JP4648373B2 - 微小金属接合部の検査方法 - Google Patents
微小金属接合部の検査方法 Download PDFInfo
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- JP4648373B2 JP4648373B2 JP2007238120A JP2007238120A JP4648373B2 JP 4648373 B2 JP4648373 B2 JP 4648373B2 JP 2007238120 A JP2007238120 A JP 2007238120A JP 2007238120 A JP2007238120 A JP 2007238120A JP 4648373 B2 JP4648373 B2 JP 4648373B2
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- metal
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Description
2 金属
Claims (2)
- 微小金属同士を接合するための微小金属接合部の検査方法であって、
前記微小金属同士の接合部に加熱エネルギーを照射すること、
前記加熱エネルギーによる接合部の加熱点から放射される赤外線を受光して前記加熱エネルギーの照射前後における前記加熱点の温度変化量を計測すること、
前記加熱点の加熱量と前記温度変化量との関係から前記加熱点の接合面積係数を算出すること、
前記算出された接合面積係数を前記と同じ方法で求めた基準モデル品の接合面積係数と比較すること、
前記比較によって得た接合面積係数の差の大小によって前記接合部の良否を判定すること、
から成ることを特徴とする微小金属接合部の検査方法。 - 接合部の検査に際し、前記加熱点における反射率を同時計測し、その値を前記接合面積係数の計算に用いる請求項1に記載の微小金属接合部の検査方法。
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JP2007238120A JP4648373B2 (ja) | 2007-09-13 | 2007-09-13 | 微小金属接合部の検査方法 |
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JP2007238120A JP4648373B2 (ja) | 2007-09-13 | 2007-09-13 | 微小金属接合部の検査方法 |
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JP2009069009A JP2009069009A (ja) | 2009-04-02 |
JP4648373B2 true JP4648373B2 (ja) | 2011-03-09 |
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JP2007238120A Expired - Fee Related JP4648373B2 (ja) | 2007-09-13 | 2007-09-13 | 微小金属接合部の検査方法 |
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Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4991893B2 (ja) * | 2010-03-16 | 2012-08-01 | 常陽機械株式会社 | 微小径ワイヤボンディングの良否判定方法及び判定装置 |
JP5500120B2 (ja) * | 2011-04-25 | 2014-05-21 | パナソニック株式会社 | 電子デバイスの検査方法 |
JP6123460B2 (ja) * | 2013-04-26 | 2017-05-10 | 株式会社ジェイテクト | 光学非破壊検査装置及び光学非破壊検査方法 |
JP6232734B2 (ja) * | 2013-04-26 | 2017-11-22 | 株式会社ジェイテクト | 光学非破壊検査装置及び光学非破壊検査方法 |
JP6255713B2 (ja) * | 2013-05-14 | 2018-01-10 | 株式会社ジェイテクト | 光学非破壊検査方法及び光学非破壊検査装置 |
JP6241069B2 (ja) * | 2013-05-24 | 2017-12-06 | 株式会社ジェイテクト | 光学非破壊検査方法及び光学非破壊検査装置 |
JP6354350B2 (ja) * | 2014-06-05 | 2018-07-11 | 株式会社ジェイテクト | 光学非破壊検査方法及び光学非破壊検査装置 |
JP6620499B2 (ja) * | 2015-10-07 | 2019-12-18 | 株式会社ジェイテクト | 光学非破壊検査装置及び光学非破壊検査方法 |
JP6604210B2 (ja) * | 2016-01-13 | 2019-11-13 | 株式会社ジェイテクト | 光学非破壊検査方法及び光学非破壊検査装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000261137A (ja) * | 1999-03-12 | 2000-09-22 | Nec Corp | 電子部品接続状態検査装置及び電子部品接続状態検査方法 |
JP2003065985A (ja) * | 2001-08-28 | 2003-03-05 | Matsushita Electric Works Ltd | レーザー溶接部の検査方法及びその装置 |
JP2006258721A (ja) * | 2005-03-18 | 2006-09-28 | Mdix:Kk | 電子部品のはんだ接合部検査方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2530788B2 (ja) * | 1991-12-25 | 1996-09-04 | 仲田 周次 | 電子部品の接合部検査方法 |
JP3271861B2 (ja) * | 1994-10-21 | 2002-04-08 | 小原株式会社 | スポット溶接部のナゲット測定方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000261137A (ja) * | 1999-03-12 | 2000-09-22 | Nec Corp | 電子部品接続状態検査装置及び電子部品接続状態検査方法 |
JP2003065985A (ja) * | 2001-08-28 | 2003-03-05 | Matsushita Electric Works Ltd | レーザー溶接部の検査方法及びその装置 |
JP2006258721A (ja) * | 2005-03-18 | 2006-09-28 | Mdix:Kk | 電子部品のはんだ接合部検査方法 |
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