JP4689289B2 - Manufacturing method of disc-shaped tag - Google Patents

Description

  The present invention relates to a disk-like tag having a data transmission / reception function and a method for manufacturing the same.

  Recently, information media such as IC cards and IC tags with built-in IC chips have attracted attention in place of magnetic cards that are problematic in terms of security. Since this type of information medium incorporating an IC chip has the advantage that it is difficult to forge or alter, it is expected to be applied in various fields where confidentiality is required. As an information medium incorporating an IC chip, an information medium having a circular or coin-shaped outer shape (hereinafter referred to as a disk-shaped tag) has been proposed (Japanese Patent Laid-Open No. 2-101599 (Patent Document 1)). JP-A-5-189626 (Patent Document 2)). Further, among IC chip built-in type information media, a non-contact type coin-shaped information medium has been proposed that can send and receive data without contact with an external reader / writer, that is, without contact. (For example, JP-A-5-50790 (Patent Document 3)).

  Since the non-contact type coin shape information medium has a shape similar to a coin, it is considered to be used as a prepaid coin in a playground that requires a coin, such as a pachinko hall or a casino. . In this way, when using as a prepaid coin, the prepaid coin is inserted into an external device provided outside, and the lead placed near the transport path while the prepaid coin passes through the transport path. -A system that transmits and receives data between the writer and the prepaid coin is adopted.

  When prepaid coins are used, it is possible to create and issue prepaid coins unique to a game hall and prevent counterfeiting, and therefore it is advantageous for a game hall to use prepaid coins.

  Here, the prepaid coin inserted into the external device falls in the transport path by its own weight, and during this fall, transmission / reception of various data, measurement of the outer shape, and the like are performed. In order to drop the inside of the conveyance path by its own weight, the prepaid coin in which the entire IC chip is covered with a curable resin is too light to drop inside the conveyance path, and trouble may occur due to clogging in the conveyance path. It has been pointed out (Japanese Patent Laid-Open No. 2003-16408 (Patent Document 4)).

  Further, in Patent Document 4, the appearance of a prepaid coin in which the entire IC chip is covered with a curable resin may deteriorate due to wear or chipping around the resin-sealed portion. It has been pointed out. It has also been pointed out that mechanical troubles occur in the conveyance path and the like due to cracking and wear of the curable resin.

  In order to eliminate the drawbacks of the prepaid coins that are entirely covered with the curable resin described above, Patent Document 4 reinforces the outer periphery with a metal ring and has a weight that allows it to fall smoothly in the conveyance path by its own weight. A plate-shaped non-contact information medium is disclosed. Furthermore, Patent Document 4 includes a metal ring having a C-shaped cross section having an opening directed inward, and a disk-shaped resin sealing body that seals interior components including a memory and an antenna. A non-contact information medium having a structure in which a metal ring is sandwiched around the peripheral edge of the plate-shaped resin sealing body is also described. Patent Document 4 describes that by providing a cutting portion in the metal ring, the work of fitting the metal ring into the disc-shaped resin sealing body is facilitated and the influence on the antenna is reduced.

  As described above, Patent Document 4 discloses that a prepaid coin is made heavy by fitting a metal ring into the peripheral portion of the disc-shaped resin sealing body. Moreover, other patent documents 1-3 have the same structure by the point which provides a metal ring in the outer periphery of the sealing body which incorporated the IC chip.

Japanese Patent Laid-Open No. 2-101599 JP-A-5-189626 JP-A-5-50790 Japanese Patent Laid-Open No. 2003-16408

  On the other hand, considering the economics etc. as a conveyance path which conveys a prepaid coin, changing into the plastic conveyance path from the conventional metal conveyance path is examined. As described above, when the prepaid coin conveyance path is made of plastic, it has been found that a problem that cannot be considered in the metal conveyance path occurs. That is, when a prepaid coin with a metal ring is repeatedly inserted and passes through the plastic conveyance path many times, the metal ring of the prepaid coin is brought into contact with and collided with the metal ring of the prepaid coin due to the metal ring. It was found that scratches were made and the plastic conveyance path was damaged. For this reason, it is not preferable in terms of system maintenance and management to use a prepaid coin in which the above-described metal ring is fitted in a system using a plastic conveyance path.

  An object of the present invention is to provide a disc-shaped tag that is suitable for a system including a plastic conveyance path and that can maintain a weight sufficient to fall due to its own weight.

  Another object of the present invention is to provide a method for manufacturing the disk-shaped tag described above.

According to the onset bright, forming a first substrate disc shape having a inner peripheral wall which is spaced inwardly of the outer peripheral wall provided with a peripheral wall, IC inside of the inner peripheral wall A step of mounting a module, a step of mounting a weight adjusting balancer between the inner peripheral wall and the outer peripheral wall, and a sealing step of resin sealing the IC module and the weight adjusting balancer. A disc-shaped tag manufacturing method characterized by the above is obtained.

  In the present invention, there is provided a disc-shaped tag configured by providing a weight adjustment balancer on the outer periphery of an IC module capable of transmitting and receiving data including an IC chip and an antenna, and sealing the IC module and the weight adjustment balancer with a resin. The obtained disc-shaped tag has an advantage that the plastic conveying path is not damaged even when the conveying path is made of plastic because the metal is not exposed to the outer peripheral portion. . Furthermore, since the disc-shaped tag according to the present invention maintains a weight that can be dropped by its own weight due to the built-in weight adjusting balancer, there is an advantage that there is no adverse effect such as clogging in the conveyance path.

  With reference to FIG.1 and FIG.2, the disc-shaped tag which concerns on one Embodiment of this invention is demonstrated. As shown in the figure, the disc-shaped tag has a disc-shaped first substrate 11 formed of a resin such as PVC (polyvinyl chloride), PET (polyethylene terephthalate), or ABS. The first substrate 11 surrounds a flat disc-shaped bottom portion 111, an outer peripheral wall 112 formed substantially perpendicular to the bottom portion 111 along the outer periphery of the bottom portion 111, and a central region of the bottom portion 111. The inner peripheral wall 113 is provided, and the inner peripheral wall 113 is disposed inside the outer peripheral wall 112 with a space therebetween. The illustrated inner peripheral wall 113 is erected in the same direction as the outer peripheral wall 112 (that is, upward), and has a substantially circular shape like the outer peripheral wall 112.

  Therefore, the plane defined by the bottom 111 of the first substrate 11 is divided into a central region positioned inside the inner peripheral wall 113 by the inner peripheral wall 113 and a peripheral region between the inner peripheral wall 113 and the outer peripheral wall 112. It is divided. Here, the diameter of the illustrated first substrate 11 is 32 mm, the thickness of the bottom 111 is 0.5 mm, and the height of the outer peripheral wall 112 and the inner peripheral wall 113 is 1.0 mm. Further, the inner diameter and thickness of the inner peripheral wall 113 are 15 mm and 1 mm, respectively, and the inner diameter and thickness of the outer peripheral wall 112 are 30 mm and 1.0 mm, respectively.

  An IC module is mounted on the central region of the first substrate 11. The illustrated IC module includes a transmission / reception function, an IC chip 13 having a built-in CPU, and an antenna 15 electrically connected to the IC chip 13. The antenna 15 is constituted by a wound antenna disposed so as to surround the IC chip 13, but other types of antennas may be mounted.

  Further, a metal ring is mounted on the peripheral region of the first substrate 11 as a weight adjusting balancer 20 for adjusting the weight of the disc-shaped tag. The illustrated metal ring is made of brass, and the inner and outer diameters of the metal ring are 18 mm and 29 mm, respectively, and the thickness is 1 mm. The IC chip 13 is mounted at a position slightly deviated from the center of the disc-shaped first substrate 11. This is because when the resin is injected, the injection is performed in a state where the resin injection port is placed at the center of the disk shape, so that the resin injection port collides with the IC chip 13 and the IC chip 13 is damaged. This is to prevent it.

  As is clear from FIG. 2, the IC chip 13 and the antenna 15 have substantially the same thickness as the inner peripheral wall 113 and the outer peripheral wall 112.

  The IC chip 13, the antenna 15, and the weight adjustment balancer 20 formed by the metal ring mounted on the central region and the peripheral region of the first substrate 11 are formed of the same resin as that of the first substrate 11. Resin-sealed by the sealing portion 22. The illustrated sealing portion 22 not only covers the IC chip 13, the antenna 15, and the weight adjustment balancer 22, but also covers the outer peripheral wall 112 and the inner peripheral wall 113. The thickness of the sealing part 22 on the outer peripheral wall 112 and the inner peripheral wall 113 is 0.5 mm.

  As a result, a disk-shaped tag having a thickness of 2 mm and having a weight of 3 g could be obtained when brass was used as the metal ring. The disk-shaped tag having the size and weight described above could be inserted into the plastic conveyance path from the coin insertion slot, and could be dropped by its own weight in the plastic conveyance path.

  Referring to FIGS. 3 and 4, the disc-shaped tag according to the second embodiment of the present invention has a weight adjusting balancer 20 formed of a brass metal ring between the outer peripheral wall 112 and the inner peripheral wall 113. It is the same as that of the disc-shaped tag of FIG.1 and FIG.2 in that it is mounted in the peripheral region defined by the bottom portion 111 of this. As is clear from FIG. 4, the disc-shaped tag according to the second embodiment is such that the height of the outer peripheral wall 112 is higher than the height of the inner peripheral wall 113. This is different from the disc-shaped tag shown in. Specifically, the heights of the outer peripheral wall 112 and the inner peripheral wall 113 shown in the figure are 2 mm and 1 mm, respectively. Further, the thickness of the bottom 111 of the first substrate 11 is 1 mm.

  Further, in the central region surrounded by the inner peripheral wall 113, similarly to FIGS. 1 and 2, the IC chip 13 and the 2-turn winding antenna 15 are mounted so as to surround the IC chip 13, and the IC An IC module is formed by the chip 13 and the wound antenna 15.

  Further, a sealing portion 22 ′ formed by filling a resin is formed in a region surrounded by the outer peripheral wall 112, and this sealing portion 22 ′ is a metal ring, IC as the weight adjustment balancer 20. The upper surface of the chip 13, the winding antenna 15, and the inner peripheral wall 113 is covered. As a result, a disc-shaped tag having a thickness of 3 mm and a diameter of 32 mm and a weight of 3 g is obtained. As the resin for forming the sealing portion 22 ′, a resin similar to the resin for forming the sealing portion 22 shown in FIG. 2 can be used.

  With reference to FIG.5 and FIG.6, the manufacturing method of the disk-shaped tag shown by FIG.3 and FIG.4 is demonstrated in order of a process. First, in step S1 of FIG. 5, primary molding is performed by injection molding to obtain a first substrate 11 as shown in FIG. The first substrate 11 includes a bottom 111, an inner peripheral wall 113, and an outer peripheral wall 112 higher than the inner peripheral wall 113. Here, as the resin for forming the first substrate 11, it is desirable to select a resin suitable for injection molding.

  On the other hand, as shown in step S2 of FIG. 5, an IC module including the IC chip 13 and the winding antenna 15 is prepared, and the IC module includes the first substrate 11 as shown in step S3 and FIG. 6B. Mounted in the center area.

  Furthermore, as shown in step S4 of FIG. 5, a metal ring is prepared as the weight adjusting balancer 20. In this case, the metal ring is formed by pressing the metal plate.

  The metal ring prepared in step S4 is mounted on the peripheral region of the first substrate 11 in step S5. As a result, as shown in FIG. 6C, a member in which the IC chip 13 and the winding coil 15 are mounted in the central region of the first substrate 11 and the metal ring is mounted in the peripheral region is obtained. .

  Next, the outer peripheral wall 112 of the member obtained in FIG. 6 (c) is filled with resin by potting or the like, and secondary molding is performed to form the sealing portion 22 ′ (step S6), whereby FIG. A disk-like tag as shown in (d) is obtained. Thereafter, as shown in step S7, inspection and laser marking are performed to complete the product.

  In the illustrated example, only the case where the first substrate 11 is configured by injection molding has been described. However, the present invention prepares the second substrate, and the first substrate, the second substrate, A similar disc-shaped tag can be manufactured by filling the resin between the two.

  In the above-described embodiment, the case where the metal ring continuously formed in the peripheral region of the first substrate 11 is used as the weight adjusting balancer 20 has been described. However, the present invention is not limited to this. Without limitation, various shape and material weight adjusting balancers can be considered.

  For example, as shown in FIG. 7, the weight adjustment balancer 20 may be provided with break portions 201 at a plurality of locations, and the weight adjustment balancer 20 may be divided into a plurality of partial weight members. With this configuration, it is possible to prevent an eddy current from being generated in the weight adjustment balancer 20 during data transmission / reception between the IC chip 13 and the antenna 15 and an external reader / writer. In addition, as shown in FIG. 7, by arranging the fractured portion 201 so as to be symmetric with respect to the center of the disk-shaped first substrate 11, the rotation of the disk-shaped tag when moving along the conveyance path. Can be minimized. Note that it is not always necessary to provide a plurality of breaking portions 201 of the weight adjusting balancer 20, and it is not necessary to arrange the balancer so as to be point-symmetric or rotationally symmetric with respect to the center of the disc-shaped tag. Furthermore, the shape of the partial weight member of the weight adjusting balancer 20 of FIG. 7 is not limited to that of FIG. 7, and various shapes such as a curved shape (for example, a circular shape), a stripe shape, a rectangular shape, a square shape, etc. are adopted. It is also possible.

  The disc-shaped tag according to the present invention can be widely applied to amusement halls and the like that use coins, and can also be used in other amusement facilities such as amusement parks.

It is a top view which shows the disk-shaped tag which concerns on the 1st Embodiment of this invention except the sealing part. It is a figure which shows the cross section of the disk shaped tag shown by FIG. It is a top view which shows the disk-shaped tag which concerns on the 2nd Embodiment of this invention except the sealing part. It is a figure which shows the cross section of the disk shaped tag shown by FIG. It is a flowchart for demonstrating the manufacturing method of the disk-shaped tag which concerns on this invention. It is process drawing for demonstrating the manufacturing method shown in FIG. It is a top view which shows the modification of the balancer for weight adjustment used for the disk shaped tag which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 1st board | substrate 111 Bottom part 112 Outer peripheral wall 113 Inner peripheral wall 13 IC chip 15 Antenna 20 Weight balancer 22, 22 'Sealing part

Claims (3)

  Forming a disk-shaped first substrate having an outer peripheral wall and having an inner peripheral wall arranged at an interval inside the outer peripheral wall; and mounting an IC module inside the inner peripheral wall; A disk-like shape comprising: a step of mounting a weight adjusting balancer between the inner peripheral wall and the outer peripheral wall; and a sealing step of resin sealing the IC module and the weight adjusting balancer. Tag manufacturing method. 2. The method of manufacturing a disc-shaped tag according to claim 1 , wherein the IC module includes an IC chip and an antenna. 2. The sealing process according to claim 1 , wherein the sealing step includes a step of covering the IC module mounted on the first substrate and the weight adjusting balancer with a resin, and a second substrate that can be bonded to the first substrate. And a step of sealing the IC module covered with the resin and the weight adjusting balancer by bonding the second substrate onto the first substrate. Method of manufacturing a tag.

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