JP2008305125A - Baggage tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a baggage tag for an air baggage, of which the manufacturing processes are simplified. <P>SOLUTION: In the baggage tag 1 constituted by forming a heat sensitive layer 3 on the surface side of a base layer 2 and laminating peeling paper 5 on the rear side through an adhesive layer 4, an IC tag inlet 8 is stuck to the surface of the peeling paper 5 and a slit 9 is formed in the peeling paper 5 so as to surround the IC tag inlet 8. Similar to a conventional baggage tag, the baggage tag 1 can be directly stuck to a baggage or attached like a ring. Moreover, the IC tag inlet 8 can be directly stuck to the rear face of the baggage tag without peeling off the peeling paper 5 only by forming the slit 9 also on a portion corresponding to the surround of the IC tag inlet 8 simultaneously with the formation of the slit on the peeling paper 5, so that the manufacturing becomes simple. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention belongs to the technical field of labels using IC tags, and particularly relates to a luggage tag for use by being attached to air baggage.

  Conventionally, as a luggage tag to be affixed to an air baggage, a tag having a layer structure of, for example, “heat-sensitive material layer / base material layer / adhesive layer / release paper” has been widely used. This baggage tag is designed to record information about the airline, baggage identification number, departure airport, transfer airport, and arrival airport on the thermal paper. What gave various processes, such as a cut, perforation, pre-printing, and a back slit, is used.

On the other hand, recently, it has been proposed that IC tags are attached to various goods to manage information during logistics process, storage, etc., and so-called baggage loss that frequently occurs at the time of transfer is eliminated as much as possible for baggage tags for air baggage. For this reason, an IC tag attached has come to be used. As such a luggage tag with an IC tag, a so-called IC tag inlet integrated with a conventional luggage tag is used. The IC tag inlet is usually a PET film or the like based on which an antenna pattern is formed by printing or etching and an IC chip is mounted.
JP 2004-317544 A JP 2003-162221 A

  Such a baggage tag for an air baggage is manufactured by the following procedure. First, a heat-sensitive material layer made of heat-sensitive paper or the like and a base material layer made of an OPP film or the like are dry-laminated through an adhesive. And after apply | coating an adhesive to the base material layer side in the laminated body and sticking a release paper, processes, such as printing, a half cut, a perforation, and a back slit, are given with respect to the laminated body. Next, a part of the release paper is turned from the back slit portion, and an IC tag inlet is inserted. An adhesive is provided on the surface of the IC tag inlet where the release paper comes. However, this adhesive may be provided in advance, or may be provided immediately before the release paper is pasted.

  Since the conventional baggage tag for airline baggage employs the manufacturing process as described above, the release paper is once turned, the IC tag inlet is attached under the release paper, and the release paper is returned to the original state. Since the process is necessary, the processing apparatus becomes complicated, and there is a problem that troubles are likely to occur during the processing. Therefore, the luggage tag integrated with the IC tag inlet has many problems in terms of delivery time and cost.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a baggage tag for airline baggage that simplifies the manufacturing process.

  The luggage tag according to claim 1 is a luggage tag having a heat sensitive material layer on the front surface side of the base material layer and a release paper laminated on the back surface via an adhesive layer. The IC tag inlet is affixed to the substrate, and a slit is formed in the release paper so as to surround the IC tag inlet.

  The package tag according to claim 2 is the package tag according to claim 1, wherein the front side of the IC tag inlet is covered with a protective layer.

  The luggage tag according to claim 3 is the luggage tag according to claim 1 or 2, wherein a release paper provided with an uncoated silicone area corresponding to a portion to which the IC tag inlet is attached is used. It is characterized by that.

  The luggage tag according to claim 1 is a luggage tag having a heat sensitive material layer on the front surface side of the base material layer and a release paper laminated on the back surface via an adhesive layer. IC tag inlet is affixed to the IC tag inlet, and the slit is formed in the release paper so as to surround the IC tag inlet. Since it remains on the tag side, it can be affixed as it is in the conventional luggage tag or attached to the luggage in the form of a ring, and when the slit is provided on the release paper, the part corresponding to the periphery of the IC tag inlet At the same time, simply by providing a slit, the IC tag inlet can be directly attached to the back of the luggage tag without peeling off the release paper, making it easy to manufacture.

  The luggage tag according to claim 2 is characterized in that, in the luggage tag according to claim 1, the front side of the IC tag inlet is covered with a protective layer. There is an effect that the IC tag inlet is protected.

  The luggage tag according to claim 3 is the luggage tag according to claim 1 or 2, wherein a release paper provided with an uncoated silicone area corresponding to a portion to which the IC tag inlet is attached is used. The IC tag inlet is prevented from falling off because part of the remaining release paper does not peel from the adhesive layer when the release paper is peeled off from the back side of the luggage tag or after peeling. Can do.

  Hereinafter, embodiments of the present invention will be described with specific examples.

  FIG. 1 is a front view showing an example of a luggage tag according to the present invention, FIG. 2 is a rear view of the luggage tag shown in FIG. 1, and FIG. 3 is a sectional view of the luggage tag shown in FIGS.

  The illustrated luggage tag 1 has a layer structure in which a heat-sensitive material layer 3 made of thermal paper is provided on the front surface side of a base material layer 2 made of OPP film and a release paper 5 is laminated on the back surface side through an adhesive layer 4. Various processings necessary for luggage tags such as slits 6 and perforations 7 are applied.

  The luggage tag 1 uses an IC tag inlet, and the portion indicated by 8 in FIGS. 2 and 3 is an IC tag inlet. The IC tag inlet 8 has a transparent plastic film made of PET, polypropylene, polyethylene, polystyrene, nylon, or the like as a base 8a, an antenna pattern 8b is formed on the front side, and an IC chip 8c is connected to both ends of the antenna pattern 8b via bumps. It is attached.

  An IC tag inlet 8 is attached to the surface of the release paper 5 with an adhesive, and a slit 9 is formed in the release paper 5 so as to surround the IC tag inlet 8.

  The baggage tag 1 is manufactured by multi-sided attachment, then cut into strips continuously connected in the length direction, and supplied as a roll-shaped winding. The manufacturing process is as follows.

  First, the heat-sensitive material layer 3 made of heat-sensitive paper and the base material layer 2 made of an OPP film are dry-laminated through an adhesive. And after forming the adhesive layer 4 in the base material layer 2 side in the laminated body and sticking the release paper 5, the IC tag inlet 8 is stuck to the predetermined position in the surface of the release paper 5 with an adhesive agent. As the release paper 5, a paper provided with an uncoated silicone region corresponding to the part where the IC tag inlet 8 is attached is used. Further, as shown in FIG. 3, it is preferable to use an IC tag inlet 8 covered with a protective layer 10 such as a resin sheet. Next, desired printing is performed on the laminate, and after processing such as slits and perforations, excess portions in layers other than the release paper 5 are scraped, cut into strips, and wound into a roll. take. A slit 9 is formed in the release paper 5 so as to surround the IC tag inlet 8 during processing of the slit, perforation, and the like.

  The package tag winding is manufactured in such a process. When the baggage tag 1 is affixed to the baggage, the baggage tag 1 is unwound from the winding and separated one by one through the perforation 7, and after a predetermined matter is described in the heat sensitive material layer 3, the release paper 5 Is peeled off to expose the adhesive layer 4, but at this time, a part of the release paper 5 surrounded by the slit 9 remains on the luggage tag side, and the IC tag inlet 8 attached thereto also remains on the luggage tag side. . In this way, the luggage tag 1 with the IC tag inlet 8 attached is used, and can be attached as it is or attached to the luggage in a ring shape. In the attached state, the IC tag inlet 8 is similar to a conventional luggage tag. It will be hidden.

  When the baggage tag 1 is used, the release paper 5 is peeled off to expose the adhesive layer 4 in the same way as the conventional baggage tag. However, a part of the remaining release paper 5 is removed after the peeling or peeling. In order to reliably prevent peeling from the pressure-sensitive adhesive layer 4, it is desirable to use the release paper 5 provided with a non-silicone-applied region corresponding to the site where the IC tag inlet 8 is attached as described above.

  Although the present invention has been described with specific examples, the luggage tag according to the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. It is natural that there is.

It is a front view which shows an example of the luggage tag which concerns on this invention. It is a rear view of the luggage tag shown in FIG. It is sectional drawing of the luggage tag shown in FIG.1 and FIG.2.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Baggage tag 2 Base material layer 3 Heat sensitive material layer 4 Adhesive layer 5 Release paper 6 Slit 7 Perforation 8 IC tag inlet 8a Base 8b Antenna pattern 8c IC chip 9 Slit 10 Protective layer

Claims (3)

  In a luggage tag having a heat sensitive material layer on the surface side of a base material layer and a release paper laminated on the back side through an adhesive layer, an IC tag inlet is attached to the surface of the release paper, and the IC tag inlet A luggage tag, characterized in that a slit is formed in the release paper so as to surround the bag.   The package tag according to claim 1, wherein the front side of the IC tag inlet is covered with a protective layer.   3. The luggage tag according to claim 1, wherein a release paper provided with an uncoated silicone region corresponding to a portion to which the IC tag inlet is attached is used.

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