JP4671292B2 - Magnetic levitation rotation processing equipment - Google Patents

Description

  The present invention floats an annular rotating plate that supports a workpiece in a container, and processes the surface of the workpiece to the back without inverting the workpiece as well as the surface of the workpiece while rotating in a non-contact state. For example, the present invention relates to an apparatus for disposing a semiconductor wafer or the like on the rotating plate and coating or cleaning or drying the surface thereof.

  In the manufacturing process of a semiconductor or a photomask, there is a series of manufacturing processes in which a thin film is formed on a surface of a workpiece such as a semiconductor wafer or a glass plate with a treatment liquid, the thin film is exposed, and then etched or dried. In this process, a semiconductor wafer or the like as a workpiece is supported on the upper surface of a rotary head portion (workpiece support plate) fixed on the rotation shaft, and the above-described semiconductor wafer is rotated at high speed to apply centrifugal force. A substrate rotation processing apparatus that is a spin coater that uniformly spreads a processing solution is used.

  A conventional spin coater, for example, as shown in Japanese Patent Application Laid-Open No. 2000-68179, supports a disk-shaped workpiece support plate on the upper end of a rotating shaft that protrudes through a bearing at the center of the cover body, The rotary shaft is configured to be rotated at a predetermined high speed by a drive motor or to be suddenly stopped.

  A workpiece such as a semiconductor wafer is supported on the workpiece support plate, and a spray nozzle is lowered to the center of the upper surface of the semiconductor wafer or the like while rotating the support plate at a high speed (for example, 4000 rpm). The film is stopped at the position, and a predetermined amount of processing liquid is discharged and spread on the surface of a wafer or the like by centrifugal force to form a thin film or to be washed.

  Usually, the workpiece support plate is enclosed in a scattering prevention cover, and the processing liquid remaining after the predetermined processing is captured by the scattering prevention cover and discharged and recovered from the lower part.

  Since such a thin film formation process needs to be performed in a “clean environment” in order to avoid contamination of impurities into the thin film, the thin film formation process is configured to perform spraying and rotation processing in a sealable container. However, since the container needs to pass through a rotating shaft that supports the workpiece support plate in the center of the lower part of the container, a bearing member or a seal member is provided in the penetrating portion to block the inside and outside of the lower side of the cover. ing.

(Generation of fine powder)
However, the conventional spin coater has a drawback in that since the rotating shaft comes into contact with the sealing material, foreign matters due to wear are generated from this portion and contaminate the clean environment in the sealed container. Contamination of the work piece due to the occurrence of foreign matter due to such problems on the apparatus cannot be completely prevented, and this causes a problem of affecting the quality of products such as semiconductor wafers. there were.

  Therefore, the present inventor cuts the edge between the rotating plate accommodated in the sealed container and the drive motor to be in a freely rotating state, magnetically levitates the rotating plate with respect to the drive motor side, and further performs magnetic coupling. A device configured to apply a rotational force by using the same has been developed and proposed as Japanese Patent Application No. 2005-363665 and Japanese Patent Application Laid-Open No. 2005-363676 on December 16, 2005. Called).

Specifically, the developed technology is configured as follows.
a) accommodating a workpiece support plate (rotary plate) in a closed container which is the upper structure of the apparatus;
b) A magnetic levitation permanent magnet is disposed on the outer periphery of the back surface of the workpiece support plate, and a rotational driving permanent magnet is concentrically disposed on the inner peripheral side of the permanent magnet.
c) Arranging a pinning body made of a bulk of the second type superconductor at a position below the outside of the sealed container, facing the permanent magnet for magnetic levitation,
d) comprising cooling means for cooling the pinning body;
e) The pinning body is cooled by the cooling means to below the critical temperature “about minus 240 ° C. (30 k)”, and is attached to a magnetic levitation permanent magnet arranged in a ring shape outside the workpiece support plate. Generating pinning force,
f) A non-contact type substrate rotation processing apparatus provided with a magnetic coupling device that generates a rotating magnetic force opposite to the rotational driving permanent magnet disposed at a lower position outside the sealed container.

  1. The substrate rotation processing apparatus as a previously developed technology is placed in a sealed container that floats a rotating plate that supports a semiconductor wafer, which is a workpiece, in a sealed container in a non-contact manner and rotates it. Since the surface of the workpiece can be processed, it is excellent in that accurate processing can be performed in an atmosphere free from contaminants.

  2. However, the previously developed technology can process only the upper surface (single side) of a semiconductor wafer or the like, which is a workpiece, and is different from this step in order to process the back surface of a semiconductor wafer or the like. There is a restriction that it is necessary.

  On the other hand, recently, there is a demand for processing the front and back both sides of the workpiece that has become larger, and the apparatus cannot be applied to both front and back side processing without turning the workpiece over. There is.

  3. In addition, the conventional substrate rotation processing apparatus has a characteristic of rotating smoothly without any mechanical resistance once the rotation plate starts to rotate because the rotation plate is magnetically levitated in the air.

  However, in the method in which the drive shaft is supported by the drive shaft and this drive shaft is driven by a motor, the rotation shaft is braked to reduce the rotation of the rotation plate, or the rotation is completed within a short time. Therefore, it is difficult to take out the workpiece from the rotating plate quickly and replace it.

  The present invention has improved the non-contact point that the problems with the previously developed device, that is, the double-sided processing of a wafer, which is a workpiece, cannot be performed at the same time, and the rotation / stop operation cannot be easily performed. An object of the present invention is to provide a rotary machining apparatus.

  In order to achieve the above object, a magnetic levitation rotation processing apparatus according to the present invention is configured as follows.

  1) An annular rotating plate, and a superconductor disposed below the rotating plate and arranged in an annular shape for magnetically levitating the rotating plate, and the superconductor on the lower surface of the rotating plate Corresponding to the permanent magnet for levitation, and the permanent magnet for rotation or the ferromagnetic steel plate on the outer peripheral side of the permanent magnet for levitation provided on the rotary plate, the permanent magnet or the ferromagnetic steel plate, etc. A rotating magnetic field coil is arranged, and the rotating plate is rotationally driven in a non-contact state by a permanent magnet or a ferromagnetic steel plate of the rotating plate and the rotating magnetic field coil.

  The rotating permanent magnet or ferromagnetic steel plate provided on the outer peripheral side of the levitation permanent magnet constitutes the rotor portion of the flat motor, and means a steel plate or iron core made of a permanent magnet or a ferromagnetic material. Yes.

  2) The annular rotating plate is accommodated in a sealed container, the superconducting bulk is disposed below the sealed container, and a part of the sealed container bulges in an annular shape to form an annular accommodating portion. The rotating plate is accommodated in the annular accommodating portion, the upper and lower sides of the annular accommodating portion are sandwiched, and a rotating magnetic field coil is disposed corresponding to a permanent magnet or a ferromagnetic steel plate for rotating the rotating plate, and the rotating plate The motor is composed of a rotating magnetic field coil.

  3) Supporting the superconductor on a support, supporting the support on a moving device that moves the support up and down, and operating the moving device on an annular rotating plate accommodated in the container The pinning effect is generated by the superconducting bulk.

  4) A spray nozzle for the treatment liquid is disposed on the upper side of the annular rotating plate accommodated in the sealed container, and a spray nozzle is also disposed on the lower side of the rotating plate, and is supported on the upper surface of the rotating plate. A feature is that the processing liquid is sprayed from both the upper and lower surfaces of the workpiece to enable the double-side processing of the workpiece.

  5) The workpiece is a plate-like body such as a semiconductor wafer or a photomask substrate, and the treatment liquid is a liquid for treating the surface of the workpiece.

  The magnetic levitation rotation processing apparatus according to the present invention magnetically levitates an annular rotating plate (workpiece support), generates a pinning effect by a superconductor, and further levitates provided on the rotating plate. A plate motor is constituted by a permanent magnet or a ferromagnetic steel plate that generates a rotational force along the outer peripheral side of the permanent magnet for use, and a rotating magnetic field coil arranged corresponding to the permanent magnet or the ferromagnetic steel plate, The outer peripheral portion of the rotating plate is configured to be driven to rotate in a non-contact state.

Therefore, the rotation of the rotating plate and the stop of the rotation can be performed quickly and accurately.
In addition, since the rotating plate has an annular shape, that is, a donut shape, the processing liquid can be sprayed from the back side of the workpiece using the central opening.

  As a result, a large workpiece can be supported, quickly rotated and stopped accurately.

  And it is possible to perform various processes, such as spraying a process liquid through the said opening part, without reversing a to-be-processed object from the back on it. Therefore, it is possible to effectively process the workpiece, and in particular, it can be effectively applied in a precise automatic processing process of a semiconductor device.

Example 1
Next, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a front sectional view showing an essential part of a “non-contact type substrate processing apparatus S”, which is an optimum embodiment of a magnetic levitation rotation processing apparatus according to Embodiment 1 of the present invention.

  The non-contact type substrate processing apparatus S includes a rotating plate 1 made of an annular plate (doughnut-shaped plate), an “upper structure U” made of a portion including a hermetic container 2, and a pinning body provided with a superconducting bulk. 3 is composed of a combination of “lower structure D” composed of portions including 3 and the like. The sealed container 2 has a workpiece w inserted and placed on the rotating plate 1, a supply port for the workpiece w is provided for the operation of taking out, and the container 2 is divided into two vertically. . By forming the rotary plate 1 in an annular shape, various processes such as spraying and spraying of dry air can be performed from the back surface of the wafer w that is a workpiece.

  The rotary plate 1 forms an annular and flat motor rotor as a whole so that various processes can be performed from the back side of the object to be processed through the opening. As shown in FIGS. 1 to 3, the rotating plate 1 is formed by balancing a nonmagnetic material such as an aluminum alloy in an annular shape, and has a first permanent magnet 1a on the front side and a corresponding back side. The second permanent magnet 1b and the third permanent magnet 1c are arranged on the inner circumference side of the second permanent magnet 1b so as to be aligned on the circumference.

  These permanent magnets 1a and 1b are a plurality of magnet pieces arranged on the circumference with different polarities along the circumference of the rotating plate 1, and further the third permanent magnet 1c has one piece. An annular magnet is arranged and formed. In the basic configuration of the apparatus according to the present invention, the permanent magnets 1a and 1b are used as rotors. However, the permanent magnets 1a and 1b can be used by changing to a ferromagnetic steel plate or the like having an equivalent action.

  Further, rotating magnetic field coils 4a and 4b using an iron core 4c made of a magnetic steel plate having a U-shaped cross-section with the periphery of the rotating plate 1 sandwiched from above and below on the peripheral surface of the rotating plate 1 include the first permanent magnet 1a and the second permanent magnet 1a. A rotating magnetic field coil 4A is provided corresponding to the permanent magnet 1b. A flat-plate motor is formed with the rotating magnetic field coil 4A as a stator and the rotating plate 1 as a rotor.

  As shown in FIG. 4, the lower structure D is an apparatus including a pinning body 3 that magnetically floats the rotating plate 1 of the upper structure U to a predetermined position in the sealed container 2 using a superconductor.

  As shown in FIGS. 1 and 4, the pinning body 3 is formed on a cooling plate 5 in which a heat conductor made of a material having excellent heat conductivity such as copper formed in a ring shape is formed in an annular shape. A bulk 6 (molded metal powder, which is a coin shape in this example) made of a molded body of two types of superconductors is arranged at a predetermined interval. In addition, the said bulk 6 can also be comprised by changing into the thing of another form instead of shape | molding powder.

  The cooling plate 5 is accommodated in a vacuum heat insulating container 7 formed in an annular shape on a plane, and is thermally isolated and fixed via a heat insulating block 8. The vacuum heat insulating container 7 is connected to a vacuum device and is kept in a vacuum state.

  A cooling device (refrigerator) 9 is connected to the annular cooling plate 5, and the bulk 6 is cooled to a temperature (−240 ° C., 30 ° k) at which superconductivity is exhibited via the cooling plate 5. It is configured as follows.

(Pinning device vertical movement device)
The vacuum heat insulating container 7 is supported by a support frame 10 (annular plate), and is supported by a vertical movement device 11 using, for example, an air cylinder device or a servo motor, and is configured to move up and down. The vertical movement device 11 is used when the rotating plate 1 is magnetically levitated and held at a predetermined position in the sealed container 2 when exhibiting the “pinning effect”.

  A support 14 is provided on the upper surface of the rotating plate 1, thereby supporting the periphery of the wafer w or the like as a workpiece at a plurality of points.

  Further, in this embodiment, the sealed container 2 is configured so as to be divided into a container lower part 2b and a container upper part 2a. (However, a door can be provided on the side surface of the integrated container, and the workpiece can be taken in and out of the door.) The lower nozzle 13 is vertically moved through the seal member 12 at the center of the container lower part 2b. It is configured to be movably supported, and from this, the processing liquid is supplied from the center of the lower surface of the wafer w or the like (or lateral movement is possible depending on the design).

  Further, an upper nozzle 13a is provided on the container upper part 2a side so as to be movable up and down (or may enter from an oblique direction), and is configured to supply the processing liquid to the upper surface of the wafer w or the like. . Reference numeral 15 denotes a robot arm that automatically supplies and discharges wafers w and the like.

(Substructure of specially shaped container)
A bulging part 17 is formed in the container lower part 2b in the circumferential direction, and surrounds the outer peripheral part of the rotating plate 1 as a workpiece support from three sides. Then, a rotating magnetic field coil 4A provided with coils 4a and 4b is formed on an iron core 4c made of a magnetic steel plate having a U-shaped cross section so as to sandwich the upper and lower sides of the bulging portion 17, thereby constituting a stator of a flat plate motor. .

  Accordingly, the permanent magnets 1a and 1b (or a plate made of a ferromagnetic material, etc.) disposed on both surfaces of the outer peripheral portion of the rotating plate 1 (rotor) face the container lower portion 2b of the sealed container 2 so as to face each other. The bulging part 17 formed in the outer periphery is located. And the stator which consists of the rotating magnetic field coil 4A which consists of the said iron core 4c and the coils 4a and 4b is arrange | positioned on both surfaces of this bulging part 17, and the flat type motor which uses the said rotating plate 1 as a rotor is comprised.

  The material of the bulk 6 made of the second kind superconductor that exhibits the “pinning effect” for magnetically floating the rotating plate 1 is yttrium (Y—Ba—Cu—O), gadolinium (Ga−). Ba-Cu-O), neodymium (Nd-Ba-Cu-0) or europium (Eu-Ba-Cu-0) oxides can be used.

  Note that the shape and arrangement of the bulk 6 need not be limited to the configuration shown in FIGS. 5 and 4 as long as it faces the third permanent magnet 1 c provided on the lower surface of the rotating plate 1.

  In this embodiment, as shown in FIG. 4, a support 20 is provided on the bottom surface of the bulging portion 17 formed in the container lower portion 2 b of the sealed container 2, and the inner peripheral portion of the annular rotating plate 1 is provided. Supports 21 that face and contact the support 20 are respectively provided on the lower surface.

  In the stationary state where the magnetic levitation rotation processing apparatus S according to the present invention is stopped and the rotating plate 1 is not levitated, the supporting members 20 and 21 are brought into contact with each other to support the rotating plate 1 on the container lower part 12b. And when exhibiting the pinning effect mentioned below, it contacts with the said support bodies 20 and 21, and it is comprised so that the rotating plate 1 may be magnetically levitated.

(Regarding the magnetic levitation operation of the rotating plate 1)
Although the pinning effect by the bulk 6 using the second type superconductor is known, it will be described based on this action just in case.

[First state]
Since the magnetic levitation force does not act on the rotating plate 1, the supporting members 20 and 21 of FIG. 4 are in contact with each other to support the rotating plate 1, and the lower surface of the rotating plate 1 is below the permanent magnet 1 c. A bulk 6 made of a second-type superconductor is arranged at a distance (α). Magnetic flux generated from the permanent magnet 1 c passes through the bulk 6.

[Second state]
The bulk (molded body of the second type superconductor) 6 is cooled to a critical temperature (−240 ° C.) or less by the cooling plate 5 while the vacuum heat insulating container 7 is in a vacuum state. In the bulk 6, the magnetic flux generated from the permanent magnet 1 c is quantized, and a “pinning effect” occurs in which the superconducting portion existing inside is trapped and held as if pinned. At this time, the potential energy of the system composed of the permanent magnet 1c and the bulk 6 is in a stable state.

[Third state]
When the gantry 10 (FIG. 1) supporting the heat insulating container 7 is slightly raised by the vertical drive device 11, the support 20 in the bulging part 17 of the container lower part 2b and the opening of the rotating plate 1 are provided. The rotating plate 1 in which the contact with the support 21 is cut and the permanent magnet 1c is provided is farther away from the bulk 6 made of the second type superconductor, that is, the lower structure D including the cooling plate 5. Therefore, the distance of the lower structure D including the rotating plate 1, the bulk 6, and the cooling plate 5 is smaller than the original distance (α).

  This means that the magnetic flux deviates from the position where the rotating plate 1 is pinned and the potential energy of the system becomes unstable. Therefore, a pinning force is generated in the axial direction opposite to gravity in the permanent magnet 1c of the rotating plate 1 so that the potential energy is stabilized, that is, to return to the second state, so that the bulk 6 and the permanent magnet 1c The permanent magnet 1c, that is, the rotating plate 1 is levitated at the position of the distance (α) between the two.

  This pinning phenomenon is the same even when the permanent magnet 1c, that is, the rotating plate 1 moves in the horizontal direction, and a pinning force is generated in the radial direction opposite to the moving direction in which the potential energy of the system is stabilized.

  The predetermined distance (α) is uniquely determined from the shape of the bulk 6 composed of the permanent magnet 1c and the second type superconductor, the strength of the permanent magnet, and the like.

(About driving of rotating body 1)
As described above, if the rotating body 1 is lifted to the middle position of the bulging portion 17 in the container lower portion 2b by the magnetic “pinning effect”, the permanent magnets 1a and 1b ( A rotating magnetic field is formed by a rotating magnetic field coil 4 </ b> A (stator) disposed between the bulging portion 17 and a portion that functions as a rotor to rotate the rotating body 1 at a predetermined rotational speed.

  A workpiece to be supported on the rotating body 1 by spraying a surface treatment liquid such as a thin film forming solution or an etching solution simultaneously or separately from the upper nozzle 13a and the lower nozzle 13 while the rotating body 1 is rotating. A surface of the wafer w or the like can be processed by etching or the like with a processing liquid to form a semiconductor element having a predetermined pattern.

  The rotational speed of the rotating body 1 is 200 to 7000 rpm in normal processing, and the processing is performed at a considerably high speed. Therefore, when the radius and weight of the rotating body 1 are taken into account, the rotational inertia energy of the rotating body 1 is considerably large, and it is difficult to stop the rotating body 1 in a short time.

  Further, providing a special brake device on the rotating plate 1 causes dust to be generated in the vacuum sealed container 2, so that it is necessary to wait for the rotating body 1 to stop using the air resistance. Become.

  However, in the magnetically levitated rotation processing apparatus S of the present invention, since the rotating body 1 itself constitutes the rotor of the motor, the rotating plate 1 is quietly controlled by controlling the current of the rotating magnetic field coil 4A. And it becomes possible to stop quickly.

  As described above, according to the magnetic levitation rotation processing apparatus S according to the present invention, the outer peripheral portion of the rotating plate 1 that rotates while supporting the workpiece such as the wafer w is directly used as a part of the electric motor. Therefore, the operation of rotating and stopping the rotating plate 1 can be performed extremely accurately and efficiently, and the semiconductor device manufacturing process can be efficiently performed.

(Example 2)
FIG. 6 shows a main part of a magnetic levitation rotation processing apparatus according to the second embodiment of the present invention.

  An annular rotating plate 21 is disposed inside a sealed container 20 having a cylindrical peripheral surface, and a pin stopper 22 is disposed below the annular rotating plate 21. A rotating permanent magnet 23 is annularly provided below the peripheral surface of the rotating plate 21, and a floating permanent magnet 24 is provided concentrically with the magnet 23. A rotating magnetic field coil 26 is disposed on the lower surface of the permanent magnet 23, and the coil 26 and the permanent magnet 23 constitute a thin motor.

  The pinning body 22 is a bulk 28 in which a second-type superconductor as shown in FIG. 5 is formed into a coin shape on the upper surface of a heat transfer plate 27 in which a metal material having good heat conduction, for example, copper or the like is formed into a disk shape. (Superconductors) are arranged at predetermined intervals and connected to the refrigerator 32 via the heat conduction column 31 on the back surface, so that the bulk 28 is cooled to an ultra-low temperature that exhibits superconductivity.

  The entire pinning body 22 is accommodated in the vacuum vessel 33 to provide a heat insulating effect, and the inside thereof is held in an ultra-low temperature state. A lower nozzle 34 is provided through the heat transfer plate 27, the vacuum container 33 and the sealed container 20, and an upper nozzle 35 is also provided on the upper surface side of the rotating plate 21.

  In order for the magnetic levitation rotation processing apparatus having the above configuration to exhibit the pinning effect, a structure for supporting the rotating plate 21 on the bottom of the sealed container 20 and a mechanism for moving the pinning body 22 up and down are required. However, for these structures, the apparatus adopted in the first embodiment or an apparatus improved from this can be used.

  In the second embodiment, since the flat motor permanent magnet 23 and the rotating magnetic field coil 26 are arranged opposite to each other at the peripheral edge of the bottom of the sealed container 20, the expansion formed in the lower portion of the sealed container 2 of the first embodiment is omitted. The protruding portion 17 is not formed, and therefore, the rotating plate 21 can be easily arranged and fixed in the sealed container 20, and the structure of the sealed container 20 can be simplified.

(Example 3)
FIG. 6 shows a main part of a magnetic levitation rotation processing apparatus according to a third embodiment of the present invention, which is a modification of a part of the structure of the second embodiment.

  In the second embodiment, the permanent magnet 23 and the rotating magnetic field coil 26 constituting the driving portion of the flat motor are opposed to each other at the bottom of the sealed container 20, but in this third embodiment, the bottom of the sealed container 20 is It is the one facing the part of the peripheral wall.

  In the case of the apparatus shown in FIG. 6, the magnetic force m generated between the permanent magnet 23 and the rotating magnetic field coil 26 with respect to the levitation magnetic force M of the rotator 21 attenuates the magnetic force M, so that the rotating plate 21 floats. Although acting in the direction of weakening the force, that is, in the longitudinal direction, in the case of the third embodiment, the magnetic field lines are generated in the peripheral direction of the rotating body 21, so the rotating magnetic field coil 26 a weakens the magnetic force M for levitation of the rotating plate 21. The advantage is that no magnetic force acts in the direction.

It is sectional drawing which shows the principal part of the apparatus which concerns on this invention. It is sectional drawing of the rotating plate for supporting a to-be-processed object. It is a top view of the said rotating plate. It is sectional drawing of the drive mechanism which drives the magnetic levitation apparatus using a superconductivity, and a rotating plate. It is a partial top view of the magnetic pinning apparatus using a 2nd type superconductor. It is a front section of the device concerning the present invention showing the 2nd example. It is a front cross section of the apparatus based on this invention which shows a 3rd Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS S Magnetic levitation rotation processing apparatus 1 Annular rotating plate 1a 1st permanent magnet 1b 2nd permanent magnet 1c 3rd permanent magnet 2 Vacuum sealed container 3 Pinning body 4A Rotating magnetic field coil 4a, 4b Rotating magnetic field coil 4c Iron core 5 Cooling Plate 6 Bulk (not limited to compressed powder, type 2 superconductor) 7 Vacuum heat insulating container 8 Heat insulating block 9 Cooling device 10 Mounting device 11 Vertical drive device 12 Sealing material 13 Lower nozzle 13a Upper nozzle 15 Robot arm 17 Container Bulging part 20, 21 Support

Claims (5)

An annular rotating plate and a superconductor disposed below the rotating plate and arranged in a ring for magnetically levitating the rotating plate are provided, and the lower surface of the rotating plate corresponds to the superconductor. The permanent magnet for levitation arranged in the above, and the permanent magnet for rotation or the ferromagnetic steel plate on the outer peripheral side of the permanent magnet for levitation provided on the rotating plate, and rotating corresponding to the permanent magnet or the ferromagnetic steel plate A magnetic levitation rotation processing apparatus comprising a magnetic field coil, wherein the rotary plate is rotationally driven in a non-contact state by a permanent magnet or a ferromagnetic steel plate of the rotary plate and the rotary magnetic field coil. The annular rotating plate is accommodated in a sealed container and the superconductor is disposed below the sealed container, and an outer periphery of a part of the sealed container is annularly formed to form an annular accommodating portion, The rotating plate is accommodated in an annular accommodating portion, the upper and lower sides of the annular accommodating portion are sandwiched, a rotating magnetic field coil is disposed corresponding to a rotating permanent magnet or a ferromagnetic steel plate of the rotating plate, and the permanent magnet of the rotating plate 2. The magnetically levitated rotation processing apparatus according to claim 1, wherein the motor is composed of a ferromagnetic steel plate and a rotating magnetic field coil.   The superconductor is supported on a support, supported by a moving device that moves the support up and down, and the superconductor is operated with respect to an annular rotating plate accommodated in the container by operating the moving device. 2. The magnetic levitation rotation processing apparatus according to claim 1, wherein a pinning effect by a conductor is generated. A spray nozzle for the treatment liquid is disposed on the upper side of the annular rotating plate accommodated in the sealed container, and a spray nozzle is also disposed on the lower side of the rotating plate, and is supported on the upper surface of the rotating plate. 2. The magnetic levitation rotation processing apparatus according to claim 1, wherein the processing liquid is sprayed from both upper and lower surfaces of the workpiece so as to enable double-side processing of the workpiece .   2. The magnetic levitation rotation process according to claim 1, wherein the workpiece is a plate-like body including a semiconductor wafer or a photomask substrate, and the treatment liquid is a liquid for treating the surface of the workpiece. apparatus.

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