JP4676740B2 - Flexible printed circuit board and manufacturing method thereof - Google Patents
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本発明は、フレキシブルプリント基板の特に保護膜に係り、前記保護膜にピンホールが発生するを抑制するとともに、前記保護膜の表面の非タック性（非粘着性）を向上させることが可能なフレキシブルプリント基板及びその製造方法に関する。 The present invention relates to a protective film of a flexible printed circuit board in particular, and is capable of suppressing the occurrence of pinholes in the protective film and improving the non-tackiness (non-adhesiveness) of the surface of the protective film. The present invention relates to a printed circuit board and a manufacturing method thereof.
フレキシブルプリント基板は、可撓性の絶縁基板上に導電パターンが形成された構造で、さらに前記導電パターン上は、接続端子となる箇所を除いて通常、レジストなどの保護膜でおおわれている。 The flexible printed circuit board has a structure in which a conductive pattern is formed on a flexible insulating substrate, and the conductive pattern is usually covered with a protective film such as a resist except for a portion to be a connection terminal.
前記保護膜は例えばスクリーン印刷で形成される。しかし前記保護膜をスクリーン印刷で形成すると、スキージにより基板上に塗膜を転移させる際などに空気が前記塗膜中に入り込み、前記塗膜を焼成した後に前記塗膜にピンホールが発生するといった問題があった。 The protective film is formed by screen printing, for example. However, when the protective film is formed by screen printing, air enters the coating film when the coating film is transferred onto the substrate by a squeegee, and pinholes are generated in the coating film after firing the coating film. There was a problem.
また、前記塗膜は粘着性があるため、フレキシブルプリント基板が電子機器内の構成部材や他のフレキシブルプリント基板にくっつきやすく、作業性が悪化し、また前記フレキシブルプリント基板をくっついた相手側から引き剥がすときなどに、粘着力が強いと、前記フレキシブルプリント基板の保護膜が相手側にくっついた状態で前記フレキシブルプリント基板から剥がれてしまい、最悪の場合、前記導電パターンも前記保護膜と一緒に剥がれてしまう等の問題があった。
特許文献１は、フレキシブルプリント基板上に塗布されるソルダーレジストに関する発明で、前記ソルダーレジスト内にガラスビーズを混入するといった発明である。 Patent Document 1 is an invention relating to a solder resist applied on a flexible printed circuit board, in which glass beads are mixed into the solder resist.
しかし特許文献１には、スクリーン印刷時に気泡が塗膜中に入り込んだとき、この気泡を抜く手段は何ら開示されていない。特許文献２，３についても同様である。前記塗膜中に気泡が入り込むことで前記塗膜の焼成後、前記塗膜表面にピンホールが形成されると、その部分での絶縁性は低下してしまう。前記塗膜からなる保護膜は、導電パターンを大気から遮断等するためのものであるが、絶縁性の低下によりフレキシブルプリント基板の電気特性が悪化する等の問題を引き起こすため前記塗膜にピンホールが形成されるのを極力避ける必要性がある。 However, Patent Document 1 does not disclose any means for removing bubbles when bubbles enter the coating film during screen printing. The same applies to Patent Documents 2 and 3. If air bubbles enter into the coating film to form pinholes on the surface of the coating film after firing the coating film, the insulation at that portion will be reduced. The protective film made of the coating film is for blocking the conductive pattern from the atmosphere, but it causes pinholes in the coating film in order to cause problems such as deterioration of electrical characteristics of the flexible printed circuit board due to a decrease in insulation. There is a need to avoid forming as much as possible.
また特許文献１ないし特許文献３には、上記した塗膜の粘着性の問題点の認識がなく、当然、前記粘着性の問題を解決するための手段を提示していない。 Further, Patent Document 1 to Patent Document 3 do not recognize the above-mentioned problem of adhesiveness of the coating film, and naturally, no means for solving the problem of adhesiveness is presented.
そこで本発明は上記従来の課題を解決するためのものであり、特に保護膜にピンホールが発生するを抑制するとともに、前記保護膜の表面の非タック性（非粘着性）を向上させることが可能なフレキシブルプリント基板及びその製造方法を提供することを目的としている。 Therefore, the present invention is for solving the above-described conventional problems, and in particular, it is possible to suppress the generation of pinholes in the protective film and to improve the non-tackiness (non-adhesiveness) of the surface of the protective film. An object of the present invention is to provide a possible flexible printed circuit board and a manufacturing method thereof.
本発明は、絶縁基板上に導電パターンが形成され、さらに前記導電パターン上に保護膜が形成されたフレキシブルプリント基板において、
前記保護膜は、絶縁塗膜中に、前記絶縁塗膜よりも比重が大きく且つ非タック性に優れる絶縁性の塊状物を含有し、スクリーン印刷によって形成されたものであり、前記塊状物の表面の一部は前記絶縁塗膜の表面から突出しており、
前記絶縁塗膜の表面から突出した前記塊状物の表面は、前記保護膜の表面に対向部材が接触する際に、前記対向部材が直接、前記絶縁塗膜の表面に接触するのを抑制するための接触面として機能することを特徴とするものである。
The present invention provides a flexible printed board in which a conductive pattern is formed on an insulating substrate, and a protective film is further formed on the conductive pattern.
The protective layer, in the insulating coating film contains the specific gravity than the insulating coating film excellent in large and nontacky insulating lumps, which are formed by screen printing, the surface of the clot Is protruding from the surface of the insulating coating ,
The surface of the lump that protrudes from the surface of the insulating coating film prevents the facing member from directly contacting the surface of the insulating coating film when the facing member contacts the surface of the protective film. It functions as a contact surface .
これにより前記塊状物がスクリーン印刷時に前記絶縁塗膜中に沈降するため、前記絶縁塗膜中に入り込んだ気泡は前記沈降時に上方へ押し上げられて外部へ抜けやすくなる。この結果、前記保護膜にピンホールが形成されるのを従来よりも適切に抑制することが出来る。 As a result, the lump is settled in the insulating coating during screen printing, so that the air bubbles that have entered the insulating coating are pushed upward during the settling and easily escape to the outside. As a result, the formation of pinholes in the protective film can be suppressed more appropriately than in the past.
本発明では、前記塊状物は、球状であることが好ましく、具体的には、前記塊状物は、ガラスビーズであることが好ましい。 In the present invention, the lump is preferably spherical, and specifically, the lump is preferably glass beads.
また本発明では、前記塊状物の表面の一部は前記絶縁塗膜の表面から突出している。これにより保護膜表面の非タック性（非粘着性）を向上させることが出来る。
また本発明では、前記ガラスビーズの底面は、前記導電パターンの表面及び前記絶縁基板の表面に接触していることが好ましい。
In the present invention also part of the surface of the lumps that protrude from the surface of the insulative coating. Thereby, the non-tack property (non-adhesiveness) on the surface of the protective film can be improved.
In the present invention, the bottom surface of the glass beads is preferably in contact with the surface of the conductive pattern and the surface of the insulating substrate.
本発明では、前記塊状物の径は、前記絶縁塗膜の膜厚の１．５倍〜２倍であることが好ましい。これにより前記保護膜の非タック性（非粘着性）を向上させることが出来るとともに、屈曲性等の機械的強度も良好な状態に保つことが出来る。 In this invention, it is preferable that the diameter of the said lump is 1.5 to 2 times the film thickness of the said insulating coating film. Thereby, the non-tackiness (non-adhesiveness) of the protective film can be improved, and the mechanical strength such as flexibility can be maintained in a good state.
また本発明では、前記塊状物は、前記保護膜中に１７vol％〜４５vol％含有されていることが好ましい。より好ましくは、前記塊状物は、前記保護膜中に２０vol％以上含有されていることである。これにより前記保護膜の非タック性（非粘着性）を向上させることが出来るとともに、屈曲性等の機械的強度も良好な状態に保つことが出来る。 Moreover, in this invention, it is preferable that the said lump is contained by 17 vol%-45 vol% in the said protective film. More preferably, the lump is contained in the protective film in an amount of 20 vol% or more. Thereby, the non-tackiness (non-adhesiveness) of the protective film can be improved, and the mechanical strength such as flexibility can be maintained in a good state.
本発明は、 絶縁基板上に導電パターンが形成され、さらに前記導電パターン上に保護膜が形成されたフレキシブルプリント基板の製造方法において、
絶縁塗膜中に、前記絶縁塗膜よりも比重が大きく且つ非タック性に優れ、更に、次工程にて前記絶縁塗膜中に沈殿した状態でも表面の一部が前記絶縁塗膜の表面から突出する程度の大きさからなる絶縁性の塊状物を含有した保護膜をスクリーン印刷によって前記導電パターン上に塗布する工程、
前記塊状物が前記絶縁塗膜中に沈降した後、前記絶縁塗膜を焼成して硬化する工程、
を有することを特徴とするものである。これにより前記絶縁塗膜中に入り込んだ気泡は前記沈降時に上方へ押し上げられて外部へ抜けやすくなる。この結果、前記保護膜にピンホールが形成されるのを従来よりも適切に抑制することが出来る。
The present invention provides a method for producing a flexible printed board in which a conductive pattern is formed on an insulating substrate, and a protective film is further formed on the conductive pattern.
In the insulating coating film, the specific gravity is larger than that of the insulating coating film and is excellent in non-tacking properties. A step of applying a protective film containing an insulative lump having a protruding size onto the conductive pattern by screen printing;
A step of baking and curing the insulating coating after the lump has settled in the insulating coating;
It is characterized by having. As a result, the bubbles that have entered the insulating coating film are pushed upward during the settling and easily escape to the outside. As a result, the formation of pinholes in the protective film can be suppressed more appropriately than in the past.
また本発明では、前記塊状物の径を、前記塊状物が前記絶縁塗膜中に沈殿した状態でも表面の一部が前記絶縁塗膜の表面から突出する程度の大きさで形成する。これにより前記保護膜表面の非タック性（非粘着性）を適切に向上させることが出来る。
In the present invention, the diameter of the lumps, the lumps is it formed in the insulating portion of the surface in the precipitated state in the coating is enough to protrude from the surface of the insulative coating size. Thereby, the non-tack property (non-adhesiveness) of the surface of the protective film can be appropriately improved.
また本発明では、前記保護膜の塗布時の、前記絶縁塗膜の粘度を５０〜３００Ｐｓの範囲内に調整することが好ましい。これにより前記塊状物を前記絶縁塗膜中に沈降しやすく出来る。 Moreover, in this invention, it is preferable to adjust the viscosity of the said insulating coating film in the range of 50-300 Ps at the time of application | coating of the said protective film. Thereby, the said lump can be easily settled in the said insulating coating film.
また本発明では、前記塊状物の混合量を、前記焼成後、前記保護膜中に１７vol％〜４５vol％含有されるように調整することが好ましい。 Moreover, in this invention, it is preferable to adjust the mixing amount of the said lump so that 17 vol%-45 vol% may be contained in the said protective film after the said baking.
フレキシブルプリント基板に用いられる保護膜は、絶縁塗膜中に、前記絶縁塗膜よりも比重の大きい絶縁性の塊状物を含有し、スクリーン印刷によって形成されたものである。 The protective film used for the flexible printed board contains an insulating lump having a specific gravity larger than that of the insulating coating in the insulating coating, and is formed by screen printing.
これにより前記塊状物がスクリーン印刷時に前記絶縁塗膜中に沈降するため、前記絶縁塗膜中に入り込んだ気泡は前記沈降時に上方へ押し上げられて外部へ抜けやすくなる。この結果、前記保護膜にピンホールが形成されるのを従来よりも適切に抑制することが出来る。 As a result, the lump is settled in the insulating coating during screen printing, so that the air bubbles that have entered the insulating coating are pushed upward during the settling and easily escape to the outside. As a result, the formation of pinholes in the protective film can be suppressed more appropriately than in the past.
また、前記塊状物の表面の一部を前記絶縁塗膜の表面から突出させることで、保護膜表面の非タック性（非粘着性）を向上させることが出来る。 Moreover, the non-tack property (non-adhesiveness) of the surface of a protective film can be improved by protruding a part of surface of the said lump from the surface of the said insulating coating film.
図１は本発明におけるフレキシブルプリント基板の部分斜視図、図２は図１に示すＩＩ−ＩＩ線から切断し、その切断面を矢印方向から見た前記フレキシブルプリント基板の部分拡大断面図、図３は図１に示すＩＩＩ−ＩＩＩ線から切断し、その切断面を矢印方向から見た前記フレキシブルプリント基板の部分拡大断面図、図４ないし図６は、フレキシブルプリント基板の使用状態等を説明するためのものであり図２と同じ断面形状を示す前記フレキシブルプリント基板の部分拡大断面図、図７ないし図１０は、保護膜の製造工程を説明するためのフレキシブルプリント基板の部分拡大断面図であり、特に気泡の抜け方を説明するための説明図、図１１，図１２は、スクリーン印刷装置を用いて基板上に保護膜（塗膜）を印刷する工程を説明するための説明図、である。 FIG. 1 is a partial perspective view of a flexible printed circuit board according to the present invention, FIG. 2 is a partially enlarged cross-sectional view of the flexible printed circuit board taken along line II-II shown in FIG. Fig. 4 is a partially enlarged cross-sectional view of the flexible printed circuit board taken along the line III-III shown in Fig. 1 and the cut surface thereof is viewed from the direction of the arrow. Figs. 2 is a partially enlarged sectional view of the flexible printed board showing the same sectional shape as FIG. 2, FIGS. 7 to 10 are partially enlarged sectional views of the flexible printed board for explaining the manufacturing process of the protective film, In particular, FIGS. 11 and 12 are explanatory diagrams for explaining how to remove bubbles, and FIG. 11 and FIG. 12 illustrate a process of printing a protective film (coating film) on a substrate using a screen printing apparatus. Because of illustration, it is.
図１に示すフレキシブルプリント基板１は、ポリエチレンテレフタレート等のポリエステル樹脂やポリイミド樹脂等の可撓性を有する絶縁基板２上に、導電パターン３が印刷等により形成されてなる。 A flexible printed circuit board 1 shown in FIG. 1 has a conductive pattern 3 formed on a flexible insulating substrate 2 such as a polyester resin such as polyethylene terephthalate or a polyimide resin by printing or the like.
図１に示すように前記フレキシブルプリント基板１の先端部１ａを除く領域には、前記導電パターン３上を覆うように保護膜４が形成され、前記先端部１ａから前記導電パターン３が露出している。露出した前記導電パターン３は接続端子３ａとなる。前記保護膜４はスクリーン印刷により形成され、焼成工程に付され硬化させられている。 As shown in FIG. 1, a protective film 4 is formed on the flexible printed circuit board 1 except for the front end portion 1a so as to cover the conductive pattern 3, and the conductive pattern 3 is exposed from the front end portion 1a. Yes. The exposed conductive pattern 3 becomes a connection terminal 3a. The protective film 4 is formed by screen printing and is subjected to a baking process and cured.
図２，図３に示すように前記保護膜４は、前記導電パターン３上から前記導電パターン３，３間に露出する絶縁基板２上にかけて形成されている。前記保護膜４は、絶縁塗膜５と塊状物６とを有して構成される。なおシリコーン系等の消泡剤も含有されていたほうが好ましい。 As shown in FIGS. 2 and 3, the protective film 4 is formed from the conductive pattern 3 to the insulating substrate 2 exposed between the conductive patterns 3 and 3. The protective film 4 includes an insulating coating film 5 and a lump 6. It is preferable that an antifoaming agent such as silicone is also contained.
前記絶縁塗膜５は、主としてポリエステル、ポリエーテル、ポリウレタン、アクリル樹脂、メラミン樹脂、フェノール樹脂、アクリル樹脂などのバインダー樹脂によって構成される。 The insulating coating film 5 is mainly composed of a binder resin such as polyester, polyether, polyurethane, acrylic resin, melamine resin, phenol resin, or acrylic resin.
前記塊状物６は球状であり、例えばガラスビーズ（以下、ガラスビーズ６と称する）で形成される。前記ガラスビーズ６は前記絶縁塗膜５よりも比重が大きい。このため前記ガラスビーズ６は前記絶縁塗膜５内に埋没した状態で存在する。ただし前記ガラスビーズ６の径Ｔ１は前記絶縁塗膜５の膜厚Ｔ２よりも大きいため前記ガラスビーズ６の表面の一部は前記絶縁塗膜５の表面５ａから突出した状態になっている。なお一部の前記ガラスビーズ６は、前記絶縁塗膜５の膜厚Ｔ２よりも径が小さく、前記絶縁塗膜５内に完全に埋没していてもよい。 The lump 6 is spherical, and is formed of, for example, glass beads (hereinafter referred to as glass beads 6). The glass beads 6 have a specific gravity greater than that of the insulating coating film 5. For this reason, the glass beads 6 exist in a state of being buried in the insulating coating film 5. However, since the diameter T1 of the glass bead 6 is larger than the film thickness T2 of the insulating coating film 5, a part of the surface of the glass bead 6 protrudes from the surface 5a of the insulating coating film 5. Some of the glass beads 6 may have a diameter smaller than the film thickness T <b> 2 of the insulating coating film 5 and may be completely embedded in the insulating coating film 5.
前記ガラスビーズ６は、図２，図３に示すように、前記絶縁塗膜５の表面５ａと平行な方向へ多数並んでいるが、例えば一部のガラスビーズ６が前記絶縁塗膜５の膜厚方向へ重なり合っていてもよい。前記ガラスビーズ６は、その底面が前記導電パターン３の表面あるいは絶縁基板２の表面に接触していることが好ましいが、一部の前記ガラスビーズ６は前記導電パターン３の表面あるいは絶縁基板２の表面から離れた位置にあってもよい。 As shown in FIGS. 2 and 3, a large number of the glass beads 6 are arranged in a direction parallel to the surface 5 a of the insulating coating 5. For example, some of the glass beads 6 are films of the insulating coating 5. It may overlap in the thickness direction. The glass beads 6 preferably have a bottom surface in contact with the surface of the conductive pattern 3 or the surface of the insulating substrate 2, but some of the glass beads 6 are formed on the surface of the conductive pattern 3 or the insulating substrate 2. It may be located away from the surface.
また前記ガラスビーズ６のように球状の塊状物であると、特に後述する絶縁塗膜５内に存在する気泡を適切に抜くことができて好ましい。 In addition, a spherical lump like the glass bead 6 is preferable because air bubbles present in the insulating coating film 5 described later can be appropriately removed.
上記のようにガラスビーズ６は、前記絶縁塗膜５よりも比重が大きい。このため次のような効果を期待できる。 As described above, the glass beads 6 have a specific gravity greater than that of the insulating coating film 5. For this reason, the following effects can be expected.
スクリーン印刷では、図１１に示すようにスキージ１０をスクリーン版１２上で矢印方向へ移動させ、このとき、前記スキージ１０に所定の印圧を基板２側に向けて与えながら、前記スクリーン版１２に設けられた網目からスキージ１０の移動により、ガラスビーズ６と、絶縁塗膜５の主成分となるバインダー樹脂を含むインク１１を前記基板２上に印刷する（図１２）。 In screen printing, as shown in FIG. 11, the squeegee 10 is moved on the screen plate 12 in the direction of the arrow, and at this time, a predetermined printing pressure is applied to the squeegee 10 toward the substrate 2 while applying to the screen plate 12. By moving the squeegee 10 from the provided mesh, the glass beads 6 and the ink 11 containing the binder resin as the main component of the insulating coating film 5 are printed on the substrate 2 (FIG. 12).
前記インク１１中にガラスビーズ６を含有させることで、図１１，図１２に示すようにインク１１を基板２上に印刷するときに、前記ガラスビーズ６の回転によって前記インク１１の流動性が増すため、従来に比べて気泡は前記絶縁塗膜５中に入り込み難くなる。また前記インク１１中に消泡剤を入れておくと、より前記気泡の発生を抑制できる。 By including the glass beads 6 in the ink 11, the fluidity of the ink 11 is increased by the rotation of the glass beads 6 when the ink 11 is printed on the substrate 2 as shown in FIGS. 11 and 12. Therefore, it is difficult for the bubbles to enter the insulating coating film 5 as compared with the conventional case. Further, if an antifoaming agent is put in the ink 11, the generation of the bubbles can be further suppressed.
さらに図７に示すように、前記絶縁塗膜５中に前記気泡１３が入り込んでも、図７ないし図１０に示すように前記気泡１３を前記絶縁塗膜５内から適切に抜くことが出来る。 Further, as shown in FIG. 7, even if the bubbles 13 enter the insulating coating film 5, the bubbles 13 can be appropriately removed from the insulating coating film 5 as shown in FIGS. 7 to 10.
上記したように前記ガラスビーズ６は前記絶縁塗膜５に比べて比重が大きい。このためスクリーン印刷時に、図７に示すように前記絶縁塗膜５の表面５ａ近くに存在する前記ガラスビーズ６は、図８に示すように前記絶縁塗膜５内に沈降していく。このとき前記ガラスビーズ６と気泡１３とが当接すると、図９に示すように、さらに前記ガラスビーズ６が前記絶縁塗膜５内に沈降していくことにより前記気泡１３が前記ガラスビーズ６の外周面に沿って上方へ押し上げられていき、前記絶縁塗膜５内から外部へ抜け出る（図１０）。前記気泡１３を適切に塗膜５内から外部へ抜くには、前記ガラスビーズ６のように球状の塊状物を含有させておくことが好ましい。前記気泡１３は前記ガラスビーズ６が前記塗膜５内に沈むにつれて前記ガラスビーズ６の外周面に沿って適切に上方へ導かれるからである。 As described above, the glass beads 6 have a higher specific gravity than the insulating coating film 5. For this reason, at the time of screen printing, the glass beads 6 existing near the surface 5a of the insulating coating 5 as shown in FIG. 7 settle in the insulating coating 5 as shown in FIG. At this time, when the glass beads 6 and the bubbles 13 come into contact with each other, as shown in FIG. 9, the glass beads 6 are further settled in the insulating coating film 5, so that the bubbles 13 are formed on the glass beads 6. It is pushed upward along the outer peripheral surface and exits from the insulating coating 5 to the outside (FIG. 10). In order to appropriately remove the bubbles 13 from the inside of the coating film 5, it is preferable to contain a spherical lump like the glass beads 6. This is because the bubbles 13 are appropriately guided upward along the outer peripheral surface of the glass beads 6 as the glass beads 6 sink into the coating film 5.
また、前記ガラスビーズ６の径を、前記ガラスビーズ６が前記絶縁塗膜５中に沈殿した状態でも表面の一部が前記絶縁塗膜５の表面から突出する程度の大きさで形成することが好ましい。これにより気泡の発生を抑制できるとともに、前記保護膜４の非タック性を向上させることができる。気泡の発生の抑制効果は、前記ガラスビーズ６の径が前記絶縁塗膜５の膜厚より小さくてもある程度得ることができるが、前記ガラスビーズ６の径を前記絶縁塗膜５の膜厚よりも大きくしたほうがより好ましい。さらに、前記ガラスビーズ６の混合量を、前記焼成後、前記保護膜中に１７vol％〜４５vol％含有されるように調整することが好ましい。 Further, the diameter of the glass beads 6 may be formed such that a part of the surface protrudes from the surface of the insulating coating film 5 even when the glass beads 6 are precipitated in the insulating coating film 5. preferable. Thereby, generation | occurrence | production of a bubble can be suppressed and the non-tack property of the said protective film 4 can be improved. The effect of suppressing the generation of bubbles can be obtained to some extent even when the diameter of the glass beads 6 is smaller than the film thickness of the insulating coating film 5, but the diameter of the glass beads 6 is smaller than the film thickness of the insulating coating film 5. Is also more preferable. Furthermore, it is preferable to adjust the mixing amount of the glass beads 6 so as to be contained in the protective film in an amount of 17 vol% to 45 vol% after the baking.
またスクリーン印刷時における前記絶縁塗膜５の粘度を５０〜３００Ｐｓの範囲内に調整することが好ましい。前記粘度が高すぎると前記絶縁塗膜５内に図７ないし図１０で説明した前記ガラスビーズ６の沈降スピードが遅くなり、あるいは前記ガラスビーズ６が適切に前記絶縁塗膜５内に沈降せず好ましくない。前記絶縁塗膜５を上記の粘度の範囲内にすることで前記ガラスビーズ６を効果的に前記絶縁塗膜５内へ沈降させることが出来る。 Moreover, it is preferable to adjust the viscosity of the said insulating coating film 5 at the time of screen printing in the range of 50-300 Ps. If the viscosity is too high, the settling speed of the glass beads 6 described in FIG. 7 to FIG. 10 in the insulating coating film 5 becomes slow, or the glass beads 6 do not properly settle in the insulating coating film 5. It is not preferable. By making the insulating coating film 5 within the above viscosity range, the glass beads 6 can be effectively settled into the insulating coating film 5.
スクリーン印刷した段階では前記絶縁塗膜５中には、有機溶剤が含まれており、この有機溶剤を蒸発させるべく前記絶縁塗膜５を焼成する。これによって前記絶縁塗膜５が硬化させられる。 At the stage of screen printing, the insulating coating 5 contains an organic solvent, and the insulating coating 5 is baked to evaporate the organic solvent. Thereby, the insulating coating film 5 is cured.
図２，図３で説明したように、前記ガラスビーズ６の径Ｔ１は前記絶縁塗膜５の膜厚Ｔ２よりも大きく、前記塗膜５が硬化した状態で前記ガラスビーズ６の表面の一部は前記絶縁塗膜５の表面５ａから突出している。これにより次のような効果を期待できる。 As described with reference to FIGS. 2 and 3, the diameter T1 of the glass beads 6 is larger than the film thickness T2 of the insulating coating film 5, and a part of the surface of the glass beads 6 with the coating film 5 cured. Protrudes from the surface 5 a of the insulating coating 5. As a result, the following effects can be expected.
図４のように例えば搬送時や、電子機器内での取り付けの関係から、フレキシブルプリント基板１の上方に別のフレキシブルプリント基板２０が相対向して、前記フレキシブルプリント基板１，２０の保護膜４，２１どうしが接触する場合がある。 As shown in FIG. 4, for example, during transportation or due to attachment in the electronic device, another flexible printed circuit board 20 is opposed to the upper side of the flexible printed circuit board 1, and the protective film 4 of the flexible printed circuit board 1, 20. , 21 may contact each other.
図４に示すようにどちらのフレキシブルプリント基板１，２０にも、保護膜４，２１を構成する絶縁塗膜５，２２には前記塗膜の表面５ａ，２２ａから表面が一部突出するガラスビーズ６，２３が多数混入されている。このため前記フレキシブルプリント基板１，２０の保護膜４，２１どうしが接触しても、ガラスビーズ６，２３が、タック性（粘着性）の高い絶縁塗膜５，２２間に介在するため、前記絶縁塗膜５，２２どうしは接触せず、前記フレキシブルプリント基板１，２０どうしがくっつき難くなる。このように前記塗膜の表面５ａ，２２ａからガラスビーズ６，２３の表面を一部突出させることで、前記保護膜４，２１の非タック性（非粘着性）を適切に向上させることが出来る。 As shown in FIG. 4, on either of the flexible printed boards 1 and 20, the insulating coatings 5 and 22 constituting the protective films 4 and 21 are glass beads whose surfaces partially protrude from the surfaces 5a and 22a of the coating film. Many 6 and 23 are mixed. For this reason, even if the protective films 4 and 21 of the flexible printed circuit boards 1 and 20 are in contact with each other, the glass beads 6 and 23 are interposed between the insulating coatings 5 and 22 having high tack (adhesiveness). The insulating coatings 5 and 22 are not in contact with each other, and the flexible printed boards 1 and 20 are difficult to stick to each other. Thus, the non-tackiness (non-adhesiveness) of the protective films 4 and 21 can be appropriately improved by partially protruding the surfaces of the glass beads 6 and 23 from the surfaces 5a and 22a of the coating film. .
あるいは図５のように、例えばフレキシブルプリント基板１を電子機器内に取り付けるときに前記電子機器内に搭載された電子部品３０とフレキシブルプリント基板１の保護膜４とが接触する場合がある。このとき、前記フレキシブルプリント基板１の保護膜４を構成する絶縁塗膜５の表面５ａからは前記ガラスビーズ６の表面の一部が突出しているため、前記ガラスビーズ６の表面と前記電子部品３０とが接触し、タック性（粘着性）の高い前記絶縁塗膜５の表面５ａと前記電子部品３０とが接触するのを回避することが出来る。 Alternatively, as shown in FIG. 5, for example, when the flexible printed circuit board 1 is mounted in an electronic device, the electronic component 30 mounted in the electronic device may come into contact with the protective film 4 of the flexible printed circuit board 1. At this time, since a part of the surface of the glass bead 6 protrudes from the surface 5a of the insulating coating 5 constituting the protective film 4 of the flexible printed circuit board 1, the surface of the glass bead 6 and the electronic component 30 And the surface 5a of the insulating coating film 5 having high tack (adhesiveness) and the electronic component 30 can be avoided from contacting each other.
図６のように、前記フレキシブルプリント基板１を電子部品３０から引き離すとき、ガラスビーズ６の突出表面の一部に塗膜片５ｂが付着している場合、前記電子部品３０側に前記塗膜片５ｂがくっつく可能性はあるが、非タック性（非粘着性）に優れるガラスビーズ６と当接する前記電子部品３０を、前記フレキシブルプリント基板１から容易に引き離すことができ、このとき、前記絶縁塗膜５や導電パターン３が、フレキシブルプリント基板１から剥離するといった問題も生じない。 As shown in FIG. 6, when the flexible printed circuit board 1 is separated from the electronic component 30, when the coating film piece 5 b is attached to a part of the protruding surface of the glass bead 6, the coating film piece is placed on the electronic component 30 side. 5b may stick, but the electronic component 30 in contact with the glass beads 6 excellent in non-tackiness (non-adhesiveness) can be easily pulled away from the flexible printed circuit board 1, and at this time, the insulating coating There is no problem that the film 5 and the conductive pattern 3 are peeled off from the flexible printed circuit board 1.
前記ガラスビーズ６の径Ｔ１は前記絶縁塗膜５の膜厚Ｔ２の１．５倍〜２倍であることが好ましい。これにより前記保護膜４の表面４ａの非タック性（非粘着性）を適切に向上させることができ、後述するタック強度試験によって、タック強度を０ｇｆにすることが出来る。また前記ガラスビーズ６の径Ｔ１が大きくなりすぎると、前記ガラスビーズ６の体積比率が大きくなることから前記保護膜４の屈曲性等の機械的強度が低下し好ましくないため、前記ガラスビーズ６の径Ｔ１を前記絶縁塗膜５の膜厚Ｔ２の２倍以下に調整している。 The diameter T1 of the glass beads 6 is preferably 1.5 to 2 times the film thickness T2 of the insulating coating film 5. Thereby, the non-tack property (non-adhesiveness) of the surface 4a of the protective film 4 can be appropriately improved, and the tack strength can be set to 0 gf by a tack strength test described later. In addition, if the diameter T1 of the glass beads 6 becomes too large, the volume ratio of the glass beads 6 increases, and therefore the mechanical strength such as the flexibility of the protective film 4 decreases, which is not preferable. The diameter T1 is adjusted to be twice or less the film thickness T2 of the insulating coating film 5.
次に前記ガラスビーズ６は、前記保護膜４中に前記ガラスビーズ６を１７vol％〜４５vol％の範囲内で含有することが好ましい。後述するタック強度試験では、これによりタック強度を０ｇｆにすることが出来る。ただし、保護膜４中における前記ガラスビーズ６の体積比率が大きくなりすぎると、絶縁塗膜５の体積が減るため、屈曲性などの機械的強度が逆に低下してしまう。このため、前記保護膜４中に前記ガラスビーズ６を体積比率で半分よりも小さい４５vol％以下含有することとしている。また前記ガラスビーズ６を保護膜４中に２０vol％以上含有することが好ましい。これにより確実にタック強度を０ｇｆにでき、前記保護膜４の表面４ａの非タック性（非粘着性）を効果的に向上させることが出来る。 Next, the glass beads 6 preferably contain the glass beads 6 in the protective film 4 within a range of 17 vol% to 45 vol%. In the tack strength test described later, the tack strength can be reduced to 0 gf. However, if the volume ratio of the glass beads 6 in the protective film 4 is too large, the volume of the insulating coating film 5 is reduced, so that the mechanical strength such as flexibility is lowered. For this reason, the glass beads 6 are contained in the protective film 4 at a volume ratio of 45 vol% or less, which is smaller than half. The glass beads 6 are preferably contained in the protective film 4 by 20 vol% or more. As a result, the tack strength can be reliably reduced to 0 gf, and the non-tack property (non-adhesiveness) of the surface 4 a of the protective film 4 can be effectively improved.
（ピンホールの測定）
図１１に示すスキージ１０のスピードを３５０ｍｍ／ｓｅｃ、印圧を２５ｋｇｆに設定し、これを標準のスクリーン印刷条件とした。
(Pinhole measurement)
The speed of the squeegee 10 shown in FIG. 11 was set to 350 mm / sec, and the printing pressure was set to 25 kgf, which were standard screen printing conditions.
上記の印刷条件により、絶縁基板上にポリウレタン系のバインダー樹脂を含むインクを印刷し、その後、焼成して前記絶縁基板上に絶縁塗膜を形成した（従来品）。 Under the above printing conditions, an ink containing a polyurethane binder resin was printed on an insulating substrate, and then fired to form an insulating coating film on the insulating substrate (conventional product).
上記の印刷条件により、絶縁基板上にポリウレタン系のバインダー樹脂とアクリル系の消泡剤を含むインクを印刷し、その後、焼成して前記絶縁基板上に絶縁塗膜を形成した（比較品）。 Under the above printing conditions, an ink containing a polyurethane binder resin and an acrylic antifoaming agent was printed on an insulating substrate, and then fired to form an insulating coating film on the insulating substrate (comparative product).
上記の印刷条件により、絶縁基板上にポリウレタン系のバインダー樹脂とアクリル系の消泡剤、ガラスビーズを含むインクを印刷し、その後、焼成して前記絶縁基板上に絶縁塗膜を形成した（実施品）。 Under the above printing conditions, an ink containing a polyurethane binder resin, an acrylic antifoaming agent, and glass beads was printed on the insulating substrate, and then fired to form an insulating coating on the insulating substrate (implemented) Product).
また上記の標準印刷条件のうち、スキージスピード、印圧を適宜変更し、その変更された印刷条件のもとで、上記した従来品、比較品、実施品をそれぞれ形成したものも用意した。なお変更条件は以下に示す表１に適宜記載してある。 In addition, among the above standard printing conditions, squeegee speed and printing pressure were appropriately changed, and the above-described conventional products, comparative products, and implementation products were formed under the changed printing conditions. The change conditions are appropriately described in Table 1 below.
そして各従来品、比較品、実施品のピンホールの発生を調べた。１００ｍｍ四方に発生するピンホールの数が３０以上の場合、「ピンホール多発」、ピンホールの数が１５〜２９の場合、「ピンホール多少」、ピンホールの数が５〜１４の場合、「ピンホール少」、ピンホールの数が２〜４の場合、「ピンホール少々」、ピンホールの数が１の場合、「ピンホール極少」、ピンホールの数が０の場合、「ピンホール無し」と評価付けることとした。その実験結果を表１に示す。 The occurrence of pinholes in each conventional product, comparative product, and implementation product was examined. When the number of pinholes generated in a 100 mm square is 30 or more, “more pinholes”, when the number of pinholes is 15 to 29, “some pinholes”, when the number of pinholes is 5 to 14, “Small pinholes”, 2 to 4 pinholes, “Small pinholes”, 1 pinholes, “very few pinholes”, 0 pinholes, “No pinholes” " The experimental results are shown in Table 1.
サンプルＮｏ．１の従来品、比較品、実施品はいずれも標準の印刷条件で形成されたものであり、表１に示すように、実施品は、従来品、比較品に比べてピンホールの発生が少ないことがわかった。 Sample No. No. 1 conventional product, comparative product, and implementation product are all formed under standard printing conditions. As shown in Table 1, the implementation product has less pinholes than the conventional product and comparison product. I understood it.
サンプルＮｏ．２の従来品は標準の印刷条件で形成されたものであるが、実施品及び比較品は、標準の印刷条件のうち、印圧を３０ｋｇｆにして形成されたものである。 Sample No. The conventional product No. 2 is formed under standard printing conditions, while the implementation product and the comparative product are formed under standard printing conditions with a printing pressure of 30 kgf.
サンプルＮｏ．１の実施品とサンプルＮｏ．２の実施品とを比べると、印圧の大きいサンプルＮｏ．２の実施品のほうがピンホールの発生を抑制できることがわかった。 Sample No. 1 product and sample no. Sample No. 2 having a large printing pressure when compared with the product of No. 2. It was found that the product of No. 2 can suppress the generation of pinholes.
サンプルＮｏ．３の実施品は、標準の印刷条件のうち、スキージスピードを２００ｍｍ／ｓｅｃに落とし、印圧を３０ｋｇｆに高くして形成されたものであり、サンプルＮｏ．４の実施品は、標準の印刷条件のうち、スキージスピードを１００ｍｍ／ｓｅｃに落とし、印圧を３０ｋｇｆに高くして形成されたものである。 Sample No. The product of No. 3 was formed by reducing the squeegee speed to 200 mm / sec and increasing the printing pressure to 30 kgf among the standard printing conditions. The actual product No. 4 was formed by reducing the squeegee speed to 100 mm / sec and increasing the printing pressure to 30 kgf among the standard printing conditions.
実施品の各サンプルの実験結果を見てわかるように、スキージスピードが遅くなると、ピンホールの発生率が低下することがわかった。また印圧を高くするとピンホールの発生率が低下することがわかった。これにより前記スキージスピードは２００ｍｍ／ｓｅｃ以下、印圧は３０ｋｇｆ以上であることが好ましいことがわかった。 As can be seen from the experimental results of each sample of the product, it was found that the incidence of pinholes decreased as the squeegee speed decreased. It was also found that the incidence of pinholes decreases when the printing pressure is increased. Accordingly, it was found that the squeegee speed is preferably 200 mm / sec or less and the printing pressure is preferably 30 kgf or more.
上記した傾向は、同様に従来品及び比較品でも得ることができることがわかったが、消泡剤を入れることで従来品よりもピンホールの発生率を低くできる比較品でも、ガラスビーズを入れた実施品に比べてピンホールの発生率は高く、実施品のようにピンホールの発生率が無い状態を得ることができなかった。 It was found that the above-mentioned tendency can be obtained in the conventional product and the comparative product as well, but the glass beads were also inserted in the comparative product that can lower the incidence of pinholes than the conventional product by adding an antifoaming agent. The incidence of pinholes was higher than that of the implemented product, and it was not possible to obtain a state without the incidence of pinholes as in the implemented product.
（タック強度試験）
基板表面に、ガラスビーズを含有した塗膜をスクリーン印刷し、その後、加熱工程に付したサンプルを用意し、φ５の円柱状の治具の表面に、前記塗膜側が外側に向くようにサンプルを取り付け、試料どうしを押付けて、引張り強度を測定した。
実験ではガラスビーズの径が異なる複数のサンプル（前記ガラスビーズの体積比率を概ね２０vol％〜３０vol％の範囲内に調整）を用意し、前記強度の測定を行なった。その実験結果を図１３に示す。
(Tack strength test)
A coating film containing glass beads is screen-printed on the substrate surface, and then a sample subjected to a heating step is prepared. The sample is placed on the surface of a φ5 cylindrical jig so that the coating film side faces outward. The tensile strength was measured by mounting and pressing the samples together.
In the experiment, a plurality of samples having different glass bead diameters (the volume ratio of the glass beads was adjusted in the range of approximately 20 vol% to 30 vol%) were prepared, and the strength was measured. The experimental results are shown in FIG.
図１３に示すように、ガラスビーズの径が１５μｍ以上になるとタック強度がなくなり（０ｋｇｆ）、前記サンプルの非タック性（非粘着性）を効果的に向上させることができることがわかった。ガラスビーズの径を前記塗膜の膜厚に対し１．５倍以上（塗膜は１０μｍ）にすると、タック強度をなくせる（０ｋｇｆ）ことがわかった。 As shown in FIG. 13, it was found that when the diameter of the glass beads was 15 μm or more, the tack strength was lost (0 kgf), and the non-tack property (non-adhesiveness) of the sample could be effectively improved. It was found that the tack strength could be eliminated (0 kgf) when the diameter of the glass beads was 1.5 times the film thickness of the coating film (the coating film was 10 μm).
次に、ガラスビーズの含有量が異なる複数のサンプル（ガラスビーズの径を２０μｍで統一）を用意し、前記強度の測定を行なった。その実験結果を以下の表２及び図１４に示す。 Next, a plurality of samples with different glass bead contents (glass beads having a uniform diameter of 20 μm) were prepared, and the strength was measured. The experimental results are shown in Table 2 below and FIG.
ガラスビーズの含有量は質量％（ｗｔ％）で求め、これをガラスビーズの比重を２．５、絶縁塗膜の比重を１．２として前記ガラスビーズのvol％を算出した。 The content of the glass beads was determined by mass% (wt%), and this was calculated as vol% of the glass beads, with the specific gravity of the glass beads being 2.5 and the specific gravity of the insulating coating film being 1.2.
表２及び図１４に示すように、ガラスビーズの体積比率が１７vol％以上になるとタック強度がなくなる（０ｋｇｆ）ことがわかった。より好ましくは前記ガラスビーズを２０vol％以上にすることで、確実にタック強度をなくせる（０ｋｇｆ）ことが出来る。また前記ガラスビーズの含有量は多くなりすぎても、フレキシブルプリント基板の屈曲性等の機械強度が低下してしまうことから、前記ガラスビーズの体積比率を４５vol％以下に設定することとした。 As shown in Table 2 and FIG. 14, it was found that the tack strength disappears (0 kgf) when the volume ratio of the glass beads is 17 vol% or more. More preferably, by making the glass beads 20 vol% or more, tack strength can be surely eliminated (0 kgf). In addition, even if the content of the glass beads is excessive, the mechanical strength such as the flexibility of the flexible printed circuit board is lowered. Therefore, the volume ratio of the glass beads is set to 45 vol% or less.
１、２０ フレキシブルプリント基板
２ 絶縁基板
３ 導電パターン
４、２１ 保護膜
５、２２ 絶縁塗膜
６、２３ 塊状物（ガラスビーズ）
１０ スキージ
１１ インク
１２ スクリーン版
１３ 気泡
３０ 電子部品
1, 20 Flexible printed circuit board 2 Insulating substrate 3 Conductive pattern 4, 21 Protective film 5, 22 Insulating coating film 6, 23 Mass (glass beads)
10 Squeegee 11 Ink 12 Screen Plate 13 Bubble 30 Electronic Component
Claims (10)
前記保護膜は、絶縁塗膜中に、前記絶縁塗膜よりも比重が大きく且つ非タック性に優れる絶縁性の塊状物を含有し、スクリーン印刷によって形成されたものであり、前記塊状物の表面の一部は前記絶縁塗膜の表面から突出しており、
前記絶縁塗膜の表面から突出した前記塊状物の表面は、前記保護膜の表面に対向部材が接触する際に、前記対向部材が直接、前記絶縁塗膜の表面に接触するのを抑制するための接触面として機能することを特徴とするフレキシブルプリント基板。 In a flexible printed board in which a conductive pattern is formed on an insulating substrate and a protective film is further formed on the conductive pattern,
The protective layer, in the insulating coating film contains the specific gravity than the insulating coating film excellent in large and nontacky insulating lumps, which are formed by screen printing, the surface of the clot Is protruding from the surface of the insulating coating ,
The surface of the lump that protrudes from the surface of the insulating coating film prevents the facing member from directly contacting the surface of the insulating coating film when the facing member contacts the surface of the protective film. A flexible printed circuit board, which functions as a contact surface of the substrate.
絶縁塗膜中に、前記絶縁塗膜よりも比重が大きく且つ非タック性に優れ、更に、次工程にて前記絶縁塗膜中に沈殿した状態でも表面の一部が前記絶縁塗膜の表面から突出する程度の大きさからなる絶縁性の塊状物を含有した保護膜をスクリーン印刷によって前記導電パターン上に塗布する工程、
前記塊状物が前記絶縁塗膜中に沈降した後、前記絶縁塗膜を焼成して硬化する工程、
を有することを特徴とするフレキシブルプリント基板の製造方法。 In the method of manufacturing a flexible printed board in which a conductive pattern is formed on an insulating substrate and a protective film is further formed on the conductive pattern,
In the insulating coating film, the specific gravity is larger than that of the insulating coating film and is excellent in non-tacking properties. A step of applying a protective film containing an insulative lump having a protruding size onto the conductive pattern by screen printing;
A step of baking and curing the insulating coating after the lump has settled in the insulating coating;
A method for producing a flexible printed circuit board, comprising:
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| JPS55151073A (en) * | 1979-05-15 | 1980-11-25 | Matsushita Electric Ind Co Ltd | Cover lay ink for printed circuit board |
| JPS62194588A (en) * | 1986-02-14 | 1987-08-27 | Omron Tateisi Electronics Co | Reference data input method for printed circuit board inspection device |
| JPH0744292B2 (en) * | 1992-08-25 | 1995-05-15 | スタンレー電気株式会社 | Mold resin for optical semiconductors |
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