JP4676135B2 - Polishing pad piece mounting structure and polishing apparatus - Google Patents

Description

【００２４】
【発明の効果】
本発明の研磨パッド取付け構造によれば、貼着補強層をエンドレスベルトなどの基板と研磨パッド片間の継ぎ目部およびその近傍の下面との間に介在させることにより、研磨パッド片と基板との剥離強度を向上させることができるため、継ぎ目部に被研磨物が衝突することによる衝撃で研磨パッド片が剥離するのを抑制することができ、被研磨物が破損したり、研磨精度が低下するのを防止することができるという効果がある。
【図面の簡単な説明】
【図１】 本発明の一実施形態にかかるベルト式研磨装置を示す模式図である。
【図２】 図１の部分断面図である。
【図３】 （ａ）〜（ｅ）は継ぎ目部を構成する研磨パッド片端部の形状を示す平面図である。
【符号の説明】
２ 研磨パッド片
３ 継ぎ目部
４ 貼着補強層
５ 基板
６ 粘着テープ
７ 回転ローラ
１０ 研磨装置[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a polishing pad mounting structure and a polishing apparatus used in semiconductor manufacturing, LCD glass, and magnetic head manufacturing processes.
[Prior art]
[0002]
Currently, surface polishing with a polishing pad is performed in a planarization process of a semiconductor wafer surface, which is one of the manufacturing processes of a semiconductor device. As a polishing apparatus using this polishing pad, a belt type polishing apparatus is used. This belt type polishing apparatus includes an endless belt stretched between a pair of rotating rollers spaced apart from each other, and a discontinuous polishing pad formed by adhering a plurality of polishing pad pieces to the surface of the endless belt. Polishing.
[0003]
As a matter of course, there is a seam on the surface of the abrasive formed with such a discontinuous polishing pad on the endless belt. When polishing is performed, if the object to be polished comes on the seam of the surface of the polishing pad piece by rotating the substrate, the object to be polished collides with the seam, and the impact causes the polishing pad piece to peel off. It was.
[0004]
In order to solve such problems, the following Patent Document 1 proposes a polishing apparatus in which a seam of a polishing pad attached to a drum surface is arranged to be inclined with respect to a drum axis. Yes.
[0005]
However, during polishing, the object to be polished is brought into close contact with the surface of the discontinuous polishing pad. Therefore, in the polishing apparatus proposed as described above, the object to be polished collides with the joint of the polishing pad pieces. There is a problem in that the polishing pad piece cannot be completely prevented and peeling of the polishing pad piece occurs from the vicinity of the seam when used for a long time.
[0006]
[Patent Document 1]
Japanese Patent Application Laid-Open No. 9-29616
[Problems to be solved by the invention]
An object of the present invention is to provide a polishing pad mounting structure and a polishing apparatus capable of improving the peeling strength between a polishing pad piece and a substrate and suppressing the peeling of the polishing pad piece from the substrate during polishing. It is.
[0008]
[Means for Solving the Problems]
A polishing pad piece mounting structure according to the present invention for solving the above-described problems has the following configuration.
(1) A structure for attaching a polishing pad piece adhered on a substrate in a state in which the opposing end faces of the polishing pad piece provided with an adhesive layer on the lower surface are attached to each other, wherein the polishing pad pieces are attached together A structure for attaching a polishing pad piece , characterized in that an adhesive reinforcing layer made of a double-sided adhesive tape is interposed between the joint and the lower surface in the vicinity thereof and the substrate.
(2) For the end of the polishing pad pieces are combined is, mounting structure longitudinally containing non-orthogonal lines having a shape capable of mating per one another (1) Symbol placement of the polishing pad pieces of the polishing pad pieces.
(3) The mounting structure of the polishing pad piece according to (1) or (2), wherein the end part of the polishing pad piece to be brought together has a shape including one or more convex parts and concave parts that can be fitted to each other. .
[0009]
According to the mounting structure of the (1) Symbol placement of the polishing pad pieces, joint part and by interposing the bonded reinforcing layer on the lower surface in the vicinity, the polishing pad pieces and the substrate of the seam portion and the vicinity thereof in the polishing pad pieces The peeling strength between the polishing pad and the polishing pad piece can be suppressed from being peeled off due to the impact of the workpiece against the seam. As a result, the polishing pad polishing apparatus can be prevented from being damaged and effective in improving the polishing amount accuracy.
[0010]
Moreover, according to the mounting structure of the polishing pad piece described in the above (2) or (3) , the end of the polishing pad piece to be attached has a shape not orthogonal to the longitudinal direction of the polishing pad piece. Since the impact on the seam is reduced, it is effective to suppress the peeling of the polishing pad piece.
[0011]
The belt-type polishing apparatus of the present invention having the above-described polishing pad piece mounting structure includes at least one polishing pad provided with an endless belt stretched between a pair of rotating rollers spaced apart from each other and having an adhesive layer on the lower surface. A piece is affixed to the surface of the endless belt in a state where the facing end faces of the polishing pad piece are brought together, and a joint portion where the polishing pad pieces are brought together and a lower surface in the vicinity thereof An adhesive reinforcing layer made of a double-sided adhesive tape is interposed between the endless belt and the surface of the endless belt.
The polishing pad of the present invention is composed of at least one polishing pad piece having an adhesive layer on the lower surface, and the polishing pad pieces are brought together in a state where the facing end faces of the polishing pad pieces are brought together. The adhesive reinforcing layer which consists of a double-sided adhesive tape is affixed on the joint part and the lower surface of the vicinity.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an exemplary type state of the present invention according to FIGS. FIG. 1 shows a belt type polishing apparatus 10 according to this embodiment. The polishing apparatus 10 includes a plurality of polishing pad pieces 2 each having an adhesive tape 6 attached to the upper surface of an endless belt 5 (substrate) stretched between a pair of rotating rollers 7 and 7 that are separated from each other. , 2... Are attached to the substrate 5 in a state where the opposing end faces are attached to each other, as shown in FIG. 2, the attached reinforcing layer 4 is attached to the joined joint 3 and the lower surface in the vicinity thereof. Attached while interposing. The rotating rollers 7 are driven to rotate by a rotation driving source (not shown). The endless belt 5 is made of stainless steel or the like.
[0013]
FIG. 2 is an enlarged cross-sectional view showing a joint portion 3 which is a main part of the belt-type polishing apparatus 10. As shown in FIG. 2, the polishing pad pieces 2, 2... Have an adhesive tape 6 for adhering the polishing pad pieces 2, 2. As a material of the polishing pad piece 2, a thermosetting resin, a thermoplastic resin or the like is generally used. When a thermosetting resin is used, an additive such as a curing agent is added to the thermosetting resin, filled in a mold, and cured by heating at a predetermined curing temperature. In addition, when a thermoplastic resin is used instead of the thermosetting resin, the thermoplastic resin may be melted, filled in a mold, and solidified. In addition, you may mix and use a thermosetting resin and a thermoplastic resin as needed. The obtained molded product is sliced as necessary to obtain a polishing pad piece 2 having a desired thickness (usually 0.81 to 2.03 mm). Specific examples of the material of the polishing pad piece 2 include hard foamed polyurethane. Further, the polishing pad piece 2 may be one in which a rubber-like elastic foam layer such as silicone rubber is adhered to the lower surface of the hard layer.
[0014]
As the adhesion reinforcing layer 4, for example, a double-sided adhesive tape layer, an adhesive coating layer, or the like can be used. The thickness of the sticking reinforcing layer 4 is preferably 150 μm or less. Moreover, when using a double-sided adhesive tape as the adhesion reinforcement layer 4, it is preferable to use the same material as the said adhesion tape 6, and by this, material between the adhesion reinforcement layer 4 and the adhesion tape 6 is used. It is possible to prevent the peel strength from being lowered due to the difference.
[0015]
In order to polish an object to be polished using the polishing apparatus 10, the object to be polished is pressed against the polishing pad piece 2 adhered to the surface of the endless belt 5, and the endless belt is supplied while supplying the abrasive slurry. 5 is driven to polish the object to be polished, and the surface of the object to be polished is flattened. Here, as the abrasive slurry, generally used is a dispersion of powder such as silica particles in an alkaline aqueous solution such as KOH.
[0016]
Attaching the reinforcing layer 4, the joint portion 3 and the vicinity thereof of the polishing pad pieces 2 has the effect of firmly bonding the lower surface of the polishing pad pieces 2 on the surface of the endless belt 5. For this reason, the peeling strength of the polishing pad pieces 2 and 2 around the joint portion 3 is improved, and the peeling of the polishing pad piece 2 due to the object to be polished colliding with the corner of the joint portion 3 can be suppressed. As a result, damage to the object to be polished can be reduced, and the object to be polished can be polished stably over a long period of time.
[0017]
The joint portion 3 formed by joining the end portions of the polishing pad pieces 2 and 2 may be a straight line orthogonal to the longitudinal direction of the polishing pad piece , but to the joint portion 3 of the object to be polished. For example, as shown in FIGS. 3A to 3E, for example, planes including lines that are not orthogonal to the longitudinal direction of the polishing pad pieces 2 and 2 can be attached to each other. It should have a shape.
[0018]
That is, FIG. 3 (a) has a zigzag planar shape in which the convex portions 24a and the concave portions 24b whose end portions are triangular are alternately repeated, and the opposing convex portions 24a and the concave portions 24b are fitted together. A seam portion 31 is formed.
Further, in FIG. 3B, the seam portion 32 is formed by fitting the convex portion 25a and the concave portion 25b having a square end. In FIG. 3C, the seam portion 33 is formed by fitting the convex portion 26a and the concave portion 26b having curved ends. In FIG. 3D, the joint portion 34 is formed by fitting one triangular convex portion 27a and the concave portion 27b. The end portion shown in FIG. 3 (e) does not have the convex portion and the concave portion which are fitted to each other as described above, but the joint portion 35 is formed by the inclined lines 28a and 28b which are not orthogonal to the longitudinal direction of the polishing pad pieces 2 and 2. Can be used in the present invention in that it is formed.
Any of these end shapes can prevent the object to be polished from colliding with the joint portion 3 at the time of polishing, and therefore has an action of mitigating the impact caused by the collision.
[0019]
Note that the present invention is not limited to the belt-type polishing apparatus described above. Therefore, the number of polishing pad pieces to be joined together is not limited, and various improvements and changes can be made. For example, well by joining both ends of a sheet of the polishing pad pieces, or seamed a plurality of polishing pad pieces. In addition to the belt type polishing apparatus, the present invention can be similarly applied to a turntable type or drum type polishing apparatus in which polishing pad pieces need to be joined together.
[0020]
【Example】
Hereinafter, the mounting structure of the polishing pad of the present invention will be described in detail with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples.
[0021]
Example 1
As shown in FIGS. 1 and 2, the 1.27 mm thick polishing pad pieces 2, 2... With the adhesive tape 6 attached to the back surface are attached to the surface of the stainless steel endless belt 5. A double-sided adhesive tape 4 (adhesive reinforcement layer, rubber adhesive, core material: polyethylene terephthalate film) is applied in advance to the surface of the endless belt 5 corresponding to the seam portion where the ends are brought together and the vicinity thereof. Next, the polishing pad pieces 2, 2... Were attached to each other and adhered to the surface of the endless belt 5 to obtain a belt type polishing apparatus. Here, the ends of the polishing pad pieces 2, 2... That are brought together are straight lines orthogonal to the longitudinal direction of the polishing pad pieces .
[0022]
Comparative Example 1
A belt-type polishing apparatus was obtained in the same manner as in Example 1 except that the double-sided adhesive tape 4 was not interposed between the polishing pad piece 2 and the substrate 5.
[0023]
Test example 1
Sample 1 in which the polishing pad piece was directly bonded to the surface of the stainless steel plate and Sample 2 in which the polishing pad piece was bonded to the surface of the stainless steel plate via a double-sided adhesive tape were prepared. The peel strength when peeling a polishing pad piece end of each sample in the direction of 180 ° with a peel strength tester ((Ltd.) AG5-500 manufactured by Shimadzu Corporation) measured in an atmosphere of normal temperature (23 ° C.) did. The results are shown in Table 1.
[Table 1]

[0024]
【The invention's effect】
According to the polishing pad mounting structure of the present invention, by interposing the bonded reinforcing layers between the joint portion and the lower surface in the vicinity thereof between the substrate and the polishing pad pieces such as an endless belt, the polishing pad piece and the substrate Since the peel strength can be improved, it is possible to prevent the polishing pad piece from being peeled off due to the impact of the object to be polished colliding with the joint portion, and the object to be polished is damaged or the polishing accuracy is lowered. There is an effect that can be prevented.
[Brief description of the drawings]
FIG. 1 is a schematic view showing a belt type polishing apparatus according to an embodiment of the present invention.
FIG. 2 is a partial cross-sectional view of FIG.
[3] (a) ~ (e) is a plan view showing the shape of the polishing pad pieces end portion constituting the joint portion.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 2 Polishing pad piece 3 Seam part 4 Adhesion reinforcement layer 5 Board | substrate 6 Adhesive tape 7 Rotating roller 10 Polishing apparatus

Claims (5)

A structure for attaching a polishing pad piece adhered to a substrate in a state in which opposing end faces of a polishing pad piece provided with an adhesive layer on the lower surface are attached to each other, and a joint portion where the polishing pad pieces are attached to each other; and A structure for attaching a polishing pad piece, wherein an adhesive reinforcing layer made of double-sided adhesive tape is interposed between the adhesive layer on the lower surface in the vicinity thereof and the substrate.   2. The structure for attaching a polishing pad piece according to claim 1, wherein the ends of the polishing pad pieces to be brought together have shapes that can be brought together with each other including a line that is not orthogonal to the longitudinal direction of the polishing pad pieces.   The mounting structure of the polishing pad piece according to claim 1 or 2, wherein an end part of the polishing pad piece to be brought together has a shape including one or more convex parts and concave parts that can be fitted to each other. An endless belt stretched between a pair of rotating rollers spaced apart from each other, and at least one polishing pad piece having an adhesive layer provided on the lower surface thereof, with the facing end faces of the polishing pad piece in contact with each other A belt-type polishing apparatus adhered to the surface of the endless belt, wherein a double-sided adhesive is bonded between the adhesive layer on the lower surface in the vicinity of the joint portion where the polishing pad pieces are brought together and the surface of the endless belt A belt-type polishing apparatus characterized by interposing an adhesive reinforcing layer made of tape. It is composed of at least one polishing pad piece provided with an adhesive layer on the lower surface, and in a state where the facing end faces of the polishing pad piece are brought together, a seam portion where the polishing pad pieces are brought together and the vicinity thereof A polishing pad , wherein an adhesive reinforcing layer made of a double-sided adhesive tape is attached to the adhesive layer on the lower surface.

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