JP4642550B2 - 基板載置台、基板処理装置、および基板の温度制御方法 - Google Patents

基板載置台、基板処理装置、および基板の温度制御方法 Download PDF

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Publication number
JP4642550B2
JP4642550B2 JP2005151025A JP2005151025A JP4642550B2 JP 4642550 B2 JP4642550 B2 JP 4642550B2 JP 2005151025 A JP2005151025 A JP 2005151025A JP 2005151025 A JP2005151025 A JP 2005151025A JP 4642550 B2 JP4642550 B2 JP 4642550B2
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Prior art keywords
substrate
heat transfer
mounting table
protrusion
transfer gas
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Expired - Fee Related
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JP2005151025A
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Japanese (ja)
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JP2006156938A5 (enExample
JP2006156938A (ja
Inventor
英利 木村
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2005151025A priority Critical patent/JP4642550B2/ja
Priority to US11/259,037 priority patent/US20060090855A1/en
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Publication of JP2006156938A5 publication Critical patent/JP2006156938A5/ja
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  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2005151025A 2004-10-29 2005-05-24 基板載置台、基板処理装置、および基板の温度制御方法 Expired - Fee Related JP4642550B2 (ja)

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Application Number Priority Date Filing Date Title
JP2005151025A JP4642550B2 (ja) 2004-10-29 2005-05-24 基板載置台、基板処理装置、および基板の温度制御方法
US11/259,037 US20060090855A1 (en) 2004-10-29 2005-10-27 Substrate mounting table, substrate processing apparatus and substrate temperature control method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004316604 2004-10-29
JP2005151025A JP4642550B2 (ja) 2004-10-29 2005-05-24 基板載置台、基板処理装置、および基板の温度制御方法

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JP2006156938A JP2006156938A (ja) 2006-06-15
JP2006156938A5 JP2006156938A5 (enExample) 2008-06-26
JP4642550B2 true JP4642550B2 (ja) 2011-03-02

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Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5003102B2 (ja) * 2006-10-27 2012-08-15 東京エレクトロン株式会社 静電チャックの診断方法、真空処理装置及び記憶媒体
JP2008198800A (ja) * 2007-02-13 2008-08-28 Bridgestone Corp 熱処理用治具
JP5269335B2 (ja) * 2007-03-30 2013-08-21 東京エレクトロン株式会社 プラズマ処理装置
JP2009060011A (ja) * 2007-09-03 2009-03-19 Tokyo Electron Ltd 基板載置台、基板処理装置、及び温度制御方法
JP5644256B2 (ja) 2010-08-20 2014-12-24 豊田合成株式会社 化合物半導体の製造装置及び化合物半導体の製造方法
US8520360B2 (en) * 2011-07-19 2013-08-27 Lam Research Corporation Electrostatic chuck with wafer backside plasma assisted dechuck
JP6010433B2 (ja) * 2012-11-15 2016-10-19 東京エレクトロン株式会社 基板載置台および基板処理装置
US11139194B2 (en) * 2016-07-25 2021-10-05 Kyocera Corporation Sample holder
JP2024125376A (ja) * 2018-12-21 2024-09-18 Toto株式会社 静電チャック
JP7458156B2 (ja) * 2019-08-22 2024-03-29 東京エレクトロン株式会社 載置台及びプラズマ処理装置
WO2022010872A1 (en) * 2020-07-06 2022-01-13 Applied Materials, Inc. Electrostatic chuck with improved temperature control
JP7778482B2 (ja) * 2021-03-02 2025-12-02 キヤノン株式会社 チャック、基板保持装置、基板処理装置、及び物品の製造方法
CN114975178B (zh) * 2022-05-18 2024-04-05 江苏微导纳米科技股份有限公司 温度控制组件、半导体处理腔室及半导体处理设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07335630A (ja) * 1994-06-13 1995-12-22 Hitachi Ltd 真空処理装置
JPH10107134A (ja) * 1996-10-01 1998-04-24 Ricoh Co Ltd 静電吸着装置
JP2000317761A (ja) * 1999-03-01 2000-11-21 Toto Ltd 静電チャックおよび吸着方法

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