JP4673545B2 - Delivery slip - Google Patents

Description

  The present invention relates to a delivery slip, and more particularly, to a delivery slip in which an IC chip is enclosed in a slip and the enclosed IC chip is collected and can be reused.

  There are known delivery slips in which a tag slip as an invoice and a receipt slip as a receipt are formed on one sheet, and the receipt slip is separated and taken home at the delivery destination.

Japanese Patent Laid-Open No. 2003-136861

  The slip of Patent Document 1 uses an original fabric in which a release paper 13 is detachably bonded to an application surface of an adhesive 12 applied to a surface layer paper 11, and a part of the release paper 13 of the original fabric is peeled off. The other paper 17 is bonded to the pressure-sensitive adhesive-coated surface where the agent 12 is exposed so as not to peel off. Perforations 4 and 5 that reach the surface paper 11 are formed along the paper 17. The part of the sheet 17 becomes the receipt 3 and the other part becomes the invoice 2. The receipt 3 and the invoice 2 are peeled off from the release paper 13 and attached to the delivery product. Since the receipt 3 peeled off from the release paper 13 is not adhered to the delivery product, the receipt 17 can be separated along the perforations 4 and 5 while being attached to the delivery product, and the receipt 3 is taken home and stored. It will be possible. The invention of Patent Document 1 separates and returns the receipt 3 at the delivery destination, but does not enclose the IC chip in the slip.

  The data capacity of the IC chip is much larger than that of a bar code and the like, and it is possible not only when the reading direction by the reader is not straight, but also by repeatedly using the stored data. In recent years, it has been attracting attention in logistics management. However, when IC chips are expensive and used for forms, even if the forms are brought home, if they are taken away and discarded, the unit price of the forms will become too high, leading to widespread use. There is no current situation.

  The present invention is a slip in which a tag slip and a receipt slip are formed on a single sheet. The IC chip is enclosed in the receipt slip, and the IC chip is collected after the receipt slip is brought back, so that the IC chip can be reused. It is intended to provide a delivery slip that is made possible.

  The first of the solutions is a form base in which a first wrap film having a size corresponding to a receipt is adhered to the release paper-coated surface of the release paper in a close contact state, the surface is mirror-finished, and an adhesive is applied to the back surface. The adhesive application surface of the material is adhered to the release agent application surface of the release paper and the first wrap film so that the first wrap film cannot be peeled off and the other parts can be peeled off. A second perforation that penetrates the first wrap film and reaches the release agent application surface of the release paper is provided, and the release agent application surface of the release mount having a size corresponding to the receipt slip is more than the receipt slip. A second wrap film with a small shape is adhered in close contact, and the second wrap film cannot be peeled off and is peelable from other parts on the pressure-sensitive adhesive coated surface of the surface layer paper coated with pressure-sensitive adhesive on the back surface. The adhesive coating surface of the surface paper and the release mount From the surface of the surface layer paper, the surface of the surface layer paper is bonded to the mirror-finished surface of the form base material so that the surface of the surface layer paper is not peelable and the other surface is peelable. A first perforation that penetrates the first wrap film and reaches the release agent application surface of the release paper is provided, and the slip is divided into a tag, a receipt, and a sticker. .

The second of the solving means is that in the first of the solving means, the receipt slip is able to peel off the peeling mount that is peelably bonded to the back surface of the surface paper and the form substrate that is peelably bonded to the surface of the peeling paper. Open the adhesive surface between the release mount and the form substrate, then remove the release mount from the surface paper, and the surface paper and the form base material from which the release mount has been removed. An IC chip sheet is inserted in between, and the surface layer paper is bonded again to the form substrate, and the IC chip sheet is enclosed in a slip .

  In the present invention, an IC chip is encapsulated in a delivery slip, particularly a receipt slip, which is a receipt. The IC chip is taken back, the IC chip is taken out, the IC chip data is erased, and new data is input. Therefore, there is an effect that an IC chip having a remarkably high data input capacity can be used repeatedly.

  In FIG. 1A, reference numeral 1 denotes a delivery slip, and a tag 2 serving as an invoice, a receipt 3 serving as a receipt, and a sticker 4 are partitioned by a first perforation 5. A tag slip 2 is formed adjacent to the left side of the receipt slip 3 and a sticker slip 4 is formed adjacent to the right side. Further, at the end of the first perforation 5 which becomes each corner of the receipt slip 3, a notch 6 in which a cut-off portion has a triangular shape is provided at each corner of the receipt slip 3. The IC chip is a sheet in which the IC chip and the antenna are combined and enclosed in the receipt slip 3, and the receipt slip 3 is separated from the first perforation 5 at the delivery destination and brought back together with the receipt slip 3.

  1B and 1C are cross-sectional views of the delivery slip, but the IC chip is not yet enclosed in the receipt slip 3. In the figure, reference numeral 10 denotes a release paper, on which a release agent 11 made of silicon or the like is applied on the surface, the application surface of the release agent 11 has a size corresponding to the receipt slip 3 and corresponds to the receipt slip 3. The first wrap film 12 is adhered to the position in a close contact state. Reference numeral 13 denotes a form base material, which has a mirror film 14 attached to the surface with an adhesive (not shown) and an adhesive 15 applied to the back surface. The application surface of the adhesive 15 is the release agent 11 of the release paper 10 and The first wrap film 12 is adhered to the surface of the release paper 10 so as to be peelable, and is adhered to the first wrap film 12 so as not to be peeled off. In addition, the front perforated second perforation 16 that reaches the first wrap film 12 from the mirror film 14 of the form base 13 is provided in a state where the form base 13 and the release paper 10 are bonded.

  Since the second perforation 16 is for cutting the form base material 13 along the second perforation 16 later, a dotted line or the like is printed along the second perforation 16. Good.

  In the embodiment, the specular film 14 is provided on the surface of the form base material 13, but the surface of the form base material 13 only needs to be mirror-finished, and as another embodiment, the surface is formed in a mirror shape. Can be replaced with plastic film.

  Reference numeral 20 denotes a surface layer paper made of high-quality paper or the like, in which an adhesive 21 is applied to the back surface. Reference numeral 22 denotes a release mount, which has a surface coated with a release agent 23 made of silicon or the like, and has a size corresponding to the receipt slip 3. The release mount 22 has a second wrap film 24 having a shape smaller than that of the release mount 22 adhered to the application surface of the release agent 23 in a close contact state, and the adhesive surface of the second wrap film 24 is attached to the receipt slip 3. The adhesive is bonded to the surface of the surface paper 20 at the corresponding position so as not to be peeled off from the application surface of the pressure-sensitive adhesive 21 and peelable from other parts.

  A member that releasably attaches the form substrate 13 to the surface of the release paper 10 is a lower form member 30, and a member that releasably attaches the release mount 22 to the back surface of the surface layer paper 20 is an upper form member 40. To form. The delivery slip 1 is obtained by adhering the adhesive 21 and the release mount 22 of the upper form member 40 to the mirror film 14 of the lower form member 30 so that the release mount 22 can be peeled off and cannot be peeled off from other parts. .

  The delivery slip 1 in which the upper slip member 40 is bonded to the lower slip member 30 is printed on the surface of the surface paper 20 as necessary for the slip, and the tag 2, the receipt slip 3 and the sticker slip 4 are attached to the first perforation 5. To form a partition. The first perforation 5 passes from the surface layer paper 20 through the release mount 22 and the form substrate 13, passes through the adhesive 15 and the first wrap film 12, and reaches the application surface of the release agent 11 of the release paper 10. ing. Although the first perforation 5 penetrates the peeling mount 22, the second wrap film 24 is assumed to be positioned inside the first perforation 5.

  In the embodiment, the first and second wrap films 12 and 24 are films developed for food packaging, and adhere to the release agent application surface and the specular film surface in a tight contact state in a tension state.

  The IC chip sheet 50 is a combination of an IC chip and an antenna (both not shown in detail), and the size of the sheet is a square having a side of approximately 45 mm. Incidentally, the size of a single IC chip is a square with a side length of 1.2 mm and a thickness of 0.3 mm.

  The procedure for enclosing the IC chip sheet 50 in the receipt slip 3 will be described with reference to FIG. First, the adhesive surface of the mirror film 14 of the form substrate 13 and the release mount 22 of the surface paper 20 in the lower part of the receipt 3 (right side in FIG. 2) is opened (FIG. 2A). Next, the peeling mount 22 is peeled off from the application surface of the adhesive 21 of the surface paper 20, and the IC chip sheet 50 is placed on the form base 13 (FIG. 2B). The IC chip sheet 50 is positioned inside the second wrap film 24 of the surface layer paper 20. When the IC chip sheet 50 is placed on the form substrate 13, the surface layer paper 20 is bonded to the form substrate 13 and the IC chip sheet 50 is enclosed in the receipt form 3 (FIG. 2C).

  Before sticking the delivery slip 1 to the delivery product, printing on the tag 2 and receipt 3 and data input to the IC chip of the IC chip sheet 50 are performed.

  In FIG. 3, the delivery slip 1 is peeled off the release paper 10 and attached to the delivery product 60. The entire surface of the tag 2 and the form 4 is bonded to the delivery 60, but the receipt 3 is not bonded. When the delivery item 60 is delivered to the customer, the receipt slip 3 receives a receipt stamp, and the receipt slip 3 is separated from the first perforation 5 and brought home.

  As shown in FIG. 4, the receipt slip 3 brought back cuts the form substrate 13 a along the second perforation 16 and takes out the IC chip sheet 50 accommodated between the second wrap film 24. . The collected IC chip of the IC chip sheet 50 erases data and reuses it.

  Next, the delivery slip manufacturing process will be described with reference to FIGS. The delivery slip 1 is a combination of a lower form member 30 and an upper form member 40.

FIG. 5 is a process of manufacturing the lower form member 30. The lower form member 30 adheres the wrap film 12a to the application surface of the release agent 11 of the release paper 10 in a close contact state (FIG. 5A), and the wrap film 12a has a portion formed in a size corresponding to the receipt form 3 described above. It is formed and left on the first wrap film 12, and the other portions are removed (FIG. 5B). Next, the adhesive-coated surface of the form substrate 13 with the adhesive 15 applied to the back surface is adhered to the release paper 10 so that the adhesive-coated surface can be peeled off and the first wrap film 12 cannot be peeled off. A second perforation 16 is provided from the mirror film 14 of the substrate 13 through the form substrate 13 and the first wrap film 12 to reach the release agent application surface of the release paper 10 (
FIG. 5C).

  FIG. 6 shows a process for manufacturing the upper form member 40. The upper form member 40 adheres the wrap film 24a in close contact with the application surface of the release agent 23a of the release board material 22a formed to the same size as the delivery slip (FIG. 6A). The part formed smaller than 3 is left as the second wrap film 24, and the other part is removed (FIG. 6B). Next, the adhesive-coated surface of the surface paper 20 with the adhesive 21 applied to the back surface is detachably bonded to the release agent-coated surface of the release mount material 22a, and the second wrap film 24 is non-detachably bonded. (FIG. 6C). Further, the peeling mount material 22a leaves the part of the peeling mount 22 formed in a size corresponding to the receipt slip 3, and removes the other part (FIG. 6D).

  FIG. 7 is a process of joining the upper form member 40 to the lower form member 30. In the delivery slip 1, the adhesive 21 of the surface layer paper 20 and the surface of the release mount 22 are bonded to the surface of the mirror surface film 14 of the form substrate 13, and the other surface of the release mount 22 is peelable while the other portions are not peelable. The slip is provided with a first perforation 5 in order to divide the tag 2, receipt 3, and sticker 4.

  In the present invention, an IC chip sheet incorporating an IC chip is enclosed in a delivery slip receipt. The amount of data that can be input into the delivery slip is much larger than that of a conventional barcode, and the receipt slip brought back. Since the IC chip sheet is taken out from the IC and the data is erased and reused, the IC chip sheet can be used repeatedly and is excellent in economic efficiency.

A is a front view showing a delivery slip, B is a bb sectional view, and C is a cc sectional view. Sectional drawing which shows the procedure which encloses an IC chip sheet in a receipt. Sectional drawing which shows the state which affixed the delivery slip to the delivery goods. Sectional drawing which shows the state which takes out an IC chip sheet from a receipt. Sectional drawing which shows the process of manufacturing the lower form of a delivery slip. Sectional drawing which shows the process of manufacturing the upper form of a delivery slip. Sectional drawing which manufactured the delivery slip by laminating the upper slip on the lower slip.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Delivery slip 2 Tag slip 3 Receipt slip 4 Sticky slip 5 First perforation 6 Notch 10 Release paper 11 Release agent 12 First wrap film 13 Form base material 14 Mirror surface film 15 Adhesive 16 Second perforation 20 Surface layer paper 21 Adhesive 22 Release mount 23 Release agent 24 Second wrap film 30 Lower form member 40 Upper form member 50 IC chip sheet 60 Delivery goods

Claims (2)

  The first wrap film (12) having a size corresponding to the receipt slip (3) was adhered to the release paper (10) surface of the release paper (10) in close contact, the surface was mirror-finished, and the adhesive was applied to the back surface. Adhering the adhesive-coated surface of the form substrate (13) to the release-coated surface of the release paper and the first wrap film so that the first wrap film cannot be peeled and other parts can be peeled, The form base material is provided with a second perforation (16) that penetrates the first wrap film and reaches the release agent-coated surface of the release paper, and the release substrate (22) having a size corresponding to the receipt form is provided. The second wrap film (24) having a shape smaller than the receipt slip is adhered to the release agent-coated surface in a close contact state, and the second adhesive film is applied to the pressure-sensitive adhesive-coated surface of the surface paper (20) coated with the pressure-sensitive adhesive on the back surface. Adhesive so that it cannot be peeled off from the wrap film and peelable from other parts. Adhesive surface of the surface layer paper and the above-mentioned release mount are adhered to the mirror-finished surface of the above-mentioned form base material so as not to be separated from the adhesive-coated surface of the surface layer paper and to be peelable from other parts. A first perforation (5) is provided from the surface through the release sheet, the form base material, and the first wrap film to reach the release agent coating surface of the release paper, and the slip is a tag and receipt. A delivery slip characterized in that it forms a section on a sticker. The receipt slip (3) can peel the release backing sheet (22) releasably adhered to the back surface of the surface paper (20) and the form substrate (13) releasably adhered to the surface of the release paper (10). Open the adhesive surface between the release mount and the form substrate, then remove the release mount from the surface paper, the surface paper from which the release mount has been removed, and the form base material. 2. The delivery slip according to claim 1 , wherein an IC chip sheet is inserted between the sheets, the surface layer paper is adhered again to the form substrate, and the IC chip sheet is enclosed in the slip.

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