) + [beta] Yrb + [alpha] (Yrc + (Ybc-Ycc)) / (2 [alpha] + [beta]), the rotation center of the mounting head 10 is obtained, provided that each position of the suction nozzle 11 at each stop position a, b, c is determined as each stop position. In each weighted state, that is, by weighting, the values of α and β are determined and averaged to determine the coordinates of the suction nozzle 11. It is used as data for calculating each point of the stop position b. If not, it is a β = 0.

  In addition, after the coordinates of the stop positions a, b, and c of the rotary table 12 are translated so that the coordinates of the origin position of the suction nozzle 11 overlap, the respective arcs of the stop positions a, b, and c are moved. , The rotation center (Xr, Yr) may be obtained from the center coordinates (Xra, Yra), (Xrb, Yrb), (Xrc, Yrc) obtained by the circle approximation of the least square method.

  In this case, the rotation center of the mounting head 10 is obtained from Xr = (αXra + βXrb + αXrc) / (2α + β) and Yr = (αYra + βYrb + αYrc) / (2α + β).

  Next, a fourth embodiment of a method for obtaining the rotation center of the mounting head 10 shown in FIG. 7 will be described. As in the first embodiment, at each stop position a, b, c of the turntable 12, the turntable 12 is stopped by rotating it by a predetermined angle clockwise, and can be imaged by the component recognition camera 13. Within SH, the head rotation drive motor 14 of the mounting head 10 is rotated at the predetermined angle, and the suction nozzle 11 is imaged five times.

Then, the center coordinates (Xra, Yra), (Xrb, Yrb), (Xrc, Yrc) obtained by circular approximation of the least squares method are respectively obtained without translating the arc coordinates of the stop positions a, b, c. To determine the rotation center (Xr, Yr). That is,
Xr = (αXra + βXrb + αXrc) / (2α + β)
Yr = (αYra + βYra + αYrc) / (2α + β)
From this, the rotation center of the mounting head 10 is obtained. However, in the state where each position of the suction nozzle 11 at each stop position a, b, c is weighted for each stop position, that is, the values of α and β are determined by weighting, and the suction nozzle is averaged. 11 coordinates are obtained. Note that β = 0 when not used as data for calculating each point of the stop position b.

  As described above, in the first to fourth embodiments, it is possible to avoid as much as possible the occurrence of errors due to screen distortion at the periphery of the imaging range SH by the component recognition camera 13 and the lens circumferential difference ratio. The rotation center is obtained. The CPU 20 calculates the amount of deviation from the design value of the rotation center, stores this in the RAM 21 as an offset value, and the suction nozzle 11 of the mounting head 10 is taken out from the component supply unit 5. In order for the CPU 20 to correct the amount of displacement of the electronic component with respect to the suction nozzle 11 on the basis of the recognition processing result obtained by the component recognition camera 13 imaging the electronic component held by suction and recognized by the recognition processing device 24, the angle direction With respect to (θ), this offset value is used when the head rotation drive motor 14 that rotates the mounting head 10 is controlled to move. And such an offset teaching is performed every 2 hours of operation time, for example in order to respond to a change with time.

  In the first to fourth embodiments described above, if the values of α and β are “1”, the weights are equal and the calculated values are average values. In addition, although the stop position of the rotary table 12 is three, a, b, and c, it is not limited to this, and may be two or more, for example, five, and the number of times the suction nozzle 11 is imaged at each stop position is limited to five. Absent.

  Furthermore, this embodiment has exemplified a high-speed electronic component mounting apparatus using a rotary table. However, the present invention is not limited to this, and the mounting head is rotated by the amount of displacement in the angular direction of the electronic component sucked and held by the suction nozzle. Any device that can be corrected and mounted on a printed circuit board can be applied to an XY robot type multifunctional electronic component mounting apparatus.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a top view of an electronic component mounting apparatus. It is a control block diagram. It is a conceptual diagram for showing the imaging operation by the component recognition camera of a suction nozzle. It is a conceptual diagram for demonstrating 1st Embodiment of the method of calculating | requiring the rotation center of a mounting head. is there. It is a conceptual diagram for demonstrating 2nd Embodiment of the method of calculating | requiring the rotation center of a mounting head. It is a conceptual diagram for demonstrating 3rd Embodiment of the method of calculating | requiring the rotation center of a mounting head. It is a conceptual diagram for demonstrating 4th Embodiment of the calculation method of the rotation center of a mounting head.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 5 Component supply unit 10 Mounting head 11 Suction nozzle 12 Rotary table 13 Component recognition camera 14 Head rotation drive motor 20 CPU
21 RAM
SH Range that can be captured by a component recognition camera

Claims (5)

The result is that the mounting head that can move from the component pick-up position to the component mounting position is equipped with a plurality of suction nozzles, and the electronic components sucked and held by the suction nozzles are imaged by the component recognition camera and recognized by the recognition processing device. On the basis of the electronic component mounting method for correcting the angular displacement by rotating the mounting head and mounting the printed circuit board on the printed circuit board,
By rotating the head rotation drive motor of the mounting head to a predetermined angle within a range that can be imaged by the component recognition camera, imaging the suction nozzle multiple times is repeated multiple times by moving the mounting head. ,
Translate each position of the suction nozzle imaged at each stop position of the mounting head and recognized by the recognition processing device so that the coordinates of the origin position of the suction nozzle of the mounting head overlap,
Each position of the suction nozzle at each stop position of the mounting head is averaged in a state weighted for each stop position to obtain each coordinate of the suction nozzle for each rotation of the mounting head,
The center coordinates of the circle passing through the coordinates of the suction nozzle or the vicinity of each of the obtained suction nozzles are obtained to determine the rotation center of the mounting head.
An electronic component mounting method characterized by: The result is that the mounting head that can move from the component pick-up position to the component mounting position is equipped with a plurality of suction nozzles, and the electronic components sucked and held by the suction nozzles are imaged by the component recognition camera and recognized by the recognition processing device. On the basis of the electronic component mounting method for correcting the angular displacement by rotating the mounting head and mounting the printed circuit board on the printed circuit board,
By rotating the head rotation drive motor of the mounting head to a predetermined angle within a range that can be imaged by the component recognition camera, imaging the suction nozzle multiple times is repeated multiple times by moving the mounting head. ,
Translate each position of the suction nozzle imaged at each stop position of the mounting head and recognized by the recognition processing device so that the coordinates of the origin position of the suction nozzle of the mounting head overlap,
Each position of the suction nozzle at each stop position of the mounting head is averaged to determine each coordinate of the suction nozzle for each rotation of the mounting head,
An electronic component mounting method characterized in that a center coordinate of a circle passing through each of the determined coordinates of the suction nozzle is obtained and used as a rotation center of the mounting head. The result is that the mounting head that can move from the component pick-up position to the component mounting position is equipped with a plurality of suction nozzles, and the electronic components sucked and held by the suction nozzles are imaged by the component recognition camera and recognized by the recognition processing device. On the basis of the electronic component mounting method for correcting the angular displacement by rotating the mounting head and mounting the printed circuit board on the printed circuit board,
By rotating the head rotation drive motor of the mounting head to a predetermined angle within a range that can be imaged by the component recognition camera, imaging the suction nozzle multiple times is repeated multiple times by moving the mounting head. ,
Translate each position of the suction nozzle imaged at each stop position of the mounting head and recognized by the recognition processing device so that the coordinates of the origin position of the suction nozzle of the mounting head overlap,
For each stop position of the mounting head, obtain the center coordinates of a circle that passes through each position of the suction nozzle recognized by the recognition processing device,
An electronic component mounting method characterized in that the center coordinates of each mounting position of the mounting head are averaged in a weighted state for each stop position to be the rotation center of the mounting head . The result is that the mounting head that can move from the component pick-up position to the component mounting position is equipped with a plurality of suction nozzles, and the electronic components sucked and held by the suction nozzles are imaged by the component recognition camera and recognized by the recognition processing device. On the basis of the electronic component mounting method for correcting the angular displacement by rotating the mounting head and mounting the printed circuit board on the printed circuit board,
By rotating the head rotation drive motor of the mounting head to a predetermined angle within a range that can be imaged by the component recognition camera, imaging the suction nozzle multiple times is repeated multiple times by moving the mounting head. ,
For each stop position of the mounting head, obtain the center coordinates of a circle that passes through each position of the suction nozzle recognized by the recognition processing device,
Translate the center coordinates for each stop position of the mounting head so that the coordinates of the origin position of the suction nozzle of the mounting head overlap,
An electronic component mounting method characterized in that the center coordinates of each mounting position of the mounting head are averaged in a weighted state for each stop position to obtain the rotation center of the mounting head. The result is that the mounting head that can move from the component pick-up position to the component mounting position is equipped with a plurality of suction nozzles, and the electronic components sucked and held by the suction nozzles are imaged by the component recognition camera and recognized by the recognition processing device. On the basis of the electronic component mounting method for correcting the angular displacement by rotating the mounting head and mounting the printed circuit board on the printed circuit board,
By rotating the head rotation drive motor of the mounting head to a predetermined angle within a range that can be imaged by the component recognition camera, imaging the suction nozzle multiple times is repeated multiple times by moving the mounting head. ,
Translate each position of the suction nozzle imaged at each stop position of the mounting head and recognized by the recognition processing device so that the coordinates of the origin position of the suction nozzle of the mounting head overlap,
For each stop position of the mounting head, obtain the center coordinates of a circle that passes through each position of the suction nozzle recognized by the recognition processing device,
An electronic component mounting method characterized in that the center coordinates for each stop position of the mounting head are averaged to be the rotation center of the mounting head.

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