JP7082748B2 - Abrasive Pad Fixtures and Abrasive Pads - Google Patents

Description

The present invention relates to a polishing pad fixing tool and a polishing pad, and more particularly to a polishing pad fixing tool for fixing the polishing pad to the polishing surface plate of the polishing device and a polishing pad provided with the polishing pad fixing tool.

Conventionally, high flatness is required for optical materials such as lenses, parallel flat plates, reflective mirrors, silicon wafers, glass substrates for liquid crystal, semiconductor substrates, etc., so polishing using a polishing pad is performed. It has been damaged. Further, in recent years, even a plate-shaped object made of glass, metal, ceramic or the like having a flat surface and a curved surface has been subjected to polishing processing using a polishing pad.
Usually, a single-sided polishing device for polishing the object to be polished on one side is used for polishing the object to be polished, and such a single-sided polishing device uses a holding platen and a polishing platen provided opposite to each other. The holding platen holds the object to be polished, and the polishing platen is equipped with a polishing pad having a polishing layer for polishing the object to be polished.
Then, at the time of polishing, a slurry is supplied to the polished surface of the polishing pad, and the object to be polished is polished by relatively rotating the polishing surface plate and the holding surface plate while applying pressure to the object to be polished. It has become.
It is necessary to replace the polishing pad whose polishing layer has been worn by use in the above polishing process, but when the polishing pad is fixed to the polishing surface plate with double-sided tape, the adhesive remains on the polishing surface plate (glue residue). Sometimes.
If the adhesive remains, the adhesive residue will rise when a new polishing pad is attached, and the flatness of the polishing surface of the polishing pad will be impaired. Therefore, when the polishing pad is replaced, it remains on the polishing surface plate. Cleaning work is required to completely remove the adhesive, which reduces the workability of mounting by cleaning work.
Therefore, it is known that the polishing pad is fixed to the polishing surface plate by a polishing pad fixing tool made of a hook-and-loop fastener (Patent Document 1). Such a polishing pad fixture has an advantage of high work efficiency because it is only necessary to separate the male side fastener member from the female side fastener member at the time of replacement and cleaning work is not required for each replacement.

Japanese Unexamined Patent Publication No. 2010-274338

However, when the polishing pad fixture made of the hook-and-loop fastener is used, when the polishing pad is pressed against the object to be polished during the polishing process, the engaging protrusions constituting the male side fastener member become the polishing layer of the polishing pad. Deform the side opposite to the polished surface. Then, when the deformation propagates to the polished surface, polishing unevenness may occur on the object to be polished. In particular, such a tendency is remarkable when the polishing process is performed under the condition of a relatively high polishing pressure of 400 gf / cm ² or more, and in particular, the surface to be polished has a flat surface and a curved surface, and the location of the surface to be polished When there was a difference in the pressing pressure to which the polishing pressure was transmitted, uneven polishing was remarkable in the place where the pressing pressure was high.
In view of such a problem, the present invention provides a polishing pad fixing tool capable of preventing the occurrence of polishing unevenness as much as possible, and a polishing pad provided with the polishing pad fixing tool.

That is, the polishing pad fixture according to the invention of claim 1 is a polishing pad fixture for fixing the polishing pad to the polishing surface plate of the polishing apparatus.
The polishing pad fixative includes a hook-and-loop fastener composed of a male side fastener member having innumerable engaging protrusions and a female side fastener member having innumerable engaged portions engaged with the engaging protrusions.
The female side fastener member is provided on the polishing pad side, and a cushion material having a thickness of 5 to 15 mm is laminated and fixed on the surface of the female side fastener member on the polishing pad side, and the male side fastener member is polished. Provided on the board side,
The A hardness of the cushion material is set in the range of 10 to 25 °.
The engaging protrusions constituting the male side fastener member are provided at a density of 30 to 100 pieces / cm2.
Further, the thickness of the male side fastener member is 1.0 to 3.0 mm, and the basis weight of the female side fastener member is 400 to 800 g / m2.
Further, the polishing pad according to the third aspect of the present invention is a polishing pad provided with a polishing layer having a polishing surface for polishing an object to be polished.
The polishing pad fixing device according to claim 1 or 2 is provided on the side opposite to the polishing surface of the polishing layer.

According to the above invention, by providing a cushioning material between the surface fastener and the polishing pad and providing a female side fastener member on the polishing pad side, when the polishing pad is pressed against the object to be polished, the male side fastener By absorbing the deformation caused by the engaging protrusions of the member by the innumerable engaged parts of the cushion material and the female side fastener member , uneven polishing is likely to occur even in polishing under the condition of a polishing pressure of 400 gf / cm2 or more. Can be suppressed, and uneven polishing of the object to be polished having a curved surface can also be suppressed.
Furthermore, by setting the thickness of the cushion material in the range of 5 to 15 mm, it was confirmed that this effect became remarkable, as is clear from the following experimental results.

Schematic diagram of the polishing apparatus according to this embodiment Enlarged sectional view of polishing surface plate and polishing pad

Hereinafter, the illustrated embodiment will be described. FIG. 1 shows a schematic view of a polishing apparatus 2 for polishing an object to be polished 1. The polishing apparatus 2 is located above and holds a plurality of objects to be polished 1. A polishing surface plate 5 to which the polishing pad 4 is fixed located below, and a slurry supply means 6 for supplying a slurry between the object to be polished 1 and the polishing pad 4 are provided.
As the object to be polished 1, in addition to an optical material, a silicon wafer, a glass substrate for liquid crystal, a semiconductor substrate, a plate-like object made of glass, metal, ceramic or the like having a flat surface and a curved surface can be polished, and the slurry is supplied. As the slurry supplied by the means 6, a conventionally known material can be used depending on the target object 1 to be polished and the required processing accuracy.
The holding surface plate 3 and the polishing surface plate 5 each have a substantially disk shape, and each of them is adapted to rotate in relatively opposite directions by a driving means (not shown), and the holding surface plate 3 can be raised and lowered. It is provided in.
Then, when performing the polishing process, the holding surface plate 3 relatively rotates the object to be polished 1 while pressing the object to be polished 1 against the polishing pad 4 on the upper surface of the polishing surface plate 5 at a set pressure, and the slurry supply means 6 transfers the slurry. It is supplied between the object to be polished 1 and the polishing pad 4.

FIG. 2 shows an enlarged cross-sectional view of the polishing pad 4, and the polishing pad 4 is interchangeably fixed to the polishing platen 5 via a polishing pad fixture 7.
As the polishing pad 4, a conventionally known polishing pad 4 can be used. In this embodiment, a polishing pad made of a polyurethane resin-impregnated non-woven fabric is used, but a polishing pad 4 made of another material is also used. May be good. Further, a groove may be formed on the polished surface on the side of the object to be polished 1 as needed.
Further, the thickness of the polishing pad 4 of this embodiment is preferably 0.5 to 5.0 mm, and if it is less than 0.5 mm, the grinding force tends to be weakened, so that unpolished residue is likely to occur. On the contrary, when it exceeds 5.0 mm, the sinking becomes deep and excessive stress is easily applied to the end portion of the object to be polished 1, so that uneven polishing is likely to occur.

The polishing pad fixture 7 is composed of a hook-and-loop fastener 11 composed of a male side fastener member 11A and a female side fastener member 11B, and a cushion material 12 provided on the polishing pad 4 side of the surface fastener 11. There is. The surface fastener 11 and the cushion material 12 are laminated and integrated by the double-sided tape T.
Specifically, the male side fastener member 11A is adhesively fixed to the polishing surface plate 5 by the double-sided tape T, and the female side fastener member 11B and the cushion material 12 are laminated and integrated via the double-sided tape T. ..
When the polishing pad 4 is fixed to the polishing surface plate 5 by using the polishing pad fixing tool 7 having the above configuration, the male side surface fastener member 11A is fixed to the polishing surface plate 5 in advance by using the double-sided tape T. The cushioning material 12 and the polishing pad 4 are fixed to the polishing surface plate 5 by bringing the polishing pad 4 to which the female side surface fastener member 11B and the cushioning material 12 are fixed into close contact with the polishing pad 4.
On the other hand, when the polishing pad 4 is replaced, the used polishing pad 4 is separated from the polishing surface plate 5 by peeling the female side surface fastener member 11B from the male side surface fastener member 11A, and the male side surface fastener member 11A is removed. A new polishing pad 4 to which the female side surface fastener member 11B and the cushion material 12 are fixed may be brought into close contact with the polishing surface plate 5 while being left on the polishing platen 5.
As described above, the polishing pad fixture 7 provided with the hook-and-loop fastener 11 as in the present embodiment repeatedly uses the male side fastener member 11A, so that the adhesion remaining on the polishing surface plate 5 during the replacement work of the polishing pad 4 is performed. Since the cleaning work for removing the agent is not required, the polishing pad 4 can be replaced quickly.

The engaging protrusion 13 of the male side fastener member 11A in the present embodiment includes a shaft 13a erected on the base material B and a substantially hemispherical engaging portion 13b provided at the tip of the shaft 13a. It is a so-called mushroom type.
On the other hand, the engaged portion 14 of the female side fastener member 11B is a so-called napping type, and is composed of mohair-like fibers fixed to the surface of the base material B, and the male side fastener member is attached to the fibers. By catching the engaging protrusion 13 of 11A, it is possible to firmly engage them.
Further, the density of the engaging protrusions 13 of the male side fastener member 11A is preferably provided in the range of 30 to 100 pieces / cm2, more preferably provided in the range of 40 to 80 pieces / cm2, and more preferably 50 to 70 pieces / cm2. It is more preferable to provide it in the range of cm2.
If it is less than 30 pieces / cm2, the close contact state between the male side surface fastener member 11A and the female side surface fastener member 11B cannot be maintained, and the polishing pad 4 shifts during the polishing process to increase chatter, and the polishing process may be continued. If it becomes impossible or exceeds 100 pieces / cm2, it becomes difficult to remove the adhering dirt when cleaning the male side surface fastener member 11A remaining on the polishing platen 5 when the polishing pad 4 is replaced.
The thickness of the male side fastener member 11A is preferably 1.0 to 3.0 mm. If it is less than 1.0 mm, the engaging force with the female side fastener member 11B is reduced, and the surface fastener members are likely to be displaced during polishing. On the contrary, if it exceeds 3.0 mm, it is between the surface fastener member and the polishing pad 4. Even if the cushion material 12 intervenes, unevenness is likely to be transferred to the polished surface.
On the other hand, the basis weight of the female side fastener member 11B is preferably 400 to 800 g / m2. If it is less than 400 g / m2, the engaging force is lowered, and the surface fastener members are likely to be displaced during the polishing process. On the other hand, if it exceeds 800 g / m2, the amount of extra fibers that do not contribute to engagement increases, and polishing troubles are likely to occur due to the aggregation of abrasive grain components in the slurry that stay in the gaps between the fibers during polishing.
The thickness of the female side fastener member 11B is preferably 1.5 to 5.0 mm. On the contrary, if it is less than 1.5 mm, the engaging force is poor and it becomes difficult to fix the polishing pad 4 to the polishing surface plate 5. On the other hand, if it exceeds 5.0 mm, the members between the hook-and-loop fasteners are likely to be displaced, and the flexibility in the thickness direction becomes too large, so that the pressing force on the object to be polished 1 is difficult to be transmitted and the polishing speed. Is likely to decrease.
The surface fasteners that can be used in this embodiment include knitted or woven surface fasteners obtained by weaving fibers such as polyester fibers, polyamide fibers, polyolefin fibers, and polyvinyl chloride fibers; polyester, polyamide, and the like. Molded synthetic resins such as polyolefins, polyolefin copolymers, vinyl chloride polymers, polyurethanes, polyester elastomers, polyamide elastomers, polyolefin elastomers, silicone resins, other thermoplastic polymers, and thermosetting polymers. Molded surface fasteners obtained from the above;
A hook-and-loop fastener 11 is also known in which a male side fastener member 11A having an engaging protrusion 13 having a hook shape and a female side fastener member 11B having an engaged portion 14 having a loop shape are combined. However, since these have lower peel strength than the combination of the mushroom type and the napping type, it is desirable to adopt the above configuration.

Polyethylene foam can be used for the cushion material 12, and other materials such as polyurethane foam and rubber can be used.
In this embodiment, by providing the cushioning material 12 between the surface fastener 11 and the polishing pad 4, it is possible to prevent the polishing pad 4 from being deformed by the engaging protrusion 13 of the male side fastener member 11A. It is possible to suppress uneven polishing when the object 1 to be polished is polished.
Specifically, when the polishing pad 4 is pressed against the object to be polished 1 in order to polish the object to be polished 1, the engaging protrusion 13 of the male side fastener member 11A is also pressed.
Since the polishing pad fixture 7 of this embodiment is provided with the cushioning material 12 between the polishing pad 4 and the surface fastener 11, even if the engaging projection 13 of the male side fastener member 11A is pressed, the above-mentioned Only the cushion material 12 is deformed, and the polishing layer of the polishing pad 4 is not deformed.
On the other hand, when the polishing pad fixture 7 does not have the cushioning material 12, the engaging protrusion 13 deforms the side opposite to the polishing surface of the polishing layer of the polishing pad 4, and the deformation also deforms the polishing surface. When it reaches the point, the contact between the polishing pad 4 and the object 1 to be polished becomes not constant, and uneven polishing occurs.

Further, in the polishing pad fixture 7 of the present embodiment, as described above, the male side fastener member 11A is fixed to the polishing surface plate 5, and the female side fastener member 11B is laminated and integrated with the cushion material 12. The female side surface fastener member 11B is positioned between the engagement protrusion 13 of the male side surface fastener member 11A and the polishing pad 4.
As a result, the engaged portion 14 of the female side fastener member 11B can act like the cushion material 12, and the deformation of the male side fastener member 11A by the engaging protrusion 13 is caused by the female side fastener member. It can be absorbed by 11B and the cushion material 12.

In order to obtain the above effect of the cushion material 12, it is desirable that the thickness of the cushion material 12 is in the range of 5 to 15 mm. If it is less than 5 mm, the deformation caused by the engaging protrusion 13 cannot be absorbed, and if it exceeds 15 mm, the cushion material 12 is excessively deformed and the surface is deformed when the polishing pad 4 is pressed against the object to be polished 1. The dignity will deteriorate.
Further, it is desirable that the A hardness of the cushion material 12 is in the range of 10 to 25 °. If it is less than 10 °, the cushion material 12 is excessively deformed when the polishing pad 4 is pressed against the object to be polished 1, and the surface quality deteriorates. If it exceeds 25 °, the engagement protrusion 13 causes the surface quality to deteriorate. Since the deformation cannot be sufficiently absorbed, the cushioning material 12 is distorted by the engaging protrusion 13, the polishing layer cannot be supported flatly, and the surface quality tends to deteriorate.
The article to be polished is not particularly limited, and examples thereof include an optical material, a silicon wafer, a glass substrate for liquid crystal, a semiconductor substrate, and the like, but in the present embodiment, the article is made of glass, metal, ceramic, or the like. It can be particularly preferably used in a plate-like object having a curved surface and a flat surface.

Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited to these examples.
The thickness, density, compressibility, compressible elastic modulus, and A hardness, which are the physical properties of the polishing pad 4 described in this embodiment, are measured by the following methods. Further, the density and A hardness, which are the physical properties of the cushion material 12, are also measured in the same manner.
(thickness)
The thickness was measured using a dial gauge (minimum scale 0.01 mm) with a load of 480 g / cm ² . The central part of the polishing pad of 10 cm in length × 10 cm in width and 5 points at the four corners were measured and read up to 1/10 (0.001 mm) of the minimum scale, and the average value was taken as the thickness (mm) of the test piece.
(density)
Density was measured by dividing the dry mass of the test piece by the volume of the test piece (apparent volume including voids).
(Compression modulus and compressive elastic modulus)
The compressibility and compressive elastic modulus were measured using a shopper type thickness measuring instrument (pressurized surface: circular with a diameter of 1 cm) in accordance with Japanese Industrial Standards (JIS L 1021).
Specifically, the thickness t0 after applying the initial load for 30 seconds from the unloaded state at room temperature is measured, and then the thickness t1 after applying the final load for 5 minutes from the state of the thickness t0 is measured. did. Next, all the loads were removed from the state of the thickness t1, and after leaving for 5 minutes (with no load), the initial load was applied again for 30 seconds, and then the thickness t0'was measured.
The compressibility is calculated by the formula of compressibility (%) = (t0-t1) / t0 × 100, and the compressibility is calculated by the formula of compressibility (%) = (t0'-t1) / (t0-t1) ×. It was calculated by the formula of 100. At this time, the initial load was 100 g / cm ² and the final pressure was 1120 g / cm ² . )
(A hardness)
For the measurement of A hardness, a sample piece (10 cm × 10 cm) was prepared and measured with an A type hardness tester (Japanese Industrial Standards, JIS K 7311). When the thickness was less than 4.5 mm, a plurality of test pieces were stacked and measured so that the thickness was 4.5 mm or more.

Next, the thickness, basis weight, and the number of protrusions, which are the physical characteristics of the male side fastener member 11A and the female side fastener member 11B constituting the surface fastener 11, are measured by the following methods.
(thickness)
The thickness of the hook-and-loop fastener member was measured by a digital micrometer (trade name "MDC-25SX" manufactured by Mitutoyo Co., Ltd.). The test piece having a length of 10 cm and a width of 10 cm was read and measured up to 0.001 mm at five points in the center and four corners, and the average value was taken as the thickness (mm) of the fastener member on each surface.
(Metsuke)
The basis weight was measured by dividing the dry mass of the test piece by the area of the test piece.
(Number of engaging protrusions)
The number of engaging protrusions on the male side fastener member 11A is determined by cutting the test piece into 1 cm squares and then magnifying and observing the protrusions using a microscope (trade name "VH-5500" manufactured by KEYENCE). It was obtained by measuring the number of engaging protrusions while moving.

(Examples 1 to 3 and Comparative Examples 1 and 2)
The same polishing pads 4 were used for Examples 1 to 3 and Comparative Examples 1 and 2. Specifically, a polishing layer made of a resin-impregnated non-woven fabric having a thickness of 1.75 mm, a density of 0.36 g / cm ³ , a compressibility of 4.3%, a compressibility modulus of 71.6%, and an A hardness of 74.5 ° is formed. The polishing pad 4 provided was used (FPK660 "manufactured by Fujibo Ehime Co., Ltd.").
Further, the same hook-and-loop fastener 11 constituting the polishing pad fixtures 7 of Examples 1 to 3 and Comparative Examples 1 and 2 was used. Specifically, the male side fastener member 11A used a mushroom type engaging protrusion 13, and the female side fastener member 11B used a napping type.
Further, the thickness of the male side surface fastener member 11A was 1.5 mm, the thickness of the female side surface fastener member 11B was 2.0 mm, and the thickness when bonded was 2.9 mm. The basis weight of the male side fastener member 11A was 564 g / m ² , and the basis weight of the female side fastener member 11B was 682 g / m ² .

For the polishing pad fixture 7 according to Examples 1 to 3, the thickness of the cushion material 12 was set to 5 mm, 10 mm, and 15 mm, and the A hardness was set to 22 °.
On the other hand, for the polishing pad fixtures of Comparative Examples 1 and 2, the thicknesses of the cushioning materials 12 were different, and the thicknesses of the cushioning materials 12 of Comparative Examples 1 and 2 were set to 3 mm and 20 mm, respectively. It is shown in Table 1 below.

(Example 4, Comparative Examples 3 and 4)
In Examples 4, Comparative Examples 3 and 4, the same as in Example 2 was produced except that the A hardness of the cushion material of the polishing pad fixture 7 was 11 °, 0 °, and 26 °. It is shown in Table 2 below.

(Example 5)
In Example 5, the polishing pad 4 was manufactured in the same manner as in Example 2 except that the thickness of the polishing pad 4 was changed to 4.83 mm. It is shown in Table 2 below.

(Example 6, Comparative Example 5)
Examples 6 and 5 were produced in the same manner as in Example 2 except that the number of engaging protrusions was 35 / cm ² and 108 / cm ² . It is shown in Table 2 below.

Then, the object to be polished 1 is polished using the polishing pad 4 provided with the polishing pad fixtures 7 of Examples 1 to 6 and Comparative Examples 1 to 5, and the presence or absence of uneven polishing on the object to be polished 1 is evaluated. gone.
As the polishing device 2 used in the above experiment, a single-sided polishing device manufactured by Fujikoshi Kikai Kogyo Co., Ltd. was used. : 5 mm))) can be polished 10 sheets per set. As the slurry, a 10% aqueous solution of cerium oxide slurry was used.
Further, the rotation speed of the polishing surface plate 5 by the polishing apparatus 2 is set to 40 rpm, the polishing pressure is set to 450 g / cm ² , and the polishing time per polishing is set to 15 min, which is 12 sets, that is, 120 sheets in total. The object to be polished 1 was polished.
Then, it is visually determined whether or not the polished object 1 has uneven polishing, and when all the objects 1 to be polished are not confirmed to have uneven polishing and are uniformly polished, ○, a part of the object to be polished. Although slight polishing unevenness was confirmed in the polished object 1, the case where it was uniformly polished as a whole was evaluated as Δ, and the case where there was a large amount of polishing unevenness and was not uniformly polished was evaluated as ×. ..

As is clear from the above experimental results, no polishing unevenness was confirmed in the object to be polished 1 polished by using the polishing pad 4 provided with the polishing pad fixtures 7 of Examples 1 to 6 and Comparative Example 5.
On the other hand, uneven polishing was confirmed in a part of the object to be polished 1 polished by using the polishing pad provided with the polishing pad fixture as Comparative Examples 1 and 2.
In Comparative Example 1, since the thickness of the cushion material is as thin as 3 mm, when the engaging protrusion 13 is pressed by the polishing surface plate, the cushion material 12 cannot completely absorb the deformation, and the polishing pad 4 is also deformed, thereby causing the polishing pad 4. It is presumed that uneven polishing occurred.
In Comparative Example 2, the thickness of the cushion material 12 is as thick as 20 mm, and when the polishing pad 4 is pressed against the object to be polished 1 by the polishing surface plate 5, the cushioning material is excessively sunk, and the polishing pad 4 and the covering are covered. It is presumed that the contact pressure with the polished object 1 could not be kept constant, which caused uneven polishing.
In Comparative Example 3, since the A hardness of the cushion material is as soft as 0 °, the cushion material 12 is excessively sunk when the polishing pad 4 is pressed by the polishing surface plate, and the polishing pad 4 and the object to be polished 1 are combined. It is presumed that the processing pressure was not kept constant, which caused slight uneven polishing.
In Comparative Example 4, the A hardness of the cushion material 12 is as hard as 26 °, and when the polishing pad 4 is pressed against the object 1 to be polished by the polishing surface plate 5, the cushion material 12 absorbs the deformation due to the engaging protrusion 13. It became difficult, and the cushion material 12 was distorted by the engaging protrusion 13, making it difficult to support the polishing layer flatly. It is presumed that this caused slight uneven polishing.
At the end of polishing, the male side fastener member was separated from the female side fastener member, and the surface of the male side fastener member on the engaging protrusion side was washed while flowing with water, but only on the male side fastener member of Comparative Example 5. The powder remained, so it was removed by brushing. This is because the number of engaging protrusions in Comparative Example 5 is 108 / cm ² , which is larger than that of other examples (56 / cm ² and 35 / cm ² ), and the distance between the engaging protrusions is large. It is presumed that it became narrower and it became difficult to remove solids.

1 Polished object 4 Polishing pad 5 Polishing surface plate 7 Polishing pad fixture 11 Surface fastener member 11A Male side fastener member 11B Female side fastener member 12 Cushion material 13 Engagement protrusion 14 Engagement part

Claims (4)

In the polishing pad fixture for fixing the polishing pad to the polishing surface plate of the polishing device,
The polishing pad fixative includes a hook-and-loop fastener composed of a male side fastener member having innumerable engaging protrusions and a female side fastener member having innumerable engaged portions engaged with the engaging protrusions.
The female side fastener member is provided on the polishing pad side, and a cushion material having a thickness of 5 to 15 mm is laminated and fixed on the surface of the female side fastener member on the polishing pad side, and the male side fastener member is polished. Provided on the board side,
The A hardness of the cushion material is set in the range of 10 to 25 °.
The engaging protrusions constituting the male side fastener member are provided at a density of 30 to 100 pieces / cm2.
Further, the polishing pad fixture is characterized in that the thickness of the male side fastener member is 1.0 to 3.0 mm, and the basis weight of the female side fastener member is 400 to 800 g / m2. The polishing pad fixture according to claim 1, wherein the engaging protrusion constituting the male side fastener member is a mushroom type, and the engaged portion constituting the female side fastener member is a napping type. In a polishing pad provided with a polishing layer having a polishing surface for polishing an object to be polished,
A polishing pad comprising the polishing pad fixing device according to claim 1 or 2 on the side opposite to the polishing surface of the polishing layer. The polishing pad according to claim 3 , wherein the polishing layer is made of a resin-impregnated nonwoven fabric having a thickness of 0.5 to 5.0 mm.

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