JP4693479B2 - Glass substrate drill - Google Patents
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- JP4693479B2 JP4693479B2 JP2005130778A JP2005130778A JP4693479B2 JP 4693479 B2 JP4693479 B2 JP 4693479B2 JP 2005130778 A JP2005130778 A JP 2005130778A JP 2005130778 A JP2005130778 A JP 2005130778A JP 4693479 B2 JP4693479 B2 JP 4693479B2
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本発明は、プラズマディスプレイ用ガラス基板にプラズマディスプレイパネルを製造する際の排気用の孔をあける等、比較的薄い電子産業用ガラス基板に対して直径１．０ｍｍ〜６．０ｍｍ程度の小径の孔あけを行うためのガラス基板の孔あけドリルに関する。 The present invention provides a small hole having a diameter of about 1.0 mm to 6.0 mm with respect to a relatively thin glass substrate for electronic industry, such as making a hole for exhaust when manufacturing a plasma display panel in a glass substrate for plasma display. The present invention relates to a glass substrate drill for drilling.
従来、ガラス基板に孔をあけるためのダイヤモンドコアドリルは、一般的に図４のような構造をしていた。 Conventionally, a diamond core drill for making a hole in a glass substrate generally has a structure as shown in FIG.
図４は従来のダイヤモンドコアドリルの説明図である。（Ａ）はドリル先端からみた拡大正面図、（Ｂ）は研磨部の回転軸方向の拡大断面図である。詳しくは、Ｃ、Ｃ´における拡大断面図である。ダイヤモンドコアドリルは、鋼製の回転軸１と、研磨材としてのダイヤモンド砥粒を電着させた研磨部２よりなる。その中心は貫通孔が空き冷却水を供給する。このようなドリルによる孔あけにおいて、孔あけ時の孔あけ加工の所要時間を速くするためには、ドリルの回転を速くし研磨材であるダイヤモンド砥粒を粗くするとよい。しかしながら、ダイヤモンド砥粒を粗くすると研磨面が粗くなり、加工した孔の精度が低下するという問題があり、引いてはクラック発生およびハマ欠け発生の懸念がある。よって、ダイヤモンド砥粒を細かくして孔あけ加工時の所要時間を遅くし、孔あけ加工をせざるを得なかった。尚、ハマ欠けとは、貝殻上のガラス基板の剥離かけを意味する。 FIG. 4 is an explanatory diagram of a conventional diamond core drill. (A) is the enlarged front view seen from the drill front-end | tip, (B) is an expanded sectional view of the rotating shaft direction of a grinding | polishing part. Specifically, it is an enlarged cross-sectional view at C and C ′. The diamond core drill is composed of a rotating shaft 1 made of steel and a polishing portion 2 on which diamond abrasive grains as an abrasive are electrodeposited. At the center, the through-hole supplies empty cooling water. In such drilling, in order to speed up the time required for drilling at the time of drilling, it is preferable to increase the rotation of the drill and roughen the diamond abrasive grains as the abrasive. However, when the diamond abrasive grains are roughened, there is a problem that the polished surface becomes rough and the accuracy of the processed holes is lowered, and there is a concern that cracks and cracks may occur. Therefore, the diamond abrasive grains must be made fine so that the time required for the drilling process is delayed, and the drilling process must be performed. Note that the lack of hook means peeling of the glass substrate on the shell.
特許文献１には、ダイヤモンド砥粒を粗くしドリルの回転を速くしたとしても良好な仕上げ面が得られるとした穿孔用ダイヤモンドコアドリルが開示され、該穿孔用ダイヤモンドコアドリルは回転軸を構成するシャンクの先端に備えたダイヤモンド砥粒を有する円筒状の砥石部が内層と外層の２層構造からなる。また、特許文献２には、クラックや欠け、割れ等の発生および砥石先端の損傷を抑制のために、研削加工中に砥石先端部に冷却水を充分供給するように工夫したダイヤモンドコアドリルが開示され、該ダイヤモンドコアドリルは、回転軸を構成するシャンクの先端に備えたダイヤモンド砥粒を有する円筒状の砥石部先端の円環状端面が、回転軸方向に変位する滑らかに連続した凹凸面より形成される。また、孔あけ加工部のハマ欠け、焼きつきを防止するためのコアドリルが特許文献３および特許文献４にて開示されている。 Patent Literature 1 discloses a diamond core drill for drilling that can obtain a good finished surface even if diamond abrasive grains are roughened and the drill rotates faster. The drilled diamond core drill is a shank that constitutes a rotating shaft. A cylindrical grindstone portion having diamond abrasive grains provided at the tip has a two-layer structure of an inner layer and an outer layer. Patent Document 2 discloses a diamond core drill that is devised so as to sufficiently supply cooling water to the tip of the grindstone during grinding in order to suppress the occurrence of cracks, chips, cracks and the like and damage to the tip of the grindstone. In the diamond core drill, an annular end surface at the tip of a cylindrical grindstone having diamond abrasive grains provided at the tip of a shank constituting a rotating shaft is formed from a smoothly continuous uneven surface that is displaced in the rotating shaft direction. . Also, Patent Document 3 and Patent Document 4 disclose a core drill for preventing cracking and seizure at a drilled portion.
一方、プラズマディスプレイ用ガラス基板における排気用の孔あけ等、比較的薄い電子産業用ガラス基板に対する孔あけは、直径１．０〜６．０ｍｍ程度の比較的小さい孔あけが通常であり、それに適応するダイヤモンドコアドリルは華奢となり破損しやすいため、一般的にラップ棒と呼ばれる円柱状の金属の周円および端面にダイヤモンド砥粒を電着等で固着された工具を使用し、偏心回転させつつガラス基板に研磨孔あけする。このようなラップ棒について、特許文献５等に開示されている。
プラズマディスプレイ用ガラス基板等の電子産業用基板は、通常、板厚０．７ｍｍ〜３．５ｍｍの範囲内である。従来のダイヤモンドコアドリルを用いた孔あけにおいて、例えば、プラズマディスプレイ用ガラス基板におけるプラズマディスプレイパネル製造における排気用の孔あけ等、電子産業用等の比較的薄いガラス基板に対する孔あけは、直径１．０ｍｍ〜６．０ｍｍ程度の比較的小径の孔あけが通常であり、それに適応するダイヤモンドコアドリルは華奢となり破損しやすい。また、ダイヤモンドコアドリル内の冷却水供給用の貫通孔が細くなるため、冷却水が供給し難く、加工孔部にハマ欠けが発生し易い等の問題があった。 A substrate for an electronic industry such as a glass substrate for plasma display is usually in a range of a thickness of 0.7 mm to 3.5 mm. In the drilling using a conventional diamond core drill, for example, a hole for a relatively thin glass substrate for the electronic industry, such as a hole for exhaust in manufacturing a plasma display panel in a glass substrate for a plasma display, is 1.0 mm in diameter. Drilling with a relatively small diameter of about ~ 6.0 mm is normal, and a diamond core drill adapted to it is delicate and easily damaged. Moreover, since the through-hole for supplying cooling water in the diamond core drill becomes thin, there is a problem that it is difficult to supply cooling water and cracks are easily generated in the processed hole.
電子産業用ガラス基板等の比較的薄いガラス基板の孔あけに際し、ダイヤモンドコアドリルを破損し難くするには、貫通孔をなくすか、あるいはできるだけ細くすればよい。また、冷却水によるドリルの冷却効果を向上させハマ欠けを防止るためには、貫通孔径をできるだけ大きくすればよい。 When making a relatively thin glass substrate such as a glass substrate for the electronic industry difficult to break the diamond core drill, the through hole may be eliminated or made as thin as possible. Further, in order to improve the cooling effect of the drill by the cooling water and prevent cracking, it is only necessary to make the through hole diameter as large as possible.
これらの相反する課題を解決するためには、回転軸の先端部にダイヤモンド砥粒を有する研磨部を設けたドリルにおいて、研磨部に回転軸方向にドリル先端まで連続して溝を設け、研磨部基部の溝は狭くしてドリル先端で溝を広くし、ドリル先端で溝が広がった構造のドリルを、ガラス基板の孔あけドリルに用いればよい。ドリル内には冷却水供給用の貫通孔を設けず、ノズルより吐出してドリル先端に当てて冷却する。
In order to solve these conflicting problems, in a drill provided with a polishing portion having diamond abrasive grains at the tip of the rotating shaft, a groove is continuously provided in the polishing portion in the direction of the rotating shaft up to the tip of the drill. A drill having a structure in which the groove at the base portion is narrowed and the groove is widened at the tip of the drill and the groove is widened at the tip of the drill may be used as a drill for drilling a glass substrate. The drill is not provided with a through hole for supplying cooling water, but is discharged from the nozzle and cooled by being applied to the tip of the drill.
即ち、本発明は、研磨して孔をあけるガラス基板の板厚が、０．７ｍｍ以上、３．５ｍｍ以下であり、あける孔の径が、１．０ｍｍ以上、６．０ｍｍ以下であるガラス基板に孔を研磨してあけるための回転軸の先端部にダイヤモンド砥粒を有する研磨部（２）を設けたガラス基板の孔あけドリルであって、研磨部（２）に２００メッシュ以上２３０メッシュ以下の範囲内の粒度のダイヤモンド砥粒を固着させてなり、ドリル先端研磨部（４）の長さ（Ｌ’）が１．０ｍｍ以上、２．０ｍｍ以下であり、研磨部（２）の外径が０．８ｍｍ以上、６．０ｍｍ以下で一定であり、回転軸（１）方向にドリル先端まで連続する溝（３）を回転軸（１）および研磨部（２）に設け、研磨部（２）とドリル先端研磨部（４）の境には段差（５）を設けて、溝（３）をドリル先端で広げて研磨部（４）を肉薄とした構造であり、ドリル先端研磨部（Ｌ’）の肉厚が０．３ｍｍ以上、０．８ｍｍ以下であることを特徴とするガラス基板の孔あけドリル。
That is, the present invention provides a glass substrate having a thickness of 0.7 mm or more and 3.5 mm or less and a diameter of the hole to be drilled of 1.0 mm or more and 6.0 mm or less. A drilling drill for a glass substrate provided with a polishing part (2) having diamond abrasive grains at the tip of a rotating shaft for polishing and opening a hole in the polishing part (2) , wherein the polishing part (2) is 200 mesh or more and 230 mesh or less The diamond abrasive grains having a particle size within the range of are fixed, the length (L ′) of the drill tip polishing portion (4 ) is 1.0 mm or more and 2.0 mm or less, and the outer diameter of the polishing portion (2) Is constant at 0.8 mm or more and 6.0 mm or less, and a groove (3) continuous to the drill tip in the direction of the rotation axis (1) is provided in the rotation axis (1) and the polishing part (2) , and the polishing part (2 ) And the drill tip polishing part (4) are provided with a step (5) (3) is widened with a drill tip to make the polishing portion (4) thin, and the thickness of the drill tip polishing portion (L ′) is 0.3 mm or more and 0.8 mm or less. Glass substrate drill.
ダイヤモンドコアドリルを用いた板厚０．７ｍｍ〜３．５ｍｍのプラズマディスプレイ用ガラス基板における排気用の孔形成等、電子産業用等の比較的薄いガラス基板に対する孔あけに、本発明のガラス基板の孔あけドリルを用いると、孔あけ時にドリルが破損し難く、加えてドリル先端の冷却効果が得やすいために、加工孔部のハマ欠けの発生が抑制された。 Holes in the glass substrate of the present invention are used for making holes in relatively thin glass substrates for the electronics industry, such as the formation of exhaust holes in a glass substrate for plasma displays having a thickness of 0.7 mm to 3.5 mm using a diamond core drill. When the drill was used, the drill was difficult to break during drilling, and in addition, it was easy to obtain a cooling effect at the tip of the drill.
図１および図２を用いて本発明のガラス基板の孔あけドリルについて説明する。図１は、本発明のガラス基板の孔あけドリルの一例の斜視図である。図２は、本発明のガラス基板の孔あけドリルの一例を溝側より見た側面図である。 The glass substrate hole drill of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a perspective view of an example of a drilling drill for a glass substrate of the present invention. FIG. 2 is a side view of an example of a drill hole for drilling a glass substrate according to the present invention as seen from the groove side.
図１および図２に示すように、本発明のガラス基板の孔あけドリルは回転軸１および研磨部２に溝３を設けてなり、ドリル先端研磨部４を肉薄にすることによって、溝３は広がっている。この肉薄のドリル先端研磨部４の長さＬ´は１．０ｍｍ以上、２．０ｍｍ以下の範囲内であることが好ましい。ドリル先端研磨部４の長さＬ´が１．０ｍｍより短いと、ドリル先端の冷却効果が得られず、加工孔部のハマ欠けが発生し易い。一方、２．０ｍｍより長いとドリル先端研磨部４が華奢となり破損し難い。 As shown in FIGS. 1 and 2, the glass substrate drill of the present invention is provided with a groove 3 in the rotating shaft 1 and the polishing portion 2, and the groove 3 is formed by thinning the drill tip polishing portion 4. It has spread. The length L ′ of the thin drill tip polishing portion 4 is preferably in the range of 1.0 mm or more and 2.0 mm or less. If the length L ′ of the drill tip polishing portion 4 is shorter than 1.0 mm, the cooling effect of the drill tip cannot be obtained, and cracks in the processed hole portion are likely to occur. On the other hand, if it is longer than 2.0 mm, the drill tip polishing portion 4 becomes delicate and is not easily damaged.
図３は、本発明の孔あけドリルの一例のドリル先端の拡大図である。（Ａ）がドリル先端側からみた拡大正面図、（Ｂ）が回転軸方向におけるドリル先端の拡大断面図である。詳しくは、Ｄ、Ｄ´における断面図である。 FIG. 3 is an enlarged view of a drill tip of an example of a drill according to the present invention. (A) is the enlarged front view seen from the drill front end side, (B) is an expanded sectional view of the drill front end in the rotation axis direction. Specifically, it is a cross-sectional view at D and D ′.
尚、本発明のガラス基板の孔あけドリルにおいて、図１〜３に示すように、研磨部２に連続した溝を設け、該溝３のドリル先端付近に段差５を設け、ドリル先端で溝３が広がった構造とした。他方、ドリルの製作は難しくなるが、ドリル先端よりドリル基部に進むに従い、研磨部２の溝３の幅６および深さ７が徐々に減少し、ドリル先端研磨部４が肉薄であり、ドリル基部方向へ進むに従い、研磨部２の肉厚が徐々に増す構造としてもよい。ドリル先端で溝３を広げて、ドリル先端研磨部４を肉薄とすることで、ドリル先端の冷却効果が増し、加工孔部のハマ欠けの発生が抑制される。加えて、ドリル先端研磨部４を肉薄化したことによりドリル先端が鋭利となり、孔あけ加工時に研磨してガラス基板を掘り進む速度が増し、無駄な力が架らないためにハマ欠けが発生し難くなる。尚、ドリル先端研磨部４以外は溝３を浅くすることで研磨部２に肉厚の厚い部位が得られて、ドリルが破損し難い。 In the drill for drilling a glass substrate of the present invention, as shown in FIGS. 1 to 3, a continuous groove is provided in the polishing portion 2, a step 5 is provided in the vicinity of the drill tip of the groove 3, and the groove 3 is formed at the tip of the drill. The structure spread. On the other hand, although it is difficult to manufacture the drill, the width 6 and the depth 7 of the groove 3 of the polishing unit 2 gradually decrease as the drill proceeds from the drill tip to the drill base, and the drill tip polishing unit 4 is thin. It is good also as a structure where the thickness of the grinding | polishing part 2 increases gradually as it goes to a direction. By widening the groove 3 at the tip of the drill and making the drill tip polished portion 4 thinner, the cooling effect of the tip of the drill is increased, and the occurrence of chipping in the processed hole is suppressed. In addition, since the drill tip polishing portion 4 is thinned, the tip of the drill is sharpened, the speed of polishing and drilling the glass substrate is increased at the time of drilling processing, and since unnecessary force is not applied, cracks are less likely to occur. Become. In addition, by making the groove 3 shallow except for the drill tip polishing portion 4, a thick portion is obtained in the polishing portion 2, and the drill is hardly damaged.
冷却水をノズルより吐出させつつドリル先端に当て冷却効果を得るためには、冷却水がドリル先端まで浸透するように、図１および図２に示すように、回転軸方向にドリル先端まで、連続する溝３を回転軸１および研磨部２に設ける。
To obtain the cooling effect against cooling water to the drill point while out ejection from the nozzle, as the cooling water to penetrate to the drill point, as shown in FIGS. 1 and 2, until the drill tip in the direction of the rotational axis, A continuous groove 3 is provided in the rotating shaft 1 and the polishing part 2 .
本発明のガラス基板の孔あけドリルにおいて、研磨部２は、ニッケル等を結合材にして、例えば２００メッシュ以上、２３０メッシュ以下の範囲内の粒度のダイヤモンド砥粒を従来知られた電着法により固着させて形成することが好ましい。２００メッシュより粒度が小さいと孔加工の際の速度が遅くなり、２３０メッシュより粒度が大きいとダイヤモンド砥粒が粗すぎて、孔の加工精度が低下するとともに、研磨する孔加工部のガラスに負荷がかかりハマ欠けが発生し易い。尚、本発明において研磨部２とはダイヤモンド砥粒を電着法等を用いて固着させた研磨に有効な部位であり、ドリル先端よりの研磨に有効な研磨部の長さが有効砥粒長Ｌである。 In the drill for drilling a glass substrate according to the present invention, the polishing part 2 uses nickel or the like as a binder, and for example, diamond abrasive grains having a particle size in the range of 200 mesh or more and 230 mesh or less are applied by a conventionally known electrodeposition method. It is preferable to form it by adhering. If the particle size is smaller than 200 mesh, the drilling speed will be slow. If the particle size is larger than 230 mesh, the diamond abrasive grains will be too coarse, the hole processing accuracy will be lowered, and the glass of the hole processed part to be polished will be loaded. It is easy to get hooked. In the present invention, the polishing portion 2 is a portion effective for polishing in which diamond abrasive grains are fixed using an electrodeposition method or the like, and the length of the polishing portion effective for polishing from the drill tip is the effective abrasive length. L.
本発明のガラス基板の孔あけドリルで孔あけ加工するガラス基板の板厚は、０．７ｍｍ以上、３．５ｍｍ以下の範囲内であることが好ましい。例えば、無アルカリガラス基板等の硬いガラス基板であっても、ガラス基板の板厚が、０．７ｍｍより薄いとガラス基板が脆弱で孔あけ時に割れて破損する虞があり、板厚が３．５ｍｍより厚いと、本発明のガラス基板の孔あけドリルにおいて、ドリル先端に負荷がかかり過ぎ、孔あけ時にドリル先端が折れ破損すること頻発する虞がある。また、プラズマディスプレイ用ガラス基板のプラズマディスプレイパネル製造における排気用の孔あけ等、孔あけ加工が必要な電子産業用ガラス基板の板厚は、通常、０．７ｍｍ〜３．５ｍｍの範囲内である。 It is preferable that the plate | board thickness of the glass substrate drilled with the drill of the glass substrate of this invention exists in the range of 0.7 mm or more and 3.5 mm or less. For example, even if it is a hard glass substrate such as an alkali-free glass substrate, if the thickness of the glass substrate is less than 0.7 mm, the glass substrate may be brittle and may break and break when drilled. If it is thicker than 5 mm, in the drill for drilling a glass substrate of the present invention, too much load is applied to the tip of the drill, and the tip of the drill may break and break during drilling. In addition, the thickness of the glass substrate for the electronics industry that needs to be drilled, such as drilling holes for exhaustion in the production of plasma display panels for plasma display glass substrates, is usually in the range of 0.7 mm to 3.5 mm. .
また、本発明のガラス基板の孔あけドリルで孔あけ加工する孔の径は１．０ｍｍ以上、６．０ｍｍ以下である。孔あけ加工する孔の径に対してドリルの径は若干小さくする必要があり、孔の径が１．０ｍｍより小さい孔あけ加工に対するドリルに対し、本発明のガラス基板の孔あけドリルが有する構造に溝３を加工することは困難であり現実的ではない。孔の径が６．０ｍｍより大きな孔あけ加工に対しては、ドリルの径が大きくなり、本発明のガラス基板の孔あけドリルが有する構造に溝３を加工としなくても、従来のダイヤモンドコアドリルのように貫通孔を設けた構造において、十分な強度および冷却が得られる。 Moreover, the diameter of the hole drilled with the drill for drilling the glass substrate of the present invention is 1.0 mm or more and 6.0 mm or less. It is necessary to make the diameter of the drill slightly smaller than the diameter of the hole to be drilled, and the structure of the drill for drilling the glass substrate of the present invention with respect to the drill for drilling with a hole diameter smaller than 1.0 mm. It is difficult and practical to process the groove 3. For drilling with a hole diameter larger than 6.0 mm, the diameter of the drill is increased, and the conventional diamond core drill can be used without forming the groove 3 in the structure of the glass substrate drill of the present invention. In the structure having the through holes as described above, sufficient strength and cooling can be obtained.
上記のように、孔あけ加工する孔の径が１．０ｍｍ以上、６．０ｍｍ以下であるので、本発明のガラス基板の孔あけドリルの研磨部２の外径は、０．８ｍｍ以上、６．０ｍｍ以下の範囲内となる。ドリルの研磨部２の外径が、０．８ｍｍより小さいと、本発明のガラス基板の孔あけドリルが有する構造に溝３を加工することは困難であり現実的ではない。ドリルの研磨部２の外径が、６．０ｍｍより大きいと、本発明のガラス基板の孔あけドリルが有する構造に加工しなくても十分な強度および冷却が得られる。 As described above, since the diameter of the hole to be drilled is 1.0 mm or more and 6.0 mm or less, the outer diameter of the polishing portion 2 of the drilling drill of the glass substrate of the present invention is 0.8 mm or more, 6 Within the range of 0.0 mm or less. If the outer diameter of the drill grinding part 2 is smaller than 0.8 mm, it is difficult and practical to process the groove 3 in the structure of the glass substrate drill of the present invention. If the outer diameter of the grinding part 2 of the drill is larger than 6.0 mm, sufficient strength and cooling can be obtained without processing into the structure of the glass substrate drill of the present invention.
また、ドリル先端で溝３を広げて、ドリル先端研磨部４を肉薄とすることで、ドリル先端研磨部４の冷却効果が増し、加工孔部のハマ欠けの発生が抑制され、加えて、ドリル先端研磨部４を肉薄化したことによりドリル先端が鋭利となり、孔あけ加工時に研磨してガラス基板を掘り進む速度が増し、無駄な力が架らないためにハマ欠けが発生し難くなる。これら効果を得るためには、ドリル先端研磨部４の肉厚を０．３ｍｍ以上、０．８ｍｍ以下の範囲とすることが好ましい。使用する鋼の種類にもよるが、０．３ｍｍより薄いと強度がなくドリル先端が破損しやすい、０．８ｍｍより厚いと冷却効果が得難くなるとともに、ドリル先端が鋭利とならず、ハマ欠けが発生し難くなる効果が得られない。 Further, by expanding the groove 3 at the tip of the drill and making the drill tip polishing portion 4 thinner, the cooling effect of the drill tip polishing portion 4 is increased, and the occurrence of chipping in the processed hole portion is suppressed. Thinning the tip polishing portion 4 makes the tip of the drill sharp, increases the speed of polishing and drilling the glass substrate at the time of drilling, and prevents unnecessary chipping because no unnecessary force is applied. In order to obtain these effects, it is preferable to set the wall thickness of the drill tip polishing portion 4 in the range of 0.3 mm or more and 0.8 mm or less. Depending on the type of steel used, if the thickness is less than 0.3 mm, the drill tip is not strong and breaks easily. If the thickness is more than 0.8 mm, the cooling effect is difficult to obtain, the drill tip is not sharp, The effect of making it difficult to occur cannot be obtained.
尚、本発明のガラス基板の孔あけドリルにおいて、研磨部２の外径が細くなる程、ドリル先端研磨部４の肉厚は薄くなり、ドリル先端研磨部４の肉厚に比べ、ドリル先端以外の研磨部２の肉厚は厚い。 In the drill for drilling a glass substrate of the present invention, the thinner the outer diameter of the polishing portion 2 is, the thinner the tip end polishing portion 4 is, and the thickness of the drill tip polishing portion 4 is other than the drill tip. The thickness of the polishing portion 2 is thick.
本発明のガラス基板の孔あけドリルの一例の側面図である図１に示す形状のガラス基板の孔あけドリルを作製した。詳しくは本発明の孔あけドリルの一例のドリル先端の拡大図である図３を用いて説明する。 A glass substrate drill of the shape shown in FIG. 1, which is a side view of an example of the glass substrate drill of the present invention, was produced. In detail, it demonstrates using FIG. 3 which is an enlarged view of the drill tip of an example of the drilling hole of this invention.
図３は、（Ａ）がドリル先端側からみた拡大正面図、（Ｂ）が回転軸方向におけるドリル先端の拡大断面図、詳しくは、Ｄ、Ｄ´における断面図である。研磨部２の外径は１．９５ｍｍで一定であり、研磨部２のドリル先端４よりの有効砥粒長Ｌは４．０ｍｍである。 3A is an enlarged front view as viewed from the drill tip side, and FIG. 3B is an enlarged cross-sectional view of the drill tip in the direction of the rotation axis. The outer diameter of the polishing part 2 is constant at 1.95 mm, and the effective abrasive grain length L from the drill tip 4 of the polishing part 2 is 4.0 mm.
研磨部２は、ニッケルを結合材にして、研磨材である２００メッシュのダイヤモンド砥粒を従来知られた電着法により固着させている。ドリル先端４からの長さＬ´が１．５ｍｍの範囲のドリル先端研磨部４は、深さが１．３５ｍｍ、幅が１．０ｍｍの溝３を設け、肉厚が０．６ｍｍの肉薄部である。それ以外の研磨部２は、深さが１．０ｍｍ、幅が０．５ｍｍの溝を入れた肉厚０．７ｍｍ〜０．９５ｍｍの肉厚部である。これら研磨部２の境には段差５を設けた。これら溝３は連続し、ドリル先端で溝３を広げた構造である。 The polishing unit 2 uses nickel as a binder, and a 200-mesh diamond abrasive that is an abrasive is fixed by a conventionally known electrodeposition method. The drill tip polished portion 4 having a length L ′ from the drill tip 4 in the range of 1.5 mm is provided with a groove 3 having a depth of 1.35 mm and a width of 1.0 mm, and a thin portion having a thickness of 0.6 mm. It is. The other polishing part 2 is a thick part having a thickness of 0.7 mm to 0.95 mm with a groove having a depth of 1.0 mm and a width of 0.5 mm. A step 5 is provided at the boundary between these polishing portions 2. These grooves 3 are continuous and have a structure in which the grooves 3 are widened at the tip of the drill.
上記寸法である本発明のガラス基板の孔あけドリルを用い、ドリルを４０００回転で回転させつつ、板厚、２.８ ｍｍ のプラズマディスプレイ用ガラス基板に押圧研磨して径、２.０ ｍｍ の孔あけ加工を行った。尚、押圧の際には研磨中の孔あけ加工部に冷脚水をノズルより吐出させて、ドリルに当てドリルの先端の冷却を行った。 Using the drilling drill for the glass substrate of the present invention having the above dimensions, while rotating the drill at 4000 rpm, the glass substrate for plasma display having a plate thickness of 2.8 mm was pressed and polished to a diameter of 2.0 mm. Drilling was performed. In addition, at the time of pressing, cold leg water was discharged from the nozzle to the drilling portion being polished, and the tip of the drill was cooled by being applied to the drill .
孔欠け加工後の貫通孔をルーペにて拡大観察したところ、ハマ欠け等発生することなく滑らかな研磨面であった。 When the through hole after the hole chipping was magnified and observed with a magnifying glass, it was a smooth polished surface with no chipping or the like.
次いで、本発明の範疇にないドリルを作製した。研磨部２の外径は１．９５ｍｍで一定であり、ドリル先端４よりの有効砥粒長Ｌは４．０ｍｍである。研磨部２には、ニッケルを結合材にして２００メッシュのダイヤモンド砥粒を従来知られた電着法により固着させており、実施例と異なり、ドリル先端まで、深さ１．０ｍｍ、幅０．５ｍｍの溝３を入れて、ドリル先端で溝３を広げてはいない。 Next, a drill not within the scope of the present invention was produced. The outer diameter of the polishing portion 2 is constant at 1.95 mm, and the effective abrasive grain length L from the drill tip 4 is 4.0 mm. The polishing portion 2 is bonded with 200 mesh diamond abrasive grains using nickel as a binder by a conventionally known electrodeposition method. Unlike the example, the drill tip has a depth of 1.0 mm and a width of 0. A groove 3 of 5 mm is inserted and the groove 3 is not widened at the tip of the drill.
上記寸法である本発明の範疇にないガラス基板の孔あけドリルを用い、ドリルを４０００回転で回転させつつ、板厚、２．８０ｍｍのプラズマディスプレイ用ガラス基板に押圧研磨して径、２．０ｍｍの孔あけ加工を行った。尚、押圧の際には研磨中の孔あけ加工部に冷脚水をノズルより吐出させて当てて冷却を行った。 Using a glass substrate drilling drill that does not fall within the scope of the present invention having the above-mentioned dimensions, while rotating the drill at 4000 rpm, the glass substrate for plasma display having a plate thickness of 2.80 mm is pressed and polished to a diameter of 2.0 mm. Drilling was performed. In the pressing, cooling leg water was discharged from the nozzle and applied to the drilling portion being polished.
孔欠け加工後の貫通孔をルーペにて拡大観察したところ、ハマ欠けが発生していた。 When the through-holes after the hole chipping were magnified and observed with a magnifying glass, cracks were generated.
１ 回転軸
２ 研磨部
３ 溝
４ ドリル先端研磨部
５ 段差
1 Rotating shaft 2 Polishing part 3 Groove 4 Drill tip polishing part 5 Step
Claims (1)
研磨部（２）に２００メッシュ以上２３０メッシュ以下の範囲内の粒度のダイヤモンド砥粒を固着させてなり、
ドリル先端研磨部（４）の長さ（Ｌ’）が１．０ｍｍ以上、２．０ｍｍ以下であり、
研磨部（２）の外径が０．８ｍｍ以上、６．０ｍｍ以下で一定であり、
回転軸（１）方向にドリル先端まで連続する溝（３）を回転軸（１）および研磨部（２）に設け、
研磨部（２）とドリル先端研磨部（４）の境には段差（５）を設けて、溝（３）をドリル先端で広げて研磨部（４）を肉薄とした構造であり、
ドリル先端研磨部（Ｌ’）の肉厚が０．３ｍｍ以上、０．８ｍｍ以下であることを特徴とするガラス基板の孔あけドリル。 The thickness of the glass substrate for polishing and opening holes is 0.7 mm or more and 3.5 mm or less, and the diameter of the holes to be opened is 1.0 mm or more and 6.0 mm or less by polishing the holes. A drilling drill for a glass substrate provided with a polishing part (2) having diamond abrasive grains at the tip of a rotating shaft for opening,
The diamond abrasive grains having a particle size within a range of 200 mesh or more and 230 mesh or less are fixed to the polishing portion (2) ,
The length (L ′) of the drill tip polishing portion (4 ) is 1.0 mm or more and 2.0 mm or less,
The outer diameter of the polishing part (2) is constant at 0.8 mm or more and 6.0 mm or less,
A groove (3) that continues to the drill tip in the direction of the rotation axis (1) is provided in the rotation axis (1) and the polishing section (2)
A step (5) is provided at the boundary between the polishing portion (2) and the drill tip polishing portion (4), and the groove (3) is widened at the drill tip to make the polishing portion (4) thin.
A drill drilling a glass substrate, wherein the drill tip polished portion (L ′) has a thickness of 0.3 mm or more and 0.8 mm or less.
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| JP5601498B2 (en) * | 2010-03-25 | 2014-10-08 | 日立工機株式会社 | Drill bit |
| JP2017138540A (en) | 2016-02-05 | 2017-08-10 | 株式会社ジャパンディスプレイ | Display device |
| JP2018167346A (en) * | 2017-03-29 | 2018-11-01 | 京セラ株式会社 | Cutting tool |
| JP7260971B2 (en) * | 2018-07-17 | 2023-04-19 | 日本特殊陶業株式会社 | Electroformed whetstone |
| JP2021020825A (en) * | 2019-07-26 | 2021-02-18 | イビデン株式会社 | Processing method of open hole to glass substrate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05308U (en) * | 1991-06-24 | 1993-01-08 | セントラル硝子株式会社 | Drill for drilling glass plates |
| JPH0625307Y2 (en) * | 1988-10-24 | 1994-07-06 | ノリタケダイヤ株式会社 | Diamond drill |
| JPH08118124A (en) * | 1994-10-25 | 1996-05-14 | Citizen Watch Co Ltd | Electrodeposited tool |
| JP2000210874A (en) * | 1999-01-21 | 2000-08-02 | Nikon Corp | Drill and processing method, stage processing method and manufacture of exposure device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0625307Y2 (en) * | 1988-10-24 | 1994-07-06 | ノリタケダイヤ株式会社 | Diamond drill |
| JPH05308U (en) * | 1991-06-24 | 1993-01-08 | セントラル硝子株式会社 | Drill for drilling glass plates |
| JPH08118124A (en) * | 1994-10-25 | 1996-05-14 | Citizen Watch Co Ltd | Electrodeposited tool |
| JP2000210874A (en) * | 1999-01-21 | 2000-08-02 | Nikon Corp | Drill and processing method, stage processing method and manufacture of exposure device |
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